EP16E7E2H-26.000MTR [ECLIPTEK]
CRYSTAL OSCILLATOR, CLOCK, 26MHz, LVHCMOS OUTPUT, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN;型号: | EP16E7E2H-26.000MTR |
厂家: | Ecliptek |
描述: | CRYSTAL OSCILLATOR, CLOCK, 26MHz, LVHCMOS OUTPUT, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN 机械 输出元件 振荡器 |
文件: | 总7页 (文件大小:287K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
EP16E7E2H-26.000M TR
EP16E7 E 2 H -26.000M TR
Series
Packaging Options
Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS
(CMOS) 1.8Vdc 4 Pad 2.5mm x 3.2mm Ceramic
Surface Mount (SMD)
Tape & Reel
Nominal Frequency
26.000MHz
Frequency Tolerance/Stability
±25ppm Maximum over -20°C to +70°C
Pin 1 Connection
Tri-State
Duty Cycle
50 ±5(%)
ELECTRICAL SPECIFICATIONS
Nominal Frequency
26.000MHz
Frequency Tolerance/Stability
±25ppm Maximum over -20°C to +70°C (Inclusive of all conditions: Calibration Tolerance at 25°C,
Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change,
First Year Aging at 25°, 260°C Reflow, Shock, and Vibration)
Aging at 25°C
±5ppm/Year Maximum
Supply Voltage
1.8Vdc ±5%
Input Current
9mA Maximum
Output Voltage Logic High (Voh)
Output Voltage Logic Low (Vol)
Rise/Fall Time
90% of Vdd Minimum (IOH = -8mA)
10% of Vdd Maximum (IOL = +8mA)
6nSec Maximum (Measured at 20% to 80% of waveform)
Duty Cycle
50 ±5(%) (Measured at 50% of waveform)
Load Drive Capability
Output Logic Type
Pin 1 Connection
15pF Maximum
CMOS
Tri-State
Pin 1 Input Voltage (Vih and Vil)
Disable Current
90% of Vdd Minimum or No Connect to Enable Output, 10% of Vdd Maximum to Disable Output
4mA Maximum (Pin 1 = Ground)
200pSec Maximum
Absolute Clock Jitter
Start Up Time
10mSec Maximum
Storage Temperature Range
-55°C to 125°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
MIL-STD-883, Method 3015, Class 1, HBM: 1500Vdc
MIL-STD-883, Method 1014, Condition A
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 1004
Fine Leak Test
Gross Leak Test
Mechanical Shock
Moisture Resistance
Moisture Sensitivity
Resistance to Soldering Heat
Resistance to Solvents
Solderability
J-STD-020, MSL 1
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
Temperature Cycling
Thermal Shock
MIL-STD-883, Method 1010, Condition B
MIL-STD-883, Method 1011, Condition B
MIL-STD-883, Method 2007, Condition A
Vibration
www.ecliptek.com | Specification Subject to Change Without Notice | Revision G 12/11/2012 | Page 1 of 7
EP16E7E2H-26.000M TR
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN CONNECTION
1
2
3
4
Tri-State
1.05
2.50
±0.15
Ground
0.75 ±0.10 (X4)
±0.15
Output
Supply Voltage
3
4
2
1
LINE MARKING
1
E26.000
1.20
±0.10
3.20
±0.15
E=Ecliptek Designator
1.00
±0.10
2
XXXXX
XXXXX=Ecliptek
Manufacturing Identifier
1.00
±0.10
Suggested Solder Pad Layout
All Dimensions in Millimeters
0.95 (X4)
1.20 (X4)
Solder Land
(X4)
1.00
0.80
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Revision G 12/11/2012 | Page 2 of 7
EP16E7E2H-26.000M TR
OUTPUT WAVEFORM & TIMING DIAGRAM
VIH
VIL
VOH
80% of Waveform
OUTPUT DISABLE
(HIGH IMPEDANCE
STATE)
50% of Waveform
20% of Waveform
VOL
tPLZ
tPZL
Fall
Time
Rise
Time
TW
T
Duty Cycle (%) = TW/T x 100
www.ecliptek.com | Specification Subject to Change Without Notice | Revision G 12/11/2012 | Page 3 of 7
EP16E7E2H-26.000M TR
Test Circuit for CMOS Output
Frequency
Counter
Oscilloscope
Probe
(Note 2)
Supply
Voltage
(VDD
)
Output
_
+
Current
Meter
+
+
Power
Supply
0.01µF
(Note 1)
Voltage
Meter
0.1µF
(Note 1)
CL
(Note 3)
Ground
_
_
Tri-State or
Power Down
Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency ceramic bypass
capacitor close (less than 2mm) to the package ground and supply voltage pin is required.
Note 2: A low input capacitance (<12pF), 10X Attentuation Factor, High Impedance (>10Mohms), and
High bandwidth (>300MHz) passive probe is recommended.
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. See applicable specification sheet
for ‘Load Drive Capability’.
www.ecliptek.com | Specification Subject to Change Without Notice | Revision G 12/11/2012 | Page 4 of 7
EP16E7E2H-26.000M TR
Tape & Reel Dimensions
All Dimensions in Millimeters
Quantity Per Reel: 1,000 units
4.00 ±0.10
2.00 ±0.05
0.60 MAX
0.10 MAX
DIA 1.50 +0.10/-0.00
1.75 ±0.10
3.50 ±0.05
8.00 ±0.30
B0
DIA 1.00 MIN
4.00 ±0.10
A0
K0
Note: Compliant to EIA 481
1.50 MIN
14.40 MAX
DIA 40 MIN
Access Hole at
Slot Location
180 MAX
DIA 50 MIN
2.50 MIN Width
10 MIN Depth
Tape slot in Core
for Tape Start
DIA 20.20 MIN
8.40 +1.50/-0.00
DIA 13.00 ±0.20
www.ecliptek.com | Specification Subject to Change Without Notice | Revision G 12/11/2012 | Page 5 of 7
EP16E7E2H-26.000M TR
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
High Temperature Infrared/Convection
TS MAX to TL (Ramp-up Rate)
3°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
150°C
175°C
200°C
60 - 180 Seconds
Ramp-up Rate (TL to TP)
3°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
217°C
60 - 150 Seconds
Peak Temperature (TP)
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
www.ecliptek.com | Specification Subject to Change Without Notice | Revision G 12/11/2012 | Page 6 of 7
EP16E7E2H-26.000M TR
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
Low Temperature Infrared/Convection 240°C
TS MAX to TL (Ramp-up Rate)
5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
N/A
150°C
N/A
60 - 120 Seconds
Ramp-up Rate (TL to TP)
5°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
150°C
200 Seconds Maximum
Peak Temperature (TP)
240°C Maximum
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
240°C Maximum 2 Times / 230°C Maximum 1 Time
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Revision G 12/11/2012 | Page 7 of 7
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