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EP3545PDC-6.451M [ECLIPTEK]

CMOS, Quartz Crystal Clock Oscillators XO (SPXO) HCMOS/TTL (CMOS) 5.0Vdc 4 Pad 3.2mm x 5.0mm Ceramic Surface Mount (SMD) Quartz Crystal Clock Oscillators XO (SPXO) HCMOS/TTL (CMOS) 5.0Vdc 4 Pad 3.2mm x 5.0mm Ceramic Surface Mount (SMD);
EP3545PDC-6.451M
型号： EP3545PDC-6.451M
厂家： Ecliptek    Ecliptek
描述：

CMOS, Quartz Crystal Clock Oscillators XO (SPXO) HCMOS/TTL (CMOS) 5.0Vdc 4 Pad 3.2mm x 5.0mm Ceramic Surface Mount (SMD) Quartz Crystal Clock Oscillators XO (SPXO) HCMOS/TTL (CMOS) 5.0Vdc 4 Pad 3.2mm x 5.0mm Ceramic Surface Mount (SMD)

机械 石英晶振 振荡器
文件： 总6页 (文件大小：165K)
中文：  中文翻译
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RoHS  
Pb  
EP3545PDC-6.451M  
EP35 45  
PD C -6.451M  
Series  
Nominal Frequency  
6.451MHz  
RoHS Compliant (Pb-free) 5.0V 4 Pad 3.2mm x 5mm  
Ceramic SMD HCMOS/TTL Programmable Oscillator  
Output Logic Type  
CMOS  
Frequency Tolerance/Stability  
±50ppm Maximum  
Pin 1 Connection  
Power Down (Disabled Output: Logic Low)  
Operating Temperature Range  
-20°C to +70°C  
Duty Cycle  
50 ±10(%)  
ELECTRICAL SPECIFICATIONS  
Nominal Frequency  
6.451MHz  
Frequency Tolerance/Stability  
±50ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the  
Operating Temperature Range, Supply Voltage Change, Output Load Change, 1st Year Aging at 25 °C,  
Shock, and Vibration)  
Aging at 25°C  
±5ppm/year Maximum  
Operating Temperature Range  
Supply Voltage  
-20°C to +70°C  
5.0Vdc ±10%  
Input Current  
45mA Maximum (Unloaded)  
Output Voltage Logic High (Voh)  
Output Voltage Logic Low (Vol)  
Rise/Fall Time  
Vdd-0.4Vdc Minimum (IOH = -16mA)  
0.4Vdc Maximum (IOH = +16mA)  
4nSec Maximum (Measured at 20% to 80% of waveform)  
50 ±10(%) (Measured at 1.4Vdc with TTL Load, or at 50% of waveform with HCMOS Load)  
50pF HCMOS Load Maximum  
Duty Cycle  
Load Drive Capability  
Output Logic Type  
CMOS  
Pin 1 Connection  
Power Down (Disabled Output: Logic Low)  
+2.0Vdc Minimum to enable output, +0.8Vdc Maximum to disable output, No Connect to enable output.  
50µA Maximum (Pin 1 = Ground)  
Pin 1 Input Voltage (Vih and Vil)  
Standby Current  
Disable Current  
30mA Maximum (Pin 1 = Ground)  
Absolute Clock Jitter  
One Sigma Clock Period Jitter  
Start Up Time  
±250pSec Maximum, ±100pSec Typical  
±50pSec Maximum  
10mSec Maximum  
Storage Temperature Range  
-55°C to +125°C  
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS  
Fine Leak Test  
MIL-STD-883, Method 1014, Condition A  
MIL-STD-883, Method 1014, Condition C  
MIL-STD-202, Method 213, Condition C  
MIL-STD-202, Method 210  
Gross Leak Test  
Mechanical Shock  
Resistance to Soldering Heat  
Resistance to Solvents  
Solderability  
MIL-STD-202, Method 215  
MIL-STD-883, Method 2003  
Temperature Cycling  
Vibration  
MIL-STD-883, MEthod 1010  
MIL-STD-883, Method 2007, Condition A  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/16/2010 | Page 1 of 6  
EP3545PDC-6.451M  
MECHANICAL DIMENSIONS (all dimensions in millimeters)  
PIN CONNECTION  
1
2
3
4
Power Down (Logic Low)  
Ground/Case Ground  
Output  
1.20 ±0.20 (x4)  
3.20  
±0.20  
1.00 ±0.20 (x4)  
Supply Voltage  
LINE MARKING  
4
3
1
2
1
E6.451  
5.00  
±0.20  
2.54  
±0.15  
E=Ecliptek Designator  
1.20  
±0.20  
(x4)  
2.20  
±0.15  
1.3  
MAX  
Suggested Solder Pad Layout  
All Dimensions in Millimeters  
1.2 (X4)  
1.4 (X4)  
Solder Land  
(X4)  
1.14  
1.0  
All Tolerances are ±0.1  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/16/2010 | Page 2 of 6  
EP3545PDC-6.451M  
OUTPUT WAVEFORM & TIMING DIAGRAM  
VIH  
VIL  
VOH  
80% or 2.0VDC  
OUTPUT DISABLE  
(LOGIC LOW)  
50% or 1.4VDC  
20% or 0.8VDC  
VOL  
tPLZ  
tPZL  
Fall  
Time  
Rise  
Time  
TW  
T
Duty Cycle (%) = TW/T x 100  
Test Circuit for TTL Output  
RL Value  
(Ohms)  
Output Load  
Drive Capability  
CL Value  
(pF)  
390  
780  
15  
15  
6
10TTL  
5TTL  
Frequency  
Counter  
1100  
2000  
2200  
2TTL  
Oscilloscope  
15  
3
10LSTTL  
1TTL  
Table 1: RL Resistance Value and CL Capacitance  
Value Vs. Output Load Drive Capability  
Probe  
Supply  
Voltage  
(Note 2)  
RL  
(Note 4)  
(VDD  
)
Output  
_
+
Current  
Meter  
+
+
+
Power  
Supply  
0.01µF  
(Note 1)  
Power  
Supply  
_
Voltage  
Meter  
0.1µF  
(Note 1)  
CL  
(Note 3)  
Ground  
_
_
No Connect  
or Tri-State  
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency  
ceramic bypass capacitor close to the package ground and VDD pin is required.  
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth  
(>300MHz) passive probe is recommended.  
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.  
Note 4: Resistance value RL is shown in Table 1. See applicable specification sheet for 'Load Drive Capability'.  
Note 5: All diodes are MMBD7000, MMBD914, or equivalent.  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/16/2010 | Page 3 of 6  
EP3545PDC-6.451M  
Test Circuit for CMOS Output  
Frequency  
Counter  
Oscilloscope  
Probe  
(Note 2)  
Supply  
Voltage  
(VDD  
)
Output  
_
+
Current  
Meter  
+
+
Power  
Supply  
0.01µF  
(Note 1)  
Voltage  
Meter  
0.1µF  
(Note 1)  
CL  
(Note 3)  
Ground  
_
_
No Connect  
or Tri-State  
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency  
ceramic bypass capacitor close to the package ground and VDD pin is required.  
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth  
(>300MHz) passive probe is recommended.  
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/16/2010 | Page 4 of 6  
EP3545PDC-6.451M  
Recommended Solder Reflow Methods  
Critical Zone  
TL to TP  
TP  
Ramp-up  
Ramp-down  
TL  
TS Max  
TS Min  
tL  
tP  
tSPreheat  
t 25°C to Peak  
Time (t)  
High Temperature Infrared/Convection  
TS MAX to TL (Ramp-up Rate)  
3°C/second Maximum  
Preheat  
- Temperature Minimum (TS MIN)  
- Temperature Typical (TS TYP)  
- Temperature Maximum (TS MAX)  
- Time (tS MIN)  
150°C  
175°C  
200°C  
60 - 180 Seconds  
Ramp-up Rate (TL to TP)  
3°C/second Maximum  
Time Maintained Above:  
- Temperature (TL)  
- Time (tL)  
217°C  
60 - 150 Seconds  
Peak Temperature (TP)  
260°C Maximum for 10 Seconds Maximum  
250°C +0/-5°C  
Target Peak Temperature (TP Target)  
Time within 5°C of actual peak (tp)  
Ramp-down Rate  
20 - 40 seconds  
6°C/second Maximum  
8 minutes Maximum  
Level 1  
Time 25°C to Peak Temperature (t)  
Moisture Sensitivity Level  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/16/2010 | Page 5 of 6  
EP3545PDC-6.451M  
Recommended Solder Reflow Methods  
Critical Zone  
TL to TP  
TP  
Ramp-up  
Ramp-down  
TL  
TS Max  
TS Min  
tL  
tP  
tSPreheat  
t 25°C to Peak  
Time (t)  
Low Temperature Infrared/Convection 240°C  
TS MAX to TL (Ramp-up Rate)  
5°C/second Maximum  
Preheat  
- Temperature Minimum (TS MIN)  
- Temperature Typical (TS TYP)  
- Temperature Maximum (TS MAX)  
- Time (tS MIN)  
N/A  
150°C  
N/A  
60 - 120 Seconds  
Ramp-up Rate (TL to TP)  
5°C/second Maximum  
Time Maintained Above:  
- Temperature (TL)  
- Time (tL)  
150°C  
200 Seconds Maximum  
Peak Temperature (TP)  
240°C Maximum  
Target Peak Temperature (TP Target)  
Time within 5°C of actual peak (tp)  
Ramp-down Rate  
240°C Maximum 1 Time / 230°C Maximum 2 Times  
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time  
5°C/second Maximum  
Time 25°C to Peak Temperature (t)  
Moisture Sensitivity Level  
N/A  
Level 1  
Low Temperature Manual Soldering  
185°C Maximum for 10 seconds Maximum, 2 times Maximum.  
High Temperature Manual Soldering  
260°C Maximum for 5 seconds Maximum, 2 times Maximum.  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/16/2010 | Page 6 of 6  

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