B37933K5000B770 [EPCOS]
Multilayer ceramic capacitors; 多层陶瓷电容器型号: | B37933K5000B770 |
厂家: | EPCOS |
描述: | Multilayer ceramic capacitors |
文件: | 总22页 (文件大小:717K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Multilayer ceramic capacitors
Chip, HQF
Series/Type:
Chip
Date:
February 2009
The following products presented in this data sheet are being withdrawn.
Substitute Products: See www.epcos.com/withdrawal_mlcc
Ordering Code
Substitute Product
Date of
Withdrawal
Deadline Last
Orders
Last Shipments
B37923K5100J070
B37923K5120J060
B37923K5120J070
2009-06-26
2009-06-26
2009-06-26
2010-06-30
2010-06-30
2010-06-30
2010-12-31
2010-12-31
2010-12-31
© EPCOS AG 2009. Reproduction, publication and dissemination of this publication, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.
Ordering Code
Substitute Product
Date of
Withdrawal
Deadline Last
Orders
Last Shipments
B37933K5000B460
B37923K5150J060
B37933K5000B470
B37923K5150J070
B37933K5000B560
B37923K5180J060
B37933K5000B570
B37923K5180J070
B37933K5000B660
B37923K5220J060
B37933K5000B670
B37923K5220J070
B37933K5000B760
B37933K5000B770
B37933K5000B860
B37933K5000B870
B37933K5000B960
B37933K5000B970
B37933K5010B060
B37933K5010B070
B37933K5010B260
B37933K5010B270
B37933K5010B560
B37933K5010B570
B37933K5010B860
B37933K5010B870
B37933K5020B260
B37933K5020B270
B37933K5020B760
B37933K5020B770
B37933K5030B360
B37933K5030B370
B37933K5030B960
B37933K5030B970
B37933K5040C760
B37933K5040C770
B37933K5050C660
B37933K5050C670
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
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2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
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2010-06-30
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2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
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2010-12-31
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2010-12-31
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2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
Ordering Code
Substitute Product
Date of
Withdrawal
Deadline Last
Orders
Last Shipments
B37933K5060C860
B37933K5060C870
B37933K5080C260
B37933K5080C270
B37933K5100J060
B37933K5100J070
B37933K5120J060
B37933K5120J070
B37933K5150J060
B37933K5150J070
B37933K5180J060
B37933K5180J070
B37933K5220J060
B37933K5220J070
B37933K5270J060
B37933K5270J070
B37933K5820J060
B37933K5820J070
B37923K5000B360
B37923K5000B370
B37923K5000B460
B37923K5000B470
B37923K5000B560
B37923K5000B570
B37923K5000B660
B37923K5000B670
B37923K5000B760
B37923K5000B770
B37923K5000B860
B37923K5000B870
B37923K5000B960
B37923K5000B970
B37923K5010B060
B37923K5010B070
B37923K5010B260
B37923K5010B270
B37923K5010B560
B37923K5010B570
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
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2010-06-30
2010-06-30
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2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
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2010-12-31
2010-12-31
2010-12-31
2010-12-31
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2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
Ordering Code
Substitute Product
Date of
Withdrawal
Deadline Last
Orders
Last Shipments
B37923K5010B860
B37923K5010B870
B37923K5020B260
B37923K5020B270
B37923K5020B760
B37923K5020B770
B37923K5030B360
B37923K5030B370
B37923K5030B960
B37923K5030B970
B37923K5040C760
B37923K5040C770
B37923K5050C660
B37923K5050C670
B37923K5060C860
B37923K5060C870
B37923K5080C260
B37923K5080C270
B37923K5100J060
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
For further information please contact your nearest EPCOS sales office, which will also support
you in selecting a suitable substitute. The addresses of our worldwide sales network are
presented at www.epcos.com/sales.
Multilayer ceramic capacitors
HQF
Chip
HQF
Ordering code system
B37923
K
5
100
J
0
60
Type and size
Chip size (inch/mm) = Temperature characteristic HQF
0402/1005 ꢀ B37923
0603/1608 ꢀ B37933
Termination
Standard:
K ꢀ nickel barrier for all case sizes
Rated voltage
5 (Code) ꢀ 50 VDC
Capacitance, coded (example)
100 ꢀ 10 ꢁ 100 pF = 10 pF
Capacitance tolerance
CR < 10 pF:
B
C
D
C
F
ꢀ ±0.1 pF (standard for capacitance values ≤ 3.9 pF)
ꢀ ±0.25 pF (standard for capacitance values ≤ 8.2 pF)
ꢀ ±0.5 pF
R ≥ 10 pF:
ꢀ ±1%
G
J
K
ꢀ ±2%
ꢀ ±5% (standard)
ꢀ ±10%
Decimal place for cap. values < 10 pF, otherwise not used
Packaging
60 ꢀ cardboard tape, 180-mm reel
70 ꢀ cardboard tape, 330-mm reel
Please read Cautions and warnings and
Page 2 of 19
Important notes at the end of this document.
Multilayer ceramic capacitors
HQF
Features
Ultra-low ESR and high Q factor
Tight capacitance tolerances
High stability with respect to time,
temperature (TCC: 0 ± 60 ppm/°C), frequency and voltage
Class 1 characteristic with copper inner electrodes
Excellent attenuation
High self-resonant frequency
Lower power dissipation / Less energy absorption
Based on AEC-Q200 Rev-C
Applications
High-frequency applications
Matching circuits
Cellular communication, Bluetooth, DECT
Cable TV, satellite TV (LNB), GPS, satellite radio
Filters, RF amplifiers, VCOs
Termination
Nickel barrier terminations (Ni) for lead-free soldering
Options
Alternative capacitance values and tolerances available on request
Delivery mode
Cardboard tape, 180-mm and 330-mm reel available
Electrical data
Temperature characteristic
Climatic category
Standard
C0H
55/125/56
EIA
(IEC 60068-1)
Dielectric
Rated voltage
Class 1
50
VR
VDC
VDC
Test voltage
Vtest 2.5 ꢁ VR/5 s
Capacitance range
Temperature coefficient
Dissipation factor
Insulation resistance1)
Insulation resistance1)
Time constant1)
CR
0.3 pF ... 82 pF
0 ±60 ꢁ 10-6/K
(limit value)
(at +25 °C)
(at +125 °C)
(at +25 °C)
(at +125 °C)
tan δ < 1.0 ꢁ 10-3
Rins
Rins
τ
> 105
> 104
> 1000
> 100
MΩ
MΩ
s
Time constant1)
τ
s
Operating temperature range
Ageing
Top
ꢂ55 ... +125
none
°C
1) For CR >10 nF the time constant τ = C ꢁ Rins is given.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 3 of 19
Multilayer ceramic capacitors
HQF
Capacitance tolerances
CR
CR ≤ 3.9 pF
4.7 pF ≤ CR ≤ 8.2 pF
Code letter
Tolerance
B (standard)
C
B
C (standard)
D
±0.1 pF
±0.25 pF
±0.1 pF
±0.25 pF
±0.5 pF
CR
CR ≥ 10 pF
Code letter
Tolerance
F
G
J (standard)
K
±1%
±2%
±5%
±10%
Dimensional drawing
Dimensions (mm)
Case size
(inch) 0402
(mm) 1005
0603
1608
l
1.0 ±0.10
0.5 ±0.05
0.5 ±0.05
0.1 ꢂ0.40
1.6 ±0.15
0.8 ±0.10
0.8 ±0.10
0.1 ꢂ0.40
w
th
k
Tolerances to CECC 32101-801
Please read Cautions and warnings and
Important notes at the end of this document.
Page 4 of 19
Multilayer ceramic capacitors
HQF
Recommended solder pad
Recommended dimensions (mm) for reflow soldering
Case size
(inch/mm)
0402/1005
0603/1608
Type
A
C
D
single chip
single chip
0.35 ... 0.45 1.0 ... 1.4
0.4 ... 0.6
0.6 ... 0.8
0.6 ... 0.7
1.8 ... 2.2
Recommended dimensions (mm) for wave soldering
Case size
(inch/mm)
0603/1608
Type
A
C
D
single chip
0.8 ... 0.9
2.2 ... 2.8
0.6 ... 0.8
Termination
Please read Cautions and warnings and
Important notes at the end of this document.
Page 5 of 19
Multilayer ceramic capacitors
HQF
Product range for HQF chip capacitors
Size
inch (l x w)
0402
0603
mm (l x w)
1005
1608
Type
B37923
50
B37933
50
CR \ VR (VDC)
0.3 pF
0.4 pF
0.5 pF
0.6 pF
0.7 pF
0.8 pF
0.9 pF
1.0 pF
1.2 pF
1.5 pF
1.8 pF
2.2 pF
2.7 pF
3.3 pF
3.9 pF
4.7 pF
5.6 pF
6.8 pF
8.2 pF
10 pF
12 pF
15 pF
18 pF
22 pF
27 pF
82 pF
Please read Cautions and warnings and
Important notes at the end of this document.
Page 6 of 19
Multilayer ceramic capacitors
HQF
Ordering codes and packing for HQF, 50 VDC, nickel barrier terminations
Chip thickness
Cardboard tape,
180-mm reel
Cardboard tape,
330-mm reel
** ꢀ 60
** ꢀ 70
CR
Ordering code
mm
pcs./reel
pcs./reel
Case size 0402, 50 VDC
0.3 pF B37923K5000B3** 0.5 ±0.05
0.4 pF B37923K5000B4** 0.5 ±0.05
0.5 pF B37923K5000B5** 0.5 ±0.05
0.6 pF B37923K5000B6** 0.5 ±0.05
0.7 pF B37923K5000B7** 0.5 ±0.05
0.8 pF B37923K5000B8** 0.5 ±0.05
0.9 pF B37923K5000B9** 0.5 ±0.05
1.0 pF B37923K5010B0** 0.5 ±0.05
1.2 pF B37923K5010B2** 0.5 ±0.05
1.5 pF B37923K5010B5** 0.5 ±0.05
1.8 pF B37923K5010B8** 0.5 ±0.05
2.2 pF B37923K5020B2** 0.5 ±0.05
2.7 pF B37923K5020B7** 0.5 ±0.05
3.3 pF B37923K5030B3** 0.5 ±0.05
3.9 pF B37923K5030B9** 0.5 ±0.05
4.7 pF B37923K5040C7** 0.5 ±0.05
5.6 pF B37923K5050C6** 0.5 ±0.05
6.8 pF B37923K5060C8** 0.5 ±0.05
8.2 pF B37923K5080C2** 0.5 ±0.05
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
10 pF
12 pF
15 pF
18 pF
22 pF
B37923K5100J0** 0.5 ±0.05
B37923K5120J0** 0.5 ±0.05
B37923K5150J0** 0.5 ±0.05
B37923K5180J0** 0.5 ±0.05
B37923K5220J0** 0.5 ±0.05
Please read Cautions and warnings and
Important notes at the end of this document.
Page 7 of 19
Multilayer ceramic capacitors
HQF
Ordering codes and packing for HQF, 50 VDC, nickel barrier terminations
Chip thickness
Cardboard tape,
180-mm reel
Cardboard tape,
330-mm reel
** ꢀ 60
** ꢀ 70
CR
Ordering code
mm
pcs./reel
pcs./reel
Case size 0603, 50 VDC
0.4 pF B37933K5000B4** 0.8 ±0.1
0.5 pF B37933K5000B5** 0.8 ±0.1
0.6 pF B37933K5000B6** 0.8 ±0.1
0.7 pF B37933K5000B7** 0.8 ±0.1
0.8 pF B37933K5000B8** 0.8 ±0.1
0.9 pF B37933K5000B9** 0.8 ±0.1
1.0 pF B37933K5010B0** 0.8 ±0.1
1.2 pF B37933K5010B2** 0.8 ±0.1
1.5 pF B37933K5010B5** 0.8 ±0.1
1.8 pF B37933K5010B8** 0.8 ±0.1
2.2 pF B37933K5020B2** 0.8 ±0.1
2.7 pF B37933K5020B7** 0.8 ±0.1
3.3 pF B37933K5030B3** 0.8 ±0.1
3.9 pF B37933K5030B9** 0.8 ±0.1
4.7 pF B37933K5040C7** 0.8 ±0.1
5.6 pF B37933K5050C6** 0.8 ±0.1
6.8 pF B37933K5060C8** 0.8 ±0.1
8.2 pF B37933K5080C2** 0.8 ±0.1
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
10 pF
12 pF
15 pF
18 pF
22 pF
27 pF
82 pF
B37933K5100J0** 0.8 ±0.1
B37933K5120J0** 0.8 ±0.1
B37933K5150J0** 0.8 ±0.1
B37933K5180J0** 0.8 ±0.1
B37933K5220J0** 0.8 ±0.1
B37933K5270J0** 0.8 ±0.1
B37933K5820J0** 0.8 ±0.1
Please read Cautions and warnings and
Important notes at the end of this document.
Page 8 of 19
Multilayer ceramic capacitors
HQF
Typical RF performance for HQF capacitors, case size 0402, 50 VDC
1)
2)
Capacitance
pF
fres
ESR @ 1 GHz2)
mΩ
Q @ 1 GHz2)
ESR @ fres
mΩ
MHz
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
23400
20350
19700
17400
15100
14450
12600
12000
10600
8900
7100
6400
6000
5500
5350
4650
3950
4100
3650
3350
3350
2600
2300
2200
560
490
440
405
375
355
335
320
295
265
245
225
205
185
170
155
145
130
120
110
102
92
920
805
720
650
600
560
520
490
440
390
350
310
275
245
225
200
175
155
140
120
104
88
710
605
535
485
445
415
385
365
330
290
265
235
210
190
175
155
140
125
115
105
94
12
15
82
18
84
70
74
22
78
56
66
1) Measured with impedance analyser E4991 A, parts not soldered.
2) Measured with network analyser HP 8753D, parts soldered.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 9 of 19
Multilayer ceramic capacitors
HQF
Typical RF performance for HQF capacitors, case size 0603, 50 VDC
3)
4)
Capacitance
pF
fres
ESR @ 1 GHz4)
mΩ
Q @ 1 GHz4)
ESR @ fres
mΩ
MHz
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
17800
17100
13600
12200
11400
10600
9600
8800
7900
6900
5750
5100
4700
4150
3550
3130
2850
2730
2580
2400
2150
2050
1870
1780
445
400
385
345
325
315
300
275
250
240
215
200
185
175
165
150
140
130
120
110
102
96
860
805
755
635
595
560
525
455
395
360
305
270
235
210
185
160
135
115
96
595
540
510
440
410
390
365
335
300
285
250
235
210
200
185
170
155
140
130
118
108
100
90
12
76
15
62
18
50
22
88
34
27
80
26
82
3)
4)
Capacitance
pF
fres
ESR @ 1 GHz4)
mΩ
Q @ 1 GHz4)
105
ESR @ fres
mΩ
MHz
930
82
52
52
3) Measured with impedance analyser E4991 A, parts not soldered.
4) Measured with network analyser HP 8753D, parts soldered.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 10 of 19
Multilayer ceramic capacitors
HQF
Typical characteristics for case size 04021)
ESR versus capacitance C
ESR versus capacitance C
(for not soldered parts)
at self-resonant frequency (for soldered parts)
ESR versus frequency f
Self-resonant frequency fres versus
capacitance C
1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 11 of 19
Multilayer ceramic capacitors
HQF
Typical characteristics for case size 04021)
Q factor versus capacitance C
Q factor versus frequency f
1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 12 of 19
Multilayer ceramic capacitors
HQF
Typical characteristics for case size 06031)
ESR versus capacitance C
ESR versus capacitance C
(for not soldered parts)
at self-resonant frequency (for soldered parts)
ESR versus frequency f
Self-resonant frequency fres versus
capacitance C
1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 13 of 19
Multilayer ceramic capacitors
HQF
Typical characteristics for case size 06031)
Q factor versus capacitance C
Q factor versus frequency f
1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 14 of 19
Multilayer ceramic capacitors
HQF
Cautions and warnings
How to select ceramic capacitors
Remember the following when selecting ceramic capacitors:
1. Ceramic capacitors that must fulfill high quality requirements must be qualified based on
AEC-Q200 Rev-C.
2. When ceramic capacitors are used at the connection to a battery or power supply (e.g. clamp
15 or 30 in an automobile) or for safety-relevant applications, two single ceramic capacitors
should be connected in series. Alternatively a ceramic capacitor with integrated series circuits
should be used in order to reduce the possibility of a short circuit caused by a fracture. The
MLSC from EPCOS contains such a series circuit in a single component.
3. The use of multilayer varistors (MLVs) is recommended for ESD protection (see chapter
“Effects on mechanical, thermal and electrical stress”, section 1.4).
4. Additional stress factors such as continuous operating voltage or application-specific derating
must be taken into account in the selection of components (refer to chapter “Reliability”).
Recommendations for the circuit board design
1. Components with an optimized geometrical design are preferable where permitted by the
application.
2. Use at least FR4 circuit board material.
3. Geometrically optimized circuit boards are preferable, especially those that cannot be
deformed.
4. Ceramic capacitors should be placed with a sufficient minimum distance from the edge of a
circuit board. High bending forces may be exerted there when boards are separated and
during further processing of a board (e.g. when incorporating it in a housing).
5. Ceramic capacitors should always be placed parallel to the possible bending axis of a circuit
board.
6. Screw connections should not be used to fix a board or connect several boards. Components
should not be placed near screw holes. If screw connections are unavoidable, they should be
cushioned, for instance using rubber pads.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 15 of 19
Multilayer ceramic capacitors
HQF
Recommendations for processing
1. Ensure correct positioning of a ceramic capacitor on the solder pad.
2. Be careful when using casting, injection-molded and molding compounds and cleaning
agents. They can damage a capacitor.
3. Support a circuit board and reduce placement forces.
4. Do not straighten a board (manually) if it is distorted by soldering.
5. Separate boards with a peripheral saw, or preferably with a milling head (no dicing or
breaking).
6. Be careful when subsequently placing heavy or leaded components (e.g. transformers or
snap-in components) because of the danger of bending and fracture.
7. When testing, transporting, packing or inserting a board, avoid any deformation of it so that
components are not damaged.
8. Avoid excessive force when plugging a connector into a device soldered onto a board.
9. Only mount ceramic capacitors using the soldering process (reflow or wave) that is
permissible for them (see chapter “Soldering directions”).
10. When soldering, select the softest solder profile possible (heating time, peak temperature,
cooling time) to avoid thermal stress and damage.
11. Ensure the correct solder meniscus height and solder quantity.
12. Ensure correct dosing of the cement.
13. Ceramic capacitors with external silver-palladium terminations are intended for conductive
adhesion - they are not suited for lead-free soldering processes.
This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 16 of 19
Multilayer ceramic capacitors
HQF
Symbols and terms
Symbol
A
English
Area
German
Fläche
C
Capacitance
Kapazität
C0
C1
CR
C20
C25
∆C
Initial (original) capacitance
Capacitance value after one hour's use Kapazitätswert nach einer Stunde
Rated capacitance
Capacitance at 20 °C
Capacitance at 25 °C
Capacitance change
Anfangskapazität
Nennkapazität
Kapazität bei 20 °C
Kapazität bei 25 °C
Kapazitätsänderung
D
Bending displacement
Durchbiegung
Ea
Activation energy
Aktivierungsenergie
ESR
Equivalent series resistance
Ersatzserienwiderstand
F
Force
Kraft
f
Frequency
Frequenz
fmeas
fres
Measuring frequency
Self-resonant frequency
Messfrequenz
Eigenresonanzfrequenz
Itest
k
Test current
Prüfstrom
Ageing constant
Inductance
Alterungskonstante
Induktivität
L
N
Quantity (integer values)
Power dissipation or loss
Anzahl (ganzzahliger Wert)
Verlustleistung
Ploss
Qel
Q
Electrical charge
Quality
Elektrische Ladung
Güte
Rins
RP
RS
Insulation resistance
Parallel resistance
Series resistance (circuit resistance)
Isolationswiderstand
Parallelwiderstand
Serienwiderstand
SV
Rate of rise of a voltage pulse
Flankensteilheit eines Spannungsimpulses
T
Temperature
Temperatur
Tmeas
Top
Tref
Ttest
t
Measuring temperature
Operating temperature
Reference temperature
Test temperature
Time
Messtemperatur
Betriebstemperatur
Bezugstemperatur
Prüftemperatur
Zeit
tr
Rise time of a voltage pulse
Test duration
Dissipation factor
Anstiegszeit eines Spannungsimpulses
Prüfdauer
Verlustfaktor
ttest
tan δ
Please read Cautions and warnings and
Important notes at the end of this document.
Page 17 of 19
Multilayer ceramic capacitors
HQF
Symbol
English
German
V
Voltage
Spannung
V0
Initial (original) voltage (basic voltage
level)
Measuring voltage
Rated voltage
Anfangsspannung
(Spannungsgrundpegel)
Messspannung
Vmeas
VR
Nennspannung
VS
VRMS
Amplitude of a voltage pulse
Measuring (root-mean-square or
effective) AC voltage
Test voltage
Hub des Spannungsimpulses
Effektivspannung
Vtest
|Z|
Prüfspannung
Magnitude of impedance (AC
resistance)
Betrag der Impedanz
(Wechselstromwiderstand)
α
Temperature coefficient
Temperaturkoeffizient
ε0
εr
Absolute dielectric constant
Relative dielectric constant
Absolute Dielektrizitätskonstante
Relative Dielektrizitätskonstante
λ
τ
Failure rate
Ausfallrate
Time constant
Zeitkonstante
Abbreviations / Notes
Symbol
English
German
Lead spacing (in mm)
Surface-mounted devices
Rastermaß (in mm)
Oberflächenmontierbares Bauelement
*
To be replaced by a number in ordering Platzhalter für Zahl im Bestellnummern-
codes, type designations etc.
code oder für die Typenbezeichnung.
Platzhalter für einen Buchstaben.
Alle Maße sind in mm angegeben.
+
To be replaced by a letter.
All dimensions are given in mm.
The commas used in numerical values Verwendete Kommas in Zahlenwerten
denote decimal points. bezeichnen Dezimalpunkte.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 18 of 19
Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical re-
quirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application.
As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar
with them than the customers themselves. For these reasons, it is always ultimately incum-
bent on the customer to check and decide whether an EPCOS product with the properties de-
scribed in the product specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or
failure before the end of their usual service life cannot be completely ruled out in the
current state of the art, even if they are operated as specified. In customer applications
requiring a very high level of operational safety and especially in customer applications in
which the malfunction or failure of an electronic component could endanger human life or
health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by
means of suitable design of the customer application or other action taken by the customer
(e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by
third parties in the event of malfunction or failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as hazardous). Useful information on this will be found in our Ma-
terial Data Sheets on the Internet (www.epcos.com/material). Should you have any more de-
tailed questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order. We also
reserve the right to discontinue production and delivery of products. Consequently, we
cannot guarantee that all products named in this publication will always be available. The
aforementioned does not apply in the case of individual agreements deviating from the fore-
going for customer-specific products.
6. Unless otherwise agreed in individual contracts, all orders are subject to the current ver-
sion of the "General Terms of Delivery for Products and Services in the Electrical In-
dustry" published by the German Electrical and Electronics Industry Association
(ZVEI).
7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CSMP, CSSP, CTVS, DSSP,
MiniBlue, MKK, MLSC, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, SIFERRIT,
SIFI, SIKOREL, SilverCap, SIMDAD, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse,
WindCap are trademarks registered or pending in Europe and in other countries. Further
information will be found on the Internet at www.epcos.com/trademarks.
Page 19 of 19
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