B37872K5105K060 [EPCOS]
CAPACITOR, CERAMIC, MULTILAYER, 50V, X7R, 1uF, SURFACE MOUNT, 1206, CHIP;型号: | B37872K5105K060 |
厂家: | EPCOS |
描述: | CAPACITOR, CERAMIC, MULTILAYER, 50V, X7R, 1uF, SURFACE MOUNT, 1206, CHIP |
文件: | 总13页 (文件大小:114K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Multilayer Ceramic Capacitors
Series/Type: B37931
The following products presented in this data sheet are being withdrawn.
Ordering Code
Substitute Product
Date of Withdrawal Deadline Last
Orders
Last Shipments
B37931K9224K060
B37931K9224K070
B37931K0224K060
2008-08-01
2008-08-01
2008-08-01
2009-07-31
2009-07-31
2009-07-31
2009-10-31
2009-10-31
2009-10-31
Ordering Code
Substitute Product
Date of Withdrawal Deadline Last
Orders
Last Shipments
B37931K0224K070
B37931K5104K060
B37931K5104K070
B37941K9224K060
B37941K9224K070
B37941K9334K060
B37941K9334K070
B37941K9474K060
B37941K9474K070
B37941K9105K062
B37941K9105K072
B37941K0224K060
B37941K0224K070
B37941K0334K060
B37941K0334K070
B37941K0474K060
B37941K0474K070
B37941K0105K062
B37941K0105K072
B37941K5224K060
B37941K5224K070
B37941K5334K062
B37941K5334K072
B37941K5474K062
B37941K5474K072
B37941K5105K062
B37941K5105K072
B37872K9105K062
B37872K9105K072
B37872K9225K062
B37872K9225K072
B37872K0105K062
B37872K0105K072
B37872K0225K062
B37872K0225K072
B37872K5105K062
B37872K5105K072
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2008-08-01
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-07-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
2009-10-31
For further information please contact your nearest EPCOS sales office, which will also support you in selecting a
suitable substitute. The addresses of our worldwide sales network are presented at www.epcos.com/sales.
Multilayer ceramic capacitors
HighCV; X7R
Chip
Ordering code system
B37941
K
5
105
K
0
62
Packaging
^
60 cardboard tape, 180-mm reel
^
62 blister tape, 180-mm reel
^
70 cardboard tape, 360-mm reel
^
72 blister tape, 360-mm reel
Internal coding
Capacitance tolerance
^
K
10% (standard)
4
^
^
Capacitance, coded 474 47 · 10 pF = 470 nF
(example)
5
105 10 · 10 pF = 1 ꢀF
Rated voltage
Rated voltage [VDC] 16
Code
25
0
50
5
9
^
nickel barrier for all case sizes
Standard:
K
Termination
Type and size
Chip size
(inch / mm)
Temperature characteristic
X7R
0603 / 1608
0805 / 2012
1206 / 3216
B37931
B37941
B37872
Please read Cautions and warnings and
Important notes at the end of this document.
2
10/06
Multilayer ceramic capacitors
HighCV; X7R
Chip
Features
■ Characteristic of class 2 dielectric
■ Highest possible capacitance to rated voltage ratio
■ High capacitance values up to 2.2 ꢀF
■ Voltage rating from 16 V to 50 V
■ To AEC-Q200
Applications
■ Coupling and bypass filters
Termination
■ For soldering: Nickel barrier terminations (Ni)
Options
■ Other capacitance values on request
Delivery mode
■ Cardboard and blister tape (blister tape for chip thickness O1.2 M0.1 mm)
Electrical data
Temperature characteristic
Max. relative capacitance change
within –55 LC to +125 LC
Climatic category (IEC 60068-1)
Standard
X7R
ꢁC/C
M15
55/125/56
EIA
%
Dielectric
Class 2
Rated voltage1)
Test voltage
Capacitance range
Dissipation factor (limit value)
VR
Vtest
CR
16; 25; 50
2.5 · VR/5 s
100 nF … 2.2 ꢀF
<50 · 10–3 for ?25 V
<25 · 10–3 for 50 V
>104
>500
–55 … +125
yes
VDC
VDC
tan ꢂ
Insulation resistance2) at +25 LC
Time constant2) at +25 LC
Operating temperature range
Ageing3)
Rins
ꢄ
Mꢃ
s
LC
Top
1) Note: No operation on AC line.
2) For C >10 nF the time constant ꢀ = C · R is given.
R
ins
3) Refer to chapter “General technical information”, “Ageing”.
Please read Cautions and warnings and
Important notes at the end of this document.
3
10/06
Multilayer ceramic capacitors
HighCV; X7R
High
CV
Capacitance tolerances
Code letter
Tolerance
K
(standard)
M10%
Dimensional drawing
b
k
k
KKE0329-N
Dimensions (mm)
Case size (inch) 0603
(mm) 1608
0805
2012
1206
3216
l
1.6 M0.15 2.00 M0.20 3.2 M0.20
0.8 M0.10 1.25 M0.15 1.6 M0.15
0.8 M0.10 1.35 max. 1.80 max.
b
s
k
0.1 –0.4
0.13 –0.75 0.25 –0.75
Tolerances to CECC 32101-801
Please read Cautions and warnings and
Important notes at the end of this document.
4
10/06
Multilayer ceramic capacitors
HighCV; X7R
High
CV
Recommended solder pad
D
KKE0308-1
Recommended dimensions (mm) for reflow soldering
Case size
(inch/mm)
Type
A
C
D
0603/1608
0805/2012
1206/3216
single chip
single chip
single chip
0.6 … 0.7
0.6 … 0.7
0.8 … 0.9
1.8 … 2.20
2.2 … 2.60
3.8 … 4.32
0.6 … 0.8
0.8 … 1.1
1.0 … 1.4
Recommended dimensions (mm) for wave soldering
Case size
(inch/mm)
Type
A
C
D
0603/1608
0805/2012
1206/3216
single chip
single chip
single chip
0.8 … 0.9
0.9 … 1.0
1.0 … 1.1
2.2 … 2.8
2.8 … 3.2
4.2 … 4.8
0.6 … 0.8
0.8 … 1.1
1.0 … 1.4
Termination
Ceramic body
Termination
(nickel barrier)
Inner electrode
Ni
Substrate electrode
Intermediate electrode
External electrode
Cu
Ni
Sn
KKE0342-F
Please read Cautions and warnings and
Important notes at the end of this document.
5
10/06
Multilayer ceramic capacitors
HighCV; X7R
High
CV
Product range for HighCV chip capacitors, X7R
1)
Size
inch
0603
0805
1206
mm
1608
2012
3216
Type
B37931
B37941
B37872
V (VDC)
R
16
25
50
16
25
50
16
25
50
C
R
100 nF
220 nF
330 nF
470 nF
1.0 ꢀF
2.2 ꢀF
1) l P b (inch) / l P b (mm)
Please read Cautions and warnings and
Important notes at the end of this document.
6
10/06
Multilayer ceramic capacitors
HighCV; X7R; 0603 to 1206
High
CV
Ordering codes and packing for HighCV, X7R, 16, 25 and 50 VDC,
nickel barrier terminations
Chip thickness
Cardboard tape, Cardboard tape,
b 180-mm reel
b 360-mm reel
^
^
** 60
** 70
1)
C
Ordering code
mm
pcs/reel
pcs/reel
16000
16000
16000
R
Case size 0603, 16 VDC
220. nF
B37931K9224K0**
0.8 M0.1
0.8 M0.1
0.8 M0.1
4000
Case size 0603, 25 VDC
220. nF
B37931K0224K0**
4000
Case size 0603, 50 VDC
100. nF
B37931K5104K0**
4000
Case size 0805, 16 VDC
220. nF
330. nF
470. nF
1.0 ꢀF
B37941K9224K0**
0.8 M0.1
0.8 M0.1
0.8 M0.1
1.2 M0.1
4000
4000
4000
16000
16000
16000
B37941K9334K0**
B37941K9474K0**
B37941K9105K0**
2)
3)
3000
12000
Case size 0805, 25 VDC
220. nF
330. nF
470. nF
1.0 ꢀF
B37941K0224K0**
0.8 M0.1
0.8 M0.1
0.8 M0.1
1.2 M0.1
4000
4000
4000
16000
16000
16000
B37941K0334K0**
B37941K0474K0**
B37941K0105K0**
2)
3)
3000
12000
Case size 0805, 50 VDC
220. nF
330. nF
470. nF
1.0 ꢀF
B37941K5224K0**
0.8 M0.1
1.2 M0.1
1.2 M0.1
1.2 M0.1
4000
3000
3000
3000
16000
12000
12000
12000
2)
3)
B37941K5334K0**
B37941K5474K0**
B37941K5105K0**
2)
3)
2)
3)
Case size 1206, 16 VDC
2)
3)
1.0 ꢀF
2.2 ꢀF
B37872K9105K0**
B37872K9225K0**
1.2 M0.1
1.2 M0.1
3000
3000
12000
12000
2)
3)
Case size 1206, 25 VDC
2)
3)
1.0 ꢀF
2.2 ꢀF
B37872K0105K0**
B37872K0225K0**
1.2 M0.1
1.2 M0.1
3000
3000
12000
12000
2)
3)
Case size 1206, 50 VDC
2)
3)
1.0 ꢀF
B37872K5105K0**
1.2 M0.1
3000
12000
1) Other capacitance values on request.
2) Blister tape, 180-mm reel, ordering code ** 62
3) Blister tape, 330-mm reel, ordering code ** 72
^
^
Please read Cautions and warnings and
Important notes at the end of this document.
7
10/06
Multilayer ceramic capacitors
HighCV; X7R
High
CV
1)
Typical characteristics for HighCV X7R
Capacitance change ꢁC/C versus
Capacitance change ꢁC/C versus
25
0
temperature T
superimposed DC voltage V
KKE0395-6
KKE0396-E
15
20
%
%
∆C
C25
∆C
C0
5
0
0
_5
_10
_20
_10
_15
_20
_25
_30
_35
_40
_45
_50
1 µF/50 V/size 1206
_30
_40
_50
_60
_70
_80
_90
_100
1 µF/25 V/size 0805
_
_
_60 40 20
0
20 40 60 80 100 C 140
0
5
10 15 20 25 30 35 40 V 50
V
˚
T
Capacitance change ꢁC/C versus
Dissipation factor tan ꢂ versus
1
time t
temperature T
_1
KKE0494-4
KKE0397-M
10
10
%
∆C
C1
tan δ
5
0
_5
_2
10
_10
_15
_20
_3
10
_60 40 20
0
20 40 60 80 100 C 140
_
_
100
101
102
103
104 h 105
t
˚
T
1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance.
Please read Cautions and warnings and
Important notes at the end of this document.
8
10/06
Multilayer ceramic capacitors
HighCV; X7R
High
CV
1)
Typical characteristics for HighCV X7R
Insulation resistance R versus
temperature T
Impedance |Z| and ESR versus
frequency f
ins
KKE0398-V
KKE0495-C
104
10 4
Ω
M
Ω
220 nF/25 V/size 0603
Rins
Z , ESR
102
10 3
10 2
10 1
101
100
1 µF/50 V/size 1206
1 µF/25 V/size 0805
2.2 µF/25 V/size 1206
_1
10
_2
_3
Z
ESR
10
10
_ 4
_ 3
_ 2
_1
10 10 10 10 100 101 102 MHz 104
f
20
40
60
80
100
C 130
T
˚
Impedance |Z| and ESR versus
frequency f
Impedance |Z| and ESR versus
frequency f
KKE0399-4
KKE0400-B
104
104
Ω
Ω
1 µF/25 V/size 0805
2.2 µF/25 V/size 1206
Z , ESR
Z , ESR
102
102
101
101
100
100
_1
_1
10
10
_2
_3
_2
_3
Z
Z
10
10
10
10
ESR
ESR
_ 4
_ 3
_ 2
_1
_ 4
_ 3
_ 2
_1
10 10 10 10 100 101 102 MHz 104
f
10 10 10 10 100 101 102 MHz 104
f
1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance.
Please read Cautions and warnings and
Important notes at the end of this document.
9
10/06
Multilayer ceramic capacitors
Cautions and warnings
Notes on the selection of ceramic capacitors
In the selection of ceramic capacitors, the following criteria must be considered:
1. Depending on the application, ceramic capacitors used to meet high quality requirements should
at least satisfy the specifications to AEC-Q200. They must meet quality requirements going
beyond this level in terms of ruggedness (e.g. mechanical, thermal or electrical) in the case of
critical circuit configurations and applications (e.g. in safety-relevant applications such as ABS
and airbag equipment or durable industrial goods).
2. At the connection to the battery or power supply (e.g. clamp 15 or 30 in the automobile) and at
positions with stranding potential, to reduce the probability of short circuits following a fracture,
two ceramic capacitors must be connected in series and/or a ceramic capacitor with integrated
series circuit should be used. The MLSC from EPCOS contains such a series circuit in a single
component.
3. Ceramic capacitors with the temperature characteristics Z5U and Y5V do not satisfy the require-
ments to AEC-Q200 and are mechanically and electrically less rugged than C0G or X7R/X8R
ceramic capacitors. In applications that must satisfy high quality requirements, therefore, these
capacitors should not be used as discrete components (see the chapter “Effects on mechanical,
thermal and electrical stress”, point 1.4).
4. For ESD protection, preference should be given to the use of multilayer varistors (MLV) (see the
chapter “Effects on mechanical, thermal and electrical stress”, point 1.4).
5. An application-specific derating or continuous operating voltage must be considered in order to
cushion (unexpected) additional stresses (see the chapter “Reliability”).
The following should be considered in circuit board design
1. If technically feasible in the application, preference should be given to components having an
optimal geometrical design.
2. At least FR4 circuit board material should be used.
3. Geometrically optimal circuit boards should be used, ideally those that cannot be deformed.
4. Ceramic capacitors must always be placed a sufficient minimum distance from the edge of the
circuit board. High bending forces may be exerted there when the panels are separated and dur-
ing further processing of the board (such as when incorporating it into a housing).
5. Ceramic capacitors should always be placed parallel to the possible bending axis of the circuit
board.
6. No screw connections should be used to fix the board or to connect several boards. Compo-
nents should not be placed near screw holes. If screw connections are unavoidable, they must
be cushioned (for instance by rubber pads).
10 10/06
Multilayer ceramic capacitors
Cautions and warnings
The following should be considered in the placement process
1. Ensure correct positioning of the ceramic capacitor on the solder pad.
2. Caution when using casting, injection-molded and molding compounds and cleaning agents,
as these may damage the capacitor.
3. Support the circuit board and reduce the placement forces.
4. A board should not be straightened (manually) if it has been distorted by soldering.
5. Separate panels with a peripheral saw, or better with a milling head (no dicing or breaking).
6. Caution in the subsequent placement of heavy or leaded components (e.g. transformers or
snap-in components): danger of bending and fracture.
7. When testing, transporting, packing or incorporating the board, avoid any deformation of the
board not to damage the components.
8. Avoid the use of excessive force when plugging a connector into a device soldered onto the
board.
9. Ceramic capacitors must be soldered only by the mode (reflow or wave soldering) permissible
for them (see the chapter “Soldering directions”).
10. When soldering the most gentle solder profile feasible should be selected (heating time, peak
temperature, cooling time) in order to avoid thermal stresses and damage.
11. Ensure the correct solder meniscus height and solder quantity.
12. Ensure correct dosing of the cement quantity.
13. Ceramic capacitors with an AgPd external termination are not suited for the lead-free solder
process: they were developed only for conductive adhesion technology.
This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.
11 10/06
Multilayer ceramic capacitors
Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical
requirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application. As
a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them
than the customers themselves. For these reasons, it is always ultimately incumbent on the
customer to check and decide whether an EPCOS product with the properties described in the
product specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of passive electronic components
or failure before the end of their usual service life cannot be completely ruled out in the
current state of the art, even if they are operated as specified. In customer applications
requiring a very high level of operational safety and especially in customer applications in which
the malfunction or failure of a passive electronic component could endanger human life or health
(e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of
suitable design of the customer application or other action taken by the customer (e.g.
installation of protective circuitry or redundancy) that no injury or damage is sustained by third
parties in the event of malfunction or failure of a passive electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as “hazardous”). Useful information on this will be found in our
Material Data Sheets on the Internet (www.epcos.com/material). Should you have any more
detailed questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order.
We also reserve the right to discontinue production and delivery of products.
Consequently, we cannot guarantee that all products named in this publication will always be
available.
6. Unless otherwise agreed in individual contracts, all orders are subject to the current version
of the “General Terms of Delivery for Products and Services in the Electrical Industry”
published by the German Electrical and Electronics Industry Association (ZVEI).
7. The trade names EPCOS, EPCOS-JONES, Baoke, CeraDiode, CSSP, MLSC, PhaseCap,
PhaseMod, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMID, SIOV, SIP5D, SIP5K, UltraCap,
WindCap are trademarks registered or pending in Europe and in other countries. Further
information will be found on the Internet at www.epcos.com/trademarks.
12 10/06
相关型号:
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