ECB-3.31872M [ECLIPTEK]
CRYSTALS 50/100 -40+85 18PF 3.31872MHZ ATCUT FUND HC-49/U;
| 型号： | ECB-3.31872M |
| 厂家： | 
Ecliptek |
| 描述： | CRYSTALS 50/100 -40+85 18PF 3.31872MHZ ATCUT FUND HC-49/U 驱动 晶体 谐振器 |
| 文件： | 总3页 (文件大小：60K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ECB-3.31872M
EC B
-3.31872M
Series
Nominal Frequency
3.31872MHz
Resistance Welded HC-49/U Crystal
Frequency Tolerance/Stability
Load Capacitance
18pF Parallel Resonant
±50ppm at 25°C, ±100ppm over -40°C to +85°C
Mode of Operation
AT-Cut Fundamental
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Tolerance/Stability
Aging at 25°C
3.31872MHz
±50ppm at 25°C, ±100ppm over -40°C to +85°C
±5ppm/year Maximum
18pF Parallel Resonant
7pF Maximum
Load Capacitance
Shunt Capacitance (C0)
Equivalent Series Resistance
Mode of Operation
200 Ohms Maximum
AT-Cut Fundamental
Drive Level
2mWatts Maximum
Storage Temperature Range
Insulation Resistance
-40°C to +85°C
500 Megaohms Minimum at 100Vdc
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test
MIL-STD-883, Method 1014, Condition A
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 2004
Gross Leak Test
Lead Integrity
Mechanical Shock
Resistance to Soldering Heat
Resistance to Solvents
Solderability
MIL-STD-202, Method 213, Condition C
MIL-STD-202, Method 210
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
Temperature Cycling
Vibration
MIL-STD-883, Method 1010
MIL-STD-883, Method 2007, Condition A
MECHANICAL DIMENSIONS (all dimensions in millimeters)
LINE MARKING
1
2
ECLIPTEK
E3.3187M
E=Ecliptek Designator or
Blank (No Marking)
12.70
MIN
3
XX
DIA 0.457
±0.051(X2)
XX=Ecliptek Manufacturing
Code
11.18
MAX
4.88 ±0.20
4.70
MAX
13.58
MAX
www.ecliptek.com | Specification Subject to Change Without Notice | Rev P 2/16/2010 | Page 1 of 3
ECB-3.31872M
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
High Temperature Solder Bath (Wave Solder)
TS MAX to TL (Ramp-up Rate)
3°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
150°C
175°C
200°C
60 - 180 Seconds
Ramp-up Rate (TL to TP)
3°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
217°C
60 - 150 Seconds
Peak Temperature (TP)
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
www.ecliptek.com | Specification Subject to Change Without Notice | Rev P 2/16/2010 | Page 2 of 3
ECB-3.31872M
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
Low Temperature Solder Bath (Wave Solder)
TS MAX to TL (Ramp-up Rate)
5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
N/A
150°C
N/A
30 - 60 Seconds
Ramp-up Rate (TL to TP)
5°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
150°C
200 Seconds Maximum
Peak Temperature (TP)
245°C Maximum
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
245°C Maximum 1 Time / 235°C Maximum 2 Times
5 seconds Maximum 1 Time / 15 seconds Maximum 2 Times
5°C/second Maximum
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev P 2/16/2010 | Page 3 of 3
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