EPSA22BBHH-48.000MTR [ECLIPTEK]
CRYSTAL OSCILLATOR, CLOCK, 48MHz, LVCMOS OUTPUT, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN;
| 型号： | EPSA22BBHH-48.000MTR |
| 厂家： | 
Ecliptek |
| 描述： | CRYSTAL OSCILLATOR, CLOCK, 48MHz, LVCMOS OUTPUT, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN 机械 输出元件 振荡器 |
| 文件： | 总6页 (文件大小：196K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
RoHS
Pb
EPSA22BBHH-48.000M TR
EPSA22 B B H H -48.000M TR
Series
Packaging Options
RoHS Compliant (Pb-free) 2.5V 4 Pad 3.2mm x 5mm
Ceramic SMD LVCMOS Programmable Spread
Spectrum Oscillator
Tape & Reel
Nominal Frequency
48.000MHz
Frequency Tolerance/Stability
±50ppm Maximum
Spread Spectrum
-1.00% Down Spread
Operating Temperature Range
-40°C to +85°C
Output Control Function
Tri-State
ELECTRICAL SPECIFICATIONS
Nominal Frequency
48.000MHz
Frequency Tolerance/Stability
±50ppm Maximum (Inclusive of all conditions: Frequency Stability over the Operating Temperature Range,
Supply Voltage Change, Output Load Change, First Year Aging at 25°C, Shock, and Vibration.)
Operating Temperature Range
Supply Voltage
-40°C to +85°C
2.5Vdc ±5%
Maximum Supply Voltage
Input Current
-0.5Vdc to +3.2Vdc
18mA Maximum
Output Voltage Logic High (Voh)
Output Voltage Logic Low (Vol)
Rise/Fall Time
90% of Vdd Minimum (IOH=-8mA)
10% of Vdd Maximum (IOL=+8mA)
3nSec Maximum (Measured at 10% to 90% of Waveform)
50% ±5(%) (Measured at 50% of waveform)
15pF Maximum
Duty Cycle
Load Drive Capability
Output Logic Type
CMOS
Output Control Function
Tri-State Input Voltage (Vih and Vil)
Tri-State Output Disable Time
Tri-State Output Enable Time
Disable Current
Tri-State (Disabled Output: High Impedance)
70% of Vdd Minimum or No Connection to Enable Output, 30% of Vdd Maximum to Disable Output
100nSec Maximum
100nSec Maximum
20mA Maximum (Unloaded; Pad 1=Ground)
-1.00% Down Spread
Spread Spectrum
Modulation Frequency
Period Jitter
30kHz Minimum, 32kHz Typical, 45kHz Maximum
100pSec Maximum (Cycle to Cycle; Spread Spectrum-On)
10mSec Maximum
Start Up Time
Storage Temperature Range
-55°C to +125°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
MIL-STD-883, Method 3015, Class 1, HBM: 1500V
MIL-STD-883, Method 1014, Condition A
UL94-V0
Fine Leak Test
Flammability
Gross Leak Test
Mechanical Shock
Moisture Resistance
Moisture Sensitivity
Resistance to Soldering Heat
Resistance to Solvents
Solderability
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 1004
J-STD-020, MSL 1
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
Temperature Cycling
Vibration
MIL-STD-883, Method 1010, Condition B
MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/13/2011 | Page 1 of 6
EPSA22BBHH-48.000M TR
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN CONNECTION
1
2
3
4
Tri-State
Case/Ground
Output
1.20 ±0.20
3.20
1.00 ±0.20 (x4)
±0.20
Supply Voltage
LINE MARKING
1
E48.000
E=Ecliptek Designator
4
3
1
2
5.00
±0.20
2.54
±0.15
2
SXXXXX
S=Configuration Designator
XXXXX=Ecliptek
1.20
±0.20
(x4)
Manufacturing Identifier
2.20
±0.15
1.3
MAX
Suggested Solder Pad Layout
All Dimensions in Millimeters
1.2 (x4)
1.4 (x4)
Solder Land
(X4)
1.14
1.0
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/13/2011 | Page 2 of 6
EPSA22BBHH-48.000M TR
OUTPUT WAVEFORM & TIMING DIAGRAM
VIH
VIL
VOH
90% of Waveform
OUTPUT DISABLE
(HIGH IMPEDANCE
STATE)
50% of Waveform
10% of Waveform
VOL
tPLZ
tPZL
Fall
Time
Rise
Time
TW
T
Duty Cycle (%) = TW/T x 100
Test Circuit for CMOS Output
Frequency
Counter
Oscilloscope
Probe
(Note 2)
Supply
Voltage
(VDD
)
Output
_
+
Current
Meter
+
+
Power
Supply
0.01µF
(Note 1)
Voltage
Meter
0.1µF
(Note 1)
CL
(Note 3)
Ground
_
_
Tri-State or
Power Down
Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency ceramic bypass
capacitor close (less than 2mm) to the package ground and supply voltage pin is required.
Note 2: A low input capacitance (<12pF), 10X Attentuation Factor, High Impedance (>10Mohms), and
High bandwidth (>300MHz) passive probe is recommended.
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. See applicable specification sheet
for ‘Load Drive Capability’.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/13/2011 | Page 3 of 6
EPSA22BBHH-48.000M TR
Tape & Reel Dimensions
Quantity Per Reel: 1,000 Units
4.0 ±0.1
2.00 ±0.05
DIA 1.5 +0.1/-0.0
0.3 ±0.1
7.50 ±0.15
16.0 ±0.3
A0*
6.75 ±0.15
8.0 ±0.1
B0*
K0*
*Compliant to EIA 481A
1.5 MIN
22.4 MAX
DIA 40 MIN
Access Hole at
Slot Location
360 MAX
DIA 50 MIN
2.5 MIN Width
10.0 MIN Depth
Tape slot in Core
for Tape Start
DIA 20.2 MIN
DIA 13.0 ±0.2
16.4 +2.0/-0.0
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/13/2011 | Page 4 of 6
EPSA22BBHH-48.000M TR
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
High Temperature Infrared/Convection
TS MAX to TL (Ramp-up Rate)
3°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
150°C
175°C
200°C
60 - 180 Seconds
Ramp-up Rate (TL to TP)
3°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
217°C
60 - 150 Seconds
Peak Temperature (TP)
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/13/2011 | Page 5 of 6
EPSA22BBHH-48.000M TR
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
Low Temperature Infrared/Convection 240°C
TS MAX to TL (Ramp-up Rate)
5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
N/A
150°C
N/A
60 - 120 Seconds
Ramp-up Rate (TL to TP)
5°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
150°C
200 Seconds Maximum
Peak Temperature (TP)
240°C Maximum
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
240°C Maximum 1 Time / 230°C Maximum 2 Times
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/13/2011 | Page 6 of 6
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