ECXO-1612-155.736M [ECLIPTEK]

OSCILLATORS -20+70 5.0V 4 155.736MHZ CMOS HALF 8PIN DIP;
ECXO-1612-155.736M
型号: ECXO-1612-155.736M
厂家: Ecliptek    Ecliptek
描述:

OSCILLATORS -20+70 5.0V 4 155.736MHZ CMOS HALF 8PIN DIP

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RoHS  
Pb  
ECXO-1612-155.736M  
PLEASE NOTE: Due to the inherent proprietary nature of custom part numbers, certain parameters  
are intentionally excluded from this specification sheet.  
ECXO-1612 -155.736M  
Series  
Nominal Frequency  
Ecliptek Custom Oscillator  
155.736MHz  
ELECTRICAL SPECIFICATIONS  
Nominal Frequency  
155.736MHz  
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS  
Fine Leak Test  
MIL-STD-883, Method 1014, Condition A  
MIL-STD-883, Method 1014, Condition C  
MIL-STD-883, Method 2004  
Gross Leak Test  
Lead Integrity  
Mechanical Shock  
Resistance to Soldering Heat  
Resistance to Solvents  
Solderability  
MIL-STD-202, Method 213, Condition C  
MIL-STD-202, Method 210  
MIL-STD-202, Method 215  
MIL-STD-883, Method 2003  
Temperature Cycling  
Vibration  
MIL-STD-883, Method 1010  
MIL-STD-883, Method 2007, Condition A  
MECHANICAL DIMENSIONS (all dimensions in millimeters)  
PIN CONNECTION  
1
4
5
8
Power Down  
7.620 ±0.203  
0.8 ±0.1 (X3)  
Ground/Case Ground  
Output  
1
8
4
5
DIA 0.457  
7.620  
Supply Voltage  
±0.1 (X4)  
5.08 MIN  
±0.203  
LINE MARKING  
1
2
3
4
ECLIPTEK  
ECXO1612  
155.73M  
5.6 MAX  
XXYZZ  
XX=Ecliptek Manufacturing  
Designator  
MARKING  
13.2  
MAX  
ORIENTATION  
Y=Last Digit Of Year  
ZZ=Week of Year  
13.2  
MAX  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 1 of 4  
ECXO-1612-155.736M  
Recommended Solder Reflow Methods  
Critical Zone  
TL to TP  
TP  
Ramp-up  
Ramp-down  
TL  
TS Max  
TS Min  
tL  
tP  
tSPreheat  
t 25°C to Peak  
Time (t)  
High Temperature Solder Bath (Wave Solder)  
TS MAX to TL (Ramp-up Rate)  
3°C/second Maximum  
Preheat  
- Temperature Minimum (TS MIN)  
- Temperature Typical (TS TYP)  
- Temperature Maximum (TS MAX)  
- Time (tS MIN)  
150°C  
175°C  
200°C  
60 - 180 Seconds  
Ramp-up Rate (TL to TP)  
3°C/second Maximum  
Time Maintained Above:  
- Temperature (TL)  
- Time (tL)  
217°C  
60 - 150 Seconds  
Peak Temperature (TP)  
260°C Maximum for 10 Seconds Maximum  
250°C +0/-5°C  
Target Peak Temperature (TP Target)  
Time within 5°C of actual peak (tp)  
Ramp-down Rate  
20 - 40 seconds  
6°C/second Maximum  
8 minutes Maximum  
Level 1  
Time 25°C to Peak Temperature (t)  
Moisture Sensitivity Level  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 2 of 4  
ECXO-1612-155.736M  
Recommended Solder Reflow Methods  
Critical Zone  
TL to TP  
TP  
Ramp-up  
Ramp-down  
TL  
TS Max  
TS Min  
tL  
tP  
tSPreheat  
t 25°C to Peak  
Time (t)  
Low Temperature Infrared/Convection 185°C  
TS MAX to TL (Ramp-up Rate)  
5°C/second Maximum  
Preheat  
- Temperature Minimum (TS MIN)  
- Temperature Typical (TS TYP)  
- Temperature Maximum (TS MAX)  
- Time (tS MIN)  
N/A  
150°C  
N/A  
60 - 120 Seconds  
Ramp-up Rate (TL to TP)  
5°C/second Maximum  
Time Maintained Above:  
- Temperature (TL)  
- Time (tL)  
150°C  
200 Seconds Maximum  
Peak Temperature (TP)  
185°C Maximum  
185°C Maximum 2 Times  
10 seconds Maximum 2 Times  
5°C/second Maximum  
N/A  
Target Peak Temperature (TP Target)  
Time within 5°C of actual peak (tp)  
Ramp-down Rate  
Time 25°C to Peak Temperature (t)  
Moisture Sensitivity Level  
Level 1  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 3 of 4  
ECXO-1612-155.736M  
Recommended Solder Reflow Methods  
Critical Zone  
TL to TP  
TP  
Ramp-up  
Ramp-down  
TL  
TS Max  
TS Min  
tL  
tP  
tSPreheat  
t 25°C to Peak  
Time (t)  
Low Temperature Solder Bath (Wave Solder)  
TS MAX to TL (Ramp-up Rate)  
5°C/second Maximum  
Preheat  
- Temperature Minimum (TS MIN)  
- Temperature Typical (TS TYP)  
- Temperature Maximum (TS MAX)  
- Time (tS MIN)  
N/A  
150°C  
N/A  
30 - 60 Seconds  
Ramp-up Rate (TL to TP)  
5°C/second Maximum  
Time Maintained Above:  
- Temperature (TL)  
- Time (tL)  
150°C  
200 Seconds Maximum  
Peak Temperature (TP)  
245°C Maximum  
Target Peak Temperature (TP Target)  
Time within 5°C of actual peak (tp)  
Ramp-down Rate  
245°C Maximum 1 Time / 235°C Maximum 2 Times  
5 seconds Maximum 1 Time / 15 seconds Maximum 2 Times  
5°C/second Maximum  
Time 25°C to Peak Temperature (t)  
Moisture Sensitivity Level  
N/A  
Level 1  
Low Temperature Manual Soldering  
185°C Maximum for 10 seconds Maximum, 2 times Maximum.  
High Temperature Manual Soldering  
260°C Maximum for 5 seconds Maximum, 2 times Maximum.  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 4 of 4  

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