EH3525TTS-16.000MTR [ECLIPTEK]
CRYSTAL OSCILLATOR, CLOCK, 16MHz, HCMOS/TTL OUTPUT, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN;型号: | EH3525TTS-16.000MTR |
厂家: | Ecliptek |
描述: | CRYSTAL OSCILLATOR, CLOCK, 16MHz, HCMOS/TTL OUTPUT, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN 机械 输出元件 振荡器 |
文件: | 总7页 (文件大小:197K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
RoHS
Pb
EH3525TTS-16.000M TR
EH35 25
T TS -16.000M TR
Series
Packaging Options
RoHS Compliant (Pb-free) 5.0V 4 Pad 3.2mm x 5mm
Ceramic SMD HCMOS/TTL High Frequency Oscillator
Tape & Reel
Nominal Frequency
Frequency Tolerance/Stability
±25ppm Maximum
16.000MHz
Pin 1 Connection
Tri-State (Disabled Output: High Impedance)
Operating Temperature Range
0°C to +70°C
Duty Cycle
50 ±5(%)
ELECTRICAL SPECIFICATIONS
Nominal Frequency
16.000MHz
Frequency Tolerance/Stability
±25ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the
Operating Temperature Range, Supply Voltage Change, Output Load Change, 1st Year Aging at 25°C,
Shock, and Vibration)
Aging at 25°C
±5ppm/year Maximum
Operating Temperature Range
Supply Voltage
0°C to +70°C
5.0Vdc ±10%
Input Current
50mA Maximum (No Load)
Output Voltage Logic High (Voh)
Output Voltage Logic Low (Vol)
Rise/Fall Time
2.4Vdc Minimum with TTL Load, Vdd-0.4Vdc Minimum with HCMOS Load (IOH = -16mA)
0.4Vdc Maximum with TTL Load, 0.5Vdc Maximum with HCMOS Load (IOL = +16mA)
6nSec Maximum (Measured at 0.8Vdc to 2.0Vdc with TTL Load or at 20% to 80% of waveform with
HCMOS Load)
Duty Cycle
50 ±5(%) (Measured at 50% of waveform with TTL Load or with HCMOS Load)
10TTL Load or 50pF HCMOS Load Maximum
CMOS
Load Drive Capability
Output Logic Type
Pin 1 Connection
Tri-State (Disabled Output: High Impedance)
Tri-State Input Voltage (Vih and Vil)
+2.2Vdc Minimum to enable output, +0.8Vdc Maximum to disable output (High Impedance), No Connect to
enable output.
Absolute Clock Jitter
±250pSec Maximum, ±100pSec Typical
±50pSec Maximum, ±30pSec Typical
10mSec Maximum
One Sigma Clock Period Jitter
Start Up Time
Storage Temperature Range
-55°C to +125°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test
MIL-STD-883, Method 1014, Condition A
MIL-STD-883, Method 1014, Condition C
MIL-STD-202, Method 213, Condition C
MIL-STD-202, Method 210
Gross Leak Test
Mechanical Shock
Resistance to Soldering Heat
Resistance to Solvents
Solderability
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
Temperature Cycling
Vibration
MIL-STD-883, MEthod 1010
MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 3/12/2011 | Page 1 of 7
EH3525TTS-16.000M TR
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN CONNECTION
1
2
3
4
Tri-State
Ground/Case Ground
Output
1.20 ±0.20 (x4)
3.20
±0.20
1.00 ±0.20 (x4)
Supply Voltage
LINE MARKING
4
3
1
2
1
E16.000
5.00
±0.20
2.54
±0.15
E=Ecliptek Designator
1.20
±0.20
(x4)
2.20
±0.15
1.3
MAX
Suggested Solder Pad Layout
All Dimensions in Millimeters
1.2 (X4)
1.4 (X4)
Solder Land
(X4)
1.14
1.0
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 3/12/2011 | Page 2 of 7
EH3525TTS-16.000M TR
OUTPUT WAVEFORM & TIMING DIAGRAM
VIH
VIL
VOH
80% or 2.0VDC
OUTPUT DISABLE
(HIGH IMPEDANCE
STATE)
50% or 1.4VDC
20% or 0.8VDC
VOL
tPLZ
tPZL
Fall
Time
Rise
Time
TW
T
Duty Cycle (%) = TW/T x 100
Test Circuit for TTL Output
RL Value
(Ohms)
Output Load
Drive Capability
CL Value
(pF)
390
780
15
15
6
10TTL
5TTL
Frequency
Counter
1100
2000
2200
2TTL
Oscilloscope
15
3
10LSTTL
1TTL
Table 1: RL Resistance Value and CL Capacitance
Value Vs. Output Load Drive Capability
Probe
Supply
Voltage
(Note 2)
RL
(Note 4)
(VDD
)
Output
_
+
Current
Meter
+
+
+
Power
Supply
0.01µF
(Note 1)
Power
Supply
_
Voltage
Meter
0.1µF
(Note 1)
CL
(Note 3)
Ground
_
_
No Connect
or Tri-State
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency
ceramic bypass capacitor close to the package ground and VDD pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.
Note 4: Resistance value RL is shown in Table 1. See applicable specification sheet for 'Load Drive Capability'.
Note 5: All diodes are MMBD7000, MMBD914, or equivalent.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 3/12/2011 | Page 3 of 7
EH3525TTS-16.000M TR
Test Circuit for CMOS Output
Frequency
Counter
Oscilloscope
Probe
(Note 2)
Supply
Voltage
(VDD
)
Output
_
+
Current
Meter
+
+
Power
Supply
0.01µF
(Note 1)
Voltage
Meter
0.1µF
(Note 1)
CL
(Note 3)
Ground
_
_
No Connect
or Tri-State
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency
ceramic bypass capacitor close to the package ground and VDD pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 3/12/2011 | Page 4 of 7
EH3525TTS-16.000M TR
Tape & Reel Dimensions
Quantity Per Reel: 1,000 units
4.0 ±0.1
2.0 ±0.1
DIA 1.5 +0.1/-0.0
0.30 ±0.05
5.5 ±0.1
12.0 ±0.2
A0*
6.5 ±0.1
8.0 ±0.1
B0*
K0*
*Compliant to EIA 481A
1.5 MIN
18.4 MAX
DIA 40 MIN
Access Hole at
Slot Location
180 MAX
DIA 50 MIN
2.5 MIN Width
10.0 MIN Depth
Tape slot in Core
for Tape Start
DIA 20.2 MIN
DIA 13.0 ±0.2
12.4 +2.0/-0.0
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 3/12/2011 | Page 5 of 7
EH3525TTS-16.000M TR
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
High Temperature Infrared/Convection
TS MAX to TL (Ramp-up Rate)
3°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
150°C
175°C
200°C
60 - 180 Seconds
Ramp-up Rate (TL to TP)
3°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
217°C
60 - 150 Seconds
Peak Temperature (TP)
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 3/12/2011 | Page 6 of 7
EH3525TTS-16.000M TR
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
Low Temperature Infrared/Convection 240°C
TS MAX to TL (Ramp-up Rate)
5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
N/A
150°C
N/A
60 - 120 Seconds
Ramp-up Rate (TL to TP)
5°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
150°C
200 Seconds Maximum
Peak Temperature (TP)
240°C Maximum
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
240°C Maximum 1 Time / 230°C Maximum 2 Times
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 3/12/2011 | Page 7 of 7
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