E522.31_16 [ELMOS]

CHANNEL SWITCHED MODE CONSTANT CURRENT CONTROLLER;
E522.31_16
型号: E522.31_16
厂家: ELMOS SEMICONDUCTOR AG    ELMOS SEMICONDUCTOR AG
描述:

CHANNEL SWITCHED MODE CONSTANT CURRENT CONTROLLER

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1 CHANNEL SWITCHED MODE CONSTANT CURRENT CONTROLLER  
PRODUCTION DATA - JUL 21, 2016  
E522.31/33  
Features  
General Description  
E522.31 and E522.33 are part of a family of fixed fre-  
quency switched-mode high voltage LED power sup-  
plies and controllers with high efficiency. Integrated  
high-side sensing allows topologies related to the sup-  
ply input (Boost-to-Battery) or to GND (Boost-to-GND).  
ÿ
ÿ
Switched-Mode, PWM LED Controller  
5V to 55V input voltage range, up to 80V boosted  
output voltage  
ÿ
Boost-, SEPIC, Buck-Boost- or Buck Topology  
supported  
ÿ
ÿ
ÿ
Constant Current Regulation implemented  
High-Precision Differential High-Side Sense up to 60V  
High-Frequency PWM Dimming Capability for  
constant LED Color  
The device is suitable for operation in boost-, buck-  
boost-, SEPIC- and buck-topologies, particularly in harsh  
automotive environments.  
ÿ
ÿ
ÿ
Analog 10:1 Dimming Capability for LED Binning  
Integrated Softstart  
Advanced Error Detection (e.g. Over-Voltage,  
Open-Load Detection, different Shorts or GND Loss)  
Integrated Automotive LDOs for 5V & 3.3V  
AEC-Q100 Qualified  
The constant switching frequency is adjustable up to  
600kHz by an external resistor or can be synchronized  
in Master-Slave configurations with other devices.  
ÿ
ÿ
ÿ
Multiple control- and monitoring functions, e.g. short-  
and open load detection, over-temperature shutdown  
and under-voltage lockout are implemented.  
Junction temperature range -40°C to +150°C  
Applications  
Ordering Information  
ÿ
Automotive LED lighting Applications (daytime  
running light, indicator, front- and rear light,  
interior lighting etc.)  
Oscillator  
Spectrum  
Softstart  
Ramping  
Ordering-No.  
Package  
E52231A61C  
spread Slow Ramping (SR) QFN32L5  
ÿ
ÿ
ÿ
General Indoor and Outdoor Lighting and -Signals  
TFT Backlighting  
General Current driven Applications  
E52231A61CXFR spread Fast Ramping (FR) QFN32L5  
E52233A61C narrow Slow Ramping (SR) QFN32L5  
E52233A61CXFR narrow Fast Ramping (FR) QFN32L5  
Typical Application Circuit  
VSM  
VSM  
AGND  
VIN  
NC  
VIN  
FBL  
FBL  
ON  
FBH  
FBH  
OSCIN  
PWDIM  
I.C.  
OVPIN  
OVP  
OVPO  
NC  
µC  
E522.31  
DIM  
LGATE  
NC  
NC  
NC  
VSM  
VIN  
OVP  
FBH  
FBL  
DIM  
“ Boost to GND Circuit ”  
Elmos Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.  
Elmos Semiconductor AG  
Data Sheet  
QM-No.: 25DS0085E.01  
1/20  
1 CHANNEL SWITCHED MODE CONSTANT CURRENT CONTROLLER  
PRODUCTION DATA - JUL 21, 2016  
E522.31/33  
Functional Diagram  
LDO Reg  
Main  
VIN  
VSM  
Supply  
Internal  
Standby  
Supply  
UVLO &  
Thermal  
Protection  
AGND  
Power On  
Reset  
Driver  
Protection  
ON  
DIM  
LEB  
DRVS  
CGATE  
PGND  
Duty Max  
Blanking  
Sync-SW  
RT  
Oscillator  
DRV  
Slope  
Gen  
Reference  
Unit  
LGATE  
ERRB  
LDRV  
AGND  
SLOPE  
IREF  
VBG  
PWM  
Logic  
Dimming  
Logic  
PWDIM  
ON  
Internal  
3V3 LDO  
V3V3  
OSCIN  
VSM  
OVPIN  
OVPO  
Open Load  
& Short  
Detection  
ON  
DIM  
HSAMP  
DIM  
FBH  
FBL  
GM  
VILIM  
CMP  
LEB SLOPE  
OFFSET  
GAIN  
CSP  
CSN  
Slope  
&
LEB  
Adim  
Circuit  
ADIM  
CMP  
ILP  
IAMP  
OFFSET  
Soft  
Start  
LS & HZ  
Buffer  
Auxiliary  
Supply  
CMP  
VSM  
ILP  
VDD  
CLOCK  
SI  
Adjustment  
Unit  
DATA  
SO  
E522.31/33  
Pin Configuration  
Top View  
ꢁottom Side  
24 23 22 21 20 19 18 17  
Eꢀꢀꢁ  
25  
26  
27  
28  
29  
30  
31  
32  
16  
15  
14  
13  
12  
11  
10  
9
Nꢂ  
Nꢂ  
ꢂMꢃ  
ꢀꢄ  
Nꢂ  
Nꢂ  
ꢃGND  
DꢀꢆS  
ꢂGAꢄE  
ꢂSꢃ  
Nꢂ  
E522.31/33  
ADꢅM  
ꢆꢇꢆꢇ  
ꢆSM  
EP  
ꢂSN  
1
2
3
4
5
6
7
8
ꢃin 1  
Note: Not to scale, EP Exposed die pad  
Elmos Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.  
Elmos Semiconductor AG  
Data Sheet  
QM-No.: 25DS0085E.01  
2/20  
1 CHANNEL SWITCHED MODE CONSTANT CURRENT CONTROLLER  
PRODUCTION DATA - JUL 21, 2016  
E522.31/33  
Pin Description  
Pin Name  
Type 1)  
Description  
Analog Ground. Ground pin for analog blocks. Make a short, low impedance con-  
nection between this pin and GND.  
1
2
3
AGND  
VIN  
S
HV_S  
HV_A_I  
High voltage supply input. Bypass with low ESR capacitance to GND.  
Control input to activate/disable the IC. CMOS compatible logic input with high-  
voltage capability and pulldown current.  
ON  
5V & 3.3V compatible input pin with pulldown current for synchronization to  
external clock. Solder to GND to use RT defined internal oscillator.  
If used, a resistor matching the applied input frequency has to be connected to  
RT (see RT pin description).  
4
OSCIN  
D_I  
D_I  
PWM dimming input with pullup current to V3V3. For constant LED color, PWM  
is used to control brightness. 5V CMOS compatible as well as open-drain com-  
patible input. If not needed, solder this pin to V3V3 for continuous operation.  
5
PWDIM  
6
7
8
9
IC  
Reserved for factory use. Connect to AGND in application  
Dimming output for regulation circuit. Low Side Gate driver output to conrol N-  
channel MOSFET types. If not needed leave this pin open.  
LGATE  
NC  
D_O  
Not connected  
Negative low-side converter current sense input. The negative biased shunt re-  
sistor terminal is connected to this pin.  
CSN  
A_I  
Positive low-side converter current sense input. The positive biased shunt resis-  
tor terminal is connected to this pin.  
10  
11  
CSP  
A_I  
Low-Side switch gate driver output. Connect the gate of the external logic level  
N-channel MOSFET to this pin.  
CGATE  
D_O  
Gate driver supply voltage. Connect a low ESR ceramic capacitor between this  
pin and PGND. Connect either VSM via a decoupling resistor or an external volt-  
age source to this pin.  
12  
13  
DRVS  
S
S
Power Ground. Ground pin for CGATE high power drivers. Make a short, low-im-  
pedance connection to GND  
PGND  
14  
15  
16  
17  
18  
19  
NC  
NC  
NC  
NC  
NC  
NC  
Not connected  
Not connected  
Not connected  
Not connected  
Not connected  
Not connected  
Over voltage protection output. Connect the low-side resistor of over-voltage  
protection feedback to this pin.  
20  
21  
OVPO  
OVPIN  
A_IO  
Over voltage protection input. Connect the high side of an external resistor di-  
vider for over voltage protection to this pin.  
HV_A_I  
Positive high-side feedback input for regulation circuit. Connect the positive ter-  
22  
23  
FBH  
FBL  
HV_A_I minal of sensing shunt resistor to this pin. For good regulation, keep the connec-  
tion to the shunt as short as possible.  
Negative high-side feedback input for regulation circuit. Connect the negative  
HV_A_I terminal of sensing shunt resistor to this pin. For good regulation, keep the con-  
nection to the shunt as short as possible.  
24  
25  
26  
NC  
Not connected.  
Open-drain error output. Low-impedant in case of Open Load, short circuit or  
over-temperature events.  
ERRB  
NC  
D_O  
Not connected.  
Elmos Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.  
Elmos Semiconductor AG  
Data Sheet  
QM-No.: 25DS0085E.01  
3/20  
1 CHANNEL SWITCHED MODE CONSTANT CURRENT CONTROLLER  
PRODUCTION DATA - JUL 21, 2016  
E522.31/33  
Pin Name  
Type 1)  
Description  
27  
28  
29  
30  
31  
32  
-
CMP  
A_IO  
Error amplifier compensation. Connect the compensation circuit to this pin.  
Oscillator control. For free-running operation, connect a resistor between this  
pin and AGND. If an external synchronization clock is applied to OSCIN, the ac-  
cording resistor must be applied at RT.  
RT  
A_IO  
NC  
Not connected.  
Analog dimming input. The input voltage at this pin controls the LED current  
sensing at FBH and FBL.  
To use internal reference voltage solder to V3V3.  
ADIM  
V3V3  
VSM  
EP  
A_I  
S
3.3V regulator output. Connect to AGND with a ceramic capacitance of typ. 1µF.  
Internal 5V low drop regulator output. Bypass this pin to AGND with a ceramic  
capacitance of typ. 1µF. Additionally, the VSM voltage can be connected to DRVS  
via a decoupling resistor so supply the CGATEx drivers.  
S
S
Exposed Die Pad Connect to AGND  
1) A = Analog, D = Digital, S = Supply, I = Input, O = Output, B = Bidirectional, HV = High Voltage  
ESD:  
More details according this topic are described in the "ESD" chapter.  
Elmos Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.  
Elmos Semiconductor AG  
Data Sheet  
QM-No.: 25DS0085E.01  
4/20  
1 CHANNEL SWITCHED MODE CONSTANT CURRENT CONTROLLER  
PRODUCTION DATA - JUL 21, 2016  
E522.31/33  
1 Absolute Maximum Ratings  
Stresses beyond these absolute maximum ratings listed below may cause permanent damage to the device. These are stress rat-  
ings only; operation of the device at these or any other conditions beyond those listed in the operational sections of this document  
is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. All voltages  
with respect to ground. Currents flowing into terminals are positive, those drawn out of a terminal are negative.  
Description  
Condition  
Symbol  
VVIN  
Min  
-0.3  
-0.3  
-0.3  
-0.3  
Max  
55  
Unit  
V
High Voltage Supply Input VIN  
High Voltage Supply Input VIN, transient tMAX = 500ms  
Voltage at pin FBH  
VVIN,TRAN  
VFBH  
60  
V
60  
V
Voltage at pin FBL  
VFBL  
60  
V
Differential Voltage between  
t
MAX < 1h 1)  
VFBH-FBL,MAX  
-60  
60  
V
Feedback Pins FBH & FBL  
Voltage at pin OVPIN  
Voltage at pin OVPO  
Voltage at pin ADIM  
Voltage at pin PWDIM  
Voltage at pin RT  
VOVPIN  
VOVPO  
VADIM  
VPWDIM  
VRT  
-0.3  
-0.3  
-0.3  
-0.3  
-0.3  
-2  
80  
V
VV3V3  
VV3V3  
VVSM  
VV3V3  
2
V
V
V
V
Input current at pin RT  
Voltage at pin ON  
IRT  
mA  
V
VON  
-0.3  
-0.3  
55  
Voltage at pin VSM  
VVSM  
5.5  
V
V
> 5.5V  
OVNIN= '1'  
Output current at pin VSM  
IVSM  
-65  
0
mA  
Voltage at pin OSCIN  
VOSCIN  
ICGATE,AVG  
ILGATE,AVG  
VERRB  
IERRB  
-0.3  
VVSM  
40  
2
V
Averaged Output Current at pin CGATE  
Average Output Current at pin LGATE  
Voltage at pin ERRB  
mA  
mA  
V
-0.3  
0
7.5  
5
Input Current at pin ERRB  
Voltage at pin CSN and CSP  
Voltage at pin V3V3  
mA  
V
VCS  
-0.3  
-0.3  
-25  
-0.3  
-0.3  
-0.3  
-2  
VV3V3  
3.6  
0
VV3V3  
IV3V3  
V
Current at pin V3V3  
V
VSM = 5V  
mA  
V
Voltage at pin DRVS  
VDRVS  
VCMPX  
VPGND  
VESD  
7.5  
VV3V3  
0.3  
2
Voltage at pin CMP  
V
PGND to AGND  
V
ESD Protection at all pins  
AECQ-100 HBM  
kV  
Thermal resistance (junction to case)  
QFN32L5  
RT_J-C  
TJ  
packaged devices TA  
5
K/W  
Junction temperature  
-40  
-40  
-40  
150  
125  
150  
°C  
°C  
°C  
Ambient temperature  
Storage temperature, soldered  
soldered device  
TS1  
un-soldered  
device  
Storage temperature, unsoldered  
Total Power Dissipation  
TS2  
-40  
125  
°C  
PTOT  
1500  
mW  
1) Absolute maximum ratings VFBH and VFBL must not be exceeded  
Elmos Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.  
Elmos Semiconductor AG  
Data Sheet  
QM-No.: 25DS0085E.01  
5/20  
1 CHANNEL SWITCHED MODE CONSTANT CURRENT CONTROLLER  
PRODUCTION DATA - JUL 21, 2016  
E522.31/33  
2 ESD Protection  
Description  
Condition  
HBM 1)  
CDM 2)  
Symbol  
VPINS-ALL  
Min  
Max  
Unit  
kV  
ESD HBM  
2
-
-
-
ESD CDM at corner pins  
ESD CDM at all other pins  
VPINS EDGE  
VPINS-OTHER  
0.75  
0.5  
kV  
2)  
CDM  
kV  
Note: Test point defined as tested pin to supply.  
1) According to AEC-Q 100-002, Human Body Model, 1.5kΩ resistance, 100pF capacitance.  
2) According to AEC-Q 100-011, Charged Device Model, pulse rise time (10% to 90%) <400ps, 1Ω resistance.  
Elmos Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.  
Elmos Semiconductor AG  
Data Sheet  
QM-No.: 25DS0085E.01  
6/20  
1 CHANNEL SWITCHED MODE CONSTANT CURRENT CONTROLLER  
PRODUCTION DATA - JUL 21, 2016  
E522.31/33  
3 Recommended Operating Conditions  
Parameters are guaranteed within the range of recommended operating conditions unless otherwise specified.  
All voltages are referred to ground (0V). Typical Parameters are given for VVIN= 14V and TJ = +25 °C.  
Currents flowing into the circuit have positive values.  
The first electrical potential connected to the IC must be GND to avoid excessive current flow in other pins.  
Description  
Condition  
Symbol  
VIN  
Min  
5.5  
4
Typ  
Max  
55  
Unit  
V
Supply voltage VIN  
Voltage at pin FBL  
14  
VFBL  
56  
V
VFBL  
+
VFBL+  
400m  
Voltage at pin FBH  
VFBH  
VFBL  
V
200m  
Voltage at pin OVPIN  
VOVPIN  
80  
V
Voltage at pin OVPO  
VOVPO  
3
V
Resistance from OVPO to GND  
External Reference at pin ADIM  
ROVPO  
10  
20  
33  
kΩ  
V
VADIM,EXREF  
0.24  
2.4  
Voltage at pin ADIM for internal  
Reference Voltage  
V
-
0.V235V3  
VADIM,INTREF  
VPWDIM  
VV3V3  
V
V
Voltage at Dimming Inputs PW-  
DIM  
0
VVSM  
RT Current to define fOSC  
Resistance from RT to GND  
Voltage at pin ON  
IRT  
-24  
50  
0
-10  
120  
55  
3
µA  
kΩ  
V
RRT  
VON  
Resistor to supply DRVS using VSM  
RVSM,DRVS  
1
Ω
Sink impedance of external open  
drain at PWDIM  
ZPWDIM  
2
kΩ  
SMPS Frequency  
x ext. Gatecharge  
driven  
Average Output Current at pin  
CGATE  
ICGATE  
25  
mA  
Average Output Current at pin  
LGATE  
Dimming Frequency x  
Gatecharge at LGATE  
ILGATE  
IERRB  
2
mA  
mA  
kHz  
Input Current at pin ERRB  
0
3
External Synchronization Frequen-  
cy applied to pin OSCIN  
fOSCIN  
225  
0
650  
400  
Voltage at pin CSP  
VCSP  
VCSN  
VDRVS  
TJ  
mV  
mV  
V
1)  
Voltage at pin CSN to AGND  
Voltage at pin DRVS  
0
4.75  
-40  
-40  
0.8  
47  
VVSM  
7.5  
Junction temperature  
+150  
+125  
2
°C  
Ambient temperature  
TA  
°C  
Capacitance at VSM to AGND  
Capacitance at pin VIN to GND  
ESR < 0.6Ω  
ESR < 0.1Ω  
CVSM  
CVIN  
CV3V3  
1
µF  
µF  
µF  
120  
1
Capacitance from pin V3V3 to AGND ESR < 0.6Ω  
0.8  
2
ESR < 0.1Ω  
Capacitance from DRVS to PGND  
ESL < 5 nH  
CDRVS  
1
2.2  
µF  
Maximum Total Capacitance at  
pins OVPIN and OVPO  
COVP  
20  
pF  
V
1)  
PGND to AGND  
VPGND  
0
1) Pins must be soldered to PCB GND potential  
Elmos Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.  
Elmos Semiconductor AG  
Data Sheet  
QM-No.: 25DS0085E.01  
7/20  
1 CHANNEL SWITCHED MODE CONSTANT CURRENT CONTROLLER  
PRODUCTION DATA - JUL 21, 2016  
E522.31/33  
4 Electrical Characteristics  
(VVIN = +5.5V to +55V, TAMB = -40°C to +125°C, unless otherwise noted. Typical values are at VVIN = +14V and TAMB  
+25°C. Positive currents flow into the device pins.)  
=
Description  
Condition  
Symbol  
Min  
Typ  
Max  
Unit  
Supply  
Supply voltage at VIN  
VIN  
5.5  
14  
8
55  
V
ON = '0'  
TJV=IN25°C  
Sleep Mode Current Consumption  
V
=14V  
IVIN,SLEEP  
µA  
ON = '1'  
Active VIN Supply Current  
Nominal Output voltage at VSM  
Low-Drop Voltage of VSM  
IVIN,ACTIVE  
VVSM,NOM  
VVSM,LDO  
VVSM,RESH  
IVSM,EXT  
2.2  
5
3.7  
mA  
V
no switching  
ON = '1'  
VVIN = 14V  
4.75  
4.7  
5.25  
VVIN=5.2V  
V
IVSM=50mA 1)  
Reset Threshold relative to nomi-  
nal VVSM  
VVSM,  
NOM  
VVSM rising  
0.925  
ON = High,  
VVIN = 6 ... 55V  
External VSM Current 2)  
External V3V3 Current 2)  
-40  
-15  
65  
mA  
mA  
mA  
V
ON='1'  
VVSM > 4.75V  
IV3V3,EXT  
Short Current Limitation of VSM  
Regulator  
VVIN = 14V  
VVSM= 0V  
IVSM,SHORT  
VV3V3,NOM  
VV3V3,RESH  
IV3V3,SHORT  
VDRVS,RESH  
VDRVS,RESL  
110  
3.3  
ON = '1'  
VVSM > 4.75V  
V3V3 Voltage Regulator Output  
3.13  
3.47  
Reset Threshold relative to  
nominal VV3V3  
VV3V3,  
NOM  
VV3V3 rising  
0.925  
55  
Short Current Limitation V3V3  
Regulator  
VVSM>4.7V  
VV3V3 = 0V  
20  
mA  
Reset threshold of DRVS input,  
relative to VSM  
VVSM>VVSM,RESH  
VDRVS rising  
0.92  
0.85  
VVSM  
VVSM  
Reset threshold of DRVS input,  
relative to VSM  
VVSM>VVSM,RESH  
VDRVS falling  
Enable Threshold at pin ON  
Disable Hysteresis at pin ON  
VVIN=14V  
VON,ENA  
VON,HYST  
1.4  
5
1.5  
18  
1.6  
V
V
VIN=14V  
mV  
VVIN = 14V  
VON = 1.5V  
Pulldown Current at pin ON  
ION,PD  
10  
µA  
Thermal Shutdown Junction  
Temperature  
TJ rising  
TJ,OFF  
160  
25  
°C  
°C  
Hysteresis of Thermal Shutdown  
TJ falling 3)  
TJ,OFF,HYST  
Oscillator  
Upper Oscillator Frequency Setting RRT = 50kΩ  
Lower Oscillator Frequency Setting RRT = 120kΩ  
fOSC,INT,H  
fOSC,INT,L  
564  
235  
600  
250  
636  
265  
kHz  
kHz  
1) Overall current at VSM voltage regulator, including IC current consumption  
2) The sum of external currents at voltage regulators must not exceed 40mA  
3) Not production tested  
Elmos Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.  
Elmos Semiconductor AG  
Data Sheet  
QM-No.: 25DS0085E.01  
8/20  
1 CHANNEL SWITCHED MODE CONSTANT CURRENT CONTROLLER  
PRODUCTION DATA - JUL 21, 2016  
E522.31/33  
Electrical Characteristics (continued)  
(VVIN = +5.5V to +55V, TAMB = -40°C to +125°C, unless otherwise noted. Typical values are at VVIN = +14V and TAMB  
+25°C. Positive currents flow into the device pins.)  
=
Description  
Condition  
Symbol  
RRT,INT  
Min  
50  
Typ  
Max  
120  
650  
Unit  
kΩ  
RT Resistor Range for Internal  
fOSCIN = 0 Hz  
Oscillator Operation 1)  
OSCIN External Frequency Range 2)  
fOSCIN,EXT  
225  
kHz  
ns  
Minimum High or Low Pulsewidth  
at OSCIN for Synchronization  
TPULSE,MIN,OSCIN 660  
RT Resistor Range for external  
Clock Synchronization  
225kHz ≤ fOSC,IN ≤ 650kHz RRT,EXT  
47  
-5  
137  
5
kΩ  
%
Tracking between RRT and OSCIN  
frequency for external Oscillator  
Synchronization  
2)  
RRT,OSCIN  
f
OSCIN = 0 Hz  
Typical Range for Spread Spectrum  
Modulation of internal Oscillator  
fSPREAD  
-40  
40  
kHz  
only valid for E522.31  
Digital Dimming Logic  
Minimum PWDIM Pulse Width  
PWDIM Frequency  
3)  
TPWDIM,MIN  
fPWDIM  
2
µs  
Hz  
20  
400  
64  
2000  
Timeout for CMP and Softstart  
Reset  
PWDIM = '0'  
TPWM,TIMEOUT  
RON,LGATEH  
RON,LGATEL  
ILGATE,AVG  
ms  
Ω
I
LGATE = -5mA  
LGATE Pullup Resistance  
LGATE Pulldown Resistance  
Average Current in LGATE  
30  
18  
TJ = 25°C  
I
LGATE = 5mA  
Ω
TJ = 25°C  
I
LGATE,AVG = fPWDIM  
x
2
mA  
QGATECHARGE + ILGATE,DC  
Pullup Current at PWDIM to V3V3 VPWDIM = 1V  
IPWDIM,PU  
VPWDIM,H  
VPWDIM,L  
-100  
-80  
2.1  
1.2  
-60  
µA  
V
High Threshold at PWDIM  
Low Threshold at PWDIM  
VPWDIM rising  
VPWDIM falling  
V
PWDIM = '1'  
Typical Delay by Internal Softstart  
Ramp (standard setting)  
(E52231A61C,  
tSOFTSTART  
7.5  
ms  
E52233A61C) 4) 5)  
PWDIM = '1'  
Rising Voltage Slope at CMP during  
Softstart (standard setting)  
dV/  
mV /  
ms  
(E52231A61C,  
200  
3.75  
400  
dtCMP,START1  
E52233A61C) 5)  
PWDIM = '1'  
Typical Delay by Internal Softstart  
Ramp (fast setting)  
(E52231A61CXFR,  
tSOFTSTART,FAST  
ms  
E52233A61CXFR) 4) 5)  
PWDIM = '1'  
Rising Voltage Slope at CMP during  
Softstart (fast setting)  
dV/  
dtCMP,START2  
mV /  
ms  
(E52231A61CXFR,  
E52233A61CXFR) 5)  
1) E522.31 drives typical 1.2V to the RT node  
2) The external input frequency must be matched to the frequency given by RRT to detect a valid OSCIN signal  
3) Note that the delays in external dimming circuit or magnetic components may limit the dimming pulse width above the  
E522.3x limit  
4) The time given is the typical delay that is necessary to reach a sufficiently high CMP voltage to regulate a typical application.  
May vary depending on implementation details  
5) Not production tested  
Elmos Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.  
Elmos Semiconductor AG  
Data Sheet  
QM-No.: 25DS0085E.01  
9/20  
1 CHANNEL SWITCHED MODE CONSTANT CURRENT CONTROLLER  
PRODUCTION DATA - JUL 21, 2016  
E522.31/33  
Electrical Characteristics (continued)  
(VVIN = +5.5V to +55V, TAMB = -40°C to +125°C, unless otherwise noted. Typical values are at VVIN = +14V and TAMB  
+25°C. Positive currents flow into the device pins.)  
=
Description  
Condition  
Symbol  
Min  
Typ  
Max  
Unit  
Analog Dimming and Highside Sense  
External voltage refer-  
ence applied  
ADIM Input Voltage Range  
VADIM,EXT  
VADIM,INT  
0.24  
192  
2.4  
V
Internal Reference Voltage for  
FBH,FBL  
VADIM = VV3V3  
200  
208  
mV  
ADIM Pull-Down Current to AGND VADIM = 1V  
Under-voltage Threshold for ADIM  
Gain from ADIM to FBH/FBL  
IADIM,PD  
0.75  
160  
1/6  
µA  
VADIM,ERR  
AADIM,FB  
mV  
Linearity Error of ADIM to FBH/FBL  
0.6V ≤ VADIM ≤ 2.4V 1)  
VIN = 14V  
VVIN = 14V  
LADIM,FB  
3
%
Gain  
Input voltage at FBL pin  
Input voltage at FBH input  
V
VFBL  
4
56  
V
V
VFBH  
VFBL  
VFBL+0.4  
Highside Feedback Amplifier Input  
Currents  
IFB = IFBH+IFBL  
IFB  
125  
3.8  
16  
µA  
V
VFBH = VFBL = 14V  
Undervoltage Detection at FBL  
and FBH  
3)  
VFB,UV  
tERR,DIM  
VERR,DIM  
4
Error detection delay after falling  
edge at PWDIM  
Evaluation of VFBH -  
VFBL during dimming  
14  
µs  
mV  
Error Detection Threshold Voltage Evaluation of VFBH-VFBL  
after falling edge at PWDIM  
50  
during dimming  
Inner Current Regulation Loop  
Voltage VCSP referred to  
GND  
Positive low-side Shunt Sense  
Input Voltage  
VCSP  
400  
-5  
mV  
Average Pull-Up Current at CSP  
Pull-Down Current at CSN  
VCSP = 0V  
ICSP,PU  
ICSN,PD  
-20  
5
µA  
µA  
Over-Current Protection Threshold  
at CSP  
VCSP,OCP  
425  
mV  
V
DRVS = 5V  
Pull-Up On-Resistance of CGATE  
ICGATE = -100mA  
TJ = 25°C  
RON,CGATEH  
1.6  
Ω
V
DRVS = 5V  
Pull-Down On-Resistance of CGATE ICGATE = 100mA  
TJ = 25°C  
RON,CGATEL  
1.2  
Ω
ICGATE,AVG = fOSC  
QGATECHARGE  
x
Average Current in CGATE  
ICGATE,AVG  
IDRVS,MIN  
TOFF  
25  
mA  
µA  
ns  
2)  
Minimum current consumption at  
DRVS  
V
= 0V  
TJC=GA2TE5°C  
7
15  
CGATE On-Pulse Width during  
Over-Current Condition  
VCSP ≥ 500 mV 4)  
130  
89  
VCMP= VV3V3  
Maximum CGATE Dutycycle  
DCCGATE,MAX  
%
Softstart finished  
1) For reference voltages at ADIMx below 0.6V the linearity error may scale to higher values  
2) Value limited to avoid excessive current flow in VSM regulator, see also „1 Absolute Maximum Ratings“  
3) Consider this parameters espesially for SEPIC or Flyback topologies  
4) Not production tested  
Elmos Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.  
Elmos Semiconductor AG  
Data Sheet  
QM-No.: 25DS0085E.01  
10/20  
1 CHANNEL SWITCHED MODE CONSTANT CURRENT CONTROLLER  
PRODUCTION DATA - JUL 21, 2016  
E522.31/33  
Electrical Characteristics (continued)  
(VVIN = +5.5V to +55V, TAMB = -40°C to +125°C, unless otherwise noted. Typical values are at VVIN = +14V and TAMB  
+25°C. Positive currents flow into the device pins.)  
=
Description  
Condition  
Symbol  
Min  
Typ  
Max  
Unit  
Outer Regulation Loop  
Transconductance differential  
Voltage VFBH-FBL to CMP  
TJ = 25°C  
GM  
4000  
85  
µS  
dB  
µA  
Openloop DC Gain from VFBH-FBL to  
CMP  
3)  
ADC  
TJ = 25°C  
VCMP = 1.5V  
Maximum Input / Output Current  
at CMP  
ICMP,MAX  
40  
V
PWDIM = 0V  
Leakage Current at CMP during  
Dimming  
TJ ≤ 85°C  
VCMP = 1.5V  
ICMP,LEAK  
1
30  
nA  
3)  
Under-voltage protection at CMP  
Over-Voltage Protection  
VOVERDR,CMP  
160  
mV  
Input Voltage at OVPIN pin  
Input voltage at OVPO pin  
VOVPIN  
80  
V
V
V
VOVPO  
VV3V3  
1.24  
1)  
Over-Voltage Protection Threshold  
VOVPO,OFF  
1.16  
1.20  
V
OVPIN = 5 ... 80V,  
TJ = 25°C  
VON=0V or VPWDIM=0  
Sleep / Dimming Leakage Current  
at OVPIN  
ILEAK,OVPIN  
0.1  
µA  
I
ACTIVE,OVPIN = VOUT/  
Active Current Flow into OVPIN  
IACTIVE,OVPIN  
tOVP,DETECT  
130  
25  
µA  
µs  
2)  
(ROVPIN+ROVPO  
)
PWDIM = '1'  
ON = '1'  
Over-Voltage Detection Delay  
ERRB Output  
10  
3)  
I
ERRB = 3mA  
Output Voltage of active ERRB  
VERRB,L  
200  
400  
5
mV  
Error detected  
TJ < 150°C  
No Error detected  
Error detected  
ERRB Leakage Current  
IERRB,Z  
µA  
ms  
Minimum ERRB Low Pulse Width  
tERRB,ON  
0.8  
1
1) Hysteresis is provided by internal minimum pulse width of ERRB signal of typ. 1ms  
2) The parameter VOUT describes the output voltage of the converter in a typical application  
3) Not production tested  
Elmos Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.  
Elmos Semiconductor AG  
Data Sheet  
QM-No.: 25DS0085E.01  
11/20  
1 CHANNEL SWITCHED MODE CONSTANT CURRENT CONTROLLER  
PRODUCTION DATA - JUL 21, 2016  
E522.31/33  
5 Functional Description  
5.1 General  
The E522.3x family is a versatile high voltage controller For further reduction of electromagnetic emission  
family for LED drivers. They can be configured for buck E522.31/32 are running with spread spectrum local os-  
from battery, buck-boost, SEPIC or boost topologies, ei- cillator. The spread spectrum is only applied if there is  
ther to VIN or GND.  
no input frequency at OSCIN.  
This flexibility combined with the high supply voltage The internal low-drop regulators VSM and V3V3 can be  
of 55V, the very large output voltage range and the used to supply external low-power components with a  
possibility to drive high power LED arrays makes the total current consumption up to 15mA(E522.32/34)and  
E522.3x family ideal for  
40mA(E522.31/33) at 5V (VSM) and 3.3V (V3V3) supply.  
LED lighting applications  
Automotive environment, e.g. headlight control  
Residential and outdoor lighting applications  
The internal oscillator can be configured for free-run-  
ning mode with fixed frequency, controlled by a resistor  
at the RT pin, or synchronized by an external clock input  
at OSCIN (Slave mode in a Master-Slave configuration).  
The E522.3x family consists of E522.31/33 for one LED  
chain and E522.32/34 for two LED chains. In all two The LED controllers support PWM dimming for LED  
channel family members the Switch Mode Power Sup- brightness control without color change and analog  
plies are 180° out of phase for reduced EMI. Digital dimming for adjusting the LED initial current. The PWM  
PWM and analog dimming for each LED channel are in- of E522.3x dimming allows a wide dimming ratio of  
dependent and can be adjusted separately.  
>1000:1 at PWM frequencies up to 400Hz.  
5.2 Supply  
The supply generates all necessary voltages to oper- V3V3 voltage regulator is used to power most of the in-  
ate E522.3x from VIN. Furthermore supervision of VVIN  
VVSM, VV3V3 and device temperature are performed.  
,
ternal analog circuitry. It may also be used to drive ex-  
ternal components, but in this case the total external  
current provided by VSM and V3V3 must not exceed  
The VSM low-drop voltage regulator provides 5V for pe- 40mA. Use 1µF ceramic capacitance (X7R) to stabilize  
ripheral structures and CGATE driver. It is controlled by V3V3.  
the ON pin and the internal temperature supervision.  
For proper stabilization use typ. 1µF ceramic capaci-  
tance (X7R recommended).  
5.3 Oscillator  
The internal oscillator defines the operation frequency For synchronous operation to an external clock source,  
of the device, adjustable from 250 to 600kHz by an ex- a frequency can be applied to OSCIN.  
ternal resistor at pin RT. Any Frequency in this range can In case of external clock it is necessary to apply a resis-  
be set by linear interpolation between the values given tor to RT with a value matching the synchronizing fre-  
in the table above ( RRT=50kΩ*600kHz/frequency ). To quency. Tolerance between frequency set by RRT and fOS-  
use the internal oscillator, solder OSCIN to AGND.  
CIN is defined in RRT,OSCIN.  
Elmos Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.  
Elmos Semiconductor AG  
Data Sheet  
QM-No.: 25DS0085E.01  
12/20  
1 CHANNEL SWITCHED MODE CONSTANT CURRENT CONTROLLER  
PRODUCTION DATA - JUL 21, 2016  
E522.31/33  
5.4 Digital Dimming Logic  
The PWM logic block controls the digital dimming of 0 the rising edge of VPWDIMx this check is disabled again.  
to 100% at pin PWDIM. When PWM = '0' is applied to The PWM range of 0 to 100% with 0.1% resolution per-  
pin PWDIM, E522.3x is set to hold state (high imped- mits LED brightness control of >1000:1 at a PWM fre-  
ant) for the regulation signal at CMPx. LGATE outputs quency of 400Hz.  
are set to match internal synchronization of PWM. Di- Note, that during dimming the current in the exter-  
rect control of external dimming transistors is not rec- nal inductor must settle to provide proper regulation.  
ommended.  
Therefore the minimum dimming pulse width depends  
At the falling edge of the PWM signal, dimming circuit is on the external circuitry, input voltages and external  
checked for short circuit connections. To verify that the resonant frequencies, too.  
external current is switched off, typ. 16µs after switch- Internal pull-up current to V3V3 makes the PWDIMx  
ing LGATE '0', internal control circuitry for short detec- pins suitable for open-drain / open-collector control  
tion in the external dimming circuit is enabled. The circuits. The voltage capability of VVSM makes this input  
threshold for this detection is typ. 50mV VFBH-FBL. With 5V/3.3V compatible as well.  
5.5 Analog Dimming and Highside Sense  
The ADIM section provides LED current adjustment, in- any topology FBH must be connected to the positively  
dependent of digital dimming feature (e.g. binning or biased shunt resistor terminal.  
initial current setting).  
Voltages below typ. 0.16V are considered an open pin, age to detect open pins or short-to-GND errors, disa-  
disabling the converter. bling the converter in case of detection. The under-  
Additionally, these pins are monitored for under-volt-  
In the range of 0.24V to 2.4V the signal is accepted as voltage threshold may be superseded by the VSM reset  
reference for regulation, divided by a factor of 6. To use generation.  
the internal reference voltage of typical 1.2V ( = 200mV Note that for SEPIC or Flyback topologies the output  
at VFBH-FBL) solder this pin to V3V3.  
must be precharged above the undervoltage threshold  
at FBx to allow startup. For example the VSM regulator  
The high side feedback FBH & FBL provides precise is suitable to drive the output via a rectification device  
measurement of the load current (e.g. LED current). In or circuit.  
5.6 Inner Current Regulation Loop  
The Low side feedback CSxP and CSxN provides induc- DRVS should be supplied by VSM (see chapter supply  
tor current measurement to the inner regulation loop for details). If DRVS is supplied externally, an maximum  
to control the pulse width of the CGATE output. Over- average current of 40mA in each CGATE is possible. Take  
Current protection is provided if the voltage at CSxP pin additional power generated in E522.3x into account.  
exceeds 425mV relative to AGND, turning the accord- E522.3x device provide internal slope compensation  
ing CGATE driver off. For over-current limitation please ramp generation. The slope can be scaled to match the  
note , that the slope compensation may decrease the external circuitry by applying a resistor RSLP between  
actual current limitation for higher dutycycles.  
the innerloop shunt RSHUNT and pin CSxP.  
CGATE output is designed to drive the gate of an exter- For applications designed to work with higher dutycy-  
nal true-logic-level N-channel FET with an average gate cles than 50%, RSLP should be choosen in the range from  
current of 25mA at switching frequencies up to 660kHz typ. 330Ω to 2kΩ. Final resistor value should be defined  
(in OSCIN synchronized operational mode).  
during prototyping of the complete application.  
The average current can be calculated by multiplication As a starting value for RSLP in Boost configuration use  
of the operation frequency with the total gate charge  
V
OUTRSHUNT  
of the external FET. For example, for a transistor of  
40nC gate-charge the maximum operational frequency  
RSLP  
=
5e4f RTL  
is 625kHz. Higher gate-charge leads to lower maximum with fRT = operating frequency set at RT  
operational frequency (e.g. 100nC transistors are possi- and L = inductance in Boost circuitry  
ble at a maximum frequency of 250kHz).  
Elmos Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.  
Elmos Semiconductor AG  
Data Sheet  
QM-No.: 25DS0085E.01  
13/20  
1 CHANNEL SWITCHED MODE CONSTANT CURRENT CONTROLLER  
PRODUCTION DATA - JUL 21, 2016  
E522.31/33  
5.7 Outer Regulation Loop  
The outer regulation loop provides control of the con- Under-voltage detection at FBL, FBH and CMP are pro-  
verter in combination with the differential high-side vided to detect external failures like short-connections.  
feedback amplifier at FBL and FBH. The failure amplifier A soft-start mechanism is implemented to avoid exces-  
(named GM) provides the inner regulation loop refer- sive input current flow. The soft-start startup time is  
ence voltage derived from CMP.  
typically 7.5ms with PWDIM='1' to fully release convert-  
er output power. A faster setting for softstart length  
A typical compensation network required for optimized can be ordered, which leads to 3.75ms for a typical im-  
operation is a network consisting of a capacitor to ref- plementation. The voltage slopes applied at CMP are ei-  
erence GND, parallel to a serial connection of a capaci- ther typ. 200mV/ms (standard) or typ. 400mV/ms (fast).  
tor and a resistor (see typical application diagram). Dur-  
ing prototyping the compensation has to be verified for Note that dimming at PWDIMx during softstart stretches this  
the whole input voltage range, especially for the maxi- delay (by approximately 1/dutycycle applied).  
mum duty cycle which occurs.  
5.8 Over-Voltage Protection  
The OVP (over voltage protection) Pins OVPIN and OVPO If E522.3x is turned off or is dimmed, the connection  
provide a GND related output over-voltage protection.  
between OVPIN and OVPO is switched off, providing  
high impedance to reduce current flow in over-voltage  
The absolute voltage level of protection is defined by protection. This feature also disconnects the DC path  
the resistive divider with respect to the maximum volt- between VIN and GND to save energy in sleep mode.  
age at pin OVPIN, connected from converter output Note, that during PWDIM='0' the over-voltage protec-  
voltage to OVPIN and from OVPO to AGND. Recom- tion is not available.  
mended resistive range is given in ROVPO.  
5.9 ERRB Output  
ERRB open-drain output is used to set an error flag for  
peripheral components, e.g. microcontroller.  
The output drives the ERRB flag to AGND, if a failure is  
detected. The following failure states are handled:  
Open ADIM connection  
Differential feedback FBH-FBL over-voltage 2)  
PWDIM time-out (e.g. caused by short to GND)  
Short in external dimming transistors 3)  
VSM or V3V3 under-voltage (e.g. short to GND)  
Junction over-temperature  
Over-voltage at OVPIN  
Open-load (detected by over-voltage protection)  
Open feedback connection at FBH or FBL  
Open current feedback at CSP  
FBH or FBL under-voltage detection  
Reversed feedback VFBH - VFBL < typ. -50mV  
Continuous innerloop current limitation for typ.  
>64ms 1)  
Open AGND or PGND connection  
DRVS under-voltage (below reset-threshold)  
ON voltage low (ON logically'0')  
Open RT input or out-of-range OSCIN signal  
Invalid frequency applied to OSCIN  
1) Error Flag is set for typ. 1s after detection, restarting the device afterwards.  
2) Differential overvoltage at FBH/FBL is detected by CMP undervoltage detection to avoid sensitivity to distortions.  
3) Differential voltage across FBH/FBL during dimming is supervised for a typ. threshold of 50mV after a delay of typ. 16µs fol-  
lowing the falling edge of the PWDIM signal.  
Elmos Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.  
Elmos Semiconductor AG  
Data Sheet  
QM-No.: 25DS0085E.01  
14/20  
1 CHANNEL SWITCHED MODE CONSTANT CURRENT CONTROLLER  
PRODUCTION DATA - JUL 21, 2016  
E522.31/33  
Operation  
with fRT  
Operation  
with fOSCIN  
No Operation  
ERRBx set  
No Operation  
ERRBx set  
0
0
0
fOSCIN  
fOSCIN  
fOSCIN  
fRT  
fRT  
Wobbling disabled for proper  
OSCIN Detection  
f
fRT  
Figure 1. OSCIN Failure Check  
5.10 Short Circuit Monitoring for floating LED Loads  
The circuitry shown in (Figure 2) can be used to detect gy can be used to partially compensate the temperatur  
LED chain short circuit in floating output topologies (e.g. dependent characteristic of the load. With the connec-  
boost-to-battery). The resistors RSC1,2 are used to adapt tion to ERRB of E522.3x, the combined feedback signal  
the threshold for short circuit detection to a threshold includes all failures detected by E522.3x together with  
of VSC,DETECT=U(BE)*(1+RSC1/RSC2), with U(BE) being the the short circuit (or under-voltage) information of the  
base-emitter voltage of the bipolar transistor devices. highside load. An additional capacitor parallel to RSC2  
Choose RSC1 value sufficiently high to prevent unintend- may be useful to implement debouncing of the feed-  
ed discharge of the converter output during dimming back signal or to increase of EMI of the circuit.  
cycles. The negative thermal coefficient of this topolo-  
Dimming  
(if used)  
RSC1  
Feedback  
Channel  
(incl. Pull-up)  
ERRB  
RSC2  
Figure 2. Exemplary shown circuit monitoring in Boost-to-Battery application  
Elmos Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.  
Elmos Semiconductor AG  
Data Sheet  
QM-No.: 25DS0085E.01  
15/20  
1 CHANNEL SWITCHED MODE CONSTANT CURRENT CONTROLLER  
PRODUCTION DATA - JUL 21, 2016  
E522.31/33  
6 List of Abbreviations  
Term  
ASSP  
IC  
Explanation  
Application Specific Standard Product  
Integrated Circuit  
OVP  
OCP  
GM  
Over Voltage Protection  
Over Current Protection  
Transconductance  
OSC  
PWM  
REF  
LDO  
CS  
Oscillator  
Pulse Width Modulation  
Reference, usually given as I (current) or V (voltage)  
Low Drop Out Voltage Regulator  
Current Sense  
FB  
Feedback  
SMPS  
EMI  
EME  
EMC  
Switched-Mode Power Supply  
Electromagnetic Immunity  
Electromagnetic Emission  
Electromagnetic Compatibility  
Elmos Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.  
Elmos Semiconductor AG  
Data Sheet  
QM-No.: 25DS0085E.01  
16/20  
1 CHANNEL SWITCHED MODE CONSTANT CURRENT CONTROLLER  
PRODUCTION DATA - JUL 21, 2016  
E522.31/33  
7 Package Information  
All devices are available in a Pb free, RoHs compliant QFN32L5 plastic package according to JEDEC MO-220 K, vari-  
ant VHHD-4. The package is classified to Moisture Sensitivity Level 3 (MSL 3) according to JEDEC J-STD-020 with a  
soldering peak temperature of (260+5)°C.  
Description  
Symbol  
mm  
typ  
inch  
typ  
min  
max  
min  
max  
Package height  
Stand off  
A
A1  
0.80  
0.00  
--  
0.90  
0.02  
1.00  
0.05  
--  
0.031  
0.000  
--  
0.035  
0.00079  
0.0079 REF  
0.010  
0.039  
0.002  
--  
Thickness of terminal leads, including lead finish  
Width of terminal leads  
A3  
0.20 REF  
0.25  
b
0.18  
--  
0.30  
--  
0.007  
--  
0.012  
--  
Package length / width  
5.00 BSC  
3.65  
D / E  
0.197 BSC  
0.144  
3.80  
--  
0.138  
--  
0.150  
--  
Length / width of exposed pad  
Lead pitch  
D2 / E2 3.50  
e
L
--  
0.5 BSC  
0.40  
0.02 BSC  
0.016  
Length of terminal for soldering to substrate  
Number of terminal positions  
0.35  
0.45  
0.014  
0.018  
N
32  
32  
Note: the mm values are valid, the inch values contains rounding errors  
Elmos Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.  
Elmos Semiconductor AG  
Data Sheet  
QM-No.: 25DS0085E.01  
17/20  
1 CHANNEL SWITCHED MODE CONSTANT CURRENT CONTROLLER  
PRODUCTION DATA - JUL 21, 2016  
E522.31/33  
8 Marking  
8.1 Top Side  
ÿ
ÿ
ÿ
Elmos (Logo)  
52231A  
XXUYWW  
Signature  
Explanation  
52231  
A
Y
WW  
XXXX  
U
Elmos project number  
Elmos project revision code  
Year of assembly (e.g. 2014)  
Week of assembly  
Production lot number (1 to 4 digits)  
Assembler Code  
9 Functional Safety  
The development of this product is based on a process according to an ISO/TS 16949 certified quality management  
system. Functional safety requirements according to ISO 26262 have not been submitted to Elmos and therefore  
have not been considered for the development of this product.  
Elmos Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.  
Elmos Semiconductor AG  
Data Sheet  
QM-No.: 25DS0085E.01  
18/20  
1 CHANNEL SWITCHED MODE CONSTANT CURRENT CONTROLLER  
PRODUCTION DATA - JUL 21, 2016  
E522.31/33  
10 Record of Revision  
Chapter  
-
-
Revision  
.00  
.01  
Change and Reason for Change  
Initial revision  
Page 1 -> new version with new ordering no. added  
Date  
Released Elmos  
Mar 26, 2015 AMIL/ZOE  
Jul 21, 2016 DHOE/ZOE  
Page 9 -> Digital Dimming Logic -> Software param-  
eter added  
4
.01  
Jul 21, 2016 DHOE/ZOE  
5.7  
9
.01  
.01  
Revised  
Jul 21, 2016 DHOE/ZOE  
Jul 21, 2016 DHOE/ZOE  
New chapter with Functional Safety Hints  
Elmos Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.  
Elmos Semiconductor AG  
Data Sheet  
QM-No.: 25DS0085E.01  
19/20  
1 CHANNEL SWITCHED MODE CONSTANT CURRENT CONTROLLER  
PRODUCTION DATA - JUL 21, 2016  
E522.31/33  
WARNING – Life Support Applications Policy  
Elmos Semiconductor AG is continually working to improve the quality and reliability of its products. Nevertheless, semicon-  
ductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress.  
It is the responsibility of the buyer, when utilizing Elmos Semiconductor AG products, to observe standards of safety, and to  
avoid situations in which malfunction or failure of an Elmos Semiconductor AG Product could cause loss of human life, body  
injury or damage to property. In the development of your design, please ensure that Elmos Semiconductor AG products are  
used within specified operating ranges as set forth in the most recent product specifications.  
General Disclaimer  
Information furnished by Elmos Semiconductor AG is believed to be accurate and reliable. However, no responsibility is as-  
sumed by Elmos Semiconductor AG for its use, nor for any infringements of patents or other rights of third parties, which may  
result from its use. No license is granted by implication or otherwise under any patent or patent rights of Elmos Semiconductor  
AG. Elmos Semiconductor AG reserves the right to make changes to this document or the products contained therein without  
prior notice, to improve performance, reliability, or manufacturability.  
Application Disclaimer  
Circuit diagrams may contain components not manufactured by Elmos Semiconductor AG, which are included as means of  
illustrating typical applications. Consequently, complete information sufficient for construction purposes is not necessarily  
given. The information in the application examples has been carefully checked and is believed to be entirely reliable. However,  
no responsibility is assumed for inaccuracies. Furthermore, such information does not convey to the purchaser of the semicon-  
ductor devices described any license under the patent rights of Elmos Semiconductor AG or others.  
Contact Information  
Headquarters  
Elmos Semiconductor AG  
Heinrich-Hertz-Str. 1 • D-44227 Dortmund (Germany)  
: +492317549100  
: +12488653200  
: sales-germany@elmos.com  
: sales-usa@elmos.com  
: www.elmos.com  
Sales and Application Support Office North America  
Elmos NA. Inc.  
32255 Northwestern Highway • Suite 220 Farmington Hills  
MI 48334 (USA)  
Sales and Application Support Office China  
Elmos Semiconductor Technology (Shanghai) Co., Ltd.  
Unit 16B, 16F Zhao Feng World Trade Building,  
No. 369 Jiang Su Road, Chang Ning District,  
Shanghai, PR China, 200050  
: +86216210 0908  
: +82317141131  
: sales-china@elmos.com  
: sales-korea@elmos.com  
Sales and Application Support Office Korea  
Elmos Korea  
B-1007, U-Space 2, #670 Daewangpangyo-ro,  
Sampyoung-dong, Bunddang-gu, Sungnam-si  
Kyounggi-do 463-400 Korea  
Sales and Application Support Office Japan  
Elmos Japan K.K.  
BR Shibaura N Bldg. 7F  
3-20-9 Shibaura, Minato-ku,  
Tokyo 108-0023 Japan  
: +81334517101  
: +65 6908 1261  
: sales-japan@elmos.com  
Sales and Application Support Office Singapore  
Elmos Semiconductor Singapore Pte Ltd.  
3A International Business Park  
#09-13 ICON@IBP • 609935 Singapore  
: sales-singapore@elmos.com  
© Elmos Semiconductor AG, 2016. Reproduction, in part or whole, without the prior written consent of Elmos Semiconductor AG, is prohibited.  
Elmos Semiconductor AG reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.  
Elmos Semiconductor AG  
Data Sheet  
QM-No.: 25DS0085E.01  
20/20  

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