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EH3925TTS-25.000MTR [ECLIPTEK]

CRYSTAL OSCILLATOR, CLOCK, 25MHz, LVCMOS OUTPUT, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN;
EH3925TTS-25.000MTR
型号： EH3925TTS-25.000MTR
厂家： Ecliptek    Ecliptek
描述：

CRYSTAL OSCILLATOR, CLOCK, 25MHz, LVCMOS OUTPUT, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN

机械 输出元件 振荡器
文件： 总6页 (文件大小：235K)
中文：  中文翻译
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RoHS  
Pb  
EH3925TTS-25.000M TR  
EH39 25  
T TS -25.000M TR  
Series  
Packaging Options  
RoHS Compliant (Pb-free) 1.8V 4 Pad 3.2mm x 5mm  
Ceramic SMD LVCMOS Oscillator  
Tape & Reel  
Nominal Frequency  
Frequency Tolerance/Stability  
±25ppm Maximum  
25.000MHz  
Pin 1 Connection  
Tri-State (High Impedance)  
Operating Temperature Range  
0°C to +70°C  
Duty Cycle  
50 ±5(%)  
ELECTRICAL SPECIFICATIONS  
Nominal Frequency  
25.000MHz  
Frequency Tolerance/Stability  
±25ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the  
Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25°,  
260°C Reflow, Shock, and Vibration)  
Aging at 25°C  
±5ppm/Year Maximum  
Operating Temperature Range  
Supply Voltage  
0°C to +70°C  
1.8Vdc ±5%  
Input Current  
3.5mA Maximum (No Load)  
90% of Vdd Minimum (IOH = -8mA)  
10% of Vdd Maximum (IOL = +8mA)  
6nSec Maximum (Measured at 20% to 80% of waveform)  
50 ±5(%) (Measured at 50% of waveform)  
15pF Maximum  
Output Voltage Logic High (Voh)  
Output Voltage Logic Low (Vol)  
Rise/Fall Time  
Duty Cycle  
Load Drive Capability  
Output Logic Type  
CMOS  
Pin 1 Connection  
Tri-State (High Impedance)  
Tri-State Input Voltage (Vih and Vil)  
90% of Vdd Minimum or No Connect to Enable Output, 10% of Vdd Maximum to Disable Output (High  
Impedance)  
Standby Current  
10µA Maximum (Pin 1 = Ground)  
±100pSec Maximum  
10mSec Maximum  
Absolute Clock Jitter  
Start Up Time  
Storage Temperature Range  
-55°C to +125°C  
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS  
ESD Susceptibility  
MIL-STD-883, Method 3015, Class 1, HBM: 1500V  
MIL-STD-883, Method 1014, Condition A  
UL94-V0  
Fine Leak Test  
Flammability  
Gross Leak Test  
Mechanical Shock  
Moisture Resistance  
Moisture Sensitivity  
Resistance to Soldering Heat  
Resistance to Solvents  
Solderability  
MIL-STD-883, Method 1014, Condition C  
MIL-STD-883, Method 2002, Condition B  
MIL-STD-883, Method 1004  
J-STD-020, MSL 1  
MIL-STD-202, Method 210, Condition K  
MIL-STD-202, Method 215  
MIL-STD-883, Method 2003  
Temperature Cycling  
Vibration  
MIL-STD-883, Method 1010, Condition B  
MIL-STD-883, Method 2007, Condition A  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 8/14/2010 | Page 1 of 6  
EH3925TTS-25.000M TR  
MECHANICAL DIMENSIONS (all dimensions in millimeters)  
PIN CONNECTION  
1
2
3
4
Tri-State  
Case Ground  
Output  
1.20 ±0.20  
3.20  
1.00 ±0.20 (x4)  
±0.20  
Supply Voltage  
LINE MARKING  
1
2
EPO  
4
3
1
2
XXXXX  
XXXXX=Ecliptek  
Manufacturing Identifier  
5.00  
±0.20  
2.54  
±0.15  
1.20  
±0.20  
(x4)  
2.20  
±0.15  
1.3  
MAX  
Suggested Solder Pad Layout  
All Dimensions in Millimeters  
1.2 (X4)  
1.4 (X4)  
Solder Land  
(X4)  
1.14  
1.0  
All Tolerances are ±0.1  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 8/14/2010 | Page 2 of 6  
EH3925TTS-25.000M TR  
OUTPUT WAVEFORM & TIMING DIAGRAM  
VIH  
VIL  
VOH  
80% of Waveform  
OUTPUT DISABLE  
(HIGH IMPEDANCE  
STATE)  
50% of Waveform  
20% of Waveform  
VOL  
tPLZ  
tPZL  
Fall  
Time  
Rise  
Time  
TW  
T
Duty Cycle (%) = TW/T x 100  
Test Circuit for CMOS Output  
Frequency  
Counter  
Oscilloscope  
Probe  
(Note 2)  
Supply  
Voltage  
(VDD  
)
Output  
_
+
Current  
Meter  
+
+
Power  
Supply  
0.01µF  
(Note 1)  
Voltage  
Meter  
0.1µF  
(Note 1)  
CL  
(Note 3)  
Ground  
_
_
Tri-State  
Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency  
ceramic bypass capacitor close (less than 2mm) to the package ground and supply voltage  
pin is required.  
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth  
(>300MHz) passive probe is recommended.  
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 8/14/2010 | Page 3 of 6  
EH3925TTS-25.000M TR  
Tape & Reel Dimensions  
Quantity Per Reel: 1,000 units  
4.0 ±0.1  
2.0 ±0.1  
DIA 1.5 +0.1/-0.0  
0.30 ±0.05  
5.5 ±0.1  
12.0 ±0.2  
A0*  
6.5 ±0.1  
8.0 ±0.1  
B0*  
K0*  
*Compliant to EIA 481A  
1.5 MIN  
18.4 MAX  
DIA 40 MIN  
Access Hole at  
Slot Location  
180 MAX  
DIA 50 MIN  
2.5 MIN Width  
10.0 MIN Depth  
Tape slot in Core  
for Tape Start  
DIA 20.2 MIN  
DIA 13.0 ±0.2  
12.4 +2.0/-0.0  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 8/14/2010 | Page 4 of 6  
EH3925TTS-25.000M TR  
Recommended Solder Reflow Methods  
Critical Zone  
TL to TP  
TP  
Ramp-up  
Ramp-down  
TL  
TS Max  
TS Min  
tL  
tP  
tSPreheat  
t 25°C to Peak  
Time (t)  
High Temperature Infrared/Convection  
TS MAX to TL (Ramp-up Rate)  
3°C/second Maximum  
Preheat  
- Temperature Minimum (TS MIN)  
- Temperature Typical (TS TYP)  
- Temperature Maximum (TS MAX)  
- Time (tS MIN)  
150°C  
175°C  
200°C  
60 - 180 Seconds  
Ramp-up Rate (TL to TP)  
3°C/second Maximum  
Time Maintained Above:  
- Temperature (TL)  
- Time (tL)  
217°C  
60 - 150 Seconds  
Peak Temperature (TP)  
260°C Maximum for 10 Seconds Maximum  
250°C +0/-5°C  
Target Peak Temperature (TP Target)  
Time within 5°C of actual peak (tp)  
Ramp-down Rate  
20 - 40 seconds  
6°C/second Maximum  
8 minutes Maximum  
Level 1  
Time 25°C to Peak Temperature (t)  
Moisture Sensitivity Level  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 8/14/2010 | Page 5 of 6  
EH3925TTS-25.000M TR  
Recommended Solder Reflow Methods  
Critical Zone  
TL to TP  
TP  
Ramp-up  
Ramp-down  
TL  
TS Max  
TS Min  
tL  
tP  
tSPreheat  
t 25°C to Peak  
Time (t)  
Low Temperature Infrared/Convection 240°C  
TS MAX to TL (Ramp-up Rate)  
5°C/second Maximum  
Preheat  
- Temperature Minimum (TS MIN)  
- Temperature Typical (TS TYP)  
- Temperature Maximum (TS MAX)  
- Time (tS MIN)  
N/A  
150°C  
N/A  
60 - 120 Seconds  
Ramp-up Rate (TL to TP)  
5°C/second Maximum  
Time Maintained Above:  
- Temperature (TL)  
- Time (tL)  
150°C  
200 Seconds Maximum  
Peak Temperature (TP)  
240°C Maximum  
Target Peak Temperature (TP Target)  
Time within 5°C of actual peak (tp)  
Ramp-down Rate  
240°C Maximum 1 Time / 230°C Maximum 2 Times  
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time  
5°C/second Maximum  
Time 25°C to Peak Temperature (t)  
Moisture Sensitivity Level  
N/A  
Level 1  
Low Temperature Manual Soldering  
185°C Maximum for 10 seconds Maximum, 2 times Maximum.  
High Temperature Manual Soldering  
260°C Maximum for 5 seconds Maximum, 2 times Maximum.  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 8/14/2010 | Page 6 of 6  

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