EV32C3B5A1-24.000M [ECLIPTEK]
VCXO, CLOCK, 24MHz, HCMOS OUTPUT, ROHS COMPLIANT, CERAMIC, SMD, 6 PIN;
| 型号： | EV32C3B5A1-24.000M |
| 厂家： | 
Ecliptek |
| 描述： | VCXO, CLOCK, 24MHz, HCMOS OUTPUT, ROHS COMPLIANT, CERAMIC, SMD, 6 PIN 机械 输出元件 石英晶振 压控振荡器 |
| 文件： | 总6页 (文件大小：243K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
RoHS
Pb
EV32C3B5A1-24.000M
EV32C3 B 5 A 1 -24.000M
Series
Nominal Frequency
24.000MHz
RoHS Compliant (Pb-free) 3.3V 6 Pad 5mm x 7mm
Ceramic SMD LVCMOS/TTL VCXO (Tri-State Pad 5)
Duty Cycle
50 ±5(%) Typical, 50 ±10(%) Maximum
Operating Temperature Range
-40°C to +85°C
Linearity
10% Typical, 20% Maximum
Absolute Pull Range
±100ppm Minimum
ELECTRICAL SPECIFICATIONS
Nominal Frequency
24.000MHz
Frequency Tolerance/Stability
±50ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the
Operating Temperature Range, Supply Voltage Change, Output Load Change, Shock, and Vibration.)
Aging at 25°C
±2ppm/first year Typical, ±10ppm/10 years Maximum
-40°C to +85°C
Operating Temperature Range
Supply Voltage
3.3Vdc ±10%
Input Current
15mA Maximum
Output Voltage Logic High (Voh)
Output Voltage Logic Low (Vol)
Rise/Fall Time
90% of Vdd Minimum (IOH = -4mA)
10% of Vdd Minimum (IOL = +4mA)
5nSec Maximum (Measured at 20% to 80% of Waveform)
50 ±5(%) Typical, 50 ±10(%) Maximum (Measured at 50% of Waveform)
15pF LVCMOS Load Maximum
CMOS
Duty Cycle
Load Drive Capability
Output Logic Type
Absolute Pull Range
±100ppm Minimum (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the
Operating Temperature Range, Supply Voltage Change, Output Load Change, Shock, Vibration, and Aging
over the Control Voltage (Vc).)
Control Voltage
0.3Vdc to 3.0Vdc (Test Condition for APR)
0.0Vdc to Vdd
Control Voltage Range
Linearity
10% Typical, 20% Maximum
Positive Tranfer Characteristic
10kHz Minimum (Measured at -3dB, Vc = 1.65Vdc)
50kOhms Minimum
Transfer Function
Modulation Bandwidth
Input Impedance
Input Leakage Current
Phase Noise
10µA Maximum
-70dBc/Hz at offset of 10Hz, -100dBc/Hz at offset of 100Hz, -130dBc/Hz at offset of 1kHz, -147dBc/Hz at
offset of 10kHz, -152dBc/Hz at offset of 100kHz, and -155dBc/Hz at offset of 1MHz (Typical Values at Fo =
27MHz)
Tri-State Input Voltage (Vih and Vil)
+0.9Vdd Minimum to Enable Output; +0.1Vdd Maximum to Disable Output (High Impedance); No Connect
to Enable Output.
RMS Phase Jitter
1pSec Maximum (Fj = 12kHz to 20MHz)
10mSec Maximum
Start Up Time
Storage Temperature Range
-55°C to +125°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
MIL-STD-883, Method 3015, Class 1, HBM: 1500V
MIL-STD-883, Method 1014, Condition A
UL94-V0
Fine Leak Test
Flammability
Gross Leak Test
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 1004
Mechanical Shock
Moisture Resistance
Moisture Sensitivity
Resistance to Soldering Heat
Resistance to Solvents
Solderability
J-STD-020, MSL 1
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
Temperature Cycling
MIL-STD-883, Method 1010, Condition B
www.ecliptek.com | Specification Subject to Change Without Notice | Rev M 2/16/2010 | Page 1 of 6
EV32C3B5A1-24.000M
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Vibration
MIL-STD-883, Method 2007, Condition A
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN CONNECTION
1
2
3
4
5
6
Control Voltage
No Connect
Case Ground
Output
5.00
±0.15
1.3 ±0.2
1.65
±0.20
Tri-State
1
2
6
5
4
Supply Voltage
2.54
TYP
3.68
±0.15
LINE MARKING
7.00
±0.15
5.08
±0.15
1
2
3
ECLIPTEK
24.000M
3
XXYZZ
XX=Ecliptek Manufacturing
Code
1.4 ±0.1
Y=Last Digit of Year
ZZ=Week of Year
Suggested Solder Pad Layout
All Dimensions in Millimeters
1.8 (X6)
2.0 (X6)
0.54 (X4)
Solder Land
1.89
(X6)
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev M 2/16/2010 | Page 2 of 6
EV32C3B5A1-24.000M
OUTPUT WAVEFORM
VOH
80% or 2.4VDC
50% or 1.4VDC
20% or 0.4VDC
VOL
Fall
Time
Rise
Time
TW
T
Duty Cycle (%) = TW/T x 100
Test Circuit for CMOS Output
Frequency
Counter
Oscilloscope
Probe
Supply
Voltage
(Note 2)
(VDD
)
Output
Current
Meter
No
Connect
0.1µF
0.01µF
Power
Supply
(Note 1)
Voltage
Meter
(Note 1)
Tri-State
Voltage
Control
CL
(Note 3)
Ground
Power
Supply
Voltage
Meter
Switch
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a
0.01µF high frequency ceramic bypass capacitor close to the package ground
and VDD pin is required.
Power
Supply
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance
(>10Mohms), and high bandwidth (>300MHz) passive probe is recommended.
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev M 2/16/2010 | Page 3 of 6
EV32C3B5A1-24.000M
Test Circuit for TTL Output
RL Value
(Ohms)
Output Load
Drive Capability
CL Value
(pF)
390
780
15
15
6
10TTL
5TTL
Frequency
Counter
Oscilloscope
1100
2000
2200
2TTL
15
3
10LSTTL
1TTL
Probe
(Note 2)
Table 1: RL Resistance Value and CL Capacitance
Value Vs. Output Load Drive Capability
Supply
Voltage
RL
(Note 4)
No
Connect
(VDD
)
Current
Meter
Output
0.1µF
(Note 1)
0.01µF
(Note 1)
CL
(Note 3)
Power
Supply
Power
Supply
Voltage
Meter
Tri-State
Note 5
Voltage
Control
Ground
Power
Supply
Voltage
Meter
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel
with a 0.01µF high frequency ceramic bypass capacitor close to the
package ground and VDD pin is required.
Power
Supply
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance
(>10Mohms), and high bandwidth (>300MHz) passive probe is recommended.
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.
Note 4: Resistance value RL is shown in Table 1. See applicable specification sheet for
'Load Drive Capability'.
Note 5: All diodes are MMBD7000, MMBD914, or equivalent.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev M 2/16/2010 | Page 4 of 6
EV32C3B5A1-24.000M
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
High Temperature Infrared/Convection
TS MAX to TL (Ramp-up Rate)
3°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
150°C
175°C
200°C
60 - 180 Seconds
Ramp-up Rate (TL to TP)
3°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
217°C
60 - 150 Seconds
Peak Temperature (TP)
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
www.ecliptek.com | Specification Subject to Change Without Notice | Rev M 2/16/2010 | Page 5 of 6
EV32C3B5A1-24.000M
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
Low Temperature Infrared/Convection 240°C
TS MAX to TL (Ramp-up Rate)
5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
N/A
150°C
N/A
60 - 120 Seconds
Ramp-up Rate (TL to TP)
5°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
150°C
200 Seconds Maximum
Peak Temperature (TP)
240°C Maximum
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
240°C Maximum 1 Time / 230°C Maximum 2 Times
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev M 2/16/2010 | Page 6 of 6
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