EUEA30-19.6608M TR [ECLIPTEK]
CRYSTALS 30/50 -20+70 30PF 19.6608MHZ ATCUT FUND HC-49/U;
| 型号： | EUEA30-19.6608M TR |
| 厂家： | 
Ecliptek |
| 描述： | CRYSTALS 30/50 -20+70 30PF 19.6608MHZ ATCUT FUND HC-49/U |
| 文件： | 总3页 (文件大小：68K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
RoHS
Pb
EUEA30-19.6608M
EU E A 30 -19.6608M
Series
Nominal Frequency
RoHS Compliant (Pb-free) Resistance Welded HC-49/U
Crystal
19.6608MHz
Load Capacitance
30pF Parallel Resonant
Frequency Tolerance/Stability
±30ppm at 25°C, ±50ppm over -20°C to +70°C
Mode of Operation
AT-Cut Fundamental
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Tolerance/Stability
Aging at 25°C
19.6608MHz
±30ppm at 25°C, ±50ppm over -20°C to +70°C
±5ppm/year Maximum
30pF Parallel Resonant
7pF Maximum
Load Capacitance
Shunt Capacitance (C0)
Equivalent Series Resistance
Mode of Operation
25 Ohms Maximum
AT-Cut Fundamental
Drive Level
2mWatts Maximum
Storage Temperature Range
Insulation Resistance
-40°C to +125°C
500 Megaohms Minimum at 100Vdc
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test
MIL-STD-883, Method 1014, Condition A
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 2004
Gross Leak Test
Lead Integrity
Lead Termination
Mechanical Shock
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Sn 2µm - 6µm
MIL-STD-202, Method 213, Condition C
MIL-STD-202, Method 210
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
Temperature Cycling
Vibration
MIL-STD-883, Method 1010
MIL-STD-883, Method 2007, Condition A
MECHANICAL DIMENSIONS (all dimensions in millimeters)
LINE MARKING
1
2
ECLIPTEK
E19.660M
E=Configuration Designator
12.70
MIN
3
XX
XX=Ecliptek Manufacturing
Code
DIA 0.457
±0.051(X2)
11.18
MAX
4.88 ±0.20
4.70
MAX
13.58
MAX
www.ecliptek.com | Specification Subject to Change Without Notice | Rev F 2/16/2010 | Page 1 of 3
EUEA30-19.6608M
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
High Temperature Solder Bath (Wave Solder)
TS MAX to TL (Ramp-up Rate)
3°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
150°C
175°C
200°C
60 - 180 Seconds
Ramp-up Rate (TL to TP)
3°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
217°C
60 - 150 Seconds
Peak Temperature (TP)
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
www.ecliptek.com | Specification Subject to Change Without Notice | Rev F 2/16/2010 | Page 2 of 3
EUEA30-19.6608M
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
Low Temperature Solder Bath (Wave Solder)
TS MAX to TL (Ramp-up Rate)
5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
N/A
150°C
N/A
30 - 60 Seconds
Ramp-up Rate (TL to TP)
5°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
150°C
200 Seconds Maximum
Peak Temperature (TP)
245°C Maximum
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
245°C Maximum 1 Time / 235°C Maximum 2 Times
5 seconds Maximum 1 Time / 15 seconds Maximum 2 Times
5°C/second Maximum
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev F 2/16/2010 | Page 3 of 3
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