ECCM1E-9.000M TR [ECLIPTEK]
CRYSTALS 30/50 -40+85 18PF P 9.000MHZ ATCUT FUND 7X5MM 4PAD SMD;
| 型号： | ECCM1E-9.000M TR |
| 厂家： | 
Ecliptek |
| 描述： | CRYSTALS 30/50 -40+85 18PF P 9.000MHZ ATCUT FUND 7X5MM 4PAD SMD |
| 文件： | 总4页 (文件大小：122K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
RoHS
Pb
ECCM1E-9.000M
ECCM1 E
-9.000M
Series
Nominal Frequency
RoHS Compliant (Pb-free) 5.0mm x 7.0mm Ceramic
SMD Crystal
9.000MHz
Load Capacitance
18pF Parallel Resonant
Frequency Tolerance/Stability
±30ppm at 25°C, ±50ppm over -40°C to +85°C
Mode of Operation
AT-Cut Fundamental
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Tolerance/Stability
Aging at 25°C
9.000MHz
±30ppm at 25°C, ±50ppm over -40°C to +85°C
±3ppm/year Maximum
Load Capacitance
18pF Parallel Resonant
Shunt Capacitance (C0)
Equivalent Series Resistance
Mode of Operation
7pF Maximum
90 Ohms Maximum
AT-Cut Fundamental
Drive Level
50µWatts Maximum, 50µWatts Correlation
-3dB Minimum (Measured from Fo to Fo +5000ppm)
-40°C to +85°C
Spurious Response
Storage Temperature Range
Insulation Resistance
500 Megaohms Minimum (Measured at 100Vdc)
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
MIL-STD-883, Method 3015, Class 1, HBM: 1500V
MIL-STD-883, Method 1014, Condition A
UL94-V0
Fine Leak Test
Flammability
Gross Leak Test
Mechanical Shock
Moisture Resistance
Moisture Sensitivity
Resistance to Soldering Heat
Resistance to Solvents
Solderability
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 1004
J-STD-020, MSL 1
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
Temperature Cycling
Vibration
MIL-STD-883, Method 1010, Condition B
MIL-STD-883, Method 2007, Condition A
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN CONNECTION
1
2
3
4
Crystal
5.00
2.54 ±0.20
1.5 +0.1/-0.4
Cover/Ground
Crystal
±0.15
1.2 ±0.1
(x3)
Cover/Ground
1
2
4
3
1
2
4
LINE MARKING
7.00
±0.15
4.6
±0.2
1
E9.000
E=Ecliptek Designator
2
XXXXX
XXXXX=Ecliptek
Manufacturing Identifier
3
1.0 ±0.2
(x4)
1.3 MAX
Note: Chamfer not shown.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev S 2/16/2010 | Page 1 of 4
ECCM1E-9.000M
Suggested Solder Pad Layout
All Dimensions in Millimeters
1.4 (x4)
2.2 (X4)
Solder Land
(X4)
3.6
1.1
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev S 2/16/2010 | Page 2 of 4
ECCM1E-9.000M
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
High Temperature Infrared/Convection
TS MAX to TL (Ramp-up Rate)
3°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
150°C
175°C
200°C
60 - 180 Seconds
Ramp-up Rate (TL to TP)
3°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
217°C
60 - 150 Seconds
Peak Temperature (TP)
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
www.ecliptek.com | Specification Subject to Change Without Notice | Rev S 2/16/2010 | Page 3 of 4
ECCM1E-9.000M
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
Low Temperature Infrared/Convection 240°C
TS MAX to TL (Ramp-up Rate)
5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
N/A
150°C
N/A
60 - 120 Seconds
Ramp-up Rate (TL to TP)
5°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
150°C
200 Seconds Maximum
Peak Temperature (TP)
240°C Maximum
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
240°C Maximum 1 Time / 230°C Maximum 2 Times
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev S 2/16/2010 | Page 4 of 4
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