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EPS13D2C1HF-32.514M [ECLIPTEK]

CRYSTAL OSCILLATOR, CLOCK, 32.514 MHz, LVCMOS OUTPUT, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN;
EPS13D2C1HF-32.514M
型号： EPS13D2C1HF-32.514M
厂家： Ecliptek    Ecliptek
描述：

CRYSTAL OSCILLATOR, CLOCK, 32.514 MHz, LVCMOS OUTPUT, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN

机械 输出元件 振荡器
文件： 总5页 (文件大小：148K)
中文：  中文翻译
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RoHS  
Pb  
EPS13D2C1HF-32.514M  
EPS13D2 C 1 H F -32.514M  
Series  
Nominal Frequency  
32.514MHz  
RoHS Compliant (Pb-free) 3.3V 4 Pad 5mm x 7mm  
Ceramic SMD LVCMOS Programmable Spread  
Spectrum Oscillator  
Spread Spectrum  
±2.00% Center Spread  
Frequency Stability  
±100ppm Maximum over Operating Temperature Range  
of -20°C to +70°C  
Output Control Function  
Tri-State  
Duty Cycle  
50% ±10%  
ELECTRICAL SPECIFICATIONS  
Nominal Frequency  
32.514MHz  
Frequency Stability  
±100ppm Maximum over Operating Temperature Range of -20°C to +70°C (Inclusive of all conditions:  
Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change,  
First Year Aging at 25°C, Shock, and Vibration.)  
Aging at 25°C  
±5ppm First Year Maximum  
3.3Vdc ±0.3Vdc  
Supply Voltage  
Maximum Supply Voltage  
Input Current  
-0.5Vdc to +7.0Vdc  
30mA Maximum (Unloaded; Vdd=3.3Vdc)  
Vdd-0.4Vdc Minimum (IOH=-8mA)  
0.4Vdc Maximum (IOL=+8mA)  
2.7nSec Maximum (Measured at 20% to 80% of Waveform)  
50% ±10% (Measured at 50% of Waveform)  
15pF Maximum  
Output Voltage Logic High (Voh)  
Output Voltage Logic Low (Vol)  
Rise/Fall Time  
Duty Cycle  
Load Drive Capability  
Output Logic Type  
Output Control Function  
CMOS  
Tri-State (High Impedance Internal Pull Down Resistor of 100kOhms Typical on Pad 3, Internal Pull Up  
Resistor of 100kOhms Typical on Pad 1)  
Tri-State Input Voltage (Vih and Vil)  
Tri-State Output Disable Time  
Tri-State Output Enable Time  
Disable Current  
70% of Vdd Minimum or No Connection to Enable Output, 30% of Vdd Maximum to Disable Output  
350nSec Maximum  
350nSec Maximum  
20mA Maximum (Unloaded; Pad 1=Ground; Vdd=3.3Vdc)  
±2.00% Center Spread  
Spread Spectrum  
Modulation Frequency  
Period Jitter  
30kHz Minimum, 31.5kHz Typical, 33kHz Maximum  
400pSec Maximum (Cycle to Cycle; Spread Spectrum-On; Vdd=3.3Vdc)  
10mSec Maximum  
Start Up Time  
Storage Temperature Range  
-55°C to +125°C  
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS  
Fine Leak Test  
MIL-STD-883, Method 1014, Condition A  
MIL-STD-883, Method 1014, Condition C  
MIL-STD-202, Method 213, Condition C  
MIL-STD-202, Method 210  
Gross Leak Test  
Mechanical Shock  
Resistance to Soldering Heat  
Resistance to Solvents  
Solderability  
MIL-STD-202, Method 215  
MIL-STD-883, Method 2003  
Temperature Cycling  
Vibration  
MIL-STD-883, Method 1010  
MIL-STD-883, Method 2007, Condition A  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 2/16/2010 | Page 1 of 5  
EPS13D2C1HF-32.514M  
MECHANICAL DIMENSIONS (all dimensions in millimeters)  
PIN CONNECTION  
1
2
3
4
Tri-State  
2.20  
±0.15  
Case/Ground  
Output  
5.00  
±0.15  
1.4 ±0.2  
Supply Voltage  
1
4
3
LINE MARKING  
1
2
3
ECLIPTEK  
32.514M  
7.00  
5.08  
3.68  
±0.15  
±0.15  
±0.15  
SXXYZZ  
S=Configuration Designator  
XX=Ecliptek Manufacturing  
Code  
2
Y=Last Digit of the Year  
ZZ=Week of the Year  
1.60 ±0.20  
1.4 ±0.1  
Suggested Solder Pad Layout  
All Dimensions in Millimeters  
2.0 (X4)  
2.0 (X4)  
Solder Land  
(X4)  
3.1  
1.6  
All Tolerances are ±0.1  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 2/16/2010 | Page 2 of 5  
EPS13D2C1HF-32.514M  
OUTPUT WAVEFORM & TIMING DIAGRAM  
VIH  
VIL  
VOH  
80% of Waveform  
OUTPUT DISABLE  
(HIGH IMPEDANCE  
STATE)  
50% of Waveform  
20% of Waveform  
VOL  
tPLZ  
tPZL  
Fall  
Time  
Rise  
Time  
TW  
T
Duty Cycle (%) = TW/T x 100  
Test Circuit for CMOS Output  
Frequency  
Counter  
Oscilloscope  
Probe  
(Note 2)  
Supply  
Voltage  
(VDD  
)
Output  
_
+
Current  
Meter  
+
+
Power  
Supply  
0.01µF  
(Note 1)  
Voltage  
Meter  
0.1µF  
(Note 1)  
CL  
(Note 3)  
Ground  
_
_
Tri-State or  
Power Down  
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency  
ceramic bypass capacitor close to the package ground and VDD pin is required.  
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth  
(>300MHz) passive probe is recommended.  
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 2/16/2010 | Page 3 of 5  
EPS13D2C1HF-32.514M  
Recommended Solder Reflow Methods  
Critical Zone  
TL to TP  
TP  
Ramp-up  
Ramp-down  
TL  
TS Max  
TS Min  
tL  
tP  
tSPreheat  
t 25°C to Peak  
Time (t)  
High Temperature Infrared/Convection  
TS MAX to TL (Ramp-up Rate)  
3°C/second Maximum  
Preheat  
- Temperature Minimum (TS MIN)  
- Temperature Typical (TS TYP)  
- Temperature Maximum (TS MAX)  
- Time (tS MIN)  
150°C  
175°C  
200°C  
60 - 180 Seconds  
Ramp-up Rate (TL to TP)  
3°C/second Maximum  
Time Maintained Above:  
- Temperature (TL)  
- Time (tL)  
217°C  
60 - 150 Seconds  
Peak Temperature (TP)  
260°C Maximum for 10 Seconds Maximum  
250°C +0/-5°C  
Target Peak Temperature (TP Target)  
Time within 5°C of actual peak (tp)  
Ramp-down Rate  
20 - 40 seconds  
6°C/second Maximum  
8 minutes Maximum  
Level 1  
Time 25°C to Peak Temperature (t)  
Moisture Sensitivity Level  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 2/16/2010 | Page 4 of 5  
EPS13D2C1HF-32.514M  
Recommended Solder Reflow Methods  
Critical Zone  
TL to TP  
TP  
Ramp-up  
Ramp-down  
TL  
TS Max  
TS Min  
tL  
tP  
tSPreheat  
t 25°C to Peak  
Time (t)  
Low Temperature Infrared/Convection 240°C  
TS MAX to TL (Ramp-up Rate)  
5°C/second Maximum  
Preheat  
- Temperature Minimum (TS MIN)  
- Temperature Typical (TS TYP)  
- Temperature Maximum (TS MAX)  
- Time (tS MIN)  
N/A  
150°C  
N/A  
60 - 120 Seconds  
Ramp-up Rate (TL to TP)  
5°C/second Maximum  
Time Maintained Above:  
- Temperature (TL)  
- Time (tL)  
150°C  
200 Seconds Maximum  
Peak Temperature (TP)  
240°C Maximum  
Target Peak Temperature (TP Target)  
Time within 5°C of actual peak (tp)  
Ramp-down Rate  
240°C Maximum 1 Time / 230°C Maximum 2 Times  
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time  
5°C/second Maximum  
Time 25°C to Peak Temperature (t)  
Moisture Sensitivity Level  
N/A  
Level 1  
Low Temperature Manual Soldering  
185°C Maximum for 10 seconds Maximum, 2 times Maximum.  
High Temperature Manual Soldering  
260°C Maximum for 5 seconds Maximum, 2 times Maximum.  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 2/16/2010 | Page 5 of 5  

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