EMVA13AB2-50.668MTR [ECLIPTEK]
VCXO, CLOCK, 50.668 MHz, LVCMOS OUTPUT, ROHS COMPLIANT, SMD, 4 PIN;型号: | EMVA13AB2-50.668MTR |
厂家: | Ecliptek |
描述: | VCXO, CLOCK, 50.668 MHz, LVCMOS OUTPUT, ROHS COMPLIANT, SMD, 4 PIN 机械 输出元件 石英晶振 压控振荡器 |
文件: | 总6页 (文件大小:197K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
RoHS
Pb
EMVA13AB2-50.668M TR
EMVA13 A B 2 -50.668M TR
Series
Packaging Options
RoHS Compliant (Pb-free) 4 Pad 5mm x 7mm SMD
Tape & Reel
3.3Vdc LVCMOS Voltage Controlled MEMS Oscillator
Frequency Tolerance/Stability
±50ppm Maximum
Operating Temperature Range
Nominal Frequency
50.668MHz
Absolute Pull Range
±50ppm Minimum
-40°C to +85°C
ELECTRICAL SPECIFICATIONS
Nominal Frequency
50.668MHz
Frequency Tolerance/Stability
±50ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the
Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25°C,
260°C Reflow, Shock, and Vibration)
Aging at 25°C
±1ppm Maximum First Year
-40°C to +85°C
Operating Temperature Range
Supply Voltage
3.3Vdc ±10%
Input Current
15mA Maximum
Output Voltage Logic High (Voh)
Output Voltage Logic Low (Vol)
Rise/Fall Time
90% of Vdd Minimum (IOH = -4mA)
10% of Vdd Maximum (IOL = +4mA)
2nSec Maximum (Measured from 20% to 80% of waveform)
50 ±5(%) (Measured at 50% of waveform)
15pF Maximum
Duty Cycle
Load Drive Capability
Output Logic Type
Absolute Pull Range
CMOS
±50ppm Minimum (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the
Operating Temperature Range, Supply Voltage Change, Output Load Change, Shock, Vibration, and First
Year Aging at 25°C over the Control Voltage (Vc).)
Control Voltage
0.05Vdc to 1.7Vdc (Test Condition for APR)
0.0Vdc to 1.8Vdc
Control Voltage Range
Linearity
1% Maximum
Transfer Function
Modulation Bandwidth
Input Impedance
Positive Transfer Characteristic
8kHz Typical, 5kHz Minimum (Measured at -3dB, Vc = 0.875Vdc)
250kOhms Minimum
Input Leakage Current
Typical Phase Noise at Offsets
10µA Maximum
-100dBc/Hz at offset of 10kHz, -115dBc/Hz at offset of 100kHz, -145dBc/Hz at offset of 1MHz, and -
154dBc/Hz at offset of 10MHz
Period Jitter (RMS)
Period Jitter (pk-pk)
3pSec Typical, 6pSec Maximum
20pSec Typical, 40pSec Maximum
0.8pSec Typical
RMS Phase Jitter (Fj = 1.875MHz to
20MHz; Random)
RMS Phase Jitter (Fj = 900kHz to
7.5MHz; Random)
0.6pSec Typical
Start Up Time
10mSec Maximum
-55°C to +125°C
Storage Temperature Range
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
MIL-STD-883, Method 3015, Class 2, HBM 2000V
Flammability
UL94-V0
Mechanical Shock
MIL-STD-883, Method 2002, Condition G, 30,000G
MIL-STD-883, Method 1004
Moisture Resistance
Moisture Sensitivity Level
Resistance to Soldering Heat
Resistance to Solvents
Solderability
J-STD-020, MSL 1
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003 (Four I/O Pads on bottom of package only)
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 1 of 6
EMVA13AB2-50.668M TR
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Temperature Cycling
Thermal Shock
Vibration
MIL-STD-883, Method 1010, Condition B
MIL-STD-883, Method 1011, Condition B
MIL-STD-883, Method 2007, Condition A, 20G
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN CONNECTION
0.85
±0.15
1.20 ±0.10 (x4)
2.1
1
2
3
4
Control Voltage
Case Ground
Output
5.00
±0.15
0.08
MAX
2
R0.70 ±0.10
1.70
Supply Voltage
3
LINE MARKING
XXXX or XXXXX
7.00
±0.15
5.08
1
±0.10
A
XXXX or XXXXX=Ecliptek
Manufacturing Lot Code
1
4
C0.25 ±0.10
2.60 ±0.15
1.40
±0.10 (x4)
Note A: Center paddle is connected
internally to oscillator ground (Pad 2).
Suggested Solder Pad Layout
All Dimensions in Millimeters
2.0 (X4)
2.2 (X4)
Solder Land
(X4)
2.88
1.81
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 2 of 6
EMVA13AB2-50.668M TR
OUTPUT WAVEFORM
VOH
80% of Waveform
50% of Waveform
20% of Waveform
VOL
Fall
Time
Rise
Time
TW
T
Duty Cycle (%) = TW/T x 100
Test Circuit for CMOS Output
Frequency
Counter
Oscilloscope
Probe
(Note 2)
Supply
Voltage
(VDD
)
Output
Current
Meter
0.1µF
(Note 1)
0.01µF
(Note 1)
CL
(Note 3)
Power
Supply
Voltage
Meter
Ground
Voltage
Control
Power
Supply
Voltage
Meter
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency
ceramic bypass capacitor close to the package ground and VDD pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 3 of 6
EMVA13AB2-50.668M TR
Tape & Reel Dimensions
Quantity Per Reel: 1,000 units
4.0 ±0.2
2.0 ±0.2
DIA 1.5 ±0.1
0.30 ±0.05
7.5 ±0.2
16.0 ±0.3
A0*
6.75 ±0.20
8.0 ±0.2
B0*
K0*
*Compliant to EIA 481A
1.5 MIN
22.4 MAX
DIA 40 MIN
Access Hole at
Slot Location
180 MAX
DIA 50 MIN
2.5 MIN Width
10.0 MIN Depth
Tape slot in Core
for Tape Start
DIA 20.2 MIN
DIA 13.0 ±0.2
16.4 +2.0/-0
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 4 of 6
EMVA13AB2-50.668M TR
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
High Temperature Infrared/Convection
TS MAX to TL (Ramp-up Rate)
3°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
150°C
175°C
200°C
60 - 180 Seconds
Ramp-up Rate (TL to TP)
3°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
217°C
60 - 150 Seconds
Peak Temperature (TP)
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 5 of 6
EMVA13AB2-50.668M TR
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
Low Temperature Infrared/Convection 240°C
TS MAX to TL (Ramp-up Rate)
5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
N/A
150°C
N/A
60 - 120 Seconds
Ramp-up Rate (TL to TP)
5°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
150°C
200 Seconds Maximum
Peak Temperature (TP)
240°C Maximum
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
240°C Maximum 1 Time / 230°C Maximum 2 Times
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 6 of 6
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