ES54K2A10V-38.400M [ECLIPTEK]
TCVCXO, CLIPPED SINE OUTPUT, 38.4 MHz, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN;
| 型号： | ES54K2A10V-38.400M |
| 厂家： | 
Ecliptek |
| 描述： | TCVCXO, CLIPPED SINE OUTPUT, 38.4 MHz, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN 机械 输出元件 石英晶振 压控振荡器 有源晶体振荡电路 |
| 文件： | 总5页 (文件大小：142K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
RoHS
Pb
ES54K2A10V-38.400M
ES54K2 A 10 V -38.400M
Series
Nominal Frequency
RoHS Compliant (Pb-free) 2.5V 2mm x 2.5mm Ceramic
SMD Clipped Sinewave TC(VC)XO
38.400MHz
Control Voltage
1.4Vdc ±1.0Vdc
Operating Temperature Range
0°C to +50°C
Frequency Stability vs. Temperature
±1.0ppm Maximum
ELECTRICAL SPECIFICATIONS
Nominal Frequency
38.400MHz
Frequency Stability vs. Frequency
Tolerance
±1.0ppm Maximum (at 25°C ±2°C, at Vdd=2.5Vdc)
Frequency Stability vs. Temperature
±1.0ppm Maximum (Inclusive of Operating Temperature Range, at Vdd=2.5Vdc)
Frequency Stability vs. Input Voltage ±0.2ppm Maximum (±5%)
Frequency Stability vs. Aging
Frequency Stability vs. Load
Frequency Stability vs. Reflow
Operating Temperature Range
Supply Voltage
±1ppm/year Maximum (at 25°C)
±0.2ppm Maximum (±1kOhm//±1pF)
±1.0ppm Maximum (at 25°C, 1 hour after reflow, 2 times)
0°C to +50°C
+2.5Vdc ±5%
Input Current
2.5mA Maximum
Output Voltage
0.8Vp-p Clipped Sinewave Minimum, 0.9Vp-p Typical (External DC-Cut capacitor required, 150pF NPO
recommended)
Load Drive Capability
Output Logic Type
Control Voltage
10kOhms//10pF
Clipped Sinewave
1.4Vdc ±1.0Vdc
Frequency Deviation
Linearity
±5ppm Minimum
±10% Maximum
Transfer Function
Input Impedance
Phase Noise
Positive Transfer Characteristic
500kOhms Minimum
-115dBc/Hz at 100Hz Offset, -135dBc/Hz at 1kHz Offset, and -148dBc/Hz at 10kHz Offset
Start Up Time
2mSec Maximum
-55°C to +125°C
Storage Temperature Range
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test
MIL-STD-883, Method 1014 Condition A
MIL-STD-883, Method 1014 Condition C
MIL-STD-202, Method 213 Condition C
MIL-STD-202, Method 210
Gross Leak Test
Mechanical Shock
Resistance to Soldering Heat
Resistance to Solvents
Solderability
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
Temperature Cycling
Vibration
MIL-STD-883, Method 1010
MIL-STD-883, Method 2007 Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/13/2011 | Page 1 of 5
ES54K2A10V-38.400M
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN CONNECTION
1
2
3
4
Voltage Control
Case/Ground
Output
0.60 ±0.15
0.9 MAX
Supply Voltage
4
3
1
2
LINE MARKING
1
E38.400
1.45
±0.15
2.50
±0.15
E=Ecliptek Designator
0.50
±0.15 (X4)
2
XXYZZ
XX=Ecliptek Manufacturing
Code
Y=Last Digit of the Year
ZZ=Week of the Year
0.70 ±0.15
(X4)
2.00
±0.15
Suggested Solder Pad Layout
All Dimensions in Millimeters
0.9 (X4)
0.8 (X4)
Solder Land
(X4)
1.25
0.55
All Tolerances are ±0.1
OUTPUT WAVEFORM
0VDC
VP-P
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/13/2011 | Page 2 of 5
ES54K2A10V-38.400M
Test Circuit for Voltage Control Option
Frequency
Counter
Oscilloscope
Probe
(Note 2)
Supply
Voltage
(VDD
)
Output
150pF
Current
Meter
0.01µF
(Note 1)
0.1µF
(Note 1)
Power
Supply
Voltage
Meter
Ground
CL = 10pF
(Note 3)
RL = 10kOhms
Voltage
Control
Power
Supply
Voltage
Meter
Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency
ceramic bypass capacitor close (less than 2mm) to the package ground and supply voltage
pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/13/2011 | Page 3 of 5
ES54K2A10V-38.400M
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
High Temperature Infrared/Convection
TS MAX to TL (Ramp-up Rate)
3°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
150°C
175°C
200°C
60 - 180 Seconds
Ramp-up Rate (TL to TP)
3°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
217°C
60 - 150 Seconds
Peak Temperature (TP)
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/13/2011 | Page 4 of 5
ES54K2A10V-38.400M
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
Low Temperature Infrared/Convection 240°C
TS MAX to TL (Ramp-up Rate)
5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
N/A
150°C
N/A
60 - 120 Seconds
Ramp-up Rate (TL to TP)
5°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
150°C
200 Seconds Maximum
Peak Temperature (TP)
240°C Maximum
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
240°C Maximum 1 Time / 230°C Maximum 2 Times
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/13/2011 | Page 5 of 5
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