B32674D3106K000 [EPCOS]
CAPACITOR, METALLIZED FILM, POLYPROPYLENE, 450V, 10uF, THROUGH HOLE MOUNT, RADIAL LEADED, ROHS COMPLIANT;型号: | B32674D3106K000 |
厂家: | EPCOS |
描述: | CAPACITOR, METALLIZED FILM, POLYPROPYLENE, 450V, 10uF, THROUGH HOLE MOUNT, RADIAL LEADED, ROHS COMPLIANT 电容器 |
文件: | 总42页 (文件大小:1337K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Film Capacitors
Metallized Polypropylene Film Capacitors (MKP)
Series/Type:
B32674 ... B32678
Date:
June 2018
© EPCOS AG 2018. Reproduction, publication and dissemination of this publication, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.
EPCOS AG is a TDK Group Company.
Metallized polypropylene film capacitors (MKP)
B32674 ... B32678
MKP DC link ꢀ high power series
Typical applications
Frequency converters
Industrial and high-end power supplies
Solar inverters
Climatic
Max. operating temperature: 105 °C (case)
Climatic category (IEC 60068-1:2013):
40/105/56
Construction
Dielectric: Polypropylene (MKP)
Plastic case (UL 94 V-0)
Epoxy resin sealing (UL 94 V-0)
Features
Capacitance value up to 270 μF
High CV product, compact
Good self-healing properties
Over-voltage capability
Low losses with high current capability
High reliability
Long useful life
AEC-Q200D compliant
Terminals
Parallel wire leads, lead-free tinned
2-pin, 4-pin and 12-pin versions
Standard lead lengths: 6 ꢀ1 mm
Marking
Manufacturer's logo and lot number,
date code, rated capacitance (coded),
capacitance tolerance (code letter),
rated DC voltage
Delivery mode
Bulk (untaped, lead length 6 ꢀ1 mm)
Please read Cautions and warnings and
Important notes at the end of this document.
Page 2 of 42
B32674 ... B32678
MKP DC link ꢀ high power series
Dimensional drawings
Dimensions in mm
Number of wires
2-pin
Lead spacing
0.4 Lead diameter d1 0.05 Type
27.5
37.5
37.5
37.5
52.5
52.5
52.5
0.8
1.0
1.2
1.2
1.2
1.2
1.2
B32674D
B32676T
B32676G
B32676T
B32678G
B32678T
B32678J
2-pin
4-pin
4-pin
4-pin
4-pin
12-pin
Dimensional drawings 2-pin versions
B32674D
Lead spacing
0.4:
27.5
0.8
Lead diameter d1:
(Dimensions in mm)
B32676T (low profile)
Lead spacing
0.4:
37.5
1.0
Lead diameter d1:
(Dimensions in mm)
Please read Cautions and warnings and
Important notes at the end of this document.
Page 3 of 42
B32674 ... B32678
MKP DC link ꢀ high power series
Dimensional drawings 4-pin versions
B32676G, B32678G
B32676G B32678G
0.4: 37.5 52.5
Lead spacing
Lead diameter d1:
1.2
1.2
(Dimensions in mm)
B32676T, B32678T (low profile)
B32676T B32678T
Lead spacing
Lead diameter d1:
0.4: 37.5
1.2
52.5
1.2
(Dimensions in mm)
Dimensional drawing 12-pin version
B32678J
Lead spacing
0.4:
52.5
1.2
Lead diameter d1:
(Dimensions in mm)
Please read Cautions and warnings and
Important notes at the end of this document.
Page 4 of 42
B32674 ... B32678
MKP DC link ꢀ high power series
Overview of available types
Lead spacing 27.5 mm
37.5 mm
B32676
9
Type
Page
VR (V DC)
CR (μF)
0.47
0.68
1.0
B32674
7
300
450
630
750
875
300
450
630
750
875
1.5
2.0
2.2
2.7
3.0
3.3
3.5
4.0
4.7
5.0
5.6
6.0
6.2
6.8
7.5
8.0
8.2
9.0
10
12
13
14
15
20
22
25
30
35
Please read Cautions and warnings and
Important notes at the end of this document.
Page 5 of 42
B32674 ... B32678
MKP DC link ꢀ high power series
Overview of available types
Lead spacing 52.5 mm
Type
Page
VR (V DC)
CR (μF)
7.0
9.0
13
B32678
11
300
450
630
750
875
15
20
22
24
25
28
30
35
38
40
45
47
60
65
80
85
100
120
180
270
Please read Cautions and warnings and
Important notes at the end of this document.
Page 6 of 42
B32674
MKP DC link ꢀ high power series
Ordering codes and packing units (lead spacing 27.5 mm)
1)
2)
3)
CR
Max. dimensions P1 Ordering code
IRMS,max ESRtyp ESLtyp tan δ tan δ
70 °C 70 °C
pcs./
MOQ
w × h × l
(composition see
below)
10 kHz 10 kHz
1 kHz 10 kHz
μF
mm
mm
A
mΩ nH
10-3 10-3
VR,85 ° = 300 V DC, Vop,70 ° = 450 V DC
C
C
2.2 11.0 × 19.0 × 31.5 ꢀ B32674D3225+000 5.0
3.3 12.5 × 21.5 × 31.5 ꢀ B32674D3335+000 7.0
4.7 14.0 × 24.5 × 31.5 ꢀ B32674D3475+000 8.5
5.0 15.0 × 24.5 × 31.5 ꢀ B32674D3505+000 9.0
6.8 18.0 × 27.5 × 31.5 ꢀ B32674D3685+000 11.5
8.0 16.0 × 32.0 × 31.5 ꢀ B32674D3805+000 12.5
8.2 18.0 × 33.0 × 31.5 ꢀ B32674D3825+000 13.0
10.0 21.0 × 31.0 × 31.5 ꢀ B32674D3106+000 14.5
12.0 22.0 × 36.5 × 31.5 ꢀ B32674D3126+000 17.0
18.1 16.0
12.2 19.0
8.9 21.0
8.4 21.0
6.3 24.0
5.6 27.0
5.5 27.0
4.6 27.0
4.0 31.0
0.7
0.7
0.7
0.7
0.7
0.7
0.7
0.8
0.8
4.1
4.1
4.2
4.2
4.4
4.5
4.5
4.6
4.9
1280
1120
1040
960
800
880
800
720
640
VR,85 ° = 450 V DC, Vop,70 ° = 630 V DC
C
C
1.5 11.0 × 19.0 × 31.5 ꢀ B32674D4155+000 4.5
2.2 12.5 × 21.5 × 31.5 ꢀ B32674D4225+000 6.0
3.3 15.0 × 24.5 × 31.5 ꢀ B32674D4335+000 8.0
4.7 18.0 × 27.5 × 31.5 ꢀ B32674D4475+000 10.5
5.0 16.0 × 32.0 × 31.5 ꢀ B32674D4505+000 11.0
5.6 18.0 × 33.0 × 31.5 ꢀ B32674D4565+000 12.0
6.0 21.0 × 31.0 × 31.5 ꢀ B32674D4605+000 13.0
6.8 22.0 × 36.5 × 31.5 ꢀ B32674D4685+000 14.5
7.5 22.0 × 36.5 × 31.5 ꢀ B32674D4755+000 15.0
22.1 16.0
14.9 19.0
10.3 22.0
7.5 24.0
7.1 28.0
6.3 29.0
5.9 28.0
5.4 29.0
5.0 32.0
0.6
0.6
0.6
0.6
0.7
0.7
0.7
0.7
0.7
3.3
3.3
3.4
3.5
3.6
3.6
3.6
3.7
3.8
1280
1120
960
800
880
800
720
640
640
VR,85 ° = 630 V DC, Vop,70 ° = 800 V DC
C
C
1.0 11.0 × 19.0 × 31.5 ꢀ B32674D6105+000 4.0
1.5 12.5 × 21.5 × 31.5 ꢀ B32674D6155+000 5.5
2.2 15.0 × 24.5 × 31.5 ꢀ B32674D6225+000 7.5
3.3 16.0 × 32.0 × 31.5 ꢀ B32674D6335+000 10.0
4.7 22.0 × 36.5 × 31.5 ꢀ B32674D6475+000 13.5
5.0 22.0 × 36.5 × 31.5 ꢀ B32674D6505+000 14.5
26.1 17.0
17.9 19.0
12.4 21.0
8.5 28.0
6.0 31.0
5.8 31.0
0.6
0.6
0.6
0.6
0.6
0.6
2.7
2.7
2.7
2.8
3.0
3.0
1280
1120
960
880
640
640
MOQ = Minimum Order Quantity, consisting of 4 packing units.
Intermediate capacitance values are available on request.
Composition of ordering code
+ = Capacitance tolerance code:
K = 10%
J = 5%
1) Capacitance value measured at 1 kHz
2) Max. ripple current IRMS at 70 °C at 10 kHz for a ΔT ≤20 °C when ΔESRtyp
≤ 5%
3) ESL value measured at resonance frequency (see specific graphs of Z versus frequency)
Please read Cautions and warnings and
Important notes at the end of this document.
Page 7 of 42
B32674
MKP DC link ꢀ high power series
Ordering codes and packing units (lead spacing 27.5 mm)
4)
5)
6)
CR
Max. dimensions P1 Ordering code
IRMS,max ESRtyp ESLtyp tan δ tan δ
70 °C 70 °C
pcs./
MOQ
w × h × l
(composition see
below)
10 kHz 10 kHz
1 kHz 10 kHz
μF
mm
mm
A
mΩ nH
10-3 10-3
VR,85 ° = 750 V DC, Vop,70 ° = 900 V DC
C
C
0.68 11.0 × 19.0 × 31.5 ꢀ B32674D1684+000 3.5
1.0 12.5 × 21.5 × 31.5 ꢀ B32674D1105+000 4.5
1.5 14.0 × 24.5 × 31.5 ꢀ B32674D1155+000 6.5
2.2 18.0 × 27.5 × 31.5 ꢀ B32674D1225+000 8.5
3.3 21.0 × 31.0 × 31.5 ꢀ B32674D1335+000 11.0
4.0 22.0 × 36.5 × 31.5 ꢀ B32674D1405+000 13.0
34.7 17.0
24.2 18.0
16.3 22.0
11.3 24.0
7.9 28.0
6.7 32.0
0.5
0.5
0.6
0.6
0.6
0.6
2.4
2.5
2.5
2.5
2.6
2.7
1280
1120
1040
800
720
640
VR,85 ° = 875 V DC, Vop,70 ° = 1050 V DC
C
C
0.47 11.0 × 19.0 × 31.5 ꢀ B32674D8474+000 3.0
0.68 11.0 × 21.0 × 31.5 ꢀ B32674D8684+000 4.0
1.0 13.5 × 23.0 × 31.5 ꢀ B32674D8105+000 5.0
1.5 18.0 × 27.5 × 31.5 ꢀ B32674D8155+000 7.5
2.2 18.0 × 33.0 × 31.5 ꢀ B32674D8225+000 9.5
3.0 22.0 × 36.5 × 31.5 ꢀ B32674D8305+000 12.0
45.2 16.0
31.5 19.0
22.2 20.0
14.7 23.0
10.3 29.0
7.8 31.0
0.5
0.5
0.5
0.5
0.5
0.5
2.2
2.2
2.2
2.2
2.3
2.4
1280
1280
1040
800
800
640
MOQ = Minimum Order Quantity, consisting of 4 packing units.
Intermediate capacitance values are available on request.
Composition of ordering code
+ = Capacitance tolerance code:
K = 10%
J = 5%
4) Capacitance value measured at 1 kHz
5) Max. ripple current IRMS at 70 °C at 10 kHz for a ΔT ≤20 °C when ΔESRtyp
≤ 5%
6) ESL value measured at resonance frequency (see specific graphs of Z versus frequency)
Please read Cautions and warnings and
Important notes at the end of this document.
Page 8 of 42
B32676
MKP DC link ꢀ high power series
Ordering codes and packing units (lead spacing 37.5 mm)
1)
2)
3)
CR Max. dimensions P1
Ordering code
(composition see
below)
IRMS,max ESRtyp ESLtyp tan δ tan δ
70 °C 70 °C
pcs./
MOQ
w × h × l
10 kHz 10 kHz
1 kHz 10 kHz
μF mm
mm
A
mΩ nH
10-3 10-3
VR,85 ° = 300 V DC, Vop,70 ° = 450 V DC
C
C
6.2 24.0 × 15.0 × 41.5 ꢀ
9.0 24.0 × 19.0 × 41.5 ꢀ
B32676T3625+000
B32676T3905+000 10.0
8.0
12.6 18.0
9.1 19.0
5.4 10.0
4.0 11.0
4.0 13.0
3.8 11.0
3.4 12.0
2.8 12.0
2.5 13.0
1.1
1.1
1.1
1.1
1.1
1.2
1.2
1.2
1.2
8.2
8.3
8.3
8.4
8.3
8.5
8.6
8.7
8.8
1040
780
640
440
280
440
440
400
180
15.0 20.0 × 39.5 × 42.0 10.2 B32676G3156+000 16.0
20.0 28.0 × 37.0 × 42.0 10.2 B32676G3206+000 20.0
20.0 43.0 × 22.0 × 41.5 20.3 B32676T3206K000 19.5
22.0 28.0 × 42.5 × 42.0 10.2 B32676G3226+000 21.5
25.0 28.0 × 42.5 × 42.0 10.2 B32676G3256+000 22.5
30.0 30.0 × 45.0 × 42.0 20.3 B32676G3306+000 26.0
35.0 33.0 × 48.0 × 42.0 20.3 B32676G3356+000 29.5
VR,85 ° = 450 V DC, Vop,70 ° = 630 V DC
C
C
4.0 24.0 × 15.0 × 41.5 ꢀ
4.7 24.0 × 19.0 × 41.5 ꢀ
B32676T4405+000
B32676T4475+000
7.0
8.0
15.5 19.0
13.2 18.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
6.6
6.6
6.7
6.7
6.6
6.8
6.9
7.1
1040
780
640
640
280
440
400
180
8.2 20.0 × 39.5 × 42.0 10.2 B32676G4825+000 13.5
10.0 20.0 × 39.5 × 42.0 10.2 B32676G4106+000 14.5
13.0 43.0 × 22.0 × 41.5 20.3 B32676T4136K000 17.5
15.0 28.0 × 42.5 × 42.0 10.2 B32676G4156+000 20.0
20.0 30.0 × 45.0 × 42.0 20.3 B32676G4206K000 24.0
25.0 33.0 × 48.0 × 42.0 20.3 B32676G4256K000 28.0
7.8
9.0
6.4 11.0
5.0 13.0
4.4 11.0
3.3 13.0
2.8 14.0
VR,85 ° = 630 V DC, Vop,70 ° = 800 V DC
C
C
2.7 24.0 × 15.0 × 41.5 ꢀ
3.5 24.0 × 19.0 × 41.5 ꢀ
B32676T6275+000
B32676T6355+000
7.0
8.0
17.7 20.0
14.1 19.0
7.4 10.0
6.6 12.0
6.1 11.0
5.7 13.0
5.1 11.0
4.4 12.0
3.7 14.0
3.5 14.0
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
5.1
5.1
5.2
5.2
5.2
5.1
5.2
5.3
5.3
5.4
1040
780
640
640
440
280
440
440
400
180
6.8 20.0 × 39.5 × 42.0 10.2 B32676G6685+000 13.5
7.5 20.0 × 39.5 × 42.0 10.2 B32676G6755+000 14.5
8.2 28.0 × 37.0 × 42.0 10.2 B32676G6825+000 16.0
9.0 43.0 × 22.0 × 41.5 20.3 B32676T6905K000 16.5
10.0 28.0 × 42.5 × 42.0 10.2 B32676G6106+000 18.5
12.0 28.0 × 42.5 × 42.0 10.2 B32676G6126+000 20.0
14.0 30.0 × 45.0 × 42.0 20.3 B32676G6146+000 23.0
15.0 33.0 × 48.0 × 42.0 20.3 B32676G6156+000 25.0
MOQ = Minimum Order Quantity, consisting of 4 packing units.
Intermediate capacitance values are available on request.
Composition of ordering code
+ = Capacitance tolerance code:
K = 10%
J = 5%
1) Capacitance value measured at 1 kHz
2) Max. ripple current IRMS at 70 °C at 10 kHz for a ΔT ≤20 °C when ΔESRtyp
≤ 5%
3) ESL value measured at resonance frequency (see specific graphs of Z versus frequency)
Please read Cautions and warnings and
Important notes at the end of this document.
Page 9 of 42
B32676
MKP DC link ꢀ high power series
Ordering codes and packing units (lead spacing 37.5 mm)
4)
5)
6)
CR Max. dimensions P1
Ordering code
(composition see
below)
IRMS,max ESRtyp ESLtyp tan δ tan δ
70 °C 70 °C
pcs./
MOQ
w × h × l
10 kHz 10 kHz
1 kHz 10 kHz
μF mm
mm
A
mΩ nH
10-3 10-3
VR,85 ° = 750 V DC, Vop,70 ° = 900 V DC
C
C
2.0 24.0 × 15.0 × 41.5 ꢀ
2.7 24.0 × 19.0 × 41.5 ꢀ
B32676T1205+000
B32676T1275+000
6.0
7.5
22.7 18.0
16.7 19.0
9.5 10.0
8.2 11.0
6.7 11.0
5.1 12.0
4.7 13.0
4.0 14.0
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
4.6
4.6
4.6
4.7
4.7
4.7
4.8
4.8
1040
780
640
640
440
440
400
180
4.7 20.0 × 39.5 × 42.0 10.2 B32676G1475+000 12.0
5.6 20.0 × 39.5 × 42.0 10.2 B32676G1565+000 13.0
6.8 28.0 × 37.0 × 42.0 10.2 B32676G1685+000 15.5
9.0 30.0 × 45.0 × 42.0 20.3 B32676G1905+000 19.5
10.0 30.0 × 45.0 × 42.0 20.3 B32676G1106+000 20.5
12.0 33.0 × 48.0 × 42.0 20.3 B32676G1126+000 23.0
VR,85 ° = 875 V DC, Vop,70 ° = 1050 V DC
C
C
1.5 24.0 × 15.0 × 41.5 ꢀ
2.0 24.0 × 19.0 × 41.5 ꢀ
B32676T8155+000
B32676T8205+000
5.5
7.0
26.2 18.0
19.6 19.0
0.7
0.7
0.7
0.7
0.7
0.7
0.7
0.7
4.1
4.1
4.1
4.1
4.1
4.2
4.2
4.3
1040
780
640
640
440
440
400
180
3.3 20.0 × 39.5 × 42.0 10.2 B32676G8335+000 10.5
4.0 20.0 × 39.5 × 42.0 10.2 B32676G8405+000 12.0
4.7 28.0 × 37.0 × 42.0 10.2 B32676G8475+000 13.5
6.8 28.0 × 42.5 × 42.0 10.2 B32676G8685+000 17.0
7.5 30.0 × 45.0 × 42.0 20.3 B32676G8755+000 19.0
10.0 33.0 × 48.0 × 42.0 20.3 B32676G8106K000 22.5
12.0
9.0
9.9 11.0
8.6 10.0
6.0 12.0
5.4 13.0
4.3 14.0
MOQ = Minimum Order Quantity, consisting of 4 packing units.
Intermediate capacitance values are available on request.
Composition of ordering code
+ = Capacitance tolerance code:
K = 10%
J = 5%
4) Capacitance value measured at 1 kHz
5) Max. ripple current IRMS at 70 °C at 10 kHz for a ΔT ≤20 °C when ΔESRtyp
≤ 5%
6) ESL value measured at resonance frequency (see specific graphs of Z versus frequency)
Please read Cautions and warnings and
Important notes at the end of this document.
Page 10 of 42
B32678
MKP DC link ꢀ high power series
Ordering codes and packing units (lead spacing 52.5 mm)
1)
2)
CR
Max. dimensions
w × h × l
P1
Ordering code
(composition see
below)
IRMS,max ESRtyp ESLtyp3) tan δ tan δ
pcs./
MOQ
70 °C 70 °C
10 kHz 10 kHz
1 kHz 10 kHz
10-3 10-3
μF
mm
mm
A
mΩ
nH
VR,85 ° = 300 V DC, Vop,70 ° = 450 V DC
C
C
30.0 43.0 × 24.0 × 57.5 20.3 B32678T3306K000 22.5 3.9
40.0 30.0 × 45.0 × 57.5 20.3 B32678G3406+000 28.0 3.0
47.0 35.0 × 50.0 × 57.5 20.3 B32678G3476+000 33.0 2.6
60.0 35.0 × 50.0 × 57.5 20.3 B32678G3606K000 37.0 2.1
80.0 45.0 × 57.0 × 57.5 20.3 B32678G3806+000 47.0 1.6
80.0 130.0 × 24.0 × 57.5 20.3 B32678J3806K000 51.0 1.4
100.0 60.0 × 45.0 × 57.5 20.3 B32678G3107+000 48.0 1.4
270.0 130.0 × 58.0 × 57.5 20.3 B32678J3277K000 108.0 0.5
13.0 1.5
12.0 1.5
13.0 1.5
15.0 1.6
18.0 1.6
4.0 1.5
19.0 1.6
6.0 1.6
11.8 560
12.3 280
12.5 108
12.9 108
13.5 140
11.7
13.5 200
13.8 40
80
VR,85 ° = 450 V DC, Vop,70 ° = 630 V DC
C
C
20.0 43.0 × 24.0 × 57.5 20.3 B32678T4206K000 20.0 4.9
30.0 35.0 × 50.0 × 57.5 20.3 B32678G4306+000 28.0 3.2
35.0 35.0 × 50.0 × 57.5 20.3 B32678G4356+000 31.5 2.8
40.0 35.0 × 50.0 × 57.5 20.3 B32678G4406K000 34.0 2.5
60.0 45.0 × 57.0 × 57.5 20.3 B32678G4606+000 45.0 1.8
60.0 130.0 × 24.0 × 57.5 20.3 B32678J4606K000 49.5 1.6
65.0 60.0 × 45.0 × 57.5 20.3 B32678G4656+000 48.0 1.6
180.0 130.0 × 58.0 × 57.5 20.3 B32678J4187K000 97.5 0.6
13.0 1.3
14.0 1.3
14.0 1.3
15.0 1.3
18.0 1.4
4.0 1.2
19.0 1.3
6.0 1.4
9.8 560
9.9 108
10.0 108
10.2 108
11.2 140
9.5
10.6 200
11.2 40
80
VR,85 ° = 630 V DC, Vop,70 ° = 800 V DC
C
C
13.0 43.0 × 24.0 × 57.5 20.3 B32678T6136K000 18.0 5.9
20.0 35.0 × 50.0 × 57.5 20.3 B32678G6206+000 26.5 4.0
25.0 35.0 × 50.0 × 57.5 20.3 B32678G6256+000 29.5 3.3
38.0 130.0 × 24.0 × 57.5 20.3 B32678J6386K000 43.5 2.1
40.0 45.0 × 57.0 × 57.5 20.3 B32678G6406+000 41.0 2.1
45.0 60.0 × 45.0 × 57.5 20.3 B32678G6456+000 43.0 1.9
120.0 130.0 × 58.0 × 57.5 20.3 B32678J6127K000 90.0 0.7
13.0 1.1
13.0 1.1
15.0 1.1
4.0 1.1
18.0 1.2
19.0 1.2
6.0 1.2
7.9 560
8.2 108
8.3 108
7.9
80
8.8 140
8.7 200
8.8
40
MOQ = Minimum Order Quantity, consisting of 4 packing units.
Intermediate capacitance values are available on request.
Composition of ordering code
+ = Capacitance tolerance code:
K = 10%
J = 5%
1) Capacitance value measured at 1 kHz
2) Max. ripple current IRMS at 70 °C at 10 kHz for a ΔT ≤20 °C when ΔESRtyp
≤ 5%
3) ESL value measured at resonance frequency (see specific graphs of Z versus frequency)
Please read Cautions and warnings and
Important notes at the end of this document.
Page 11 of 42
B32678
MKP DC link ꢀ high power series
Ordering codes and packing units (lead spacing 52.5 mm)
4)
5)
CR
Max. dimensions
w × h × l
P1
Ordering code
(composition see
below)
IRMS,max ESRtyp ESLtyp6) tan δ tan δ
pcs./
MOQ
70 °C 70 °C
10 kHz 10 kHz
1 kHz 10 kHz
10-3 10-3
μF
mm
mm
A
mΩ
nH
VR,85 ° = 750 V DC, Vop,70 ° = 900 V DC
C
C
9.0 43.0 × 24.0 × 57.5 20.3 B32678T1905K000 16.5 7.2
15.0 30.0 × 45.0 × 57.5 20.3 B32678G1156K000 23.0 4.5
20.0 35.0 × 50.0 × 57.5 20.3 B32678G1206K000 28.0 3.5
28.0 45.0 × 57.0 × 57.5 20.3 B32678G1286+000 37.5 2.5
30.0 60.0 × 45.0 × 57.5 20.3 B32678G1306+000 39.5 2.4
30.0 130.0 × 24.0 × 57.5 20.3 B32678J1306K000 40.5 2.3
85.0 130.0 × 58.0 × 57.5 20.3 B32678J1856K000 82.5 0.9
13.0 1.0
14.0 1.0
15.0 1.0
18.0 1.0
19.0 1.0
4.0 1.0
6.0 1.0
6.8 560
7.0 280
7.2 108
7.4 140
7.3 200
6.8
7.4
80
40
VR,85 ° = 875 V DC, Vop,70 ° = 1050 V DC
C
C
7.0 43.0 × 24.0 × 57.5 20.3 B32678T8705K000 15.5 8.2
15.0 35.0 × 50.0 × 57.5 20.3 B32678G8156K000 26.5 4.0
22.0 45.0 × 57.0 × 57.5 20.3 B32678G8226+000 35.0 2.9
22.0 130.0 × 24.0 × 57.5 20.3 B32678J8226K000 39.0 2.6
24.0 60.0 × 45.0 × 57.5 20.3 B32678G8246+000 38.0 2.6
65.0 130.0 × 58.0 × 57.5 20.3 B32678J8656K000 78.0 1.0
13.0 0.9
15.0 0.9
17.0 1.0
5.0 0.9
19.0 0.9
6.0 1.0
6.0 560
6.3 108
6.5 140
6.0
6.4 200
6.5 40
80
MOQ = Minimum Order Quantity, consisting of 4 packing units.
Intermediate capacitance values are available on request.
Composition of ordering code
+ = Capacitance tolerance code:
K = 10%
J = 5%
4) Capacitance value measured at 1 kHz
5) Max. ripple current IRMS at 70 °C at 10 kHz for a ΔT ≤20 °C when ΔESRtyp
≤ 5%
6) ESL value measured at resonance frequency (see specific graphs of Z versus frequency)
Please read Cautions and warnings and
Important notes at the end of this document.
Page 12 of 42
B32674 ... B32678
MKP DC link ꢀ high power series
Technical data
Reference standard: IEC 61071:2007 and AEC-Q200D. All data given at T = 20 °C, unless other-
wise specified.
+85 °C
Rated temperature TR
Max. operating temperature, Top,max
Upper category temperature Tmax
Lower category temperature Tmin
+105 °C
+105 °C
ꢀ40 °C
Operating temperature range (case)
Insulation resistance Rins
given as time constant
τ = CR ꢁ Rins, rel. humidity ≤ 65%
(minimum as-delivered values)
τ > 10000 s (after 1 min)
For VR ≥ 500 V measured at 500 V
For VR < 500 V measured at VR
DC voltage test between terminals (10 s) 1.5 ꢁ VR
Voltage test terminal to case (10 s)
2110 V AC, 50 Hz
IP (A) / C (μF)
1000 hours / 40 °C / 93% relative humidity with VR,DC
Capacitance change |ΔC/C| ≤ 5%
Dissipation factor change Δtan δ ≤ 0.002 (at 1 kHz)
Pulse Handling Capability (V/μs)
Biased humidity
Limit values after test
≥ 50% of minimum
Insulation resistance Rins
as-delivered values
Reliability:
VR (V DC)
Continuous operation voltage
Vop (V DC) at 70 °C
Continuous operation voltage
Failure rate λ
Service life tSL
1 fit (≤ 1 ꢁ 10-9/h) at 0.5 ꢁ VR, 40 °C
200 000 h at VR, 85 °C
For conversion to other operating conditions and
temperatures, refer to chapter "Quality, 2 Reliability".
300
450
300
450
630
450
630
800
630
750
900
750
875
1050
875
Vop (V DC) at 85 °C
For temperatures between
85 °C and 100 °C
1.2%/°C of Vop derating compared to Vop at 85 °C
Typical waveforms
Restrictions:
VR: Maximum operating peak voltage of either polarity but of a non-reversing waveform, for which
the capacitor has been designed for continuous operation.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 13 of 42
B32674 ... B32678
MKP DC link ꢀ high power series
ûAC ≤0.2 ꢁ VR
Vp, max
:
Overvoltage
Maximum duration within one day Observation
1.1 ꢁ VR
1.15 ꢁ VR
1.2 ꢁ VR
1.3 ꢁ VR
30% of on-load duration
System regulation
System regulation
System regulation
System regulation
30 min.
5 min.
1 min.
NOTE 1 An overvoltage equal to 1.5 ꢁ VR for 30 ms is permitted 1000 times during the life of the
capacitor.
The amplitudes of the overvoltages that may be tolerated without significant reduction in the life
time of the capacitor depend on their duration, the number of application and the capacitor
temperature.
In addition these values assume that the overvoltages may appear when the internal temperature
of the capacitor is less than 0 °C but within the temperature category.
NOTE 2 The average applied voltage must not be higher than the specified voltage.
Pulse handling capability
"dV/dt" represents the maximum permissible voltage change per unit of time for non-sinusoidal
voltages, expressed in V/μs.
Note:
The values of dV/dt and k0 provided below must not be exceeded in order to avoid damaging the
capacitor. These parameters are given for isolated pulses in such a way that the heat generated
by one pulse will be completely dissipated before applying the next pulse. For a train of pulses,
please refer to the curves of permissible AC voltage-current versus frequency.
dV/dt values
Lead spacing
Type
27.5 mm
B32674
37.5 mm
B32676
52.5 mm
B32678
VR (V DC)
dV/dt in V/μs
300 450 630 750 875 300 450 630 750 875 300 450 630 750 875
40 75 100 125 150 22 54 73 85 100 15 35 50 60 70
Please read Cautions and warnings and
Important notes at the end of this document.
Page 14 of 42
B32674
MKP DC link ꢀ high power series
Characteristics curves
Additional technical information can be found under "Design support" on www.epcos.com.
Impedance Z versus frequency f
ESR versus frequency f
(typical values)
(typical values)
Lead spacing 27.5 mm
Lead spacing 27.5 mm
300 V DC
300 V DC
Impedance Z versus frequency f
ESR versus frequency f
(typical values)
(typical values)
Lead spacing 27.5 mm
Lead spacing 27.5 mm
450 V DC
450 V DC
Please read Cautions and warnings and
Important notes at the end of this document.
Page 15 of 42
B32674
MKP DC link ꢀ high power series
Characteristics curves
Additional technical information can be found under "Design support" on www.epcos.com.
Impedance Z versus frequency f
ESR versus frequency f
(typical values)
(typical values)
Lead spacing 27.5 mm
Lead spacing 27.5 mm
630 V DC
630 V DC
Impedance Z versus frequency f
ESR versus frequency f
(typical values)
(typical values)
Lead spacing 27.5 mm
Lead spacing 27.5 mm
750 V DC
750 V DC
Please read Cautions and warnings and
Important notes at the end of this document.
Page 16 of 42
B32674
MKP DC link ꢀ high power series
Characteristics curves
Additional technical information can be found under "Design support" on www.epcos.com.
Impedance Z versus frequency f
ESR versus frequency f
(typical values)
(typical values)
Lead spacing 27.5 mm
Lead spacing 27.5 mm
875 V DC
875 V DC
Please read Cautions and warnings and
Important notes at the end of this document.
Page 17 of 42
B32676
MKP DC link ꢀ high power series
Characteristics curves
Additional technical information can be found under "Design support" on www.epcos.com.
Impedance Z versus frequency f
ESR versus frequency f
(typical values)
(typical values)
Lead spacing 37.5 mm
Lead spacing 37.5 mm
300 V DC
300 V DC
Impedance Z versus frequency f
ESR versus frequency f
(typical values)
(typical values)
Lead spacing 37.5 mm
Lead spacing 37.5 mm
450 V DC
450 V DC
Please read Cautions and warnings and
Important notes at the end of this document.
Page 18 of 42
B32676
MKP DC link ꢀ high power series
Characteristics curves
Additional technical information can be found under "Design support" on www.epcos.com.
Impedance Z versus frequency f
ESR versus frequency f
(typical values)
(typical values)
Lead spacing 37.5 mm
Lead spacing 37.5 mm
630 V DC
630 V DC
Impedance Z versus frequency f
ESR versus frequency f
(typical values)
(typical values)
Lead spacing 37.5 mm
Lead spacing 37.5 mm
750 V DC
750 V DC
Please read Cautions and warnings and
Important notes at the end of this document.
Page 19 of 42
B32676
MKP DC link ꢀ high power series
Characteristics curves
Additional technical information can be found under "Design support" on www.epcos.com.
Impedance Z versus frequency f
ESR versus frequency f
(typical values)
(typical values)
Lead spacing 37.5 mm
Lead spacing 37.5 mm
875 V DC
875 V DC
Please read Cautions and warnings and
Important notes at the end of this document.
Page 20 of 42
B32678
MKP DC link ꢀ high power series
Characteristics curves
Additional technical information can be found under "Design support" on www.epcos.com.
Impedance Z versus frequency f
ESR versus frequency f
(typical values)
(typical values)
Lead spacing 52.5 mm
Lead spacing 52.5 mm
300 V DC
300 V DC
Impedance Z versus frequency f
ESR versus frequency f
(typical values)
(typical values)
Lead spacing 52.5 mm
Lead spacing 52.5 mm
450 V DC
450 V DC
Please read Cautions and warnings and
Important notes at the end of this document.
Page 21 of 42
B32678
MKP DC link ꢀ high power series
Characteristics curves
Additional technical information can be found under "Design support" on www.epcos.com.
Impedance Z versus frequency f
ESR versus frequency f
(typical values)
(typical values)
Lead spacing 52.5 mm
Lead spacing 52.5 mm
630 V DC
630 V DC
Impedance Z versus frequency f
ESR versus frequency f
(typical values)
(typical values)
Lead spacing 52.5 mm
Lead spacing 52.5 mm
750 V DC
750 V DC
Please read Cautions and warnings and
Important notes at the end of this document.
Page 22 of 42
B32678
MKP DC link ꢀ high power series
Characteristics curves
Additional technical information can be found under "Design support" on www.epcos.com.
Impedance Z versus frequency f
ESR versus frequency f
(typical values)
(typical values)
Lead spacing 52.5 mm
Lead spacing 52.5 mm
875 V DC
875 V DC
Impedance Z versus frequency f
ESR versus frequency f
(typical values)
(typical values)
Lead spacing 52.5 mm (12 pins)
Lead spacing 52.5 mm (12 pins)
300 V DC, 450 V DC, 630 V DC,
750 V DC, 875 V DC
300 V DC, 450 V DC, 630 V DC,
750 V DC, 875 V DC
Please read Cautions and warnings and
Important notes at the end of this document.
Page 23 of 42
B32674
MKP DC link ꢀ high power series
Characteristics curves
Permissible current IRMS versus frequency f at 70 °C
Lead spacing 27.5 mm
B32674D*
Please read Cautions and warnings and
Important notes at the end of this document.
Page 24 of 42
B32676
MKP DC link ꢀ high power series
Characteristics curves
Permissible current IRMS versus frequency f at 70 °C
Lead spacing 37.5 mm
B32676G/T*
Please read Cautions and warnings and
Important notes at the end of this document.
Page 25 of 42
B32678
MKP DC link ꢀ high power series
Characteristics curves
Permissible current IRMS versus frequency f at 70 °C
Lead spacing 52.5 mm
B32678G/T*
B32678J*
Please read Cautions and warnings and
Important notes at the end of this document.
Page 26 of 42
B32674 ... B32678
MKP DC link ꢀ high power series
Curves characteristics (IRMS derating versus temperature)
Maximum IRMS current as function of the ambient temperature: IRMS (TA) = Factor × IRMS (70 °C)
Please read Cautions and warnings and
Important notes at the end of this document.
Page 27 of 42
B32674 ... B32678
MKP DC link ꢀ high power series
Heat transference for self heating calculation
Box dimensions
Equivalent heat
coefficient
w (mm) h (mm) l (mm) G (mW/°C)
11.0
11.0
12.5
13.5
14.0
15.0
16.0
18.0
18.0
19.0
20.0
21.0
22.0
19.0
21.0
21.5
23.0
24.5
24.5
32.0
27.5
33.0
30.0
11.0
31.0
36.5
31.5
31.5
31.5
31.5
31.5
31.5
31.5
31.5
31.5
31.5
31.5
31.5
31.5
25
28
30
32
35
36
45
44
48
48
65
51
58
Figure 1 (2-pin, 4-pin)
12.0
14.0
16.0
18.0
20.0
24.0
24.0
28.0
28.0
30.0
33.0
43.0
22.0
25.0
28.5
32.5
39.5
19.0
15.0
37.0
42.5
45.0
48.0
22.0
41.5
41.5
41.5
41.5
42.0
41.5
41.5
42.0
42.0
42.0
42.0
41.5
70
43
50
59
72
50
44
83
90
Figure 2 (12-pin)
100
110
80
30.0
35.0
43.0
45.0
60.0
45.0
50.0
24.0
57.0
45.0
24.0
58.0
57.5
57.5
57.5
57.5
57.5
57.5
57.5
125
145
103
185
192
200
300
130.0
130.0
The equivalent heat coefficient "G (mW/ºC)" is given for measuring the temperature on the lateral
surface of the plastic box as figure1 shows. By using a thermocouple and avoiding effect of radia-
tion and convection the temperature measured during operation conditions should be a result of
the dissipated power divided by the equivalent heat coefficient.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 28 of 42
B32674 ... B32678
MKP DC link ꢀ high power series
Self Heating by power dissipation and equivalent heat coefficient
The IRMS and consequently the power dissipation must be limited during operation in order to not
exceed the maximum limit of ΔT allowed for this series. ΔTmax given for this series is equal or low-
er than 20 °C at rated temperature (70 °C), for higher ambient temperatures ΔTmax (T) will have
the same derating factor than IRMS versus temperature and then an equivalent derating as per:
ΔTmax (T) = (Factor)2 × ΔT (70 °C).
For any particular IRMS the ΔT may be calculated by:
ΔT (°C) = Pdis (mW) / G(mW/°C).
Where ΔT (°C) is the difference between the temperature measured on the box (see figure 1) and
the ambient temperature when capacitor is working during normal operation;
ΔT (°C) = Top (°C) ꢀ TA (°C).
It represents the increasing of temperature provoked by the IRMS during operation.
G (mW/°C) is the equivalent heat coefficient described above and Pdis (mW) is the dissipated
dis (mW) = ESRtyp (mΩ) × IRMS2 (ARMS).
power defined by:
P
Example for thermal calculation:
We will take as reference B32678G8156K (15 μF/875 V) type for thermal calculation.
Considering the following load and capacitor characteristics:
IRMS: 15 ARMS at 20 kHz
TA: 85 ºC
35 × 50 × 57.5 box
G (mW/ºC): 145
Then we have to find the ESRtyp at 20 kHz what is approximately 4.0 mΩ.
So according to
Pdis (mW) = ESRtyp (mΩ) × IRMS 2 (ARMS
)
we have the following:
And as per
Pdis (mW) = 4.0 mΩ ×15 ARMS2 = 900 mW.
ΔT (°C) = Pdis (mW) / G (mW/°C)
we have the following:
What is below of the
ΔT (°C) = 900 (mW) / 145 (mW/°C) = 6.2 °C.
ΔTmax (85 °C) = (Factor)2 × ΔT (70 °C) = (0.7)2 × 20 °C = 9.8 °C.
On the other hand we may confirm that max IRMS at 20 kHz at 70 °C = 26.5 ARMS
.
And then max IRMS for 85 °C of ambient temperature is defined as follows:
I
RMS (85 °C) = Factor × IRMS (70 °C) = 0.7 × 26.5 ARMS = 18.55 ARMS.
What confirms once again that IRMS (15 ARMS at 20 kHz at 85 °C) is below the max specified for
such frequency and ambient temperature.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 29 of 42
B32674 ... B32678
MKP DC link ꢀ high power series
Life time expectancy - typical curve
B3267*3/4/6/1/8 (300 V DC / 450 V DC / 630 V DC / 750 V DC / 875 V DC)
Note: Confidence level of 98%
Please read Cautions and warnings and
Important notes at the end of this document.
Page 30 of 42
B32674 ... B32678
MKP DC link ꢀ high power series
Testing and Standards
Test
Reference
Conditions of test
Performance
requirements
Electrical
parameters
(Routine
test)
IEC61071:2007
Voltage between terminals,
1.5 VR, during 10 s
Insulation resistance, Rins at VR if
VR < 500 V or 500 V if VR ≥ 500 V
Capacitance, C at 1 kHz
(room temperature)
Within specified limits
Dissipation factor, tan δ at 1/10 kHz
(room temperature)
Robustness IEC
Tensile strength (test Ua1)
Capacitance and tan δ
within specified limits
of termina-
tions
60068-2-21:2006
Wire diameter
0.5 < d1 ≤ 0.8 mm
0.8 < d1 ≤ 1.25
mm
Tensile force
10 N
20 N
(Type test)
IEC
Solder bath temperature at 260 5 °C,
ꢂΔC/C0ꢂ ≤ 2%
Resistance
to soldering
heat
60068-2-20:2008, immersion for 10 seconds
test Tb,
ꢂΔ tan δꢂ ≤ 0.002
method 1A
(Type test)
ꢂΔC/C0ꢂ ≤ 2%
ꢂΔ tan δꢂ ≤ 0.002
Rins ≥ 50% of initial limit
Rapid
IEC
TA = lower category temperature
TB = upper category temperature
Five cycles, duration t = 30 min.
change of
temperature
(Type test)
60384-16:2005
Vibration
(Type test)
IEC
Test FC: vibration sinusoidal
Displacement: 0.75 mm
Accleration: 98 m/s2
No visible damage
60384-16:2005
Frequency: 10 Hz ... 500 Hz
Test duration: 3 orthogonal axes,
2 hours each axe
No visible damage
ꢂΔC/C0ꢂ ≤ 2%
Bump
(Type test)
IEC
Test Eb: Total 4000 bumps with
390 m/s2 mounted on PCB
60384-16:2005
ꢂΔ tan δꢂ ≤ 0.002
Rins ≥ 50% of initial limit
No visible damage
ꢂΔC/C0ꢂ ≤ 3%
ꢂΔ tan δꢂ ≤ 0.001
Rins ≥ 50% of initial limit
Duration: 6 ms
Climatic
sequence
(Type test)
IEC
Dry heat Tb / 16 h
60384-16:2005
Damp heat cyclic, 1st cycle
+55 °C / 24 h / 95% ... 100% RH
Cold Ta / 2 h
Damp heat cyclic, 5 cycles
+55 °C / 24 h / 95% ... 100% RH
Please read Cautions and warnings and
Important notes at the end of this document.
Page 31 of 42
B32674 ... B32678
MKP DC link ꢀ high power series
Test
Reference
Conditions of test
Performance
requirements
Test Ca
40 °C / 93% RH / 56 days
No visible damage
ꢂΔC/C0ꢂ ≤ 5%
Damp heat, IEC
steady state 60384-16:2005
(Type test)
ꢂΔ tan δꢂ ≤ 0.005
Rins ≥ 50% of initial limit
No visible damage
ꢂΔC/C0ꢂ ≤ 3% at 1 kHz
ꢂΔ tan δꢂ ≤ 0.015 at
10 kHz
Endurance
(Type test)
70 °C / 1.4 VR / 250 hours or
Top / 1.4 Vop / 250 hours
+ 1000 discharges at 1.4 IR
+70 °C / 1.4 VR / 250 hours or
Top / 1.4 Vop / 250 hours
IEC61071:2007
Endurance
(Type test)
70 °C / 1.25 VR / 1000 hours or
85 °C / 1.25 Vop / 1000 hours or
100 °C / 1.25 Vop / 1000 hours
No visible damage
ꢂΔC/C0ꢂ ≤ 5% at 1 kHz
ꢂΔ tan δꢂ ≤ 0.005
IEC
60384-16:2005
Rins ≥ 50% of initial limit
Mounting guidelines
1
Soldering
1.1
Solderability of leads
The solderability of terminal leads is tested to IEC 60068-2-20, test Ta, method 1.
Before a solderability test is carried out, terminals are subjected to accelerated ageing (to
IEC 60068-2-2, test Ba: 4 h exposure to dry heat at 155 °C). Since the ageing temperature is far
higher than the upper category temperature of the capacitors, the terminal wires should be cut off
from the capacitor before the ageing procedure to prevent the solderability being impaired by the
products of any capacitor decomposition that might occur.
Solder bath temperature
Soldering time
235 5 °C
2.0 0.5 s
Immersion depth
2.0 +0/ꢀ0.5 mm from capacitor body or seating plane
Evaluation criteria:
Wetting of wire surface by new solder ≥90%,
free-flowing solder
Visual inspection
Please read Cautions and warnings and
Important notes at the end of this document.
Page 32 of 42
B32674 ... B32678
MKP DC link ꢀ high power series
1.2
Resistance to soldering heat
Resistance to soldering heat is tested to IEC 60068-2-20, test Tb, method 1.
Conditions:
Series
Solder bath temperature Soldering time
MKT boxed (except 2.5 × 6.5 × 7.2 mm) 260 5 °C
coated
10 1 s
uncoated (lead spacing >10 mm)
MFP
MKP (lead spacing >7.5 mm)
MKT boxed (case 2.5 × 6.5 × 7.2 mm)
5 1 s
(lead spacing ≤7.5 mm)
uncoated (lead spacing ≤10 mm)
insulated (B32559)
MKP
MKT
<4 s
recommended soldering
profile for MKT uncoated
(lead spacing ≤ 10 mm) and
insulated (B32559)
Immersion depth
Shield
2.0 +0/ꢀ0.5 mm from capacitor body or seating plane
Heat-absorbing board, (1.5 0.5) mm thick, between
capacitor body and liquid solder
Evaluation criteria:
Visual inspection
No visible damage
2% for MKT/MKP/MFP
5% for EMI suppression capacitors
As specified in sectional specification
ΔC/C0
tan δ
Please read Cautions and warnings and
Important notes at the end of this document.
Page 33 of 42
B32674 ... B32678
MKP DC link ꢀ high power series
1.3
General notes on soldering
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature Tmax. Long exposure to temperatures above this type-related temperature limit
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
EPCOS recommendations
As a reference, the recommended wave soldering profile for our film capacitors is as follows:
Please read Cautions and warnings and
Important notes at the end of this document.
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Body temperature should follow the description below:
MKP capacitor
During pre-heating: Tp ≤110 °C
During soldering: Ts ≤120 °C, ts ≤45 s
MKT capacitor
During pre-heating: Tp ≤125 °C
During soldering: Ts ≤160 °C, ts ≤45 s
When SMD components are used together with leaded ones, the film capacitors should not pass
into the SMD adhesive curing oven. The leaded components should be assembled after the SMD
curing step.
Leaded film capacitors are not suitable for reflow soldering.
In order to ensure proper conditions for manual or selective soldering, the body temperature of
the capacitor (Ts) must be ≤120 °C.
One recommended condition for manual soldering is that the tip of the soldering iron should
be <360 °C and the soldering contact time should be no longer than 3 seconds.
For uncoated MKT capacitors with lead spacings ≤10 mm (B32560/B32561) the following mea-
sures are recommended:
pre-heating to not more than 110 °C in the preheater phase
rapid cooling after soldering
Please refer to EPCOS Film Capacitor Data Book in case more details are needed.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 35 of 42
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Cautions and warnings
Do not exceed the upper category temperature (UCT).
Do not apply any mechanical stress to the capacitor terminals.
Avoid any compressive, tensile or flexural stress.
Do not move the capacitor after it has been soldered to the PC board.
Do not pick up the PC board by the soldered capacitor.
Do not place the capacitor on a PC board whose PTH hole spacing differs from the specified
lead spacing.
Do not exceed the specified time or temperature limits during soldering.
Avoid external energy inputs, such as fire or electricity.
Avoid overload of the capacitors.
Consult us if application is with severe temperature and humidity condition.
There are no serviceable or repairable parts inside the capacitor. Opening the capacitor or
any attempts to open or repair the capacitor will void the warranty and liability of EPCOS.
Please note that the standards referred to in this publication may have been revised in the
meantime.
The table below summarizes the safety instructions that must always be observed. A detailed de-
scription can be found in the relevant sections of the chapters "General technical information" and
"Mounting guidelines".
Topic
Safety information
Reference chapter
"General technical
information"
Storage
Make sure that capacitors are stored within the specified 4.5
conditions
Flammability
range of time, temperature and humidity conditions.
Avoid external energy, such as fire or electricity (passive 5.3
"Storage conditions"
flammability), avoid overload of the capacitors (active
flammability) and consider the flammability of materials.
"Flammability"
Resistance to Do not exceed the tested ability to withstand vibration.
5.2
vibration
The capacitors are tested to IEC 60068-2-6:2007.
EPCOS offers film capacitors specially designed for
operation under more severe vibration regimes such as
those found in automotive applications. Consult our
catalog "Film Capacitors for Automotive Electronics".
"Resistance to
vibration"
Topic
Safety information
Reference chapter
"Mounting guidelines"
1 "Soldering"
Soldering
Cleaning
Do not exceed the specified time or temperature limits
during soldering.
Use only suitable solvents for cleaning capacitors.
2 "Cleaning"
Please read Cautions and warnings and
Important notes at the end of this document.
Page 36 of 42
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MKP DC link ꢀ high power series
Topic
Safety information
Reference chapter
"Mounting guidelines"
3 "Embedding of
Embedding of When embedding finished circuit assemblies in plastic
capacitors in
finished
resins, chemical and thermal influences must be taken capacitors in finished
into account.
assemblies"
assemblies
Caution: Consult us first, if you also wish to embed other
uncoated component types!
Display of ordering codes for EPCOS products
The ordering code for one and the same product can be represented differently in data sheets,
data books, other publications and the website of EPCOS, or in order-related documents such as
shipping notes, order confirmations and product labels. The varying representations of the or-
dering codes are due to different processes employed and do not affect the specifications
of the respective products. Detailed information can be found on the Internet under
www.epcos.com/orderingcodes.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 37 of 42
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Symbols and terms
Symbol
α
English
German
Heat transfer coefficient
Wärmeübergangszahl
αC
Temperature coefficient of capacitance Temperaturkoeffizient der Kapazität
A
Capacitor surface area
Kondensatoroberfläche
Feuchtekoeffizient der Kapazität
Kapazität
βC
C
Humidity coefficient of capacitance
Capacitance
CR
Rated capacitance
Nennkapazität
ΔC
ΔC/C
Absolute capacitance change
Relative capacitance change (relative
deviation of actual value)
Absolute Kapazitätsänderung
Relative Kapazitätsänderung (relative
Abweichung vom Ist-Wert)
ΔC/CR
Capacitance tolerance (relative deviation Kapazitätstoleranz (relative Abweichung
from rated capacitance)
Time differential
vom Nennwert)
dt
Differentielle Zeit
Δt
Time interval
Zeitintervall
ΔT
Absolute temperature change
(self-heating)
Absolute Temperaturänderung
(Selbsterwärmung)
Δtan δ
ΔV
Absolute change of dissipation factor
Absolute voltage change
Absolute Änderung des Verlustfaktors
Absolute Spannungsänderung
dV/dt
Time differential of voltage function (rate Differentielle Spannungsänderung
of voltage rise)
(Spannungsflankensteilheit)
Spannungsänderung pro Zeitintervall
Aktivierungsenergie zur Diffusion
Eigeninduktivität
ΔV/Δt
E
Voltage change per time interval
Activation energy for diffusion
Self-inductance
ESL
ESR
f
Equivalent series resistance
Frequency
Ersatz-Serienwiderstand
Frequenz
f1
Frequency limit for reducing permissible Grenzfrequenz für thermisch bedingte
AC voltage due to thermal limits
Reduzierung der zulässigen
Wechselspannung
f2
Frequency limit for reducing permissible Grenzfrequenz für strombedingte
AC voltage due to current limit
Reduzierung der zulässigen
Wechselspannung
fr
Resonant frequency
Resonanzfrequenz
FD
Thermal acceleration factor for diffusion Therm. Beschleunigungsfaktor zur
Diffusion
FT
i
Derating factor
Deratingfaktor
Current (peak)
Stromspitze
IC
Category current (max. continuous
current)
Kategoriestrom (max. Dauerstrom)
Please read Cautions and warnings and
Important notes at the end of this document.
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Symbol
IRMS
English
German
(Sinusoidal) alternating current,
root-mean-square value
Capacitance drift
(Sinusförmiger) Wechselstrom
iz
Inkonstanz der Kapazität
Impulskennwert
k0
LS
λ
Pulse characteristic
Series inductance
Serieninduktivität
Failure rate
Ausfallrate
λ0
Constant failure rate during useful
service life
Konstante Ausfallrate in der
Nutzungsphase
λtest
Pdiss
Pgen
Q
Failure rate, determined by tests
Dissipated power
Experimentell ermittelte Ausfallrate
Abgegebene Verlustleistung
Erzeugte Verlustleistung
Wärmeenergie
Generated power
Heat energy
ρ
Density of water vapor in air
Dichte von Wasserdampf in Luft
R
Universal molar constant for gases
Ohmic resistance of discharge circuit
Allg. Molarkonstante für Gas
Ohmscher Widerstand des
Entladekreises
R
Ri
Internal resistance
Insulation resistance
Parallel resistance
Series resistance
severity (humidity test)
Time
Innenwiderstand
Rins
RP
RS
S
Isolationswiderstand
Parallelwiderstand
Serienwiderstand
Schärfegrad (Feuchtetest)
Zeit
t
T
Temperature
Temperatur
τ
Time constant
Zeitkonstante
tan δ
tan δD
Dissipation factor
Dielectric component of dissipation
factor
Verlustfaktor
Dielektrischer Anteil des Verlustfaktors
tan δP
tan δS
TA
Parallel component of dissipation factor Parallelanteil des Verlfustfaktors
Series component of dissipation factor Serienanteil des Verlustfaktors
Temperature of the air surrounding the Temperatur der Luft, die das Bauteil
component
umgibt
Tmax
Tmin
tOL
Upper category temperature
Lower category temperature
Obere Kategorietemperatur
Untere Kategorietemperatur
Operating life at operating temperature Betriebszeit bei Betriebstemperatur und
and voltage
-spannung
Top
TR
Operating temperature, TA + ΔT
Rated temperature
Beriebstemperatur, TA + ΔT
Nenntemperatur
Tref
tSL
Reference temperature
Reference service life
Referenztemperatur
Referenz-Lebensdauer
Please read Cautions and warnings and
Important notes at the end of this document.
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MKP DC link ꢀ high power series
Symbol
VAC
English
German
AC voltage
Wechselspannung
VC
Category voltage
Category AC voltage
Kategoriespannung
(Sinusförmige)
VC,RMS
Kategorie-Wechselspannung
Teilentlade-Einsatzspannung
Ladespannung
VCD
Vch
VDC
VFB
Vi
Corona-discharge onset voltage
Charging voltage
DC voltage
Gleichspannung
Fly-back capacitor voltage
Input voltage
Spannung (Flyback)
Eingangsspannung
Ausgangssspannung
Betriebsspannung
Vo
Output voltage
Vop
Vp
Operating voltage
Peak pulse voltage
Peak-to-peak voltage Impedance
Rated voltage
Impuls-Spitzenspannung
Spannungshub
Vpp
VR
Nennspannung
Amplitude of rated AC voltage
Amplitude der Nenn-Wechselspannung
R
VRMS
(Sinusoidal) alternating voltage,
root-mean-square value
S-correction voltage
(Sinusförmige) Wechselspannung
VSC
Vsn
Spannung bei Anwendung "S-correction"
Spannung bei Anwendung
"Beschaltung"
Snubber capacitor voltage
Z
Impedance
Scheinwiderstand
Lead spacing
Rastermaß
Please read Cautions and warnings and
Important notes at the end of this document.
Page 40 of 42
Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical re-
quirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application.
As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar
with them than the customers themselves. For these reasons, it is always ultimately incum-
bent on the customer to check and decide whether an EPCOS product with the properties de-
scribed in the product specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or
failure before the end of their usual service life cannot be completely ruled out in the
current state of the art, even if they are operated as specified. In customer applications
requiring a very high level of operational safety and especially in customer applications in
which the malfunction or failure of an electronic component could endanger human life or
health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by
means of suitable design of the customer application or other action taken by the customer
(e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by
third parties in the event of malfunction or failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as hazardous). Useful information on this will be found in our Ma-
terial Data Sheets on the Internet (www.epcos.com/material). Should you have any more de-
tailed questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order. We also
reserve the right to discontinue production and delivery of products. Consequently, we
cannot guarantee that all products named in this publication will always be available. The
aforementioned does not apply in the case of individual agreements deviating from the fore-
going for customer-specific products.
6. Unless otherwise agreed in individual contracts, all orders are subject to the current ver-
sion of the "General Terms of Delivery for Products and Services in the Electrical In-
dustry" published by the German Electrical and Electronics Industry Association
(ZVEI).
Page 41 of 42
Important notes
7. Our manufacturing sites serving the automotive business apply the IATF 16949
standard. The IATF certifications confirm our compliance with requirements regarding the
quality management system in the automotive industry. Referring to customer requirements
and customer specific requirements (“CSR”) TDK always has and will continue to have the
policy of respecting individual agreements. Even if IATF 16949 may appear to support the
acceptance of unilateral requirements, we hereby like to emphasize that only requirements
mutually agreed upon can and will be implemented in our Quality Management System.
For clarification purposes we like to point out that obligations from IATF 16949 shall only
become legally binding if individually agreed upon.
8. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP,
CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD,
MKK, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine,
PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV,
ThermoFuse, WindCap are trademarks registered or pending in Europe and in other coun-
tries. Further information will be found on the Internet at www.epcos.com/trademarks.
Release 2018-06
Page 42 of 42
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