ECXO-1784-44.736M [ECLIPTEK]
OSCILLATORS 25PPM 0+70 10% 45/ 44.736MHZ FS 100PPM VCXO FULL 14PIN DIP;
| 型号： | ECXO-1784-44.736M |
| 厂家： | 
Ecliptek |
| 描述： | OSCILLATORS 25PPM 0+70 10% 45/ 44.736MHZ FS 100PPM VCXO FULL 14PIN DIP 石英晶振 压控振荡器 |
| 文件： | 总4页 (文件大小：79K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ECXO-1784-44.736M
PLEASE NOTE: Due to the inherent proprietary nature of custom part numbers, certain parameters
are intentionally excluded from this specification sheet.
ECXO-1784 -44.736M
Series
Nominal Frequency
Ecliptek Custom Oscillator
44.736MHz
ELECTRICAL SPECIFICATIONS
Nominal Frequency
44.736MHz
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test
MIL-STD-883, Method 1014, Condition A
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 2004
Gross Leak Test
Lead Integrity
Mechanical Shock
Resistance to Soldering Heat
Resistance to Solvents
Solderability
MIL-STD-202, Method 213, Condition C
MIL-STD-202, Method 210
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
Temperature Cycling
Vibration
MIL-STD-883, Method 1010
MIL-STD-883, Method 2007, Condition A
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN CONNECTION
15.240
±0.203
1
Voltage Control
Ground/Case Ground
Output
0.9 MAX
DIA 0.457
7
±0.100 (X4)
8
1
7
8
7.620
±0.203
14
Supply Voltage
14
LINE MARKING
1
2
3
4
ECLIPTEK
ECXO1784
44.736M
5.08 MIN
5.08 MAX
XXYZZ
XX=Ecliptek Manufacturing
Designator
Y=Last Digit Of Year
ZZ=Week of Year
MARKING
ORIENTATION
13.2
MAX
20.8 MAX
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 1 of 4
ECXO-1784-44.736M
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
High Temperature Solder Bath (Wave Solder)
TS MAX to TL (Ramp-up Rate)
3°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
150°C
175°C
200°C
60 - 180 Seconds
Ramp-up Rate (TL to TP)
3°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
217°C
60 - 150 Seconds
Peak Temperature (TP)
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
Temperatures shown are applied to back of PCB board and device leads
only. Do not use this method for product with the Gull Wing option.
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
Additional Notes
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 2 of 4
ECXO-1784-44.736M
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
Low Temperature Infrared/Convection 185°C
TS MAX to TL (Ramp-up Rate)
5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
N/A
150°C
N/A
60 - 120 Seconds
Ramp-up Rate (TL to TP)
5°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
150°C
200 Seconds Maximum
Peak Temperature (TP)
185°C Maximum
185°C Maximum 2 Times
10 seconds Maximum 2 Times
5°C/second Maximum
N/A
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
Additional Notes
Level 1
Temperatures shown are applied to body of device. Use this method only
for product with the Gull Wing option.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 3 of 4
ECXO-1784-44.736M
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
Low Temperature Solder Bath (Wave Solder)
TS MAX to TL (Ramp-up Rate)
5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
N/A
150°C
N/A
30 - 60 Seconds
Ramp-up Rate (TL to TP)
5°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
150°C
200 Seconds Maximum
Peak Temperature (TP)
245°C Maximum
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
245°C Maximum 1 Time / 235°C Maximum 2 Times
5 seconds Maximum 1 Time / 15 seconds Maximum 2 Times
5°C/second Maximum
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
Additional Notes
N/A
Level 1
Temperatures shown are applied to back of PCB board and device leads
only. Do not use this method for product with the Gull Wing option.
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum. (Temperatures listed are applied to device leads only.
This method can be utilized with both Gull Wing and Non-Gull Wing devices.)
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum. (Temperatures listed are applied to device leads only. This
method can be utilized with both Gull Wing and Non-Gull Wing devices.)
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 4 of 4
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