B37931X5223K070_技术文档

Multilayer ceramic capacitors

Chip, MLSC, X7R

Series/Type:

Chip

Date:

February 2009

The following products presented in this data sheet are being withdrawn.

Substitute Products: See www.epcos.com/withdrawal_mlcc

Ordering Code

Substitute Product

Date of

Withdrawal

Deadline Last

Orders

Last Shipments

B37941X5333K060

B37941X5333K070

B37941X5473K060

2009-06-26

2010-06-30

2010-12-31

information contained therein without EPCOS' prior express consent is prohibited.

Ordering Code

Substitute Product

Date of

Withdrawal

Deadline Last

Orders

Last Shipments

B37941X5473K070

B37941X5683K062

B37941X5683K072

B37941X5104K062

B37941X5104K072

B37941X1102K060

B37941X1102K070

B37941X1152K060

B37941X1152K070

B37941X1222K060

B37941X1222K070

B37941X1332K060

B37941X1332K070

B37941X1472K060

B37941X1472K070

B37941X1682K060

B37941X1682K070

B37941X1103K060

B37941X1103K070

B37941X1153K060

B37941X1153K070

B37941X1223K060

B37941X1223K070

B37931X5152K060

B37931X5152K070

B37931X5222K060

B37931X5222K070

B37931X5332K060

B37931X5332K070

B37931X5472K060

B37931X5472K070

B37931X5682K060

B37931X5682K070

B37931X5103K060

B37931X5103K070

B37931X1102K060

B37931X1102K070

2009-06-26

2010-06-30

2010-12-31

For further information please contact your nearest EPCOS sales office, which will also support

you in selecting a suitable substitute. The addresses of our worldwide sales network are

presented at www.epcos.com/sales.

Multilayer ceramic capacitors

MLSC; X7R

Chip

General

The MLSC was developed for typical applications with a direct connection to the battery or gener-

ator in the automobile, as it satisfies the requirements of the automobile manufacturers for a se-

ries connection of two capacitors for battery applications in a single component.

It not only represents the only real alternative to the series connection of discrete capacitors, but

also offers advantages over these and other possible solutions, which contain only a single ca-

pacitor.

Compared with a series circuit made up of conventional ceramic capacitors, it allows the number

of components to be reduced. This reduces the space requirement on the circuit board and short-

ens the placement time. Because fewer components are used, the failure probability is additional-

ly reduced.

The MLSC is based on proven MLCC technology, but has a more rugged design. This technology

offers highest reliability (ppb rate) on the basis of long field experience. Both undamaged and typi-

cally cracked MLSCs are characterized by a high breakdown voltage and high ESD and pulse

strength.

It may be used at temperatures of up to 150 °C with consideration of a voltage derating and with

brief temperature peaks of up to 175 °C without electrical stressing.

The MLSC is also manufactured to the specifications of the ppb level assurance system, and a

bending strength of 2 mm is assured on the basis of the rigorous piezoelectric method.

Please read Cautions and warnings and

Important notes at the end of this document.

Page 2 of 16

Multilayer ceramic capacitors

MLSC; X7R

Ordering code system

B37941

X

1

103

K

0

60

Type and size

Chip size (inch/mm) = Temperature characteristic X7R:

0603/1608 ꢀ B37931

0805/2012 ꢀ B37941

Internal coding

"X" indicates MLSC type

Rated voltage

5 (Code) ꢀ 50 VDC

1 (Code) ꢀ 100 VDC

Capacitance, coded (example)

103 ꢀ 10 ꢁ 10³pF = 10 nF

104 ꢀ 10 ꢁ 10⁴pF = 100 nF

223 ꢀ 22 ꢁ 10³pF = 22 nF

Capacitance tolerance

K

ꢀ ±10% (standard)

Internal coding

Packaging

60 ꢀ cardboard tape, 180-mm reel

62 ꢀ blister tape, 180-mm reel

70 ꢀ cardboard tape, 330-mm reel

72 ꢀ blister tape, 330-mm reel

Please read Cautions and warnings and

Page 3 of 16

Important notes at the end of this document.

Multilayer ceramic capacitors

MLSC; X7R

Features

Two series-connected ceramic capacitors in a

single component

The MLSC thus satisfies the requirements of the

automobile manufacturers for applications on the

battery / generator (e.g. clamp 30 or clamp 15)

in a single component.

Reduction of the effects of a

ꢂ

bending fracture

placement fracture

solder-shock crack

thanks to a lower probability of a short circuit.

Evaluation criteria: Insulation resistance >10 k after the following treatment

bending until crack

humidity tests (85 °C/85% RH, rated voltage), 14 days

The breakdown voltage of MLSCs in the case of a typical bending crack is still greater than

five times the rated voltage.

Both undamaged and cracked MLSCs are capable of fulfilling the requirements to

ISO 7637 for 12 V automotive power systems, including load-dump and jump-start

requirements (24 V/1 h and 36 V/1 h).

Based on AEC-Q200 Rev-C

Applications

Automobile electronics

ꢂ

for direct connection to the car battery or generator

at positions with “stranding potential”

as RF filters in small motors (e.g. electrically operated windows)

Power electronics (e.g. DC/DC converters)

Smoothing capacitors (e.g. on the rechargeable battery in mobile equipment)

Cautions

A short circuit cannot be completely excluded. The use of MLSCs does not therefore result in

100% fail-safe operation, but in the event of a crack the probability of a short circuit can be

greatly reduced.

In the event of an untypical (bending) crack formation (e. g. double-sided crack or extreme

mounting crack) and other mechanical or thermal damage to the capacitor, the capacitor may

have a low ohmic state.

Please read Cautions and warnings and

Important notes at the end of this document.

Page 4 of 16

Multilayer ceramic capacitors

MLSC; X7R

Termination

Nickel barrier terminations (Ni) for lead-free soldering

Options

Alternative capacitance values and tolerances available on request

Delivery mode

Cardboard and blister tape (blister tape for chip thickness ≥1.2 ±0.1 mm),

180-mm and 330-mm reel available

Electrical data

Temperature characteristic

X7R

Max. relative capacitance change within ꢂ55 ... +125 °C ∆C/C ±15

%

Climatic category

Standard

(IEC 60068-1)

55/125/56

EIA

Dielectric

Rated voltage¹⁾

Class 2

50, 100

V_R

VDC

Test voltage

V_test2.5 ꢁ V_R/5 s

Capacitance range

Dissipation factor

Insulation resistance²⁾

Time constant²⁾

Operating temperature range

Ageing³⁾

C_R

1 nF ... 100 nF (E6)

(limit value)

(at +25 °C)

(at +125 °C)

(at +25 °C)

(at +125 °C)

tan δ < 25 ꢁ 10^-3

R_ins

τ

> 10⁵

> 10⁴

> 1000

> 100

ꢂ55 ... +125

yes

MΩ

s

°C

τ

T_op

1) Note: No operation on AC line.

2) For C_R>10 nF the time constant τ = C ꢁ R_insis given.

3) Refer to chapter "General technical information", "Ageing".

Please read Cautions and warnings and

Important notes at the end of this document.

Page 5 of 16

Multilayer ceramic capacitors

MLSC; X7R

Capacitance tolerances

Code letter

Tolerance

K (standard)

±10%

Dimensional drawing

Dimensions (mm)

Case size

(inch) 0603

0805

2012

(mm)

1608

l

1.60 ±0.15

0.80 ±0.10

0.10 - 0.40

2.00 ±0.20

1.25 ±0.15

1.35 max.

0.13 - 0.75

w

th

k

Tolerances to CECC 32101-801

Please read Cautions and warnings and

Important notes at the end of this document.

Page 6 of 16

Multilayer ceramic capacitors

MLSC; X7R

Recommended solder pad

Recommended dimensions (mm) for reflow soldering

Case size

(inch/mm)

0603/1608

0805/2012

Type

A

C

D

single chip

0.60 ... 0.70 1.80 ... 2.20 0.60 ... 0.80

0.60 ... 0.70 2.20 ... 2.60 0.80 ... 1.10

Recommended dimensions (mm) for wave soldering

Case size

(inch/mm)

0603/1608

0805/2012

Type

A

C

D

single chip

0.80 ... 0.90 2.20 ... 2.80 0.60 ... 0.80

0.90 ... 1.00 2.80 ... 3.20 0.80 ... 1.10

Termination

Please read Cautions and warnings and

Important notes at the end of this document.

Page 7 of 16

Multilayer ceramic capacitors

MLSC; X7R

Product range for MLSC chip capacitors, X7R

Size

inch (l x w)

0603

0805

mm (l x w)

1608

2012

Type

B37931X

B37941X

C_R\ V_R(VDC)

1.0 nF

1.5 nF

2.2 nF

3.3 nF

4.7 nF

6.8 nF

10 nF

50

100

50

100

15 nF

22 nF

33 nF

47 nF

68 nF

100 nF

Please read Cautions and warnings and

Important notes at the end of this document.

Page 8 of 16

Multilayer ceramic capacitors

MLSC; X7R

Ordering codes and packing for MLSC, X7R, 50 VDC, nickel barrier terminations

Chip

thickness

Cardboard Cardboard Blister tape, Blister tape,

tape, tape, 180-mm 330-mm

180-mm 330-mm reel reel

reel

** ꢀ 60

pcs./reel

** ꢀ 70

pcs./reel

** ꢀ 62

** ꢀ 72

C_R

Ordering code

mm

pcs./reel

Case size 0603, 50 VDC

1.5 nF B37931X5152K0** 0.8 ±0.1

2.2 nF B37931X5222K0** 0.8 ±0.1

3.3 nF B37931X5332K0** 0.8 ±0.1

4.7 nF B37931X5472K0** 0.8 ±0.1

6.8 nF B37931X5682K0** 0.8 ±0.1

4000

16000

10 nF

B37931X5103K0** 0.8 ±0.1

Case size 0805, 50 VDC

33 nF

47 nF

68 nF

B37941X5333K0** 0.8 ±0.1

4000

16000

B37941X5473K0** 0.8 ±0.1

B37941X5683K0** 1.2 ±0.1

3000

12000

100 nF B37941X5104K0** 1.2 ±0.1

Ordering codes and packing for MLSC, X7R, 100 VDC, nickel barrier terminations

Chip thickness

Cardboard tape,

180-mm reel

Cardboard tape,

330-mm reel

** ꢀ 60

** ꢀ 70

C_R

Ordering code

mm

pcs./reel

Case size 0603, 100 VDC

1.0 nF B37931X1102K0** 0.8 ±0.1

Case size 0805, 100 VDC

4000

16000

1.0 nF B37941X1102K0** 0.8 ±0.1

1.5 nF B37941X1152K0** 0.8 ±0.1

2.2 nF B37941X1222K0** 0.8 ±0.1

3.3 nF B37941X1332K0** 0.8 ±0.1

4.7 nF B37941X1472K0** 0.8 ±0.1

6.8 nF B37941X1682K0** 0.8 ±0.1

4000

16000

10 nF

15 nF

22 nF

B37941X1103K0** 0.8 ±0.1

B37941X1153K0** 0.8 ±0.1

B37941X1223K0** 0.8 ±0.1

Please read Cautions and warnings and

Important notes at the end of this document.

Page 9 of 16

Multilayer ceramic capacitors

MLSC; X7R

Typical characteristics¹⁾

Capacitance change ∆C/C₂₅versus

Capacitance change ∆C/C₀versus

temperature T

superimposed DC voltage V

Impedance |Z| versus

frequency f for case size 0603

frequency f for case size 0805

1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance.

Please read Cautions and warnings and

Important notes at the end of this document.

Page 10 of 16

Multilayer ceramic capacitors

MLSC; X7R

Typical characteristics¹⁾

Dissipation factor tan δ versus temperature T

Insulation resistance R_insversus temperature T

Capacitance change ∆C/C₁versus time t

1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance.

Please read Cautions and warnings and

Important notes at the end of this document.

Page 11 of 16

Multilayer ceramic capacitors

MLSC; X7R

Cautions and warnings

How to select ceramic capacitors

Remember the following when selecting ceramic capacitors:

1. Ceramic capacitors that must fulfill high quality requirements must be qualified based on

AEC-Q200 Rev-C.

2. When ceramic capacitors are used at the connection to a battery or power supply (e.g. clamp

15 or 30 in an automobile) or for safety-relevant applications, two single ceramic capacitors

should be connected in series. Alternatively a ceramic capacitor with integrated series circuits

should be used in order to reduce the possibility of a short circuit caused by a fracture. The

MLSC from EPCOS contains such a series circuit in a single component.

3. The use of multilayer varistors (MLVs) is recommended for ESD protection (see chapter

“Effects on mechanical, thermal and electrical stress”, section 1.4).

4. Additional stress factors such as continuous operating voltage or application-specific derating

must be taken into account in the selection of components (refer to chapter “Reliability”).

Recommendations for the circuit board design

1. Components with an optimized geometrical design are preferable where permitted by the

application.

2. Use at least FR4 circuit board material.

3. Geometrically optimized circuit boards are preferable, especially those that cannot be

deformed.

4. Ceramic capacitors should be placed with a sufficient minimum distance from the edge of a

circuit board. High bending forces may be exerted there when boards are separated and

during further processing of a board (e.g. when incorporating it in a housing).

5. Ceramic capacitors should always be placed parallel to the possible bending axis of a circuit

board.

6. Screw connections should not be used to fix a board or connect several boards. Components

should not be placed near screw holes. If screw connections are unavoidable, they should be

cushioned, for instance using rubber pads.

Please read Cautions and warnings and

Important notes at the end of this document.

Page 12 of 16

Multilayer ceramic capacitors

MLSC; X7R

Recommendations for processing

1. Ensure correct positioning of a ceramic capacitor on the solder pad.

2. Be careful when using casting, injection-molded and molding compounds and cleaning

agents. They can damage a capacitor.

3. Support a circuit board and reduce placement forces.

4. Do not straighten a board (manually) if it is distorted by soldering.

5. Separate boards with a peripheral saw, or preferably with a milling head (no dicing or

breaking).

6. Be careful when subsequently placing heavy or leaded components (e.g. transformers or

snap-in components) because of the danger of bending and fracture.

7. When testing, transporting, packing or inserting a board, avoid any deformation of it so that

components are not damaged.

8. Avoid excessive force when plugging a connector into a device soldered onto a board.

9. Only mount ceramic capacitors using the soldering process (reflow or wave) that is

permissible for them (see chapter “Soldering directions”).

10. When soldering, select the softest solder profile possible (heating time, peak temperature,

cooling time) to avoid thermal stress and damage.

11. Ensure the correct solder meniscus height and solder quantity.

12. Ensure correct dosing of the cement.

13. Ceramic capacitors with external silver-palladium terminations are intended for conductive

adhesion - they are not suited for lead-free soldering processes.

This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.

Please read Cautions and warnings and

Important notes at the end of this document.

Page 13 of 16

Multilayer ceramic capacitors

MLSC; X7R

Symbols and terms

Symbol

A

English

Area

German

Fläche

C

Capacitance

Kapazität

C₀

C₁

C_R

C₂₀

C₂₅

∆C

Initial (original) capacitance

Capacitance value after one hour's use Kapazitätswert nach einer Stunde

Rated capacitance

Capacitance at 20 °C

Capacitance at 25 °C

Capacitance change

Anfangskapazität

Nennkapazität

Kapazität bei 20 °C

Kapazität bei 25 °C

Kapazitätsänderung

D

Bending displacement

Durchbiegung

E_a

Activation energy

Aktivierungsenergie

ESR

Equivalent series resistance

Ersatzserienwiderstand

F

Force

Kraft

f

Frequency

Frequenz

f_meas

f_res

Measuring frequency

Self-resonant frequency

Messfrequenz

Eigenresonanzfrequenz

I_test

k

Test current

Prüfstrom

Ageing constant

Inductance

Alterungskonstante

Induktivität

L

N

Quantity (integer values)

Power dissipation or loss

Anzahl (ganzzahliger Wert)

Verlustleistung

P_loss

Q_el

Q

Electrical charge

Quality

Elektrische Ladung

Güte

R_ins

R_P

R_S

Insulation resistance

Parallel resistance

Series resistance (circuit resistance)

Isolationswiderstand

Parallelwiderstand

Serienwiderstand

S_V

Rate of rise of a voltage pulse

Flankensteilheit eines Spannungsimpulses

T

Temperature

Temperatur

T_meas

T_op

T_ref

T_test

t

Measuring temperature

Operating temperature

Reference temperature

Test temperature

Time

Messtemperatur

Betriebstemperatur

Bezugstemperatur

Prüftemperatur

Zeit

t_r

Rise time of a voltage pulse

Test duration

Dissipation factor

Anstiegszeit eines Spannungsimpulses

Prüfdauer

Verlustfaktor

t_test

tan δ

Please read Cautions and warnings and

Important notes at the end of this document.

Page 14 of 16

Multilayer ceramic capacitors

MLSC; X7R

Symbol

English

German

V

Voltage

Spannung

V₀

Initial (original) voltage (basic voltage

level)

Measuring voltage

Rated voltage

Anfangsspannung

(Spannungsgrundpegel)

Messspannung

V_meas

V_R

Nennspannung

V_S

V_RMS

Amplitude of a voltage pulse

Measuring (root-mean-square or

effective) AC voltage

Test voltage

Hub des Spannungsimpulses

Effektivspannung

V_test

|Z|

Prüfspannung

Magnitude of impedance (AC

resistance)

Betrag der Impedanz

(Wechselstromwiderstand)

α

Temperature coefficient

Temperaturkoeffizient

ε₀

ε_r

Absolute dielectric constant

Relative dielectric constant

Absolute Dielektrizitätskonstante

Relative Dielektrizitätskonstante

λ

τ

Failure rate

Ausfallrate

Time constant

Zeitkonstante

Abbreviations / Notes

Symbol

English

German

Lead spacing (in mm)

Surface-mounted devices

Rastermaß (in mm)

Oberflächenmontierbares Bauelement

*

To be replaced by a number in ordering Platzhalter für Zahl im Bestellnummern-

codes, type designations etc.

code oder für die Typenbezeichnung.

Platzhalter für einen Buchstaben.

Alle Maße sind in mm angegeben.

+

To be replaced by a letter.

All dimensions are given in mm.

The commas used in numerical values Verwendete Kommas in Zahlenwerten

denote decimal points. bezeichnen Dezimalpunkte.

Please read Cautions and warnings and

Important notes at the end of this document.

Page 15 of 16

Important notes

The following applies to all products named in this publication:

1. Some parts of this publication contain statements about the suitability of our products for

certain areas of application. These statements are based on our knowledge of typical re-

quirements that are often placed on our products in the areas of application concerned. We

nevertheless expressly point out that such statements cannot be regarded as binding

statements about the suitability of our products for a particular customer application.

As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar

with them than the customers themselves. For these reasons, it is always ultimately incum-

bent on the customer to check and decide whether an EPCOS product with the properties de-

scribed in the product specification is suitable for use in a particular customer application.

2. We also point out that in individual cases, a malfunction of electronic components or

failure before the end of their usual service life cannot be completely ruled out in the

current state of the art, even if they are operated as specified. In customer applications

requiring a very high level of operational safety and especially in customer applications in

which the malfunction or failure of an electronic component could endanger human life or

health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by

means of suitable design of the customer application or other action taken by the customer

(e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by

third parties in the event of malfunction or failure of an electronic component.

3. The warnings, cautions and product-specific notes must be observed.

4. In order to satisfy certain technical requirements, some of the products described in this

publication may contain substances subject to restrictions in certain jurisdictions (e.g.

because they are classed as hazardous). Useful information on this will be found in our Ma-

terial Data Sheets on the Internet (www.epcos.com/material). Should you have any more de-

tailed questions, please contact our sales offices.

5. We constantly strive to improve our products. Consequently, the products described in this

publication may change from time to time. The same is true of the corresponding product

specifications. Please check therefore to what extent product descriptions and specifications

contained in this publication are still applicable before or when you place an order. We also

reserve the right to discontinue production and delivery of products. Consequently, we

cannot guarantee that all products named in this publication will always be available. The

aforementioned does not apply in the case of individual agreements deviating from the fore-

going for customer-specific products.

6. Unless otherwise agreed in individual contracts, all orders are subject to the current ver-

sion of the "General Terms of Delivery for Products and Services in the Electrical In-

dustry" published by the German Electrical and Electronics Industry Association

(ZVEI).

7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CSMP, CSSP, CTVS, DSSP,

MiniBlue, MKK, MLSC, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, SIFERRIT,

SIFI, SIKOREL, SilverCap, SIMDAD, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse,

WindCap are trademarks registered or pending in Europe and in other countries. Further

information will be found on the Internet at www.epcos.com/trademarks.

Page 16 of 16


型号：	B37931X5223K070
厂家：	EPCOS
描述：	Multilayer ceramic capacitors 多层陶瓷电容器电容器陶瓷电容器
文件：	总17页 (文件大小：794K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

B37931X5223K070 [EPCOS]

相关型号：

B37931X5223K072

B37931X5332K060

B37931X5332K070

B37931X5472K060

B37931X5472K070

B37931X5682K060

B37931X5682K070

B37932

B37932-K0104-M01

B37932-K0104-M60

B37932-K0223-M01

B37932-K0223-M60