EM6132K800VSA-35F [EOREX]
32Kx8 LP SRAM; 32Kx8 LP SRAM
| 型号： | EM6132K800VSA-35F |
| 厂家： | 
EOREX CORPORATION |
| 描述： | 32Kx8 LP SRAM |
| 文件： | 总12页 (文件大小：340K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
32Kx8 LP SRAM EM6132K800W Series
GENERAL DESCRIPTION
The EM6132K800W is a 262,144-bit low power CMOS static random access memory organized as
32,768 words by 8 bits. It is fabricated using very high performance, high reliability CMOS technology.
Its standby current is stable within the range of operating temperature.
The EM6132K800W is well designed for low power application, and particularly well suited for battery
back-up nonvolatile memory application.
The EM6132K800W operates from a single power supply of 2.7V ~ 5.5V and all inputs and outputs are
fully TTL compatible
FEATURES
z
z
Fast access time: 35/55/70ns
Low power consumption:
Operating current:
20/15/10mA (TYP.), VCC = 2.7 ~ 3.6V; 40/35/30mA (TYP.), VCC = 4.5 ~ 5.5V
Standby current: -L/-LL version
1/0.5µA (TYP.), VCC = 2.7 ~ 3.6V; 2/1µA (TYP.), VCC = 4.5 ~ 5.5V
Single 2.7V ~ 5.5V power supply
All inputs and outputs TTL compatible
Fully static operation
Tri-state output
Data retention voltage: 2.0V (MIN.)
Package: 28-pin 600 mil PDIP
z
z
z
z
z
z
28-pin 330 mil SOP
28-pin 8mm x 13.4mm STSOP
FUNCTIONAL BLOCK DIAGRAM
Vcc
Vss
32Kx8
MEMORY
ARRAY
A0-A14
DECODER
I/O DATA
CURCUIT
COLUMN I/O
DQ0-DQ7
CONTROL
CIRCUIT
CE#
WE#
OE#
PIN DESCRIPTION
SYMBOL
A0 - A14
DQ0 – DQ7
CE#
WE#
OE#
DESCRIPTION
Address Inputs
Data Inputs/Outputs
Chip Enable Input
Write Enable Input
Output Enable Input
Power Supply
Vcc
Vss
Ground
1
DCC-SR-041001-A
32Kx8 LP SRAM EM6132K800W Series
PIN CONFIGURATION
PDIP/SOP
28
A14
1
Vcc
27
A12
A7
2
WE#
26
3
A13
25
A8
A6
4
24
A9
A5
5
23
A4
6
A11
22
A3
7
OE#
21
A2
8
A10
20
A1
9
CE#
19
A0
10
11
12
13
14
DQ7
18
DQ0
DQ1
DQ2
Vss
DQ6
17
DQ5
16
DQ4
15
DQ3
STSOP Type I
OE#
A11
A9
1
2
3
4
5
6
7
8
28
27
26
25
24
23
22
21
20
19
18
17
16
A10
CE#
DQ7
DQ6
DQ5
DQ4
DQ3
Vss
DQ2
DQ1
DQ0
A0
A8
A13
WE#
Vcc
A14
A12
A7
A6
A5
A4
A3
9
10
11
12
13
A1
A2
2
DCC-SR-041001-A
32Kx8 LP SRAM EM6132K800W Series
ABSOLUTE MAXIMUN RATINGS*
PARAMETER
SYMBOL
RATING
-0.5 to 7.0
0 to 70(C grade)
-20 to 80(E grade)
-40 to 85(I grade)
-65 to 150
1
UNIT
Terminal Voltage with Respect to Vss
VTERM
V
Operating Temperature
TA
°C
Storage Temperature
TSTG
PD
°C
W
Power Dissipation
DC Output Current
IOUT
50
mA
°C
Soldering Temperature (under 10 sec)
TSOLDER
260
*Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device or any other conditions above those indicated in the operational sections
of this specification is not implied. Exposure to the absolute maximum rating conditions for extended period may affect device
reliability.
TRUTH TABLE
MODE
Standby
CE#
H
OE#
X
WE#
X
I/O OPERATION
High-Z
SUPPLY CURRENT
ISB,ISB1
Output Disable
Read
L
L
H
L
H
H
High-Z
DOUT
ICC,ICC1
ICC,ICC1
Write
L
X
L
DIN
ICC,ICC1
Note: H = VIH, L = VIL, X = Don't care.
DC ELECTRICAL CHARACTERISTICS
I. Vcc=3.3V
PARAMETER
SYMBOL TEST CONDITION
MIN.
TYP. *5 MAX.
UNIT
Supply Voltage
Vcc
2.7
3.3
3.6
V
Input High Voltage
VIH*1
2.0
-
Vcc+
0.5
V
Input Low Voltage
VIL*2
-0.5
-1
-
-
0.6
V
Input Leakage
Current
ILI
Vcc ≧ VIN ≧ Vss
+1
µA
Output Leakage
Current
Output High
Voltage
Output Low
Voltage
Average Operating
Power supply
Current
ILO
VCC ≧ VOUT ≧ VSS,
Output Disabled
IOH = -1mA
-1
2.4
-
-
3.0
-
1
µA
V
VOH
VOL
ICC
-
IOL = 2mA
0.4
V
Cycle time = Min.
CE# = VIL , II/O = 0mA
-35
-55
-70
-
-
-
-
20
15
10
3
40
30
20
6
mA
mA
mA
mA
ICC1
Cycle time = 1µs
CE#≦0.2V and II/O = 0mA
other pins at 0.2V or VCC-0.2V
Standby Power
Supply Current
ISB
CE# = VIH
-
-
1
3
mA
ISB1
CE# V ≧ VCC - 0.2V
-L
-LL
1
0.5
40
20*4
µA
µA
3
DCC-SR-041001-A
32Kx8 LP SRAM EM6132K800W Series
II. Vcc=5V
PARAMETER
SYMBOL TEST CONDITION
MIN.
TYP. *5 MAX.
UNIT
Supply Voltage
Vcc
4.5
5.0
5.5
V
Input High Voltage
VIH*1
2.0
-
Vcc+
0.5
V
Input Low Voltage
VIL*2
-0.5
-1
-
-
0.8
V
Input Leakage
Current
ILI
Vcc ≧ VIN ≧ Vss
+1
µA
Output Leakage
Current
Output High
Voltage
Output Low
Voltage
Average Operating
Power supply
Current
ILO
VCC ≧ VOUT ≧ VSS,
Output Disabled
IOH = -1mA
-1
2.4
-
-
-
-
1
µA
V
VOH
VOL
ICC
-
IOL = 2mA
0.4
V
Cycle time = Min.
CE# = VIL , II/O = 0mA
-35
-55
-70
-
-
-
-
40
35
30
5
50
45
40
10
mA
mA
mA
mA
ICC1
Cycle time = 1µs
CE#≦0.2V and II/O = 0mA
other pins at 0.2V or VCC-0.2V
Standby Power
Supply Current
ISB
CE# = VIH
-
-
1
3
mA
ISB1
CE# V ≧ VCC - 0.2V
-L
-LL
2
1
100
50*4
µA
µA
Notes:
1. VIH(max) = VCC + 3.0V for pulse width less than 10ns.
2. VIL(min) = VSS - 3.0V for pulse width less than 10ns.
3. Over/Undershoot specifications are characterized, not 100% tested.
4. 10µA for special request
5. Typical values are included for reference only and are not guaranteed or tested.
Typical valued are measured at VCC = VCC(TYP.) and TA = 25°C
CAPACITANCE (TA = 25°C , f = 1.0MHz)
PARAMETER
Input Capacitance
Input/Output Capacitance
SYMBOL
MIN.
-
-
MAX.
6
UNIT
pF
CIN
CI/O
8
pF
Note : These parameters are guaranteed by device characterization, but not production tested.
AC TEST CONDITIONS
Input Pulse Levels
0.2V to VCC - 0.2V
Input Rise and Fall Times
Input and Output Timing Reference Levels
Output Load
3ns
1.5V
CL = 50pF + 1TTL, IOH/IOL = -1mA/2mA
4
DCC-SR-041001-A
32Kx8 LP SRAM EM6132K800W Series
AC ELECTRICAL CHARACTERISTICS
READ CYCLE
PARAMETER
SYM.
-35
-55
70
UNIT
MIN. MAX. MIN. MAX. MIN. MAX.
Read Cycle Time
Address Access Time
Chip Enable Access Time
Output Enable Access Time
Chip Enable to Output in Low-Z
Output Enable to Output in Low-Z
Chip Disable to Output in High-Z
Output Disable to Output in High-Z tOHZ*
Output Hold from Address Change tOH
tRC
tAA
35
-
-
-
10
5
-
-
10
-
55
-
-
-
10
5
-
-
10
-
70
-
-
-
10
5
-
-
10
-
ns
ns
ns
ns
ns
ns
ns
ns
ns
35
35
25
-
55
55
30
-
70
70
35
-
tACE
tOE
tCLZ*
tOLZ*
tCHZ*
-
-
-
15
15
-
20
20
-
25
25
-
WRITE CYCLE
PARAMETER
SYM.
-35
-55
70
UNIT
MIN. MAX. MIN. MAX. MIN. MAX.
Write Cycle Time
tWC
tAW
tCW
tAS
tWP
twr
tDW
tDH
tOW*
tWHZ*
35
30
30
0
25
0
20
0
5
-
-
-
-
-
-
-
-
-
55
50
50
0
45
0
25
0
5
-
-
-
-
-
-
-
-
-
70
60
60
0
55
0
30
0
5
-
-
-
-
-
-
-
-
-
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Address Valid to End of Write
Chip Enable to End of Write
Address Set-up Time
Write Pulse Width
Write Recovery Time
Data to Write Time Overlap
Data Hold from End of Write Time
Output Active from End of Write
Write to Output in High-Z
-
15
-
20
-
25
*These parameters are guaranteed by device characterization, but not production tested.
5
DCC-SR-041001-A
32Kx8 LP SRAM EM6132K800W Series
TIMING WAVEFORMS
READ CYCLE 1 (Address Controlled) (1,2)
tRC
Address
tAA
tOH
Dout
Previous Data Valid
Data Valid
READ CYCLE 2 (CE# and OE# Controlled) (1,3,4,5)
tRC
Address
tAA
CE#
OE#
tACE
tOH
tOHZ
tOE
tCHZ
tOLZ
tCLZ
Dout
Valid Data
High-Z
Notes :
1.WE# is high for read cycle.
2.Device is continuously selected OE# = low, CE# = low.
3.Address must be valid prior to or coincident with CE# = low,; otherwise tAA is the limiting parameter.
4.tCLZ, tOLZ, tCHZ and tOHZ are specified with CL = 5pF. Transition is measured ±500mV from steady state.
5.At any given temperature and voltage condition, tCHZ is less than tCLZ , tOHZ is less than tOLZ.
6
DCC-SR-041001-A
32Kx8 LP SRAM EM6132K800W Series
WRITE CYCLE 1 (WE# Controlled) (1,2,3,5,6)
tWC
Address
CE#
tAW
tCW
tWP
tAS
tWR
tOW
WE#
tWHZ
Dout
(4)
(4)
tDW
tDH
High-Z
Din
Valid Data
WRITE CYCLE 2 (CE# Controlled) (1,2,5,6)
tWC
Address
tAW
CE#
tAS
tWR
tCW
tWP
WE#
Dout
tWHZ
High-Z
tDW
tDH
High-Z
Din
Valid Data
Notes :
1.WE#, CE# must be high during all address transitions.
2.A write occurs during the overlap of a low CE#, low WE#.
3.During a WE# controlled write cycle with OE# low, tWP must be greater than tWHZ + tDW to allow the drivers to turn off and
data to be placed on the bus.
4.During this period, I/O pins are in the output state, and input signals must not be applied.
5.If the CE# low transition occurs simultaneously with or after WE# low transition, the outputs remain in a high impedance state.
6.tOW and tWHZ are specified with CL = 5pF. Transition is measured ±500mV from steady state.
7
DCC-SR-041001-A
32Kx8 LP SRAM EM6132K800W Series
DATA RETENTION CHARACTERISTICS
PARAMETER
VCC for Data
SYMBOL
VDR
TEST CONDITION
CE# V ≧ VCC - 0.2V
MIN.
2.0
TYP. MAX. UNIT
-
5.5
V
Retention
Data Retention
Current
Chip Disable to Data
Retention Time
Recovery Time
IDR
tCDR
tR
VCC = 1.5V
-L
-LL
-
-
0
1
0.5
-
50
20
-
µA
µA
ns
CE# V ≧ VCC - 0.2V
See Data Retention
Waveforms (below)
tRC*
ns
tRC* = Read Cycle Time
DATA RETENTION WAVEFORM
VDR ≧ 2.0V
Vcc(min.)
Vcc(min.)
tR
Vcc
tCDR
CE# ≧ Vcc-0.2V
VIH
VIH
CE#
8
DCC-SR-041001-A
32Kx8 LP SRAM EM6132K800W Series
PACKAGE OUTLINE DIMENSION
28 pin 600 mil PDIP Package Outline Dimension
28 pin 330 mil SOP Package Outline Dimension
9
DCC-SR-041001-A
32Kx8 LP SRAM EM6132K800W Series
28 pin 8mm x 13.4mm STSOP Package Outline Dimension
10
DCC-SR-041001-A
32Kx8 LP SRAM EM6132K800W Series
Product Number Information
EM
61
32K
8
0
0
W
S
A – 35
IF*
Version
SRAM
Family
Option
Speed:
35ns
61: Standard
Configuration: Option
55ns
70ns
8: x8
16: x16
Voltage:
V: 3V
W: 2.7V
~5.5V
T: 5V
Address Density
TEMP:
Blank: Normal
I: Industrial
EOREX
Manufactured
Memory
Package:
S: sTSOP
P: PDIP
Pb-Free PKG:
Blank: Normal
F: Pb-free
F: SOP
* Product number example
11
DCC-SR-041001-A
32Kx8 LP SRAM EM6132K800W Series
©COPYRIGHT 2004 EOREX CORPORATION
Printed in Canada
The information in this document is subject to change without notice.
EOREX makes no commitment to update or keep current the information contained in this document. No part of this document
may be copied or reproduced in any form or by any means without the prior written consent of EOREX.
EOREX subjects its products to normal quality control sampling techniques which are intended to provide an assurance of high
quality products suitable for usual commercial applications.
EOREX CORPORATION
http://www.eorex.com
sales@eorex.com
2F., No. 301-3, Guang-Ming 6th Rd., Chu-Pei City, Hsinchu County, Taiwan 302, ROC
TEL: +886-3-5585138
FAX: +886-3-5585139
12
DCC-SR-041001-A
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