PM6A-1LFE [ELITE]

1W RGB Power LED;
PM6A-1LFE
型号: PM6A-1LFE
厂家: Elite Enterprises (H.K.) Co., Ltd.    Elite Enterprises (H.K.) Co., Ltd.
描述:

1W RGB Power LED

文件: 总13页 (文件大小:1598K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ProLight PM6A-1LFx  
1W RGB Power LED  
Technical Datasheet  
Version: 1.4  
Features  
R, G, B three color in one Package  
High flux per LED  
Good color uniformity  
More energy efficient than incandescent and  
most halogen lamps  
Low Voltage DC operated  
Instant light (less than 100ns)  
No UV  
Typical Applications  
Reading lights (car, bus, aircraft)  
Portable (flashlight, bicycle)  
Uplighters/Downlighters  
Decorative/Entertainment  
Bollards/Security/Garden  
Cove/Undershelf/Task  
Indoor/Outdoor Commercial and  
Residential Architectural  
Automotive Ext (Stop-Tail-Turn,  
CHMSL, Mirror Side Repeat)  
LCD backlights  
2010/04  
1
Emitter Mechanical Dimensions  
BOTTOM VIEW  
TOP VIEW  
Notes:  
1. The Anode side of the device is denoted by a hole in the lead frame.  
2. Electrical insulation between the case and the board is required --- slug of device is not  
electrically neutral. Do not electrically connect either the anode or cathode to the slug.  
3. Drawing not to scale.  
4. All dimensions are in millimeters.  
5. All dimendions without tolerances are for reference only.  
6. Please do not bend the leads of the LED, otherwise it will damage the LED.  
7. Please do not use a force of over 3kgf impact or pressure on the lens of the LED, otherwise  
it will cause a catastrophic failure.  
*The appearance and specifications of the product may be modified for improvement without notice.  
2
Star Mechanical Dimensions  
Notes:  
1. Slots in aluminum-core PCB for M3 or #4 mounting screw.  
2. Electrical interconnection pads labeled on the aluminum-core PCB with "+" and "-" to denote  
positive and negative, respectively. All positive pads are interconnected, as are all negative pads,  
allowing for flexibility in array interconnection.  
3. Drawing not to scale.  
4. All dimensions are in millimeters.  
5. All dimendions without tolerances are for reference only.  
6. Please do not use a force of over 3kgf impact or pressure on the lens of the LED, otherwise  
it will cause a catastrophic failure.  
*The appearance and specifications of the product may be modified for improvement without notice.  
3
Flux Characteristics at 150mA, TJ = 25°C  
Part Number  
Emitter  
Lumious Flux ΦV (lm)  
Radiation  
Pattern  
Color  
Star  
Minimum  
Typical  
Red  
Green  
Blue  
10.7  
13.9  
3.8  
15.0  
22.0  
5.8  
Lambertian  
PM6A-1LFE  
PM6A-1LFS  
ProLight maintains a tolerance of ± 10% on flux and power measurements.  
Please do not drive at rated current more than 1 second without proper heat sink.  
Optical Characteristics at 150mA, TJ = 25°C  
Total  
Dominant Wavelength λD,  
included  
Angle  
Viewing  
Angle  
or Color Temperature CCT  
(degrees)  
θ0.90V  
(degrees)  
2 θ1/2  
Color  
Min.  
Typ.  
Max.  
Red  
Green  
Blue  
613.5 nm  
515 nm  
455 nm  
623 nm  
525 nm  
465 nm  
631 nm  
535 nm  
475 nm  
180  
180  
180  
130  
130  
130  
ProLight maintains a tolerance of ± 1nm for dominant wavelength measurements.  
ProLight maintains a tolerance of ± 5% for CCT measurements.  
Electrical Characteristics at 150mA, TJ = 25°C  
Forward Voltage VF (V)  
Color  
Min.  
Typ.  
Max.  
Red  
Green  
Blue  
1.75  
2.85  
2.85  
2.2  
3.5  
3.5  
3.1  
4.1  
4.1  
4
Absolute Maximum Ratings  
Red/Green/Blue  
Parameter  
150  
250  
150  
DC Forward Current (mA)  
Peak Pulsed Forward Current (mA)  
Average Forward Current (mA)  
ESD Sensitivity  
> ±500V  
(HBM per MIL-STD-883E Method 3015.7)  
LED Junction Temperature (°C)  
Aluminum-core PCB Temperature (°C)  
Storage & Operating Temperature (°C)  
Soldering Temperature(°C)  
120  
105  
-40 to +105  
235°C  
Dominant Wavelength Bin Structure  
Minimum Dominant  
Maximum Dominant  
Wavelength (nm)  
Color  
Bin Code  
Wavelength (nm)  
613.5  
620.5  
620.5  
631.0  
2
4
Red  
515  
520  
525  
530  
520  
525  
530  
535  
A
1
2
3
Green  
Blue  
455  
460  
465  
470  
460  
465  
470  
475  
A
1
2
3
ProLight maintains a tolerance of ± 1nm for dominant wavelength measurements.  
Note: Although several bins are outlined, product availability in a particular bin varies by production run  
and by product performance. Not all bins are available in all colors.  
5
Color Spectrum, TJ = 25°C  
1. BlueGreenRed  
1.0  
Blue  
Red  
Green  
0.8  
0.6  
0.4  
0.2  
0.0  
400  
450  
500  
550  
600  
650  
700  
Wavelength(nm)  
Light Output Characteristics  
Relative Light Output vs. Junction Temperature at 150mA  
160  
140  
120  
100  
80  
Red  
Green  
Blue  
60  
40  
20  
0
-20  
0
20  
40  
60  
80  
100  
120  
Junction Temperature, TJ ()  
6
Forward Current Characteristics, TJ = 25°C  
1. Forward Voltage vs. Forward Current  
160  
140  
120  
100  
80  
160  
140  
120  
100  
80  
Green, Blue  
Red  
60  
60  
40  
40  
20  
20  
0
0
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
0
0.5  
1
1.5  
2
2.5  
3
Forward Voltage (V)  
Forward Voltage (V)  
2. Forward Current vs. Normalized Relative Luminous Flux  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
Green, Blue  
Red  
0
50  
100  
150  
200  
0
50  
100  
150  
200  
Forward Current (mA)  
Forward Current (mA)  
7
Typical Representative Spatial Radiation Pattern  
Lambertian Radiation Pattern  
1
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
-90 -80 -70 -60 -50 -40 -30 -20 -10  
0
10 20 30 40 50 60 70 80 90  
Angular Displacement (Degrees)  
8
Qualification Reliability Testing  
Stress Conditions  
Stress Test  
Room Temperature  
Operating Life (RTOL)  
Wet High Temperature  
Operating Life (WHTOL)  
Wet High Temperature  
Storage Life (WHTSL)  
High Temperature  
Stress Duration Failure Criteria  
25°C, IF = max DC (Note 1)  
85°C/60%RH, IF = max DC (Note 1)  
85°C/85%RH, non-operating  
110°C, non-operating  
1000 hours  
1000 hours  
1000 hours  
1000 hours  
1000 hours  
200 cycles  
200 cycles  
Note 2  
Note 2  
Note 2  
Note 2  
Note 2  
Note 2  
Note 2  
Note 3  
Note 3  
Note 3  
Storage Life (HTSL)  
Low Temperature  
-40°C, non-operating  
Storage Life (LTSL)  
Non-operating  
-40°C to 120°C, 30 min. dwell,  
<5 min. transfer  
Temperature Cycle (TMCL)  
Non-operating  
-40°C to 120°C, 20 min. dwell,  
<20 sec. transfer  
Thermal Shock (TMSK)  
1500 G, 0.5 msec. pulse,  
5 shocks each 6 axis  
Mechanical Shock  
Natural Drop  
On concrete from 1.2 m, 3X  
10-2000-10 Hz, log or linear sweep rate,  
20 G about 1 min., 1.5 mm, 3X/axis  
Steam age for 16 hrs., then solder dip  
at 260°C for 5 sec.  
Variable Vibration  
Frequency  
Solder coverage  
on lead  
Solderability  
Notes:  
1. Depending on the maximum derating curve.  
2. Criteria for judging failure  
Criteria for Judgement  
Item  
Test Condition  
IF = max DC  
IF = max DC  
VR = 5V  
Max.  
Min.  
--  
Forward Voltage (VF)  
Luminous Flux or  
Initial Level x 1.1  
Initial Level x 0.7  
--  
Radiometric Power (ΦV)  
Reverse Current (IR)  
50 μA  
--  
* The test is performed after the LED is cooled down to the room temperature.  
3. A failure is an LED that is open or shorted.  
9
Recommended Solder Pad Design  
All dimensions are in millimeters.  
Electrical isolation is required between Slug and Solder Pad.  
10  
Heat Plate Soldering Condition  
(1) Soldering Process for Solder Paste  
(2) Soldering Process for Solder Wire  
Solder Paste  
MCPCB  
Heat Plate  
MCPCB  
Put MCPCB on Heat Plate.  
Use Solder Mask to print Solder Paste on MCPCB.  
Solder Wire  
Emitter  
Heat Plate  
Place Solder Wire to the solder pad of MCPCB.  
Place Emitter on MCPCB.  
Emitter  
Heat Plate  
Heat Plate  
Put MCPCB on Heat Plate until Solder Paste melt.  
The Solder Paste sould be melted within 10 seconds.  
Take out MCPCB out from Heat Plate within 15 seconds.  
Put Emitter on MCPCB. Take the MCPCB out  
from Heat Plate within 10 seconds.  
Heat plate temperature: 230°C max for Lead Solder and 230°C max for Lead-Free Solder.  
We recommend using the 58Bi-42Sn eutectic alloy for low-temp. and lead free soldering (melting point = 138 °C).  
When soldering, do not put stress on the LEDs during heating.  
After soldering, do not warp the circuit board.  
Manual Hand Soldering  
Solder Wire  
Thermal Conductive Glue  
Soldering Iron  
MCPCB  
Emitter  
Use Soldering Iron to solder the  
leads of Emtter within 5 seconds.  
Place Emitter on the MCPCB.  
Place Thermal Comductive Glue  
on the MCPCB.  
For prototype builds or small series production runs it possible to place and solder the emitters by hand.  
Solder tip temperature: 230°C max for Lead Solder and 260°C max for Lead-Free Solder.  
Avoiding damage to the emitter or to the MCPCB dielectric layer. Damage to the epoxy layer can cause  
a short circuit in the array.  
Do not let the solder contact from solder pad to back-side of MCPCB. This one will cause a short circuit  
and damage emitter.  
11  
Emitter Tube Packaging  
Star Tube Packaging  
Notes:  
1. Emitter 50 pieces per tube and Star 20 pieces per tube.  
2. Drawing not to scale.  
3. All dimensions are in millimeters.  
4. All dimendions without tolerances are for reference only.  
**Please do not open the moisture barrier bag (MBB) more than one week. This may cause the leads  
of LED discoloration. We recommend storing ProLight’s LEDs in a dry box after opening the MBB.  
The recommended storage conditions are temperature 5 to 30°C and humidity less than 40% RH.  
12  
Precaution for Use  
Storage  
Please do not open the moisture barrier bag (MBB) more than one week. This may cause the  
leads of LED discoloration. We recommend storing ProLight’s LEDs in a dry box after opening  
the MBB. The recommended storage conditions are temperature 5 to 30°C and humidity less  
than 40% RH. It is also recommended to return the LEDs to the MBB and to reseal the MBB.  
The slug is is not electrically neutral. Therefore, we recommend to isolate the heat sink.  
The slug is to be soldered. If not, please use the heat conductive adhesive.  
Any mechanical force or any excess vibration shall not be accepted to apply during cooling  
process to normal temperature after soldering.  
Please avoid rapid cooling after soldering.  
Components should not be mounted on warped direction of PCB.  
Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,  
a heat plate should be used. It should be confirmed beforehand whether the characteristics of  
the LEDs will or will not be damaged by repairing.  
This device should not be used in any type of fluid such as water, oil, organic solvent and etc.  
When cleaning is required, isopropyl alcohol should be used.  
When the LEDs are illuminating, operating current should be decide after considering the  
package maximum temperature.  
The appearance, specifications and flux bin of the product may be modified for improvement  
without notice. Please refer to the below website for the latest datasheets.  
http://www.prolightopto.com/  
13  

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