B37627K9681K060 [EPCOS]
CAPACITOR, CERAMIC, MULTILAYER, 16V, 0.00068uF, SURFACE MOUNT, 0402, CHIP;
| 型号： | B37627K9681K060 |
| 厂家： | 
EPCOS |
| 描述： | CAPACITOR, CERAMIC, MULTILAYER, 16V, 0.00068uF, SURFACE MOUNT, 0402, CHIP PC 电容器 |
| 文件： | 总7页 (文件大小：164K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Multilayer Ceramic Capacitor
HC1 - Chip / Size 0402
HC1 / 0402 / 16V
B37627K9******
Preleminary Data Sheet
(parameters may be changed if necessary)
0402 High Cap Class 1 Capacitor
Todays electronic devices need more and more capacitors of small dimensions but high cap values of
class 1 characteristic (based on non-ferroelectric materials)
EPCOS HC1 capacitors provide high cap values in small chip sizes due to their special ceramic
material with a very high dielectric constant (ε) which is more than 5 times higher than the ε of the
conventional C0G – material.
The electrical behaviour of these capacitors are very close to that of the C0G-material, except for the
Temperature coefficient of capacitance (TCC) which is higher but does not exceed ± 4% between –
25°C and +85°C.
Features
• High capacitance values in class 1 dielectric
• No ageing effects
• No voltage dependence
• No piezoelectric effect
• Nearly linear temperature coefficient of capacitance (TCC)
• Low dielectric absorption
• Suitable for Pb-free soldering processes
Applications
• Mobile phones
• Portable handheld products (e.g. PDA)
• Notebook
• Bluetooth applications
• Remote keyless entry systems
• ADSL – applications
• USB Hub controllers
• Set top boxes
ISSUE DATE
28.03.02
ISSUE
b
PUBLISHER
EPCOS AG
PAGE
1/7
Multilayer Ceramic Capacitor
HC1 - Chip / Size 0402
HC1 / 0402 / 16V
B37627K9******
Preleminary Data Sheet
(parameters may be changed if necessary)
Ordering Code System
-
-
B37627
K 9 271 J 0 60
Type and Size:
HC1 / 0402
Class 1 Capacitor
Metallization Type:
K = Ag/Ni/Sn
Rated Voltage:
9 = 16V
Rated Capacitance:
271 = 27 x 101pF
471 = 47 x 101pF
102 = 10 x 102pF
Capacitance Tolerance:
J = ±5% K = ±10%
Internal code
Packaging code:
60 = cardboard tape, 180mm reel
Part Dimensions
l
l = 1,0 ± 0,1
b = 0,5 ± 0,05
s = 0,5 ± 0,05
k = 0,1 – 0,3
b
Dimensions and tolerances in accordance with
CECC 32101-801
s
k
ISSUE DATE
28.03.02
ISSUE
b
PUBLISHER
EPCOS AG
PAGE
2/7
Multilayer Ceramic Capacitor
HC1 - Chip / Size 0402
HC1 / 0402 / 16V
B37627K9******
Preleminary Data Sheet
(parameters may be changed if necessary)
Electrical Data
Capacitance Test Conditions
Test frequency:
1.0 MHz ± 0,2 MHz
1.0 V ± 0.2 V
Test voltage:
Dissipation factor tan δ (limit value):
Insulation Resistance:
Capacitance Change vs. Temperature
Operating Temperature Range:
Ageing
< 1.0 x 10-3
> 105 MΩ (at 25°C)
∆C/C25 < ± 4% between –25°C and +85°C
-25°C ... +85°C
none
Voltage Dependence
none
Capacitance Range:
270pF ... 1nF (Serie E12)
Specifications and Test Methods
Item
Specification
Test Method
Dielectric Strength
No defects or abnormalties 250% of the rated voltage is applied between the
terminatios for 1 to 5 seconds, provided the
charge/discharge current is less than 50mA.
Dry heat test
100% of the rate voltage is applied for
1000h +48/-0h at the maximum operating
temperatue ±3°C. The charge/discharge current is
less than 50mA.
∆C/C < 1%
tan δ < 1,5*10-3
IR
> 104 MΩ
Solderability
Solder tests according IEC 68-2-58:
Wettability Test: 215°C ± 3°C / 3 sec ± 0,3sec (wetting of soldering area > 95%)
Leaching Test: 260°C ± 5°C / 10sec ± 1sec (no leaching of contacts)
ISSUE DATE
28.03.02
ISSUE
b
PUBLISHER
EPCOS AG
PAGE
3/7
Multilayer Ceramic Capacitor
HC1 - Chip / Size 0402
HC1 / 0402 / 16V
B37627K9******
Preliminary Data Sheet
(parameters may be changed if necessary)
Soldering conditions:
•
Reflow soldering conditions according to CECC 00802, temperature characteristics at terminals
during infrared-reflow soldering:
• Two reflow cycles and Pb-free solder process admitted
Reliability
Failure rate < 1 fit (failures in time)
ISSUE DATE
28.03.02
ISSUE
b
PUBLISHER
EPCOS AG
PAGE
4/7
Multilayer Ceramic Capacitor
HC1 - Chip / Size 0402
HC1 / 0402 / 16V
B37627K9******
Preliminary Data Sheet
(parameters may be changed if necessary)
Taping, Packing
Cardboard Taping
(in accordance with DIN IEC 60286-3)
P
0
T
P
D
2
0
E
F
W
B
0
G
T
A
1
0
T
1
P
1
T
2
Direction of unreeling
Dimensions and Tolerances:
Definition
Symbol
Dimension (mm)
Tol. (mm)
Compartment width x Compartments length
Compartment height
A0 x B0
T
1.15 x 0.6
± 0.2
max.
max.
± 0.1
± 0.11)
± 0.05
± 0.1
± 0.3
± 0.1
± 0.05
0.6
0.7
1.5
4
Overall thickness
T2
Sprocket hole diameter
D0
P0
P2
P1
W
Sprocket hole pitch
Distance center hole to center compartment
Pitch of the component compartments
Tape width
2
2
8
Distance edge to center of hole
Distance center hole to center compartment
1) ≤ +0.2 mm over 10 sprocket holes.
E
1.75
3.5
F
Part orientation in tape pocket :
equivalent terminations
because of unipolar component
ISSUE DATE
28.03.02
ISSUE
b
PUBLISHER
EPCOS AG
PAGE
5/7
Multilayer Ceramic Capacitor
HC1 - Chip / Size 0402
HC1 / 0402 / 16V
B37627K9******
Preliminary Data Sheet
(parameters may be changed if necessary)
Reel Packaging
W
2
+0,15
12,75
-0
A
Ø62
±1,5
W
1
Package 8-mm Tape
Definition
Symbol Dim.
(mm)
Tol.
Dim.
(mm)
330
Tol.
(mm)
-3/+0
(mm)
± 2.0
+1.5/-0
Reel diameter A
180
8.4
Reel width
(inside)
W1
+1.5/-0 8.4
Reel width
(outside)
W2
14.4
max.
14.4
max.
Packing units
Size
Chip
thickness
Cardboard
tape
Units /reel
Ø 180mm
10000 pcs
inch / mm
0402/1005
0.5 mm
8 mm
Leader, Trailer
Tape end (trailer)
l
40 min.
Vacant positions
Leader
25 min.
Vacant positions
300 mm
Top cover tape
ISSUE DATE
28.03.02
ISSUE
b
PUBLISHER
EPCOS AG
PAGE
6/7
Multilayer Ceramic Capacitor
HC1 - Chip / Size 0402
HC1 / 0402 / 16V
B37627K9******
Preliminary Data Sheet
(parameters may be changed if necessary)
Additional Taping Information
Reel material:
PS.
Tape material:
Tape break force:
Cardboard
min 10 N
Top cover tape strength: min 10 N
Top cover tape peel force: 0.1-0.65 N at a peel speed of 300 mm/min
Tape peel angle:
Angle between top cover tape and the direction of feed during peel
off: 165 -180°
Cavity play:
Each part rests in the cavity so that the angle between the part and
cavity centreline is no more than 20°
Weight of component:
Weight of loaded reel:
1.3 mg
max. 1500 g
Label Example
EPCOS AG 2002. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the information
contained therein without EPCOS' prior express consent is prohibited.
Purchase orders are subject to the General Conditions for the Supply of Products and Services of the Electrical and
Electronics Industry recommended by the ZVEI (German Electrical and Electronic Manufacturers' Association), unless
otherwise agreed.
ISSUE DATE
28.03.02
ISSUE
b
PUBLISHER
EPCOS AG
PAGE
7/7
相关型号：
©2020 ICPDF网 联系我们和版权申明