EC2945ETTTS-31.608M [ECLIPTEK]
CMOS, Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 1.8Vdc 4 Pad 5.0mm x 7.0mm Ceramic Surface Mount (SMD) Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 1.8Vdc 4 Pad 5.0mm x 7.0mm Ceramic Surface Mount (SMD);
| 型号： | EC2945ETTTS-31.608M |
| 厂家： | 
Ecliptek |
| 描述： | CMOS, Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 1.8Vdc 4 Pad 5.0mm x 7.0mm Ceramic Surface Mount (SMD) Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 1.8Vdc 4 Pad 5.0mm x 7.0mm Ceramic Surface Mount (SMD) 机械 石英晶振 振荡器 |
| 文件： | 总5页 (文件大小：167K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
RoHS
Pb
EC2945ETTTS-31.608M
EC29 45 ET T TS -31.608M
Series
Nominal Frequency
31.608MHz
RoHS Compliant (Pb-free) 1.8V 4 Pad 5mm x 7mm
Ceramic SMD LVCMOS Oscillator
Pin 1 Connection
Tri-State (High Impedance)
Frequency Tolerance/Stability
±50ppm Maximum
Duty Cycle
50 ±5(%)
Operating Temperature Range
-40°C to +85°C
ELECTRICAL SPECIFICATIONS
Nominal Frequency
31.608MHz
Frequency Tolerance/Stability
±50ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the
Operating Temperature Range, Supply Voltage Change, Ouput Load Change, First Year Aging at 25°C,
Shock, and Vibration)
Operating Temperature Range
Supply Voltage
-40°C to +85°C
1.8Vdc ±5%
Input Current
4mA Maximum
Output Voltage Logic High (Voh)
Output Voltage Logic Low (Vol)
Rise/Fall Time
90% of Vdd Minimum (IOH=-2.8mA)
10% of Vdd Maximum (IOL=2.8mA)
6nSec Maximum (Measured at 10% to 90% of waveform)
50 ±5(%) (Measured at 50% of waveform)
15pF Maximum
Duty Cycle
Load Drive Capability
Output Logic Type
CMOS
Pin 1 Connection
Tri-State (High Impedance)
Tri-State Input Voltage (Vih and Vil)
90% of Vdd Minimum to enable output, 10% of Vdd Maximum to disable output (High Impedance), No
Connect to enable output.
Standby Current
10µA Maximum (Disabled Output, High Impedance) (Disabled Output, High Impedance)
RMS Phase Jitter
Start Up Time
1pSec Maximum (12kHz to 20MHz offset frequency)
10mSec Maximum
Storage Temperature Range
-55°C to +125°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test
MIL-STD-883, Method 1014, Condition A
MIL-STD-883, Method 1014, Condition C
MIL-STD-202, Method 213, Condition C
MIL-STD-202, Method 210
Gross Leak Test
Mechanical Shock
Resistance to Soldering Heat
Resistance to Solvents
Solderability
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
Temperature Cycling
Vibration
MIL-STD-883, Method 1010
MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev G 2/17/2010 | Page 1 of 5
EC2945ETTTS-31.608M
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN CONNECTION
1
2
3
4
Tri-State
7.00
±0.15
5.08
±0.15
Ground/Case Ground
Output
4
1
3
2
Supply Voltage
MARKING
ORIENTATION
2.60
±0.15
5.00
±0.15
LINE MARKING
1
2
3
ECLIPTEK
31.608M
XXYZZ
1.2 ±0.2
XX=Ecliptek Manufacturing
Code
1.4 ±01
Y=Last Digit of the Year
ZZ=Week of the Year
3.68
±0.15
1.60 ±0.20
Suggested Solder Pad Layout
All Dimensions in Millimeters
2.0 (X4)
2.2 (X4)
Solder Land
(X4)
2.88
1.81
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev G 2/17/2010 | Page 2 of 5
EC2945ETTTS-31.608M
OUTPUT WAVEFORM & TIMING DIAGRAM
VIH
VIL
VOH
80% of Waveform
OUTPUT DISABLE
(HIGH IMPEDANCE
STATE)
50% of Waveform
20% of Waveform
VOL
tPLZ
tPZL
Fall
Time
Rise
Time
TW
T
Duty Cycle (%) = TW/T x 100
Test Circuit for CMOS Output
Frequency
Counter
Oscilloscope
Probe
(Note 2)
Supply
Voltage
(VDD
)
Output
_
+
Current
Meter
+
+
Power
Supply
0.01µF
(Note 1)
Voltage
Meter
0.1µF
(Note 1)
CL
(Note 3)
Ground
_
_
No Connect
or Tri-State
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency
ceramic bypass capacitor close to the package ground and VDD pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev G 2/17/2010 | Page 3 of 5
EC2945ETTTS-31.608M
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
High Temperature Infrared/Convection
TS MAX to TL (Ramp-up Rate)
3°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
150°C
175°C
200°C
60 - 180 Seconds
Ramp-up Rate (TL to TP)
3°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
217°C
60 - 150 Seconds
Peak Temperature (TP)
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
Additional Notes
Temperatures shown are applied to body of device.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev G 2/17/2010 | Page 4 of 5
EC2945ETTTS-31.608M
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
Low Temperature Infrared/Convection 240°C
TS MAX to TL (Ramp-up Rate)
5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
N/A
150°C
N/A
60 - 120 Seconds
Ramp-up Rate (TL to TP)
5°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
150°C
200 Seconds Maximum
Peak Temperature (TP)
240°C Maximum
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
240°C Maximum 1 Time / 230°C Maximum 2 Times
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
Additional Notes
N/A
Level 1
Temperatures shown are applied to body of device.
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.)
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.)
www.ecliptek.com | Specification Subject to Change Without Notice | Rev G 2/17/2010 | Page 5 of 5
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