EPSA12BBHL-156.000M [ECLIPTEK]
CRYSTAL OSCILLATOR, CLOCK, 156MHz, LVCMOS OUTPUT, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN;
| 型号： | EPSA12BBHL-156.000M |
| 厂家： | 
Ecliptek |
| 描述： | CRYSTAL OSCILLATOR, CLOCK, 156MHz, LVCMOS OUTPUT, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN 机械 输出元件 振荡器 |
| 文件： | 总5页 (文件大小：165K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
RoHS
Pb
EPSA12BBHL-156.000M
EPSA12 B B H L -156.000M
Series
Nominal Frequency
156.000MHz
RoHS Compliant (Pb-free) 2.5V 4 Pad 5mm x 7mm
Ceramic SMD LVCMOS Programmable Spread
Spectrum Oscillator
Spread Spectrum
-2.00% Down Spread
Frequency Tolerance/Stability
±50ppm Maximum
Output Control Function
Tri-State
Operating Temperature Range
-40°C to +85°C
ELECTRICAL SPECIFICATIONS
Nominal Frequency
156.000MHz
Frequency Tolerance/Stability
±50ppm Maximum (Inclusive of all conditions: Frequency Stability over the Operating Temperature Range,
Supply Voltage Change, Output Load Change, First Year Aging at 25°C, Shock, and Vibration.)
Operating Temperature Range
Supply Voltage
-40°C to +85°C
2.5Vdc ±5%
Maximum Supply Voltage
Input Current
-0.5Vdc to +3.2Vdc
25mA Maximum
Output Voltage Logic High (Voh)
Output Voltage Logic Low (Vol)
Rise/Fall Time
90% of Vdd Minimum (IOH=-8mA)
10% of Vdd Maximum (IOL=+8mA)
3nSec Maximum (Measured at 10% to 90% of Waveform)
50% ±5(%) (Measured at 50% of waveform)
15pF Maximum
Duty Cycle
Load Drive Capability
Output Logic Type
CMOS
Output Control Function
Tri-State Input Voltage (Vih and Vil)
Tri-State Output Disable Time
Tri-State Output Enable Time
Disable Current
Tri-State (Disabled Output: High Impedance)
70% of Vdd Minimum or No Connection to Enable Output, 30% of Vdd Maximum to Disable Output
100nSec Maximum
100nSec Maximum
20mA Maximum (Unloaded; Pad 1=Ground)
-2.00% Down Spread
Spread Spectrum
Modulation Frequency
Period Jitter
30kHz Minimum, 32kHz Typical, 45kHz Maximum
100pSec Maximum (Cycle to Cycle; Spread Spectrum-On)
10mSec Maximum
Start Up Time
Storage Temperature Range
-55°C to +125°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
MIL-STD-883, Method 3015, Class 1, HBM: 1500V
MIL-STD-883, Method 1014, Condition A
UL94-V0
Fine Leak Test
Flammability
Gross Leak Test
Mechanical Shock
Moisture Resistance
Moisture Sensitivity
Resistance to Soldering Heat
Resistance to Solvents
Solderability
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 1004
J-STD-020, MSL 1
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
Temperature Cycling
Vibration
MIL-STD-883, Method 1010, Condition B
MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 1 of 5
EPSA12BBHL-156.000M
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN CONNECTION
1
2
3
4
Tri-State
7.00
±0.15
5.08
±0.15
Case Ground
Output
4
1
3
2
Supply Voltage
MARKING
ORIENTATION
2.20
±0.15
5.00
±0.15
LINE MARKING
1
2
3
ECLIPTEK
156.00M
SXXXXX
1.4 ±0.2
S=Configuration Designator
XXXXX=Ecliptek
1.4 ±0.1
Manufacturing Identifier
3.68
±0.15
1.60 ±0.20
Suggested Solder Pad Layout
All Dimensions in Millimeters
2.0 (X4)
2.2 (X4)
Solder Land
(X4)
2.88
1.81
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 2 of 5
EPSA12BBHL-156.000M
OUTPUT WAVEFORM & TIMING DIAGRAM
VIH
VIL
VOH
90% of Waveform
OUTPUT DISABLE
(HIGH IMPEDANCE
STATE)
50% of Waveform
10% of Waveform
VOL
tPLZ
tPZL
Fall
Time
Rise
Time
TW
T
Duty Cycle (%) = TW/T x 100
Test Circuit for CMOS Output
Frequency
Counter
Oscilloscope
Probe
(Note 2)
Supply
Voltage
(VDD
)
Output
_
+
Current
Meter
+
+
Power
Supply
0.01µF
(Note 1)
Voltage
Meter
0.1µF
(Note 1)
CL
(Note 3)
Ground
_
_
Tri-State or
Power Down
Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency ceramic bypass
capacitor close (less than 2mm) to the package ground and supply voltage pin is required.
Note 2: A low input capacitance (<12pF), 10X Attentuation Factor, High Impedance (>10Mohms), and
High bandwidth (>300MHz) passive probe is recommended.
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. See applicable specification sheet
for ‘Load Drive Capability’.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 3 of 5
EPSA12BBHL-156.000M
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
High Temperature Infrared/Convection
TS MAX to TL (Ramp-up Rate)
3°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
150°C
175°C
200°C
60 - 180 Seconds
Ramp-up Rate (TL to TP)
3°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
217°C
60 - 150 Seconds
Peak Temperature (TP)
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
Additional Notes
Temperatures shown are applied to body of device.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 4 of 5
EPSA12BBHL-156.000M
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
Low Temperature Infrared/Convection 240°C
TS MAX to TL (Ramp-up Rate)
5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
N/A
150°C
N/A
60 - 120 Seconds
Ramp-up Rate (TL to TP)
5°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
150°C
200 Seconds Maximum
Peak Temperature (TP)
240°C Maximum
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
240°C Maximum 1 Time / 230°C Maximum 2 Times
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
Additional Notes
N/A
Level 1
Temperatures shown are applied to body of device.
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.)
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.)
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 5 of 5
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