EP1400SJTSL-25.177MTR [ECLIPTEK]
CRYSTAL OSCILLATOR, CLOCK, 25.177MHz, TTL OUTPUT, ROHS COMPLIANT, PLASTIC, J-LEADED, SMD, 4 PIN;型号: | EP1400SJTSL-25.177MTR |
厂家: | Ecliptek |
描述: | CRYSTAL OSCILLATOR, CLOCK, 25.177MHz, TTL OUTPUT, ROHS COMPLIANT, PLASTIC, J-LEADED, SMD, 4 PIN 机械 输出元件 振荡器 |
文件: | 总6页 (文件大小:172K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
RoHS
EP1400SJTSL-25.177M TR
EP14 00 SJ
TS L -25.177M TR
Series
Packaging Options
RoHS Compliant 5.0V Plastic J-Lead SMD HCMOS/TTL
Programmable Oscillator
Tape & Reel
Nominal Frequency
Frequency Tolerance/Stability
±100ppm Maximum
25.177MHz
Output Logic Type
Package
TTL
Operating Temperature Range
-20°C to +70°C
Pin 1 Connection
Tri-State (Disabled Output: High Impedance)
Duty Cycle
50 ±10(%)
ELECTRICAL SPECIFICATIONS
Nominal Frequency
25.177MHz
Frequency Tolerance/Stability
±100ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the
Operating Temperature Range,Supply Voltage Change, Output Load Change,
First Year Aging at 25°C, Shock, and Vibration)
Aging at 25°C
±5ppm/year Maximum
Operating Temperature Range
Supply Voltage
-20°C to +70°C
5.0Vdc ±10%
Input Current
45mA Maximum (Unloaded)
Output Voltage Logic High (Voh)
Output Voltage Logic Low (Vol)
Rise/Fall Time
2.4Vdc Minimum (IOH = -16mA)
0.4Vdc Maximum (IOL = +16mA)
4nSec Maximum (Measured at 0.8Vdc to 2.0Vdc)
Duty Cycle
50 ±10(%) (Measured at 1.4Vdc with TTL Load; Measured at 50% of waveform with HCMOS Load)
Load Drive Capability
Output Logic Type
10TTL Load Maximum
TTL
Pin 1 Connection
Tri-State (Disabled Output: High Impedance)
Tri-State Input Voltage (Vih and Vil)
Standby Current
+2.0Vdc Minimum to enable output, +0.8Vdc Max, to disable output, No Connect to enable output.
50µA Maximum (Pin 1 = Ground)
30mA Maximum (Pin 1 = Ground)
±250pSec Maximum, ±100pSec Typical
±50pSec Maximum
Disable Current
Absolute Clock Jitter
One Sigma Clock Period Jitter
Start Up Time
10mSec Maximum
Storage Temperature Range
-55°C to +125°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test
MIL-STD-883, Method 1014, Condition A
MIL-STD-883, Method 1014, Condition C
MIL-STD-202, Method 213, Condition C
MIL-STD-202, Method 210
Gross Leak Test
Mechanical Shock
Resistance to Soldering Heat
Resistance to Solvents
Solderability
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
Temperature Cycling
Vibration
MIL-STD-883, Method 1010
MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev D 8/12/2010 | Page 1 of 6
EP1400SJTSL-25.177M TR
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN CONNECTION
1
Tri-State (High
Impedance)
5.080
0.25 MIN
±0.203
2
3
4
Ground
Output
4
3
9.8
MAX
7.620
±0.203
MARKING
ORIENTATION
Supply Voltage
LINE MARKING
1
2
1
2
3
ECLIPTEK
25.177M
4.7
MAX
14.0
MAX
0.510 ±0.203
PXXYZZ
P=Configuration Designator
XX=Ecliptek Manufacturing
Code
Y=Last Digit of the Year
ZZ=Week of the Year
Suggested Solder Pad Layout
All Dimensions in Millimeters
1.27 (X4)
3.0 (X4)
Solder Land
(X4)
5.8
3.81
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev D 8/12/2010 | Page 2 of 6
EP1400SJTSL-25.177M TR
OUTPUT WAVEFORM & TIMING DIAGRAM
VIH
VIL
VOH
80% or 2.0VDC
OUTPUT DISABLE
(HIGH IMPEDANCE
STATE)
50% or 1.4VDC
20% or 0.8VDC
VOL
tPLZ
tPZL
Fall
Time
Rise
Time
TW
T
Duty Cycle (%) = TW/T x 100
Test Circuit for TTL Output
RL Value
(Ohms)
Output Load
Drive Capability
CL Value
(pF)
390
780
15
15
6
10TTL
5TTL
Frequency
Counter
1100
2000
2200
2TTL
Oscilloscope
15
3
10LSTTL
1TTL
Table 1: RL Resistance Value and CL Capacitance
Value Vs. Output Load Drive Capability
Probe
Supply
Voltage
(Note 2)
RL
(Note 4)
(VDD
)
Output
_
+
Current
Meter
+
+
+
Power
Supply
0.01µF
(Note 1)
Power
Supply
_
Voltage
Meter
0.1µF
(Note 1)
CL
(Note 3)
Ground
_
_
No Connect
or Tri-State
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency
ceramic bypass capacitor close to the package ground and VDD pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.
Note 4: Resistance value RL is shown in Table 1. See applicable specification sheet for 'Load Drive Capability'.
Note 5: All diodes are MMBD7000, MMBD914, or equivalent.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev D 8/12/2010 | Page 3 of 6
EP1400SJTSL-25.177M TR
Test Circuit for CMOS Output
Frequency
Counter
Oscilloscope
Probe
(Note 2)
Supply
Voltage
(VDD
)
Output
_
+
Current
Meter
+
+
Power
Supply
0.01µF
(Note 1)
Voltage
Meter
0.1µF
(Note 1)
CL
(Note 3)
Ground
_
_
No Connect
or Tri-State
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency
ceramic bypass capacitor close to the package ground and VDD pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev D 8/12/2010 | Page 4 of 6
EP1400SJTSL-25.177M TR
Tape & Reel Dimensions
Quantity Per Reel: 1,000 units
4.0 ±0.2
2.0 ±0.1
1.5 +1.0/-0.0
0.3 ±0.1
11.5 ±0.1
24.0 ±0.3
A0*
10.75 ±0.10
12.0 ±0.1
B0*
K0*
*Compliant to EIA 481A
1.5 MIN
30.4 MAX
DIA 40 MIN
Access Hole at
Slot Location
360 MAX
DIA 50 MIN
2.5 MIN Width
10.0 MIN Depth
Tape slot in Core
for Tape Start
DIA 20.2 MIN
DIA 13.0 ±0.2
24.4 +2.0/-0.0
www.ecliptek.com | Specification Subject to Change Without Notice | Rev D 8/12/2010 | Page 5 of 6
EP1400SJTSL-25.177M TR
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
Low Temperature Infrared/Convection 240°C
TS MAX to TL (Ramp-up Rate)
5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
N/A
150°C
N/A
60 - 120 Seconds
Ramp-up Rate (TL to TP)
5°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
150°C
200 Seconds Maximum
Peak Temperature (TP)
240°C Maximum
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
240°C Maximum 1 Time / 230°C Maximum 2 Times
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev D 8/12/2010 | Page 6 of 6
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