EH1345ETTS-66.000M-G [ECLIPTEK]
CRYSTAL OSCILLATOR, CLOCK, 66 MHz, LVCMOS OUTPUT, ROHS COMPLIANT, METAL, GULLWING, DIP-14/4;
| 型号： | EH1345ETTS-66.000M-G |
| 厂家： | 
Ecliptek |
| 描述： | CRYSTAL OSCILLATOR, CLOCK, 66 MHz, LVCMOS OUTPUT, ROHS COMPLIANT, METAL, GULLWING, DIP-14/4 机械 输出元件 振荡器 |
| 文件： | 总6页 (文件大小：164K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
RoHS
Pb
EH1345ETTS-66.000M-G
EH13 45
ET
TS -66.000M - G
Series
Gull Wing
RoHS Compliant (Pb-free) 3.3V 14 Pin DIP Metal
Thru-Hole LVCMOS High Frequency Oscillator
Gull Wing
Value Added Option Prefix
Nominal Frequency
66.000MHz
Pin 1 Connection
Tri-State (High Impedance)
Frequency Tolerance/Stability
±50ppm Maximum
Package
Operating Temperature Range
-40°C to +85°C
Duty Cycle
50 ±10(%)
ELECTRICAL SPECIFICATIONS
Nominal Frequency
66.000MHz
Frequency Tolerance/Stability
±50ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the
Operating Temperature Range, Supply Voltage Changem Output Load Change, Output Load Change, 1st
Year Aging at 25°C, Shock, and Vibration)
Aging at 25°C
±5ppm/year Maximum
Operating Temperature Range
Supply Voltage
-40°C to +85°C
3.3Vdc ±0.3Vdc
Input Current
35mA Maximum (No Load)
2.7Vdc Minimum (IOH = -8mA)
0.5Vdc Maximum (IOL = +8mA)
6nSec Maximum (Measured at 20% to 80% of waveform)
50 ±10(%) (Measured at 50% of waveform)
30pF Maximum
Output Voltage Logic High (Voh)
Output Voltage Logic Low (Vol)
Rise/Fall Time
Duty Cycle
Load Drive Capability
Output Logic Type
CMOS
Pin 1 Connection
Tri-State (High Impedance)
Tri-State Input Voltage (Vih and Vil)
70% of Vdd Minimum to Enable Output, 20% of Vdd Maximum to Disable Output, No Connect to Enable
Output.
Absolute Clock Jitter
±250pSec Maximum, ±100pSec Typical
±50pSec Maximum, ±40pSec Typical
10mSec Maximum
One Sigma Clock Period Jitter
Start Up Time
Storage Temperature Range
-55°C to +125°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test
MIL-STD-883, Method 1014, Condition A
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 2004
Gross Leak Test
Lead Integrity
Mechanical Shock
Resistance to Soldering Heat
Resistance to Solvents
Solderability
MIL-STD-202, Method 213, Condition C
MIL-STD-202, Method 210
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
Temperature Cycling
Vibration
MIL-STD-883, Method 1010
MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 3/12/2011 | Page 1 of 6
EH1345ETTS-66.000M-G
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN CONNECTION
15.240
±0.203
1
Tri-State (High
Impedance)
0.9 MAX
DIA 0.457
7
Ground/Case Ground
Output
±0.100 (X4)
1
7
8
8
7.620
±0.203
14
Supply Voltage
14
LINE MARKING
1
2
ECLIPTEK
5.08 MIN
EH13TS
EH13=Product Series
5.08 MAX
3
4
66.000M
MARKING
ORIENTATION
13.2
MAX
XXYZZ
XX=Ecliptek Manufacturing
Code
Y=Last Digit of the Year
ZZ=Week of the Year
20.8 MAX
OUTPUT WAVEFORM & TIMING DIAGRAM
VIH
VIL
VOH
80% of Waveform
OUTPUT DISABLE
(HIGH IMPEDANCE
STATE)
50% of Waveform
20% of Waveform
VOL
tPLZ
tPZL
Fall
Time
Rise
Time
TW
T
Duty Cycle (%) = TW/T x 100
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 3/12/2011 | Page 2 of 6
EH1345ETTS-66.000M-G
Test Circuit for CMOS Output
Frequency
Counter
Oscilloscope
Probe
(Note 2)
Supply
Voltage
(VDD
)
Output
_
+
Current
Meter
+
+
Power
Supply
0.01µF
(Note 1)
Voltage
Meter
0.1µF
(Note 1)
CL
(Note 3)
Ground
_
_
No Connect
or Tri-State
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency
ceramic bypass capacitor close to the package ground and VDD pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 3/12/2011 | Page 3 of 6
EH1345ETTS-66.000M-G
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
High Temperature Solder Bath (Wave Solder)
TS MAX to TL (Ramp-up Rate)
3°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
150°C
175°C
200°C
60 - 180 Seconds
Ramp-up Rate (TL to TP)
3°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
217°C
60 - 150 Seconds
Peak Temperature (TP)
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
Temperatures shown are applied to back of PCB board and device leads
only. Do not use this method for product with the Gull Wing option.
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
Additional Notes
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 3/12/2011 | Page 4 of 6
EH1345ETTS-66.000M-G
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
Low Temperature Infrared/Convection 185°C
TS MAX to TL (Ramp-up Rate)
5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
N/A
150°C
N/A
60 - 120 Seconds
Ramp-up Rate (TL to TP)
5°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
150°C
200 Seconds Maximum
Peak Temperature (TP)
185°C Maximum
185°C Maximum 2 Times
10 seconds Maximum 2 Times
5°C/second Maximum
N/A
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
Additional Notes
Level 1
Temperatures shown are applied to body of device. Use this method only
for product with the Gull Wing option.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 3/12/2011 | Page 5 of 6
EH1345ETTS-66.000M-G
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
Low Temperature Solder Bath (Wave Solder)
TS MAX to TL (Ramp-up Rate)
5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
N/A
150°C
N/A
30 - 60 Seconds
Ramp-up Rate (TL to TP)
5°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
150°C
200 Seconds Maximum
Peak Temperature (TP)
245°C Maximum
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
245°C Maximum 1 Time / 235°C Maximum 2 Times
5 seconds Maximum 1 Time / 15 seconds Maximum 2 Times
5°C/second Maximum
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
Additional Notes
N/A
Level 1
Temperatures shown are applied to back of PCB board and device leads
only. Do not use this method for product with the Gull Wing option.
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum. (Temperatures listed are applied to device leads only.
This method can be utilized with both Gull Wing and Non-Gull Wing devices.)
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum. (Temperatures listed are applied to device leads only. This
method can be utilized with both Gull Wing and Non-Gull Wing devices.)
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 3/12/2011 | Page 6 of 6
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