PPR20 [EDI]
FAST RECOVERY SINGLE-PHASE FULL WAVE BRIDGE 5.0 AMPERES HEAT SINK MOUNTING 2.0 AMPERES FOR P.C. BOARD MOUNTING; 快速恢复单相全波桥式5.0安培散热器装配2.0安培PC电路板安装
| 型号： | PPR20 |
| 厂家： | 
ELECTRONIC DEVICES INC. |
| 描述： | FAST RECOVERY SINGLE-PHASE FULL WAVE BRIDGE 5.0 AMPERES HEAT SINK MOUNTING 2.0 AMPERES FOR P.C. BOARD MOUNTING |
| 文件： | 总2页 (文件大小：53K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PPR
FAST RECOVERY
SINGLE-PHASE FULL WAVE BRIDGE
5.0 AMPERES HEAT SINK MOUNTING
2.0 AMPERES FOR P.C. BOARD MOUNTING
PPR SERIES
PRV/ leg
50V
100V
200V
400V
600V
800V
1000V
Type No.
PPR05
PPR10
PPR20
PPR40
PPR60
PPR80
PPR100
ELECTRICAL CHARACTERISTICS PER LEG
(at T
A
=25 C Unl ess Oth erw ise Spe cified)
Max. Reverse Recovery , Trr (Fig.4)
200
Nano Sec.
Amp
Max. Forward Voltage Drop, VF =1.3 V @ IF=
2.0
1.0
o
A
C, I
Max. DC Reverse Current @ PRV and 25
R
I
(8.3ms)
Max. Peak Surge Current,
100
Amp
FSM
o
Ambient Operating Temperature Range,TA
-55 to +150
-55 to +150
7.0typ.
C
o
Storage Temperature Range, T
C
STG
o
-
Thermal Resistance (Total Bridge), R0
C/ W
c
-
j
NOTE:
O
Maximum lead and terminal temperature for soldering, 3/8 inch from case,5 seconds at 250 C.
EDI reserves the right to change these specifications at any time without notice.
PPR
Figure 1
Figure 2
NON- REPETITIVE SURGE CURRENT
PPR SERIES CURRENT DERATING
0.1SEC
1.0SEC
8
6
4
100
75
BRIDGE OUTPUT
A
RES IND LOADS
50
B
2
25
0
0
0
20
40
60
80
100
120
140
160
1
2
3
4
5
6
7 8 9 10
20
30 40 50 60
O
TEMPERATURE ( C)
CYCLES(60 Hz)
A=CASE TEMPERATURE HEAT SINK MOUNTED
B=AMBIENT TEMPERATURE
Figure 3
Figure 4
POWER DISSIP ATION
TEST CIRCUIT
15
T
RR
R
1
12
ZERO
D.U.T.
50 OHM
REFERENCE
0.5A
PULSE
9
GENERATOR
-
SCOPE
1.0A
R
2
0.25A
1 OHM
6
R R
1, 2 NON-INDUCTIVE RESISTORS
BRIDGE OUTPUT
3
PULSE GENERATOR - HEWLETT PACKARD 214A OR EQUI.V
IKC REP.RATE, 10 SEC. PULSE WIDTH
RES IND LOADS
ADJUST PULSE AMPLITUDE FOR PEAK I
R
0
0
2
4
6
8
IF(AV). AVERAGE FORWARD CURRENT (AMP)
PPR SERIES MECHANICAL OUTLINE
D
AC
A
+
LTR
INCHES
MILLIMETERS
10.44-11.20
B
E
A
B
C
.411-.441
A
.137-.167 DIA
3.48-4.24 DIA
14.99-15.49
.97-1.07
.590-.610
.038-.042
1.000 MIN
.300 MAX
D
E
F
25.4 MIN
_
F
AC
C
7.62 MAX
NOTE: A thin film of silicone thermal compound is recommended between the Minibridge
case and mounting surface for improved thermal conduction.
ELECTRONIC DEVICES, INC. DESIGNERS AND MANUFACTURERS OF SOLID STATE DEVICES SINCE 1951.
21 GRAY OAKS AVENUE
*
YONKERS. NEW YORK 10710 914-965-4400
* Wwebsite: http://www.edidiodes.com
* FAX 914-965-5531 * 1-800-678-0828
Ee-mail:sales@edidiodes.com
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FAST RECOVERY SINGLE-PHASE FULL WAVE BRIDGE 5.0 AMPERES HEAT SINK MOUNTING 2.0 AMPERES FOR P.C. BOARD MOUNTING
EDI
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