PP6N-FLGE [ELITE]
0.5W Power LED;
| 型号： | PP6N-FLGE |
| 厂家： | 
Elite Enterprises (H.K.) Co., Ltd. |
| 描述： | 0.5W Power LED |
| 文件： | 总20页 (文件大小：924K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ProLight PP6N-FLxE
0.5W Power LED
Technical Datasheet
Version: 3.5
Features
● High flux per LED
● Good color uniformity
● Industry best moisture senstivity level - JEDEC 1
● Low-temp. & lead free reflow soldering
● RoHS compliant
● More energy efficient than incandescent and
most halogen lamps
● Low Voltage DC operated
● Instant light (less than 100ns)
● No UV
Typical Applications
● Reading lights (car, bus, aircraft)
● Portable (flashlight, bicycle)
● Decorative
● Appliance
● Sign and Channel Letter
● Architectural Detail
● Cove Lighting
● Automotive Exterior (Stop-Tail-Turn, CHMSL, Mirror Side Repeat)
● LCD backlight
2010/04
1
Emitter Mechanical Dimensions
Notes:
1. The Anode side of the device is denoted by a hole in the lead frame.
2. Electrical insulation between the case and the board is required --- slug of device is not
electrically neutral. Do not electrically connect either the anode or cathode to the slug.
3. Drawing not to scale.
4. All dimensions are in millimeters.
5. All dimendions without tolerances are for reference only.
6. Please do not bend the leads of the LED, otherwise it will damage the LED.
7. Please do not use a force of over 3kgf impact or pressure on the lens of the LED, otherwise
it will cause a catastrophic failure.
*The appearance and specifications of the product may be modified for improvement without notice.
2
Flux Characteristics at 150mA, TJ = 25°C
Lumious Flux ΦV (lm)
Part Number
Emitter
Radiation
Pattern
Color
Minimum
Typical
PP6N-FLWE
PP6N-FLVE
PP6N-FLRE
PP6N-FLAE
PP6N-FLGE
PP6N-FLBE
White
Warm White
Red
18.1
18.1
10.7
13.9
18.1
4.9
32
30
17
20
25
6.5
Lambertian
Amber
Green
Blue
● ProLight maintains a tolerance of ± 10% on flux and power measurements.
● Please do not drive at rated current more than 1 second without proper heat sink.
Electrical Characteristics at 150mA, TJ = 25°C
Forward Voltage VF (V)
Typ.
Thermal Resistance
Junction to Slug (°C/ W)
Color
Min.
Max.
20
20
20
20
20
20
White
Warm White
Red
2.8
2.8
1.9
1.9
2.8
2.8
3.5
3.5
2.2
2.2
3.5
3.5
4.1
4.1
3.1
3.1
4.1
4.1
Amber
Green
Blue
Optical Characteristics at 150mA, TJ = 25°C
Total
Dominant Wavelength λD,
included
Angle
Viewing
Angle
or Color Temperature CCT
(degrees)
θ0.90V
(degrees)
2 θ1/2
Color
Min.
Typ.
Max.
White
Warm White
Red
6020 K
2870 K
6535 K
3045 K
623 nm
592 nm
525 nm
465 nm
7050 K
3220 K
631 nm
597 nm
535 nm
475 nm
160
160
160
160
160
160
140
140
140
140
140
140
613.5 nm
587 nm
515 nm
455 nm
Amber
Green
Blue
● ProLight maintains a tolerance of ± 1nm for dominant wavelength measurements.
● ProLight maintains a tolerance of ± 5% for CCT measurements.
3
Absolute Maximum Ratings
White/Warm White/
Red/Amber/Green/Blue
Parameter
150
250
150
Max DC Forward Current (mA)
Peak Pulsed Forward Current (mA)
Average Forward Current (mA)
ESD Sensitivity
> ±500V
(HBM per MIL-STD-883E Method 3015.7)
LED Junction Temperature (°C)
Aluminum-core PCB Temperature (°C)
Storage & Operating Temperature (°C)
Soldering Temperature(°C)
120
105
-40 to +105
235°C
Photometric Luminous Flux Bin Structure
Minimum
Maximum
Available
Color
Bin Code
Photometric Flux (lm)
Photometric Flux (lm)
Color Bins
All
All
All
N
P
Q
18.1
22
22
White
30.6
39.8
30.6
All
All
All
N
P
Q
18.1
22
22
Warm White
30.6
39.8
30.6
All
All
L
10.7
13.9
13.9
18.1
Red
Amber
Green
Blue
M
All
All
M
N
13.9
18.1
18.1
23.5
All
All
N
P
18.1
22
22
30.6
All
All
H
J
4.9
6.3
6.3
8.2
● ProLight maintains a tolerance of ± 10% on flux and power measurements.
● The flux bin of the product may be modified for improvement without notice.
4
Color Bins
White Binning Structure Graphical Representation
0.40
0.38
0.36
6020 K
0.34
7050 K
X0
Planckian
(BBL)
0.32
0.30
White
0.28
0.26
0.26
0.28
0.30
0.32
0.34
0.36
x
White Bin Structure
Typ. CCT
(K)
Bin Code
x
y
0.321
0.303
0.307
0.322
0.348
0.330
0.311
0.326
X0
6500
● Tolerance on each color bin (x , y) is ± 0.01
5
Color Bins
Warm White Binning Structure Graphical Representation
0.48
0.46
0.44
2870 K
3220 K
0.42
0.40
0.38
0.36
0.34
Planckian
(BBL)
N0
Warm White
0.38
0.40
0.42
0.44
0.46
0.48
x
Warm White Bin Structure
Typ. CCT
(K)
Bin Code
x
y
0.456
0.430
0.415
0.437
0.426
0.417
0.381
0.389
N0
3000
● Tolerance on each color bin (x , y) is ± 0.01
6
Dominant Wavelength Bin Structure
Minimum Dominant
Maximum Dominant
Wavelength (nm)
Color
Bin Code
Wavelength (nm)
613.5
620.5
620.5
631.0
2
4
Red
587.0
589.5
592.0
594.5
589.5
592.0
594.5
597.0
2
4
6
7
Amber
Green
Blue
515
520
525
530
520
525
530
535
A
1
2
3
455
460
465
470
460
465
470
475
A
1
2
3
● ProLight maintains a tolerance of ± 1nm for dominant wavelength measurements.
Note: Although several bins are outlined, product availability in a particular bin varies by production run
and by product performance. Not all bins are available in all colors.
7
Color Spectrum, TJ = 25°C
1. White
1.0
Standard Eye Response Cruve
White
0.8
0.6
0.4
0.2
0.0
350 400 450 500 550 600 650 700 750 800 850
Wavelength(nm)
2. Warm White
1.0
Standard Eye Response Cruve
Warm White
0.8
0.6
0.4
0.2
0.0
350 400 450 500 550 600 650 700 750 800 850
Wavelength(nm)
3. Blue、Green、Amber、Red
1.0
Blue
Green
Amber
Red
0.8
0.6
0.4
0.2
0.0
400
450
500
550
600
650
700
Wavelength(nm)
8
Light Output Characteristics
Relative Light Output vs. Junction Temperature at 150mA
160
White, Warm White
Green
Blue
140
120
100
80
60
40
20
0
-20
0
20
40
60
80
100
120
Junction Temperature, TJ (℃)
160
140
120
100
80
Red
Amber
60
40
20
0
60
100
-20
0
20
40
80
120
Junction Temperature, TJ (℃)
9
Forward Current Characteristics, TJ = 25°C
1. Forward Voltage vs. Forward Current
180
150
120
90
180
150
120
90
Red, Amber
White, Warm White,
Green, Blue,
60
60
30
30
0
0
0
0.5
1
1.5
2
2.5
3
0
0.5
1
1.5
2
2.5
3
3.5
4
Forward Voltage (V)
Forward Voltage (V)
2. Forward Current vs. Normalized Relative Luminous Flux
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
Red, Amber
White, Warm White,
Green, Blue,
0
30
60
90 120 150 180
0
30
60
90 120 150 180
Forward Current (mA)
Forward Current (mA)
10
Ambient Temperature vs. Maximum Forward Current
1. White, Warm White, Green, Blue (TJMAX = 120°C)
180
150
120
90
RθJ-A = 90°C/W
RθJ-A = 75°C/W
60
RθJ-A = 60°C/W
30
RθJ-A = 45°C/W
0
0
25
50
75
100
125
150
Ambient Temperature (℃)
2. Red, Amber (TJMAX = 120°C)
180
150
120
RθJ-A = 90°C/W
RθJ-A = 75°C/W
RθJ-A = 60°C/W
90
60
30
0
RθJ-A = 45°C/W
0
25
50
75
100
125
150
Ambient Temperature (℃)
11
Typical Representative Spatial Radiation Pattern
Lambertian Radiation Pattern
100
90
80
70
60
50
40
30
20
10
0
-100
-80
-60
-40
-20
0
20
40
60
80
100
Angular Displacement (Degrees)
12
Moisture Sensitivity Level - JEDEC 1
Soak Requirements
Accelerated Environment
Conditions Time (hours) Conditions Time (hours) Conditions
Floor Life
Standard
Level
Time
≤30°C /
85°C /
1
Unlimited
168 +5/-0
NA
NA
85% RH
85% RH
● The standard soak time includes a default value of 24 hours for semiconductor manufature's
exposure time (MET) between bake and bag and includes the maximum time allowed out of
the bag at the distributor's facility.
● Table below presents the moisture sensitivity level definitions per IPC/JEDEC's J-STD-020C.
Soak Requirements
Floor Life
Standard
Accelerated Environment
Level
Time
Conditions Time (hours) Conditions Time (hours) Conditions
≤30°C /
85% RH
≤30°C /
60% RH
≤30°C /
60% RH
≤30°C /
60% RH
≤30°C /
60% RH
≤30°C /
60% RH
≤30°C /
60% RH
≤30°C /
60% RH
85°C /
85% RH
85°C /
1
2
Unlimited
168 +5/-0
168 +5/-0
696 +5/-0
192 +5/-0
96 +2/-0
72 +2/-0
48 +2/-0
NA
NA
NA
1 year
4 weeks
168 hours
72 hours
48 hours
24 hours
NA
60% RH
30°C /
60°C /
60% RH
60°C /
2a
3
120 +1/-0
40 +1/-0
20 +0.5/-0
15 +0.5/-0
10 +0.5/-0
NA
60% RH
30°C /
60% RH
30°C /
60% RH
60°C /
4
60% RH
30°C /
60% RH
60°C /
5
60% RH
30°C /
60% RH
60°C /
5a
6
60% RH
30°C /
60% RH
Time on Label
(TOL)
Time on Label
(TOL)
NA
60% RH
13
Qualification Reliability Testing
Stress Conditions
Stress Test
Room Temperature
Operating Life (RTOL)
Wet High Temperature
Operating Life (WHTOL)
Wet High Temperature
Storage Life (WHTSL)
High Temperature
Stress Duration Failure Criteria
25°C, IF = max DC (Note 1)
85°C/60%RH, IF = max DC (Note 1)
85°C/85%RH, non-operating
110°C, non-operating
1000 hours
1000 hours
1000 hours
1000 hours
1000 hours
200 cycles
200 cycles
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 3
Note 3
Note 3
Note 3
Storage Life (HTSL)
Low Temperature
-40°C, non-operating
Storage Life (LTSL)
Non-operating
-40°C to 120°C, 30 min. dwell,
<5 min. transfer
Temperature Cycle (TMCL)
Non-operating
-40°C to 120°C, 20 min. dwell,
<20 sec. transfer
Thermal Shock (TMSK)
1500 G, 0.5 msec. pulse,
5 shocks each 6 axis
Mechanical Shock
Natural Drop
On concrete from 1.2 m, 3X
10-2000-10 Hz, log or linear sweep rate,
20 G about 1 min., 1.5 mm, 3X/axis
Variable Vibration
Frequency
Solder Heat Resistance
(SHR)
260°C ± 5°C, 10 sec.
Steam age for 16 hrs., then solder dip
at 260°C for 5 sec.
Solder coverage
on lead
Solderability
Notes:
1. Depending on the maximum derating curve.
2. Criteria for judging failure
Criteria for Judgement
Item
Test Condition
IF = max DC
IF = max DC
VR = 5V
Max.
Min.
-
Forward Voltage (VF)
Luminous Flux or
Initial Level x 1.1
Initial Level x 0.7
-
Radiometric Power (ΦV)
Reverse Current (IR)
50 μA
-
* The test is performed after the LED is cooled down to the room temperature.
3. A failure is an LED that is open or shorted.
14
Recommended Solder Pad Design
● All dimensions are in millimeters.
● Electrical isolation is required between Slug and Solder Pad.
15
Reflow Soldering Condition
Low-Temp. & Pb-Free Assembly
(58Bi-42Sn Eutectic Alloy)
Profile Feature
Preheat & Soak
Sn-Pb Eutectic Assembly
Temperature min (Tsmin
Temperature max (Tsmax
Time (Tsmin to Tsmax
)
100 °C
150 °C
90 °C
120 °C
)
)
60-120 seconds
3 °C / second max.
183°C
60-120 seconds
2 °C / second max.
138°C
Average Ramp-Up Rate (Tsmax to TP)
Liquidous temperature (TL)
Time at liquidous (tL)
60-150 seconds
235°C
20-50 seconds
185°C
Peak package body temperature (TP)
Time (tP) within 5°C of the specified
classification temperature (TC)
20 seconds
20 seconds
Average ramp-down rate (TP to Tsmax
)
6 °C/second max.
6 minutes max.
3 °C/second max.
4 minutes max.
Time 25°C to Peak Temperature
● All temperatures refer to topside of the package, measured on the package body surface.
● Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
a heat plate should be used. It should be confirmed beforehand whether the characteristics of
LEDs will or will not be damaged by repairing.
● Reflow soldering should not be done more than two times.
● When soldering, do not put stress on the LEDs during heating.
● After soldering, do not warp the circuit board.
16
Heat Plate Soldering Condition
(1) Soldering Process for Solder Paste
(2) Soldering Process for Solder Wire
Solder Paste
MCPCB
Heat Plate
MCPCB
Put MCPCB on Heat Plate.
Use Solder Mask to print Solder Paste on MCPCB.
Solder Wire
Emitter
Heat Plate
Place Solder Wire to the solder pad of MCPCB.
Place Emitter on MCPCB.
Emitter
Heat Plate
Heat Plate
Put MCPCB on Heat Plate until Solder Paste melt.
The Solder Paste sould be melted within 10 seconds.
Take out MCPCB out from Heat Plate within 15 seconds.
Put Emitter on MCPCB. Take the MCPCB out
from Heat Plate within 10 seconds.
● Heat plate temperature: 230°C max for Lead Solder and 230°C max for Lead-Free Solder.
● We recommend using the 58Bi-42Sn eutectic alloy for low-temp. and lead free soldering (melting point = 138 °C).
● When soldering, do not put stress on the LEDs during heating.
● After soldering, do not warp the circuit board.
17
Emitter Reel Packaging
Notes:
1. Drawing not to scale.
2. All dimensions are in millimeters.
3. General tolerance is ± 0.10 mm.
18
Emitter Reel Packaging
13.2 ± 0.5
16.2 ± 0.5
Φ 21 ± 0.5
Φ 13.1 ± 0.5
3 ± 0.5
60 ± 0.5
178 ± 1
4 ± 0.5
5 ± 0.5
Notes:
1. Empty component pockets sealed with top cover tape.
2. 250 or 500 pieces per reel.
3. Drawing not to scale.
4. All dimensions are in millimeters.
19
Precaution for Use
● Storage
Please do not open the moisture barrier bag (MBB) more than one week. This may cause the
leads of LED discoloration. We recommend storing ProLight’s LEDs in a dry box after opening
the MBB. The recommended storage conditions are temperature 5 to 30°C and humidity less
than 40% RH. It is also recommended to return the LEDs to the MBB and to reseal the MBB.
● The slug is is not electrically neutral. Therefore, we recommend to isolate the heat sink.
● The slug is to be soldered. If not, please use the heat conductive adhesive.
● Any mechanical force or any excess vibration shall not be accepted to apply during cooling
process to normal temperature after soldering.
● Please avoid rapid cooling after soldering.
● Components should not be mounted on warped direction of PCB.
● Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
a heat plate should be used. It should be confirmed beforehand whether the characteristics of
the LEDs will or will not be damaged by repairing.
● This device should not be used in any type of fluid such as water, oil, organic solvent and etc.
When cleaning is required, isopropyl alcohol should be used.
● When the LEDs are illuminating, operating current should be decide after considering the
package maximum temperature.
● The appearance, specifications and flux bin of the product may be modified for improvement
without notice. Please refer to the below website for the latest datasheets.
http://www.prolightopto.com/
Handling of Silicone Lens LEDs
Notes for handling of silicone lens LEDs
● Please do not use a force of over 3kgf impact or pressure on the silicone lens,
otherwise it will cause a catastrophic failure.
● The LEDs should only be picked up by making contact with the sides of the LED body.
● Avoid touching the silicone lens especially by sharp tools such as Tweezers.
● Avoid leaving fingerprints on the silicone lens.
● Please store the LEDs away from dusty areas or seal the product against dust.
● When populating boards in SMT production, there are basically no restrictions
regarding the form of the pick and place nozzle, except that mechanical pressure
on the silicone lens must be prevented.
● Please do not mold over the silicone lens with another resin. (epoxy, urethane, etc)
╳
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20
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