EMVA13AB1-57.1429MTR [ECLIPTEK]

VCXO, CLOCK, 57.1429 MHz, LVCMOS OUTPUT, ROHS COMPLIANT, SMD, 4 PIN;


型号：	EMVA13AB1-57.1429MTR
厂家：	Ecliptek
描述：	VCXO, CLOCK, 57.1429 MHz, LVCMOS OUTPUT, ROHS COMPLIANT, SMD, 4 PIN 机械输出元件石英晶振压控振荡器
文件：	总6页 (文件大小：197K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

RoHS

EMVA13AB1-57.1429M TR

EMVA13 A B 1 -57.1429M TR

Series

Packaging Options

RoHS Compliant (Pb-free) 4 Pad 5mm x 7mm SMD

Tape & Reel

3.3Vdc LVCMOS Voltage Controlled MEMS Oscillator

Frequency Tolerance/Stability

±50ppm Maximum

Operating Temperature Range

Nominal Frequency

57.1429MHz

Absolute Pull Range

±30ppm Minimum

-40°C to +85°C

ELECTRICAL SPECIFICATIONS

Nominal Frequency

57.1429MHz

Frequency Tolerance/Stability

±50ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the

Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25°C,

260°C Reflow, Shock, and Vibration)

Aging at 25°C

±1ppm Maximum First Year

-40°C to +85°C

Operating Temperature Range

Supply Voltage

3.3Vdc ±10%

Input Current

15mA Maximum

Output Voltage Logic High (Voh)

Output Voltage Logic Low (Vol)

Rise/Fall Time

90% of Vdd Minimum (IOH = -4mA)

10% of Vdd Maximum (IOL = +4mA)

2nSec Maximum (Measured from 20% to 80% of waveform)

50 ±5(%) (Measured at 50% of waveform)

15pF Maximum

Duty Cycle

Load Drive Capability

Output Logic Type

Absolute Pull Range

CMOS

±30ppm Minimum (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the

Operating Temperature Range, Supply Voltage Change, Output Load Change, Shock, Vibration, and First

Year Aging at 25°C over the Control Voltage (Vc).)

Control Voltage

0.05Vdc to 1.7Vdc (Test Condition for APR)

0.0Vdc to 1.8Vdc

Control Voltage Range

Linearity

1% Maximum

Transfer Function

Modulation Bandwidth

Input Impedance

Positive Transfer Characteristic

8kHz Typical, 5kHz Minimum (Measured at -3dB, Vc = 0.875Vdc)

250kOhms Minimum

Input Leakage Current

Typical Phase Noise at Offsets

10µA Maximum

-100dBc/Hz at offset of 10kHz, -115dBc/Hz at offset of 100kHz, -145dBc/Hz at offset of 1MHz, and -

154dBc/Hz at offset of 10MHz

Period Jitter (RMS)

Period Jitter (pk-pk)

3pSec Typical, 6pSec Maximum

20pSec Typical, 40pSec Maximum

0.8pSec Typical

RMS Phase Jitter (Fj = 1.875MHz to

20MHz; Random)

RMS Phase Jitter (Fj = 900kHz to

7.5MHz; Random)

0.6pSec Typical

Start Up Time

10mSec Maximum

-55°C to +125°C

Storage Temperature Range

ENVIRONMENTAL & MECHANICAL SPECIFICATIONS

ESD Susceptibility

MIL-STD-883, Method 3015, Class 2, HBM 2000V

Flammability

UL94-V0

Mechanical Shock

MIL-STD-883, Method 2002, Condition G, 30,000G

MIL-STD-883, Method 1004

Moisture Resistance

Moisture Sensitivity Level

Resistance to Soldering Heat

Resistance to Solvents

Solderability

J-STD-020, MSL 1

MIL-STD-202, Method 210, Condition K

MIL-STD-202, Method 215

MIL-STD-883, Method 2003 (Four I/O Pads on bottom of package only)

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 1 of 6

EMVA13AB1-57.1429M TR

ENVIRONMENTAL & MECHANICAL SPECIFICATIONS

Temperature Cycling

Thermal Shock

Vibration

MIL-STD-883, Method 1010, Condition B

MIL-STD-883, Method 1011, Condition B

MIL-STD-883, Method 2007, Condition A, 20G

MECHANICAL DIMENSIONS (all dimensions in millimeters)

PIN CONNECTION

0.85

±0.15

1.20 ±0.10 (x4)

2.1

Control Voltage

Case Ground

Output

5.00

±0.15

0.08

MAX

R0.70 ±0.10

1.70

Supply Voltage

LINE MARKING

XXXX or XXXXX

7.00

±0.15

5.08

±0.10

XXXX or XXXXX=Ecliptek

Manufacturing Lot Code

C0.25 ±0.10

2.60 ±0.15

1.40

±0.10 (x4)

Note A: Center paddle is connected

internally to oscillator ground (Pad 2).

Suggested Solder Pad Layout

All Dimensions in Millimeters

2.0 (X4)

2.2 (X4)

Solder Land

(X4)

2.88

1.81

All Tolerances are ±0.1

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 2 of 6

EMVA13AB1-57.1429M TR

OUTPUT WAVEFORM

VOH

80% of Waveform

50% of Waveform

20% of Waveform

VOL

Fall

Time

Rise

Time

Duty Cycle (%) = TW/T x 100

Test Circuit for CMOS Output

Frequency

Counter

Oscilloscope

Probe

(Note 2)

Supply

Voltage

(V_DD

)

Output

Current

Meter

0.1µF

(Note 1)

0.01µF

(Note 1)

C_L

(Note 3)

Power

Supply

Voltage

Meter

Ground

Voltage

Control

Power

Supply

Voltage

Meter

Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency

ceramic bypass capacitor close to the package ground and V_DDpin is required.

Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth

(>300MHz) passive probe is recommended.

Note 3: Capacitance value C_Lincludes sum of all probe and fixture capacitance.

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 3 of 6

EMVA13AB1-57.1429M TR

Tape & Reel Dimensions

Quantity Per Reel: 1,000 units

4.0 ±0.2

2.0 ±0.2

DIA 1.5 ±0.1

0.30 ±0.05

7.5 ±0.2

16.0 ±0.3

A0*

6.75 ±0.20

8.0 ±0.2

B0*

K0*

*Compliant to EIA 481A

1.5 MIN

22.4 MAX

DIA 40 MIN

Access Hole at

Slot Location

180 MAX

DIA 50 MIN

2.5 MIN Width

10.0 MIN Depth

Tape slot in Core

for Tape Start

DIA 20.2 MIN

DIA 13.0 ±0.2

16.4 +2.0/-0

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 4 of 6

EMVA13AB1-57.1429M TR

Recommended Solder Reflow Methods

Critical Zone

T_Lto T_P

T_P

Ramp-up

Ramp-down

T_L

T_SMax

T_SMin

t_L

t_P

t_SPreheat

t 25°C to Peak

Time (t)

High Temperature Infrared/Convection

TS MAX to TL (Ramp-up Rate)

3°C/second Maximum

Preheat

- Temperature Minimum (TS MIN)

- Temperature Typical (TS TYP)

- Temperature Maximum (TS MAX)

- Time (tS MIN)

150°C

175°C

200°C

60 - 180 Seconds

Ramp-up Rate (TL to TP)

3°C/second Maximum

Time Maintained Above:

- Temperature (TL)

- Time (tL)

217°C

60 - 150 Seconds

Peak Temperature (TP)

260°C Maximum for 10 Seconds Maximum

250°C +0/-5°C

Target Peak Temperature (TP Target)

Time within 5°C of actual peak (tp)

Ramp-down Rate

20 - 40 seconds

6°C/second Maximum

8 minutes Maximum

Level 1

Time 25°C to Peak Temperature (t)

Moisture Sensitivity Level

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 5 of 6

EMVA13AB1-57.1429M TR

Recommended Solder Reflow Methods

Critical Zone

T_Lto T_P

T_P

Ramp-up

Ramp-down

T_L

T_SMax

T_SMin

t_L

t_P

t_SPreheat

t 25°C to Peak

Time (t)

Low Temperature Infrared/Convection 240°C

TS MAX to TL (Ramp-up Rate)

5°C/second Maximum

Preheat

- Temperature Minimum (TS MIN)

- Temperature Typical (TS TYP)

- Temperature Maximum (TS MAX)

- Time (tS MIN)

N/A

150°C

N/A

60 - 120 Seconds

Ramp-up Rate (TL to TP)

5°C/second Maximum

Time Maintained Above:

- Temperature (TL)

- Time (tL)

150°C

200 Seconds Maximum

Peak Temperature (TP)

240°C Maximum

Target Peak Temperature (TP Target)

Time within 5°C of actual peak (tp)

Ramp-down Rate

240°C Maximum 1 Time / 230°C Maximum 2 Times

10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time

5°C/second Maximum

Time 25°C to Peak Temperature (t)

Moisture Sensitivity Level

N/A

Level 1

Low Temperature Manual Soldering

185°C Maximum for 10 seconds Maximum, 2 times Maximum.

High Temperature Manual Soldering

260°C Maximum for 5 seconds Maximum, 2 times Maximum.

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 6 of 6

EMVA13AB1-57.1429MTR [ECLIPTEK]

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