EC3SMD-S-8.000M TR [ECLIPTEK]
CRYSTALS 30/50 -20+70 SERIES 8.000MHZ ATCUT FUND 12X4X4MM 4PAD SMD;
| 型号： | EC3SMD-S-8.000M TR |
| 厂家： | 
Ecliptek |
| 描述： | CRYSTALS 30/50 -20+70 SERIES 8.000MHZ ATCUT FUND 12X4X4MM 4PAD SMD |
| 文件： | 总3页 (文件大小：94K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
EC3SMD-S-8.000M
EC3SM D
-S -8.000M
Series
Nominal Frequency
8.000MHz
4.0mm Epoxy Base SMD Crystal
Frequency Tolerance/Stability
±30ppm at 25°C, ±50ppm over -20°C to +70°C
Load Capacitance
Series Resonant
Mode of Operation
AT-Cut Fundamental
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Tolerance/Stability
Aging at 25°C
8.000MHz
±30ppm at 25°C, ±50ppm over -20°C to +70°C
±5ppm/year Maximum
Series Resonant
Load Capacitance
Shunt Capacitance (C0)
Equivalent Series Resistance
Mode of Operation
7pF Maximum
90 Ohms Maximum
AT-Cut Fundamental
Drive Level
1mWatts Maximum
Storage Temperature Range
Insulation Resistance
-40°C to +85°C
500 Megaohms Minimum at 100Vdc
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test
MIL-STD-883, Method 1014 Condition A
MIL-STD-883, Method 1014 Condition C
MIL-STD-202, Method 213 Condition C
MIL-STD-202, Method 210
Gross Leak Test
Mechanical Shock
Resistance to Soldering Heat
Resistance to Solvents
Solderability
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
Temperature Cycling
Vibration
MIL-STD-883, Method 1010
MIL-STD-883, Method 2007 Condition A
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN CONNECTION
1
2
3
4
Crystal
12.5
Connected to Pin 3
Connected to Pin 2
Crystal
MAX
4
1
3
2
2.0 REF
MARKING
ORIENTATION
4.95
MAX
LINE MARKING
1
E8.000
E=Ecliptek Designator
4.0
MAX
1.3 ±0.1
(x4)
1.2 ±0.1
9.0 ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev R 2/17/2010 | Page 1 of 3
EC3SMD-S-8.000M
Suggested Solder Pad Layout
All Dimensions in Millimeters
2.2 (X4)
2.3 (X4)
Solder Land
(X4)
6.7
1.3
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev R 2/17/2010 | Page 2 of 3
EC3SMD-S-8.000M
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
Low Temperature Infrared/Convection 225°C
TS MAX to TL (Ramp-up Rate)
5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
N/A
150°C
N/A
30 - 60 Seconds
Ramp-up Rate (TL to TP)
5°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
150°C
200 Seconds Maximum
Peak Temperature (TP)
225°C Maximum
225°C Maximum 2 Times
80 seconds Maximum 2 Times
5°C/second Maximum
N/A
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev R 2/17/2010 | Page 3 of 3
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