EB52F4D15BN-19.200M [ECLIPTEK]
TCXO, CLOCK, 19.2 MHz, LVCMOS OUTPUT, METAL, DIP-14/4;型号: | EB52F4D15BN-19.200M |
厂家: | Ecliptek |
描述: | TCXO, CLOCK, 19.2 MHz, LVCMOS OUTPUT, METAL, DIP-14/4 机械 输出元件 石英晶振 温度补偿晶振 振荡器 |
文件: | 总4页 (文件大小:116K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
EB52F4D15BN-19.200M
EB52F4 D 15 B N -19.200M
Series
Nominal Frequency
3.3Vdc 14-Pin DIP LVCMOS TCXO
19.200MHz
Initial Tolerance
±2.5ppm Maximum
Control Voltage
None (No Connect on Pin 1)
Frequency Stability
±1.5ppm Maximum
Operating Temperature Range
0°C to +70°C
ELECTRICAL SPECIFICATIONS
Nominal Frequency
19.200MHz
Initial Tolerance
±2.5ppm Maximum (Measured at Nominal Vdd and Vc)
±1.5ppm Maximum
Frequency Stability
Frequency Stability vs. Input Voltage ±0.3ppm Maximum (Vdd ±5%)
Frequency Stability vs. Aging
Frequency Stability vs. Load
Operating Temperature Range
Supply Voltage
±1ppm/Year Maximum (at 25°C)
±0.2ppm Maximum (±10%)
0°C to +70°C
3.3Vdc ±5%
Input Current
15mA Maximum (Measured at Steady State at 25°C)
90% of Vdd Minimum
Output Voltage Logic High (Voh)
Output Voltage Logic Low (Vol)
Rise/Fall Time
10% of Vdd Maximum
6nSec Maximum (Measured at 20% to 80% of waveform)
50% ±5% (Measured at 50% of waveform)
15pF Maximum
Duty Cycle
Load Drive Capability
Output Logic Type
CMOS
Control Voltage
None (No Connect on Pin 1)
10kOhms Typical
Input Impedance
Phase Noise
-70dBc/Hz at 10Hz Offset, -100dBc/Hz at 100Hz Offset, -130dBc/Hz at 1kHz Offset, -140dBc/Hz at 10kHz
Offset, -145dBc/Hz at 100kHz Offset (Typical Values at 19.440MHz)
Storage Temperature Range
-55°C to +125°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test
MIL-STD-883, Method 1014 Condition A
MIL-STD-883, Method 1014 Condition C
MIL-STD-883, Method 2004
Gross Leak Test
Lead Integrity
Mechanical Shock
Resistance to Soldering Heat
Resistance to Solvents
Solderability
MIL-STD-202, Method 213 Condition C
MIL-STD-202, Method 210
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
Temperature Cycling
Vibration
MIL-STD-883, Method 1010
MIL-STD-883, Method 2007 Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 1 of 4
EB52F4D15BN-19.200M
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN CONNECTION
15.240
±0.203
1
No Connect
Case Ground
Output
0.6 MAX
DIA 0.457
7
±0.100 (X4)
8
1
7
8
7.620
±0.203
14
Supply Voltage
14
LINE MARKING
1
2
3
ECLIPTEK
19.200M
5.08 MIN
XXYZZ
XX=Ecliptek Manufacturing
Code
8.3 MAX
MARKING
ORIENTATION
13.0
±0.5
Y=Last Digit of the Year
ZZ=Week of the Year
20.3 ±0.5
OUTPUT WAVEFORM
VOH
80% of Waveform
50% of Waveform
20% of Waveform
VOL
Fall
Time
Rise
Time
TW
T
Duty Cycle (%) = TW/T x 100
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 2 of 4
EB52F4D15BN-19.200M
Test Circuit for No Connect Option
Frequency
Counter
Oscilloscope
Probe
(Note 2)
Supply
Voltage
(VDD
)
Output
Current
Meter
0.01µF
(Note 1)
0.1µF
(Note 1)
Power
Supply
Voltage
Meter
Ground
CL
(Note 3)
No
Connect
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency
ceramic bypass capacitor close to the package ground and VDD pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 3 of 4
EB52F4D15BN-19.200M
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
Low Temperature Solder Bath (Wave Solder)
TS MAX to TL (Ramp-up Rate)
5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
N/A
150°C
N/A
30 - 60 Seconds
Ramp-up Rate (TL to TP)
5°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
150°C
200 Seconds Maximum
Peak Temperature (TP)
245°C Maximum
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
245°C Maximum 1 Time / 235°C Maximum 2 Times
5 seconds Maximum 1 Time / 15 seconds Maximum 2 Times
5°C/second Maximum
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 4 of 4
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