ECCM1T-66.667MTR [ECLIPTEK]
QUARTZ CRYSTAL RESONATOR, 66.667 MHz, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN;
| 型号： | ECCM1T-66.667MTR |
| 厂家： | 
Ecliptek |
| 描述： | QUARTZ CRYSTAL RESONATOR, 66.667 MHz, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN 驱动 晶体 谐振器 |
| 文件： | 总5页 (文件大小：154K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
RoHS
Pb
ECCM1T-66.667M TR
ECCM1
T
-66.667M TR
Series
Packaging Options
RoHS Compliant (Pb-free) 5.0mm x 7.0mm Ceramic
SMD Crystal
Tape & Reel
Nominal Frequency
Frequency Tolerance/Stability
±50ppm at 25°C, ±100ppm over 0°C to +70°C
66.667MHz
Load Capacitance
18pF Parallel Resonant
Mode of Operation
AT-Cut Third Overtone
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Tolerance/Stability
Aging at 25°C
66.667MHz
±50ppm at 25°C, ±100ppm over 0°C to +70°C
±3ppm/year Maximum
Load Capacitance
18pF Parallel Resonant
Shunt Capacitance (C0)
Equivalent Series Resistance
Mode of Operation
7pF Maximum
80 Ohms Maximum
AT-Cut Third Overtone
Drive Level
50µWatts Maximum, 50µWatts Correlation
-3dB Minimum (Measured from Fo to Fo +5000ppm)
-40°C to +85°C
Spurious Response
Storage Temperature Range
Insulation Resistance
500 Megaohms Minimum (Measured at 100Vdc)
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
MIL-STD-883, Method 3015, Class 1, HBM: 1500V
MIL-STD-883, Method 1014, Condition A
UL94-V0
Fine Leak Test
Flammability
Gross Leak Test
Mechanical Shock
Moisture Resistance
Moisture Sensitivity
Resistance to Soldering Heat
Resistance to Solvents
Solderability
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 1004
J-STD-020, MSL 1
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
Temperature Cycling
Vibration
MIL-STD-883, Method 1010, Condition B
MIL-STD-883, Method 2007, Condition A
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN CONNECTION
1
2
3
4
Crystal
5.00
2.54 ±0.20
Cover/Ground
Crystal
±0.15
1.2 ±0.1
(x4)
Cover/Ground
1
2
4
1
2
4
LINE MARKING
7.00
±0.15
4.6
±0.2
1
E66.66
E=Ecliptek Designator
2
XXXXX
XXXXX=Ecliptek
Manufacturing Identifier
3
3
1.0 ±0.2
(x4)
1.3 MAX
Note: Chamfer and index
mark not shown.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev T 3/11/2011 | Page 1 of 5
ECCM1T-66.667M TR
Suggested Solder Pad Layout
All Dimensions in Millimeters
1.4 (x4)
2.2 (X4)
Solder Land
(X4)
3.6
1.1
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev T 3/11/2011 | Page 2 of 5
ECCM1T-66.667M TR
Tape & Reel Dimensions
Quantity Per Reel: 1,000 units
4.0 ±0.2
2.0 ±0.2
DIA 1.5 ±0.1
0.30 ±0.05
7.5 ±0.2
16.0 ±0.3
7.9
±0.1
6.75 ±0.20
8.0 ±0.2
5.4 ±0.1
1.7 ±0.1
*Compliant to EIA 481A
1.5 MIN
22.4 MAX
DIA 40 MIN
Access Hole at
Slot Location
360 MAX
DIA 50 MIN
2.5 MIN Width
10.0 MIN Depth
Tape slot in Core
for Tape Start
DIA 20.2 MIN
DIA 13.0 ±0.2
16.4 +2.0/-0.0
www.ecliptek.com | Specification Subject to Change Without Notice | Rev T 3/11/2011 | Page 3 of 5
ECCM1T-66.667M TR
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
High Temperature Infrared/Convection
TS MAX to TL (Ramp-up Rate)
3°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
150°C
175°C
200°C
60 - 180 Seconds
Ramp-up Rate (TL to TP)
3°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
217°C
60 - 150 Seconds
Peak Temperature (TP)
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
www.ecliptek.com | Specification Subject to Change Without Notice | Rev T 3/11/2011 | Page 4 of 5
ECCM1T-66.667M TR
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
Low Temperature Infrared/Convection 240°C
TS MAX to TL (Ramp-up Rate)
5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
N/A
150°C
N/A
60 - 120 Seconds
Ramp-up Rate (TL to TP)
5°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
150°C
200 Seconds Maximum
Peak Temperature (TP)
240°C Maximum
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
240°C Maximum 1 Time / 230°C Maximum 2 Times
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev T 3/11/2011 | Page 5 of 5
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