ECXO-1949-20.000M [ECLIPTEK]
OSCILLATORS 50PPM -40+85 3.3V 4 20.000MHZ TS HCMOS PLASTIC 4 J-LEAD SMD;
| 型号： | ECXO-1949-20.000M |
| 厂家： | 
Ecliptek |
| 描述： | OSCILLATORS 50PPM -40+85 3.3V 4 20.000MHZ TS HCMOS PLASTIC 4 J-LEAD SMD |
| 文件： | 总3页 (文件大小：94K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ECXO-1949-20.000M
PLEASE NOTE: Due to the inherent proprietary nature of custom part numbers, certain parameters
are intentionally excluded from this specification sheet.
ECXO-1949 -20.000M
Series
Nominal Frequency
Ecliptek Custom Oscillator
20.000MHz
ELECTRICAL SPECIFICATIONS
Nominal Frequency
20.000MHz
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test
MIL-STD-883, Method 1014, Condition A
MIL-STD-883, Method 1014, Condition C
MIL-STD-202, Method 213, Condition C
MIL-STD-202, Method 210
Gross Leak Test
Mechanical Shock
Resistance to Soldering Heat
Resistance to Solvents
Solderability
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
Temperature Cycling
Vibration
MIL-STD-883, Method 1010
MIL-STD-883, Method 2007, Condition A
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN CONNECTION
1
2
3
4
Tri-State
5.080
0.25 MIN
±0.203
Ground/Case Ground
Output
4
3
Supply Voltage
9.8
MAX
7.620
±0.203
MARKING
ORIENTATION
LINE MARKING
1
2
1
2
3
ECXO1949
20.000M
4.7
MAX
14.0
MAX
0.510 ±0.203
XXYZZ
XX=Ecliptek Manufacturing
Designator
Y=Last Digit Of Year
ZZ=Week of Year
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/17/2010 | Page 1 of 3
ECXO-1949-20.000M
Suggested Solder Pad Layout
All Dimensions in Millimeters
1.27 (X4)
3.0 (X4)
Solder Land
(X4)
5.8
3.81
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/17/2010 | Page 2 of 3
ECXO-1949-20.000M
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
Low Temperature Infrared/Convection 240°C
TS MAX to TL (Ramp-up Rate)
5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
N/A
150°C
N/A
60 - 120 Seconds
Ramp-up Rate (TL to TP)
5°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
150°C
200 Seconds Maximum
Peak Temperature (TP)
240°C Maximum
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
240°C Maximum 1 Time / 230°C Maximum 2 Times
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/17/2010 | Page 3 of 3
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