ECX-6407-50.000M [ECLIPTEK]
CRYSTALS 15/30 0+70 16PF 50.000MHZ ATCUT ATCUT FUND 4.0X2.5MM 4PAD SMD;
| 型号： | ECX-6407-50.000M |
| 厂家： | 
Ecliptek |
| 描述： | CRYSTALS 15/30 0+70 16PF 50.000MHZ ATCUT ATCUT FUND 4.0X2.5MM 4PAD SMD |
| 文件： | 总4页 (文件大小：83K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
RoHS
Pb
ECX-6407-50.000M
PLEASE NOTE: Due to the inherent proprietary nature of custom part numbers, certain parameters
are intentionally excluded from this specification sheet.
ECX-6407 -50.000M
Series
Nominal Frequency
Ecliptek Custom Crystal
50.000MHz
ELECTRICAL SPECIFICATIONS
Nominal Frequency
50.000MHz
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test
JIS C 6701 10.6 Leak Rate: 2.1 x 10-9 Pa-m3/6 Maximum
JIS C 6701 10.6 Leak Rate: 1.27 x 10-5 Pa-m3/8 Maximum
JIS C 7021 B-10: at 85°C for 1000 Hours
Gross Leak Test
High Temperature Storage
Low Temperature Storage
Mechanical Shock
Moisture Resistance
Solder Thermal Stability
Thermal Shock
JIS C 7021 B-12: at -40°C for 1000 Hours
Random Drop on Rigid Hard Wood Surface 3 Times at Height of 75cm
JIS C 7021 B-11: at 85°C and 90% Humidity for 1000 Hours
Recommended Reflow Temperature Profile 1 Time
100 Cycles over -40°C to +85°C for 30 Minutes
Vibration
JIS C 6701 10.26: at 10Hz to 55Hz, 1.5mm Amplitude for 1 Minute. Test Time: X, Y, Z Each Direction for 2
Hours.
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN CONNECTION
2.50
1
2
3
4
Crystal
0.70 ±0.10
±0.20
Cover/Ground
Crystal
Cover/Ground
2
1
3
4
LINE MARKING
1
2
ECX
6407
4.00
±0.20
2.00
±0.10
0.70 ±0.10
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 1 of 4
ECX-6407-50.000M
Suggested Solder Pad Layout
All Dimensions in Millimeters
1.2 (X4)
1.4 (X4)
Solder Land
(X4)
1.6
0.5
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 2 of 4
ECX-6407-50.000M
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
High Temperature Infrared/Convection
TS MAX to TL (Ramp-up Rate)
3°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
150°C
175°C
200°C
60 - 180 Seconds
Ramp-up Rate (TL to TP)
3°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
217°C
60 - 150 Seconds
Peak Temperature (TP)
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 3 of 4
ECX-6407-50.000M
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
Low Temperature Infrared/Convection 245°C
TS MAX to TL (Ramp-up Rate)
5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
N/A
150°C
N/A
30 - 60 Seconds
Ramp-up Rate (TL to TP)
5°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
150°C
200 Seconds Maximum
Peak Temperature (TP)
245°C Maximum
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
245°C Maximum 2 Times / 230°C Maximum 1 Time
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 4 of 4
相关型号：
ECX-6424-14.318M TR
CRYSTALS 30/50 -20+70 12PF 14.318MHZ ATCUT ATCUT FUND 4.0X2.5MM 4PAD SMD
ECLIPTEK
©2020 ICPDF网 联系我们和版权申明