PG1C-3LGS-SD [ELITE]
3W Power LED;
| 型号： | PG1C-3LGS-SD |
| 厂家： | 
Elite Enterprises (H.K.) Co., Ltd. |
| 描述： | 3W Power LED |
| 文件： | 总22页 (文件大小：1512K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ProLight PG1C-3Lxx-SD
3W Power LED
Technical Datasheet
Version: 3.4
Features
● High flux per LED
● Various colors
● Good color uniformity
● Industry best moisture senstivity level - JEDEC 2a
4 week floor life without reconditioning
● Low-temp. & lead free reflow soldering
● RoHS compliant
● More energy efficient than incandescent and
most halogen lamps
● Low Voltage DC operated
● Instant light (less than 100ns)
● No UV
● Superior ESD protection
Typical Applications
● Reading lights (car, bus, aircraft)
● Portable (flashlight, bicycle)
● Uplighters/Downlighters
● Decorative/Entertainment
● Bollards/Security/Garden
● Cove/Undershelf/Task
● Indoor/Outdoor Commercial and
Residential Architectural
● Automotive Ext (Stop-Tail-Turn,
CHMSL, Mirror Side Repeat)
● LCD backlights
2010/04
1
Emitter Mechanical Dimensions
BOTTOM VIEW
TOP VIEW
Notes:
1. The Anode side of the device is denoted by a hole in the lead frame.
2. Electrical insulation between the case and the board is required --- slug of device is not
electrically neutral. Do not electrically connect either the anode or cathode to the slug.
3. Drawing not to scale.
4. All dimensions are in millimeters.
5. All dimendions without tolerances are for reference only.
6. Please do not bend the leads of the LED, otherwise it will damage the LED.
7. Please do not use a force of over 3kgf impact or pressure on the lens of the LED, otherwise
it will cause a catastrophic failure.
*The appearance and specifications of the product may be modified for improvement without notice.
2
Star Mechanical Dimensions
Notes:
1. Slots in aluminum-core PCB for M3 or #4 mounting screw.
2. Electrical interconnection pads labeled on the aluminum-core PCB with "+" and "-" to denote
positive and negative, respectively. All positive pads are interconnected, as are all negative pads,
allowing for flexibility in array interconnection.
3. Drawing not to scale.
4. All dimensions are in millimeters.
5. All dimendions without tolerances are for reference only.
6. Please do not use a force of over 3kgf impact or pressure on the lens of the LED, otherwise
it will cause a catastrophic failure.
*The appearance and specifications of the product may be modified for improvement without notice.
3
Flux Characteristics at 700mA, TJ = 25°C
Part Number
Emitter
LumiousFlux or Power
Radiation
Pattern
Color
Star
Minimum
Typical
White
Warm White
Red
PG1C-3LWE-SD PG1C-3LWS-SD
PG1C-3LVE-SD PG1C-3LVS-SD
PG1C-3LRE-SD PG1C-3LRS-SD
PG1C-3LAE-SD PG1C-3LAS-SD
PG1C-3LGE-SD PG1C-3LGS-SD
PG1C-3LBE-SD PG1C-3LBS-SD
PG1C-3LDE-SD PG1C-3LDS-SD
129.5 lm
113.6 lm
58.9 lm
67.2 lm
99.6 lm
23.5 lm
435 mW
148 lm
138 lm
81 lm
Lambertian
Amber
85 lm
Green
114 lm
32 lm
Blue
Royal Blue
510 mW
● ProLight maintains a tolerance of ± 10% on flux and power measurements.
● Please do not drive at rated current more than 1 second without proper heat sink.
Electrical Characteristics at 700mA, TJ = 25°C
Forward Voltage VF (V)
Typ.
Thermal Resistance
Junction to Slug (°C/ W)
Color
Min.
Max.
White
Warm White
Red
3.1
3.1
2.0
2.0
3.1
3.1
3.1
3.8
3.8
2.7
2.7
3.9
3.8
3.8
4.35
4.35
3.25
3.25
4.35
4.35
4.35
8
8
10
10
Amber
Green
8
8
8
Blue
Royal Blue
4
Optical Characteristics at 700mA, TJ = 25°C
Total
included
Angle
Dominant Wavelength λD,
Peak Wavelength [1]λP,
Viewing
Angle
or Color Temperature CCT
(degrees)
θ0.90V
(degrees)
2 θ1/2
Color
Min.
Typ.
Max.
White
Warm White
Red
4100 K
2700 K
613.5 nm
587 nm
515 nm
455 nm
450 nm
5500 K
3300 K
623 nm
592 nm
525 nm
465 nm
455 nm
10000 K
4100 K
631 nm
597 nm
535 nm
475 nm
460nm
160
160
160
160
160
160
160
140
140
140
140
140
140
140
Amber
Green
Blue
Royal Blue
● ProLight maintains a tolerance of ± 1nm for dominant wavelength measurements.
● ProLight maintains a tolerance of ± 5% for CCT measurements.
Absolute Maximum Ratings
White/Warm White/Red/
Amber/Green/Blue/Royal Blue
Parameter
700
1000
700
DC Forward Current (mA)
Peak Pulsed Forward Current (mA)
Average Forward Current (mA)
ESD Sensitivity
±4000V (Class III)
(HBM per MIL-STD-883E Method 3015.7)
LED Junction Temperature (°C)
Aluminum-core PCB Temperature (°C)
Storage & Operating Temperature (°C)
Soldering Temperature(°C)
120
90
-40 to + 90
235°C
5
Radiometric Power Bin Structure
Minimum
Maximum
Available
Color
Bin Code
Radiometric Power (mW) Radiometric Power (mW)
Color Bins
435
515
635
515
635
755
All
All
All
Q
R
S
Royal Blue
● ProLight maintains a tolerance of ± 10% on flux and power measurements.
● The flux bin of the product may be modified for improvement without notice.
Photometric Luminous Flux Bin Structure
Minimum
Maximum
Available
Color
Bin Code
Photometric Flux (lm)
Photometric Flux (lm)
Color Bins
129.5
147.7
147.7
168.4
V2
All
White
Yx, Xx, Wx, Vx, Ux【1】
W1
113.6
129.5
147.7
129.5
147.7
168.4
All
All
V1
V2
Warm White
Sx, Rx【1】
W1
58.9
67.2
76.6
87.4
67.2
76.6
87.4
99.6
All
All
S2
T1
T2
U1
Red
All
【1】
67.2
76.6
87.4
76.6
87.4
99.6
All
T1
T2
U1
Amber
Green
Blue
All
【1】
99.6
113.6
129.5
113.6
129.5
147.7
All
U2
V1
V2
All
【1】
A, 1, 2【1】
1, 2【1】
【1】
23.5
30.6
39.8
30.6
39.8
51.7
P
Q
R
● ProLight maintains a tolerance of ± 10% on flux and power measurements.
● The flux bin of the product may be modified for improvement without notice.
●
【1】The rest of color bins are not 100% ready for order currently. Please ask for quote and order possibility.
6
Color Bin
White and Warm White Binning Structure Graphical Representation
0.48
2700 K
2850 K
0.46
0.44
3050 K
3250 K
3500 K
3800 K
M1
4100 K
N1
0.42
0.40
0.38
0.36
0.34
0.32
0.30
0.28
0.26
P1
N0
Q1
4500 K
M0
Planckian
(BBL)
R1
P0
Q0
S1
S0
5000 K
R0
TN
T0
5650 K
UN
U0
6300 K
VN
V0
Warm White
7000 K
WN
XN
X0
W0
WP
10000 K
Y0
White
XP
YA
0.26
0.28
0.30
0.32
0.34
0.36
0.38
0.40
0.42
0.44
0.46
0.48
0.50
x
7
Color Bins
White Bin Structure
Typ. CCT
(K)
Typ. CCT
(K)
Bin Code
x
y
Bin Code
WN
x
y
0.378
0.374
0.360
0.362
0.382
0.378
0.362
0.365
0.362
0.360
0.344
0.346
0.365
0.362
0.346
0.347
0.329
0.329
0.346
0.344
0.329
0.329
0.347
0.346
0.329
0.329
0.317
0.316
0.382
0.366
0.357
0.372
0.397
0.382
0.372
0.386
0.372
0.357
0.344
0.359
0.386
0.372
0.359
0.372
0.331
0.345
0.359
0.344
0.345
0.357
0.372
0.359
0.345
0.331
0.320
0.333
0.329
0.316
0.315
0.329
0.329
0.329
0.318
0.317
0.308
0.305
0.316
0.317
0.305
0.303
0.315
0.316
0.308
0.317
0.319
0.311
0.308
0.283
0.274
0.303
0.308
0.311
0.290
0.283
0.345
0.333
0.344
0.357
0.331
0.320
0.310
0.320
0.311
0.322
0.333
0.320
0.322
0.333
0.344
0.333
0.311
0.320
0.300
0.293
0.311
0.284
0.301
0.333
0.311
0.293
0.270
0.284
T0
4300
4300
4750
4750
5320
5320
5970
5970
5970
6650
6650
6650
8000
8000
TN
U0
UN
V0
WP
X0
XN
XP
Y0
VN
W0
YA
● Tolerance on each color bin (x , y) is ± 0.01
Note: Although several bins are outlined, product availability in a particular bin varies by production run
and by product performance. Not all bins are available in all colors.
8
Color Bins
Warm White Bin Structure
Typ. CCT
(K)
Typ. CCT
(K)
Bin Code
x
y
Bin Code
Q0
x
y
0.453
0.444
0.459
0.467
0.460
0.453
0.467
0.473
0.438
0.429
0.444
0.453
0.444
0.438
0.453
0.460
0.424
0.416
0.429
0.438
0.430
0.424
0.438
0.444
0.416
0.399
0.403
0.419
0.430
0.416
0.419
0.432
0.412
0.394
0.399
0.416
0.426
0.412
0.416
0.430
0.407
0.389
0.394
0.412
0.421
0.407
0.412
0.426
0.409
0.402
0.416
0.424
0.414
0.409
0.424
0.430
0.392
0.387
0.402
0.409
0.414
0.409
0.392
0.397
0.392
0.387
0.374
0.378
0.397
0.392
0.378
0.382
0.400
0.382
0.389
0.407
0.414
0.400
0.407
0.421
0.391
0.374
0.382
0.400
0.414
0.400
0.391
0.406
0.391
0.374
0.366
0.382
0.406
0.391
0.382
0.397
M0
2770
2770
2950
2950
3150
3150
3370
3370
3650
3650
3950
3950
M1
N0
N1
P0
P1
Q1
R0
R1
S0
S1
● Tolerance on each color bin (x , y) is ± 0.01
Note: Although several bins are outlined, product availability in a particular bin varies by production run
and by product performance. Not all bins are available in all colors.
9
Dominant Wavelength Bin Structure
Minimum Dominant
Maximum Dominant
Wavelength (nm)
Color
Bin Code
Wavelength (nm)
613.5
620.5
620.5
631.0
2
4
Red
587.0
589.5
592.0
594.5
589.5
592.0
594.5
597.0
2
4
6
7
Amber
Green
515
520
525
530
520
525
530
535
A
1
2
3
455
460
465
470
460
465
470
475
A
1
2
3
Blue
450
455
455
460
5
6
Royal Blue
● ProLight maintains a tolerance of ± 1nm for dominant wavelength measurements.
Note: Although several bins are outlined, product availability in a particular bin varies by production run
and by product performance. Not all bins are available in all colors.
10
Color Spectrum, TJ = 25°C
1. White
1.0
Standard Eye Response Cruve
0.8
White
0.6
0.4
0.2
0.0
350 400 450 500 550 600 650 700 750 800 850
Wavelength(nm)
2. Warm White
1.0
Standard Eye Response Cruve
Warm White
0.8
0.6
0.4
0.2
0.0
350 400 450 500 550 600 650 700 750 800 850
Wavelength(nm)
3. Royal Blue、Blue、Green、Amber、Red
1.0
Red
Blue
Green
Royal Blue
Amber
0.8
0.6
0.4
0.2
0.0
400
450
500
550
600
650
700
Wavelength(nm)
11
Light Output Characteristics
Relative Light Output vs. Junction Temperature at 700mA
160
White, Warm White
140
120
100
80
Green, Royal Blue
Blue
60
40
20
0
-20
0
20
40
60
80
100
120
Junction Temperature, TJ (℃)
160
140
120
100
80
Red
Amber
60
40
20
0
60
100
-20
0
20
40
80
120
Junction Temperature, TJ (℃)
12
Forward Current Characteristics, TJ = 25°C
1. Forward Voltage vs. Forward Current
800
700
600
500
400
300
200
100
0
800
700
600
500
400
300
200
100
0
White, Warm White,
Green, Blue,
Royal Blue
Red, Amber
0
0.5
1
1.5
2
2.5
3
3.5
4
0
0.5
1
1.5
2
2.5
3
Forward Voltage (V)
Forward Voltage (V)
2. Forward Current vs. Normalized Relative Luminous Flux
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.2
1.0
0.8
0.6
0.4
0.2
0.0
Red, Amber
White, Warm White,
Green, Blue,
Royal Blue
0
200
400
600
800
0
200
400
600
800
Forward Current (mA)
Forward Current (mA)
13
Ambient Temperature vs. Maximum Forward Current
1. White, Warm White, Green, Blue, Royal Blue (TJMAX = 120°C)
800
700
600
500
RθJ-A = 30°C/W
400
RθJ-A = 25°C/W
300
RθJ-A = 20°C/W
200
RθJ-A = 15°C/W
100
0
0
25
50
75
100
125
150
Ambient Temperature (℃)
2. Red, Amber (TJMAX = 120°C)
800
700
600
500
RθJ-A = 30°C/W
RθJ-A = 25°C/W
400
300
200
100
0
RθJ-A = 20°C/W
RθJ-A = 15°C/W
0
25
50
75
100
125
150
Ambient Temperature (℃)
14
Typical Representative Spatial Radiation Pattern
Lambertian Radiation Pattern
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
Angular Displacement (Degrees)
15
Moisture Sensitivity Level - JEDEC 2a
Soak Requirements
Accelerated Environment
Conditions Time (hours) Conditions Time (hours) Conditions
Floor Life
Standard
Level
Time
≤30°C /
30°C /
60°C /
2a
4 weeks
696 +5/-0
120 +1/-0
60% RH
60% RH
60% RH
● The standard soak time includes a default value of 24 hours for semiconductor manufature's
exposure time (MET) between bake and bag and includes the maximum time allowed out of
the bag at the distributor's facility.
● Table below presents the moisture sensitivity level definitions per IPC/JEDEC's J-STD-020C.
Soak Requirements
Floor Life
Standard
Accelerated Environment
Level
Time
Conditions Time (hours) Conditions Time (hours) Conditions
≤30°C /
85% RH
≤30°C /
60% RH
≤30°C /
60% RH
≤30°C /
60% RH
≤30°C /
60% RH
≤30°C /
60% RH
≤30°C /
60% RH
≤30°C /
60% RH
85°C /
85% RH
85°C /
1
2
Unlimited
168 +5/-0
168 +5/-0
696 +5/-0
192 +5/-0
96 +2/-0
72 +2/-0
48 +2/-0
NA
NA
NA
1 year
4 weeks
168 hours
72 hours
48 hours
24 hours
NA
60% RH
30°C /
60°C /
60% RH
60°C /
2a
3
120 +1/-0
40 +1/-0
20 +0.5/-0
15 +0.5/-0
10 +0.5/-0
NA
60% RH
30°C /
60% RH
30°C /
60% RH
60°C /
4
60% RH
30°C /
60% RH
60°C /
5
60% RH
30°C /
60% RH
60°C /
5a
6
60% RH
30°C /
60% RH
Time on Label
(TOL)
Time on Label
(TOL)
NA
60% RH
16
Qualification Reliability Testing
Stress Conditions
Stress Test
Room Temperature
Operating Life (RTOL)
Wet High Temperature
Operating Life (WHTOL)
Wet High Temperature
Storage Life (WHTSL)
High Temperature
Stress Duration Failure Criteria
25°C, IF = max DC (Note 1)
85°C/60%RH, IF = max DC (Note 1)
85°C/85%RH, non-operating
110°C, non-operating
1000 hours
1000 hours
1000 hours
1000 hours
1000 hours
200 cycles
200 cycles
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 3
Note 3
Note 3
Note 3
Storage Life (HTSL)
Low Temperature
-40°C, non-operating
Storage Life (LTSL)
Non-operating
-40°C to 120°C, 30 min. dwell,
<5 min. transfer
Temperature Cycle (TMCL)
Non-operating
-40°C to 120°C, 20 min. dwell,
<20 sec. transfer
Thermal Shock (TMSK)
1500 G, 0.5 msec. pulse,
5 shocks each 6 axis
Mechanical Shock
Natural Drop
On concrete from 1.2 m, 3X
10-2000-10 Hz, log or linear sweep rate,
20 G about 1 min., 1.5 mm, 3X/axis
Variable Vibration
Frequency
Solder Heat Resistance
(SHR)
260°C ± 5°C, 10 sec.
Steam age for 16 hrs., then solder dip
at 260°C for 5 sec.
Solder coverage
on lead
Solderability
Notes:
1. Depending on the maximum derating curve.
2. Criteria for judging failure
Criteria for Judgement
Item
Test Condition
IF = max DC
IF = max DC
VR = 5V
Max.
Min.
--
Forward Voltage (VF)
Luminous Flux or
Initial Level x 1.1
Initial Level x 0.7
--
Radiometric Power (ΦV)
Reverse Current (IR)
50 μA
--
* The test is performed after the LED is cooled down to the room temperature.
3. A failure is an LED that is open or shorted.
17
Recommended Solder Pad Design
● All dimensions are in millimeters.
● Electrical isolation is required between Slug and Solder Pad.
18
Reflow Soldering Condition
Low-Temp. & Pb-Free Assembly
(58Bi-42Sn Eutectic Alloy)
Profile Feature
Preheat & Soak
Sn-Pb Eutectic Assembly
Temperature min (Tsmin
Temperature max (Tsmax
Time (Tsmin to Tsmax
)
100 °C
150 °C
90 °C
120 °C
)
)
60-120 seconds
3 °C / second max.
183°C
60-120 seconds
2 °C / second max.
138°C
Average Ramp-Up Rate (Tsmax to TP)
Liquidous temperature (TL)
Time at liquidous (tL)
60-150 seconds
235°C
20-50 seconds
185°C
Peak package body temperature (TP)
Time (tP) within 5°C of the specified
classification temperature (TC)
20 seconds
20 seconds
Average ramp-down rate (TP to Tsmax
)
6 °C/second max.
6 minutes max.
3 °C/second max.
4 minutes max.
Time 25°C to Peak Temperature
● All temperatures refer to topside of the package, measured on the package body surface.
● Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
a heat plate should be used. It should be confirmed beforehand whether the characteristics of
LEDs will or will not be damaged by repairing.
● Reflow soldering should not be done more than two times.
● When soldering, do not put stress on the LEDs during heating.
● After soldering, do not warp the circuit board.
19
Heat Plate Soldering Condition
(1) Soldering Process for Solder Paste
(2) Soldering Process for Solder Wire
Solder Paste
MCPCB
Heat Plate
MCPCB
Put MCPCB on Heat Plate.
Use Solder Mask to print Solder Paste on MCPCB.
Solder Wire
Emitter
Heat Plate
Place Solder Wire to the solder pad of MCPCB.
Place Emitter on MCPCB.
Emitter
Heat Plate
Heat Plate
Put MCPCB on Heat Plate until Solder Paste melt.
The Solder Paste sould be melted within 10 seconds.
Take out MCPCB out from Heat Plate within 15 seconds.
Put Emitter on MCPCB. Take the MCPCB out
from Heat Plate within 10 seconds.
● Heat plate temperature: 230°C max for Lead Solder and 230°C max for Lead-Free Solder.
● We recommend using the 58Bi-42Sn eutectic alloy for low-temp. and lead free soldering (melting point = 138 °C).
● When soldering, do not put stress on the LEDs during heating.
● After soldering, do not warp the circuit board.
Manual Hand Soldering
Solder Wire
Thermal Conductive Glue
Soldering Iron
MCPCB
Emitter
Use Soldering Iron to solder the
leads of Emtter within 5 seconds.
Place Emitter on the MCPCB.
Place Thermal Comductive Glue
on the MCPCB.
● For prototype builds or small series production runs it possible to place and solder the emitters by hand.
● Solder tip temperature: 230°C max for Lead Solder and 260°C max for Lead-Free Solder.
● Avoiding damage to the emitter or to the MCPCB dielectric layer. Damage to the epoxy layer can cause
a short circuit in the array.
● Do not let the solder contact from solder pad to back-side of MCPCB. This one will cause a short circuit
and damage emitter.
20
Emitter Tube Packaging
Star Tube Packaging
Notes:
1. Emitter 50 pieces per tube and Star 20 pieces per tube.
2. Drawing not to scale.
3. All dimensions are in millimeters.
4. All dimendions without tolerances are for reference only.
**Please do not open the moisture barrier bag (MBB) more than one week. This may cause the leads
of LED discoloration. We recommend storing ProLight’s LEDs in a dry box after opening the MBB.
The recommended storage conditions are temperature 5 to 30°C and humidity less than 40% RH.
21
Precaution for Use
● Storage
Please do not open the moisture barrier bag (MBB) more than one week. This may cause the
leads of LED discoloration. We recommend storing ProLight’s LEDs in a dry box after opening
the MBB. The recommended storage conditions are temperature 5 to 30°C and humidity less
than 40% RH. It is also recommended to return the LEDs to the MBB and to reseal the MBB.
● The slug is is not electrically neutral. Therefore, we recommend to isolate the heat sink.
● The slug is to be soldered. If not, please use the heat conductive adhesive.
● Any mechanical force or any excess vibration shall not be accepted to apply during cooling
process to normal temperature after soldering.
● Please avoid rapid cooling after soldering.
● Components should not be mounted on warped direction of PCB.
● Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
a heat plate should be used. It should be confirmed beforehand whether the characteristics of
the LEDs will or will not be damaged by repairing.
● This device should not be used in any type of fluid such as water, oil, organic solvent and etc.
When cleaning is required, isopropyl alcohol should be used.
● When the LEDs are illuminating, operating current should be decide after considering the
package maximum temperature.
● The appearance, specifications and flux bin of the product may be modified for improvement
without notice. Please refer to the below website for the latest datasheets.
http://www.prolightopto.com/
Handling of Silicone Lens LEDs
Notes for handling of silicone lens LEDs
● Please do not use a force of over 3kgf impact or pressure on the silicone lens,
otherwise it will cause a catastrophic failure.
● The LEDs should only be picked up by making contact with the sides of the LED body.
● Avoid touching the silicone lens especially by sharp tools such as Tweezers.
● Avoid leaving fingerprints on the silicone lens.
● Please store the LEDs away from dusty areas or seal the product against dust.
● When populating boards in SMT production, there are basically no restrictions
regarding the form of the pick and place nozzle, except that mechanical pressure
on the silicone lens must be prevented.
● Please do not mold over the silicone lens with another resin. (epoxy, urethane, etc)
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