ES54K2C10V-16.369MTR [ECLIPTEK]

TCVCXO, CLIPPED SINE OUTPUT, 16.369 MHz, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN;
ES54K2C10V-16.369MTR
型号: ES54K2C10V-16.369MTR
厂家: Ecliptek    Ecliptek
描述:

TCVCXO, CLIPPED SINE OUTPUT, 16.369 MHz, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN

机械 输出元件 石英晶振 压控振荡器 有源晶体振荡电路
文件: 总6页 (文件大小:175K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
RoHS  
Pb  
ES54K2C10V-16.369M TR  
ES54K2 C 10 V -16.369M TR  
Series  
Packaging Options  
RoHS Compliant (Pb-free) 2.5V 2mm x 2.5mm Ceramic  
SMD Clipped Sinewave TC(VC)XO  
Tape & Reel  
Nominal Frequency  
16.369MHz  
Operating Temperature Range  
-20°C to +70°C  
Control Voltage  
1.4Vdc ±1.0Vdc  
Frequency Stability vs. Temperature  
±1.0ppm Maximum  
ELECTRICAL SPECIFICATIONS  
Nominal Frequency  
16.369MHz  
Frequency Stability vs. Frequency  
Tolerance  
±1.0ppm Maximum (at 25°C ±2°C, at Vdd=2.5Vdc)  
Frequency Stability vs. Temperature  
±1.0ppm Maximum (Inclusive of Operating Temperature Range, at Vdd=2.5Vdc)  
Frequency Stability vs. Input Voltage ±0.2ppm Maximum (±5%)  
Frequency Stability vs. Aging  
Frequency Stability vs. Load  
Frequency Stability vs. Reflow  
Operating Temperature Range  
Supply Voltage  
±1ppm/year Maximum (at 25°C)  
±0.2ppm Maximum (±1kOhm//±1pF)  
±1.0ppm Maximum (at 25°C, 1 hour after reflow, 2 times)  
-20°C to +70°C  
+2.5Vdc ±5%  
Input Current  
2.0mA Maximum  
Output Voltage  
0.8Vp-p Clipped Sinewave Minimum, 0.9Vp-p Typical (External DC-Cut capacitor required, 150pF NPO  
recommended)  
Load Drive Capability  
Output Logic Type  
Control Voltage  
10kOhms//10pF  
Clipped Sinewave  
1.4Vdc ±1.0Vdc  
Frequency Deviation  
Linearity  
±5ppm Minimum  
±10% Maximum  
Transfer Function  
Input Impedance  
Phase Noise  
Positive Transfer Characteristic  
500kOhms Minimum  
-115dBc/Hz at 100Hz Offset, -135dBc/Hz at 1kHz Offset, and -148dBc/Hz at 10kHz Offset  
Start Up Time  
2mSec Maximum  
-55°C to +125°C  
Storage Temperature Range  
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS  
Fine Leak Test  
MIL-STD-883, Method 1014 Condition A  
MIL-STD-883, Method 1014 Condition C  
MIL-STD-202, Method 213 Condition C  
MIL-STD-202, Method 210  
Gross Leak Test  
Mechanical Shock  
Resistance to Soldering Heat  
Resistance to Solvents  
Solderability  
MIL-STD-202, Method 215  
MIL-STD-883, Method 2003  
Temperature Cycling  
Vibration  
MIL-STD-883, Method 1010  
MIL-STD-883, Method 2007 Condition A  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/13/2011 | Page 1 of 6  
ES54K2C10V-16.369M TR  
MECHANICAL DIMENSIONS (all dimensions in millimeters)  
PIN CONNECTION  
1
2
3
4
Voltage Control  
Case/Ground  
Output  
0.60 ±0.15  
0.9 MAX  
Supply Voltage  
4
3
1
2
LINE MARKING  
1
E16.369  
1.45  
±0.15  
2.50  
±0.15  
E=Ecliptek Designator  
0.50  
±0.15 (X4)  
2
XXYZZ  
XX=Ecliptek Manufacturing  
Code  
Y=Last Digit of the Year  
ZZ=Week of the Year  
0.70 ±0.15  
(X4)  
2.00  
±0.15  
Suggested Solder Pad Layout  
All Dimensions in Millimeters  
0.9 (X4)  
0.8 (X4)  
Solder Land  
(X4)  
1.25  
0.55  
All Tolerances are ±0.1  
OUTPUT WAVEFORM  
0VDC  
VP-P  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/13/2011 | Page 2 of 6  
ES54K2C10V-16.369M TR  
Test Circuit for Voltage Control Option  
Frequency  
Counter  
Oscilloscope  
Probe  
(Note 2)  
Supply  
Voltage  
(VDD  
)
Output  
150pF  
Current  
Meter  
0.01µF  
(Note 1)  
0.1µF  
(Note 1)  
Power  
Supply  
Voltage  
Meter  
Ground  
CL = 10pF  
(Note 3)  
RL = 10kOhms  
Voltage  
Control  
Power  
Supply  
Voltage  
Meter  
Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency  
ceramic bypass capacitor close (less than 2mm) to the package ground and supply voltage  
pin is required.  
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth  
(>300MHz) passive probe is recommended.  
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/13/2011 | Page 3 of 6  
ES54K2C10V-16.369M TR  
Tape & Reel Dimensions  
Quantity Per Reel: 1,000 units  
4.0 ±0.1  
2.0 ±0.1  
DIA 1.55 ±0.05  
0.25 ±0.05  
3.5 ±0.1  
8.0 ±0.2  
2.70  
±0.05  
2.75 ±0.10  
4.0 ±0.1  
2.25 ±0.05  
1.15 ±0.05  
14.4 MAX  
*Compliant to EIA 481A  
1.5 MIN  
DIA 40 MIN  
Access Hole at  
Slot Location  
330 MAX  
DIA 50 MIN  
2.5 MIN Width  
10.0 MIN Depth  
Tape slot in Core  
for Tape Start  
DIA 20.2 MIN  
DIA 13.0 ±0.2  
8.4 +1.5/-0.0  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/13/2011 | Page 4 of 6  
ES54K2C10V-16.369M TR  
Recommended Solder Reflow Methods  
Critical Zone  
TL to TP  
TP  
Ramp-up  
Ramp-down  
TL  
TS Max  
TS Min  
tL  
tP  
tSPreheat  
t 25°C to Peak  
Time (t)  
High Temperature Infrared/Convection  
TS MAX to TL (Ramp-up Rate)  
3°C/second Maximum  
Preheat  
- Temperature Minimum (TS MIN)  
- Temperature Typical (TS TYP)  
- Temperature Maximum (TS MAX)  
- Time (tS MIN)  
150°C  
175°C  
200°C  
60 - 180 Seconds  
Ramp-up Rate (TL to TP)  
3°C/second Maximum  
Time Maintained Above:  
- Temperature (TL)  
- Time (tL)  
217°C  
60 - 150 Seconds  
Peak Temperature (TP)  
260°C Maximum for 10 Seconds Maximum  
250°C +0/-5°C  
Target Peak Temperature (TP Target)  
Time within 5°C of actual peak (tp)  
Ramp-down Rate  
20 - 40 seconds  
6°C/second Maximum  
8 minutes Maximum  
Level 1  
Time 25°C to Peak Temperature (t)  
Moisture Sensitivity Level  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/13/2011 | Page 5 of 6  
ES54K2C10V-16.369M TR  
Recommended Solder Reflow Methods  
Critical Zone  
TL to TP  
TP  
Ramp-up  
Ramp-down  
TL  
TS Max  
TS Min  
tL  
tP  
tSPreheat  
t 25°C to Peak  
Time (t)  
Low Temperature Infrared/Convection 240°C  
TS MAX to TL (Ramp-up Rate)  
5°C/second Maximum  
Preheat  
- Temperature Minimum (TS MIN)  
- Temperature Typical (TS TYP)  
- Temperature Maximum (TS MAX)  
- Time (tS MIN)  
N/A  
150°C  
N/A  
60 - 120 Seconds  
Ramp-up Rate (TL to TP)  
5°C/second Maximum  
Time Maintained Above:  
- Temperature (TL)  
- Time (tL)  
150°C  
200 Seconds Maximum  
Peak Temperature (TP)  
240°C Maximum  
Target Peak Temperature (TP Target)  
Time within 5°C of actual peak (tp)  
Ramp-down Rate  
240°C Maximum 1 Time / 230°C Maximum 2 Times  
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time  
5°C/second Maximum  
Time 25°C to Peak Temperature (t)  
Moisture Sensitivity Level  
N/A  
Level 1  
Low Temperature Manual Soldering  
185°C Maximum for 10 seconds Maximum, 2 times Maximum.  
High Temperature Manual Soldering  
260°C Maximum for 5 seconds Maximum, 2 times Maximum.  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/13/2011 | Page 6 of 6  

相关型号:

ES54K2C15N-16.367667M

TCXO, CLIPPED SINE OUTPUT, 16.367667 MHz, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN
ECLIPTEK

ES54K2C15N-19.200MTR

TCXO, CLIPPED SINE OUTPUT, 19.2 MHz, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN
ECLIPTEK

ES54K2C20N-16.369MTR

TCXO, CLIPPED SINE OUTPUT, 16.369 MHz, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN
ECLIPTEK

ES54K2C20N-19.200MTR

TCXO, CLIPPED SINE OUTPUT, 19.2 MHz, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN
ECLIPTEK

ES54K2C20N-26.000MTR

TCXO, CLIPPED SINE OUTPUT, 26 MHz, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN
ECLIPTEK

ES54K2C20V-16.367667M

TCVCXO, CLIPPED SINE OUTPUT, 16.367667 MHz, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN
ECLIPTEK

ES54K2C20V-16.367667MTR

TCVCXO, CLIPPED SINE OUTPUT, 16.367667 MHz, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN
ECLIPTEK

ES54K2C25N-38.400MTR

TCXO, CLIPPED SINE OUTPUT, 38.4 MHz, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN
ECLIPTEK

ES54K2C25V-16.367667M

TCVCXO, CLIPPED SINE OUTPUT, 16.367667 MHz, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN
ECLIPTEK

ES54K2C25V-26.000M

TCVCXO, CLIPPED SINE OUTPUT, 26 MHz, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN
ECLIPTEK

ES54K2C30N-16.369M

TCXO, CLIPPED SINE OUTPUT, 16.369 MHz, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN
ECLIPTEK

ES54K2C30N-16.369MTR

TCXO, CLIPPED SINE OUTPUT, 16.369 MHz, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN
ECLIPTEK