B37923K5000C860 [EPCOS]
CAPACITOR, CERAMIC, MULTILAYER, 50V, CH, 0.0000008uF, SURFACE MOUNT, 0402, CHIP;
| 型号： | B37923K5000C860 |
| 厂家： | 
EPCOS |
| 描述： | CAPACITOR, CERAMIC, MULTILAYER, 50V, CH, 0.0000008uF, SURFACE MOUNT, 0402, CHIP |
| 文件： | 总11页 (文件大小：277K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Multilayer Ceramic Capacitor
HQM - Chip / Size 0402
HQM / 0402 / 50V
B37923K5******
Preliminary Data Sheet
(parameters may be changed if necessary)
Hi-Q Capacitor 0402
Description
The “High-Q-series” was designed for wireless communications and high frequency applications.
The “High-Q-Capacitors” have a class 1 dielectric ceramic and copper inner electrode. The class 1
dielectric ceramic used, HQM, is a very stable dielectric offering a temperature coefficient of
capacitance (TCC) of 0± 60ppm/°C. The higher conductivity of copper give a lower ESR. These
advantages mean a improved performance of matching circuits, lower power dissipation and less
energy absorption.
Features
n Ultra low ESR and high Q-factor
n Tight capacitance tolerances
n Class 1 capacitor with Cu-inner-electrodes
n High stability with respect of time, temperature, frequency and voltage
n Excellent attenuation
n High self resonance frequency
n Lead free component
n CuNiSn (Nickel Barrier) Termination
Applications
n Cellular Communication
n Bluetooth
n DECT
n Cable TV
n Satellite TV (LNB)
n GPS
n Vehicle Location Systems
n Paging
n Test and Measurement
n Filters
n RF Amplifiers
n VCO´s
n HIPERLAN
ISSUE DATE
28.03.02
ISSUE
d
PUBLISHER
EPCOS AG
PAGE
1/11
Multilayer Ceramic Capacitor
HQM - Chip / Size 0402
HQM / 0402 / 50V
B37923K5******
Preliminary Data Sheet
(parameters may be changed if necessary)
Ordering Code System
Chip
-
-
B37923
K 5 100 J 5 60
Type and Size:
HQM / 0402
Termination Type:
K = Cu/Ni/Sn
Rated Voltage:
5 = 50V
Rated Capacitance:
100 = 10 x 100pF = 10pF
Capacitance Tolerance:
C<10pF: B = ±0.1pF C = ±0.25pF
C>10pF: J = ±5%
K = ±10%
Decimal place:
for cap. values <10pF, otherwise not used
Packaging code:
60 = card board, 180mm reel
ISSUE DATE
28.03.02
ISSUE
d
PUBLISHER
EPCOS AG
PAGE
2/11
Multilayer Ceramic Capacitor
HQM - Chip / Size 0402
HQM / 0402 / 50V
B37923K5******
Preliminary Data Sheet
(parameters may be changed if necessary)
Sample Kit Set
-
-
B37923
K 5 999 J 0 99
Cap values:
0.4, 0.5, 1.2, 1.5, 2.2, 2.7, 3.3, 3.9, 4.7,
5.6, 6.8, 8.2, 10, 12, 15, 18, 22
Capacitance Tolerance:
C<3.9pF: B = ±0.1pF
4.7pF<C10pF C = ±0.25pF
C>10pF: J = ±5%
Internal Code
Packaging code:
99 = Sample Kit
Part Dimensions
l
Symbol Min
Max
1.05
0.55
Unit
b
s
l
0.95
mm
mm
mm
mm
b
s
k
0.45
0.45
0.10
0.55
0.30
Dimensions and tolerances in accordance with
CECC 32101-801
k
ISSUE DATE
28.03.02
ISSUE
d
PUBLISHER
EPCOS AG
PAGE
3/11
Multilayer Ceramic Capacitor
HQM - Chip / Size 0402
HQM / 0402 / 50V
B37923K5******
Preliminary Data Sheet
(parameters may be changed if necessary)
Electrical Data
Capacitance Test Conditions
Test frequency:
1.0 MHz ± 0,2 MHz
1.0 V ± 0.2 V
25°C ± 1°C (EIA)
< 1.0 x 10-3
Test voltage:
Reference Temperature
Dissipation factor tan δ (limit value):
Insulation Resistance:
Ageing:
> 105 MΩ
none
Temperature coefficient (tolerance) 0 ± 60*10-6 1/K
Operating Temperature Range:
Climatic category (IEC 68-1):
Capacitance Range:
-55°C ... +125°C
55/125/56
0.3 ... 22pF (up from 1pF Series E12)
RF Measuring equipment
S-Parameter Measuring Configuration:
n HP 8753D (30kHz – 6GHz)
n HP 8722D (1MHz – 40GHz)
n samples soldered on microstrip PCB’s
n Measuring Direction: Shunt
Impedance Measuring Configuration:
n Agilent E 4991A (1MHz – 3GHz)
n Test fixture 16197A
n parts not soldered
ISSUE DATE
28.03.02
ISSUE
d
PUBLISHER
EPCOS AG
PAGE
4/11
Multilayer Ceramic Capacitor
HQM - Chip / Size 0402
HQM / 0402 / 50V
B37923K5******
Preliminary Data Sheet
(parameters may be changed if necessary)
Typical RF Performance
1
2
Capacitance
[pF]
0.3
0.4
0.5
0.7
0.8
1.0
1.2
1.5
2.2
2.7
3
fres
ESR@ 1GHz 2 Q@ 1GHz 2
ESR@ fres
[mΩ]
690
630
535
455
390
365
330
295
245
225
210
205
195
175
165
150
140
124
116
106
96
[MHz]
23400
20350
19700
15100
14450
12000
10600
8900
6400
6000
6200
5500
5350
4650
4400
3950
4100
3650
3350
3350
2600
2300
2200
[mΩ]
535
495
425
365
320
300
275
255
215
195
185
180
170
155
145
135
125
112
106
96
940
865
750
640
555
520
475
405
315
280
255
240
225
200
175
155
135
112
100
80
3.3
3.9
4.7
5.1
5.6
6.8
8.2
10
12
15
90
66
18
80
52
88
22
78
46
84
1 Impedance Analyser E 4991A, parts not soldered
2 Network Analyser HP 8753D, parts soldered
ISSUE DATE
28.03.02
ISSUE
d
PUBLISHER
EPCOS AG
PAGE
5/11
Multilayer Ceramic Capacitor
HQM - Chip / Size 0402
HQM / 0402 / 50V
B37923K5******
Preliminary Data Sheet
(parameters may be changed if necessary)
Fig. 1: Typical ESR for different Frequencies vs.
Capacitance 3
Fig. 2: Typical Q Factor for different Frequencies vs.
Capacitance 3
Fig. 3: Typical Self Resonant Frequencies vs.
Capacitance 3
Fig. 4: Typical ESR at Resonant Frequencies for
soldered parts vs. Capacitance 4
Fig. 5: Typical ESR for different Capacitances vs.
Frequency 3
Fig. 6: Typical Q Factor for different Capacitances vs.
Frequency 3
3 Impedance Analyser E 4991A, parts not soldered
4 Network Analyser HP 8753D, parts soldered
ISSUE DATE
28.03.02
ISSUE
d
PUBLISHER
EPCOS AG
PAGE
6/11
Multilayer Ceramic Capacitor
HQM - Chip / Size 0402
HQM / 0402 / 50V
B37923K5******
Preliminary Data Sheet
(parameters may be changed if necessary)
RF Experiences
The proporties of Hi-Q capacitors depend on soldering conditions and pad sizes. In general soldered
parts show a better RF behaveour then not soldered parts. The resonant frequency decreases with
bigger pad sizes.
Measurand
ESR@1GHz
Q@1GHz
ESR@fres
fres
Parts only
Parts soldered
lower
see figure 1 and 5
see figure 2 and 6
higher
higher
see figure 4
lower
see figure 3
Mounting Instructions
Copper/Nickel/Tin terminations
Class 1 Ceramic
Copper Inner electrodes
Substrate electrode - copper
Intermediate electrode- nickel
External electrode - tin
Geometry of solder pads
Recommended dimensions:
B
B
A
B
C
Unit
mm
0.6
0.6
1.7
A
C
ISSUE DATE
28.03.02
ISSUE
d
PUBLISHER
EPCOS AG
PAGE
7/11
Multilayer Ceramic Capacitor
HQM - Chip / Size 0402
HQM / 0402 / 50V
B37923K5******
Preliminary Data Sheet
(parameters may be changed if necessary)
Recommended soldering profile
Test according IEC 60068-2-58:
Wettability Test: 215°C ± 3°C / 3 sec ± 0,3sec (wetting of soldering area > 95%)
Leaching Test: 260°C ± 5°C / 10sec ± 1sec (no leaching of contacts)
Soldering conditions:
n Reflow soldering conditions according to CECC 00802, temperature characteristics at terminals
during infrared-reflow soldering
n Two reflow cycles and Pb free solder process admitted
Storage conditions:
Solderability is guaranteed for 12 months from date of delivery, provided that the components are
stored in the original packages.
Storage temperature: -25 ... +45°C
Relative humidity: < 75% annual average, < 95% on max. 30 days in a year, dew precipitation and
wetness are inadmissible.
ISSUE DATE
28.03.02
ISSUE
d
PUBLISHER
EPCOS AG
PAGE
8/11
Multilayer Ceramic Capacitor
HQM - Chip / Size 0402
HQM / 0402 / 50V
B37923K5******
Preliminary Data Sheet
(parameters may be changed if necessary)
Taping, Packing
Cardboard Taping
(in accordance with DIN IEC 60286-3)
P
0
T
P
D
2
0
E
F
W
B
0
G
T
A
1
0
T
1
P
1
T
2
Direction of unreeling
Dimensions and Tolerances:
Definition
Symbol
Dimension (mm)
Tol. (mm)
Compartment width x Compartments length
Compartment height
A0 x B0
T
1.15 x 0.6
± 0.2
max.
max.
± 0.1
± 0.11)
± 0.05
± 0.1
± 0.3
± 0.1
± 0.05
0.6
0.7
1.5
4
Overall thickness
T2
Sprocket hole diameter
D0
P0
P2
P1
W
Sprocket hole pitch
Distance center hole to center compartment
Pitch of the component compartments
Tape width
2
2
8
Distance edge to center of hole
Distance center hole to center compartment
1) ≤ +0.2 mm over 10 sprocket holes.
E
1.75
3.5
F
Part orientation in tape pocket :
equivalent terminations
because of unipolar component
ISSUE DATE
28.03.02
ISSUE
d
PUBLISHER
EPCOS AG
PAGE
9/11
Multilayer Ceramic Capacitor
HQM - Chip / Size 0402
HQM / 0402 / 50V
B37923K5******
Preliminary Data Sheet
(parameters may be changed if necessary)
Reel Packaging
W
2
+0,15
12,75
-0
A
Ø62
±1,5
W
1
Package 8-mm Tape
Definition
Symbol Dim.
(mm)
Tol.
Dim.
(mm)
330
Tol.
(mm)
-3/+0
(mm)
± 2.0
+1.5/-0
Reel diameter A
180
8.4
Reel width
(inside)
W1
+1.5/-0 8.4
Reel width
(outside)
W2
14.4
max.
14.4
max.
Packing units
Size
Chip
thickness
Cardboard
tape
Units /reel
Ø 180mm
10000 pcs
inch / mm
0402/1005
0.5 mm
8 mm
Leader, Trailer
Tape end (trailer)
l
40 min.
Vacant positions
Leader
25 min.
Vacant positions
300 mm
Top cover tape
ISSUE DATE
28.03.02
ISSUE
d
PUBLISHER
EPCOS AG
PAGE 10/11
Multilayer Ceramic Capacitor
HQM - Chip / Size 0402
HQM / 0402 / 50V
B37923K5******
Preliminary Data Sheet
(parameters may be changed if necessary)
Additional Taping Information
Reel material:
PS.
Tape material:
Tape break force:
Cardboard
min 10 N
Top cover tape strength: min 10 N
Top cover tape peel force: 0.1-0.65 N at a peel speed of 300 mm/min
Tape peel angle:
Angle between top cover tape and the direction of feed during peel
off: 165 -180°
Cavity play:
Each part rests in the cavity so that the angle between the part and
cavity centreline is no more than 20°
Weight of component:
Weight of loaded reel:
1.3 mg
max. 1500 g
Label Example
EPCOS AG 2002. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the information
contained therein without EPCOS' prior express consent is prohibited.
Purchase orders are subject to the General Conditions for the Supply of Products and Services of the Electrical and
Electronics Industry recommended by the ZVEI (German Electrical and Electronic Manufacturers' Association), unless
otherwise agreed.
ISSUE DATE
28.03.02
ISSUE
d
PUBLISHER
EPCOS AG
PAGE 11/11
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