B37941K5224K070_技术文档

Multilayer Ceramic Capacitors

Series/Type: B37931

The following products presented in this data sheet are being withdrawn.

Ordering Code

Substitute Product

Date of Withdrawal Deadline Last

Orders

Last Shipments

B37931K9224K060

B37931K9224K070

B37931K0224K060

2008-08-01

2009-07-31

2009-10-31

Ordering Code

Substitute Product

Date of Withdrawal Deadline Last

Orders

Last Shipments

B37931K0224K070

B37931K5104K060

B37931K5104K070

B37941K9224K060

B37941K9224K070

B37941K9334K060

B37941K9334K070

B37941K9474K060

B37941K9474K070

B37941K9105K062

B37941K9105K072

B37941K0224K060

B37941K0224K070

B37941K0334K060

B37941K0334K070

B37941K0474K060

B37941K0474K070

B37941K0105K062

B37941K0105K072

B37941K5224K060

B37941K5224K070

B37941K5334K062

B37941K5334K072

B37941K5474K062

B37941K5474K072

B37941K5105K062

B37941K5105K072

B37872K9105K062

B37872K9105K072

B37872K9225K062

B37872K9225K072

B37872K0105K062

B37872K0105K072

B37872K0225K062

B37872K0225K072

B37872K5105K062

B37872K5105K072

2008-08-01

2009-07-31

2009-10-31

For further information please contact your nearest EPCOS sales office, which will also support you in selecting a

suitable substitute. The addresses of our worldwide sales network are presented at www.epcos.com/sales.

Multilayer ceramic capacitors

HighCV; X7R

Chip

Ordering code system

B37941

K

5

105

K

0

62

Packaging

^

60 cardboard tape, 180-mm reel

^

62 blister tape, 180-mm reel

^

70 cardboard tape, 360-mm reel

^

72 blister tape, 360-mm reel

Internal coding

Capacitance tolerance

^

K

10% (standard)

4

^

Capacitance, coded 474 47 · 10 pF = 470 nF

(example)

5

105 10 · 10 pF = 1 ꢀF

Rated voltage

Rated voltage [VDC] 16

Code

25

0

50

5

9

^

nickel barrier for all case sizes

Standard:

K

Termination

Type and size

Chip size

(inch / mm)

Temperature characteristic

X7R

0603 / 1608

0805 / 2012

1206 / 3216

B37931

B37941

B37872

Please read Cautions and warnings and

Important notes at the end of this document.

2

10/06

Multilayer ceramic capacitors

HighCV; X7R

Chip

Features

■ Characteristic of class 2 dielectric

■ Highest possible capacitance to rated voltage ratio

■ High capacitance values up to 2.2 ꢀF

■ Voltage rating from 16 V to 50 V

■ To AEC-Q200

Applications

■ Coupling and bypass filters

Termination

■ For soldering: Nickel barrier terminations (Ni)

Options

■ Other capacitance values on request

Delivery mode

■ Cardboard and blister tape (blister tape for chip thickness O1.2 M0.1 mm)

Electrical data

Temperature characteristic

Max. relative capacitance change

within –55 LC to +125 LC

Climatic category (IEC 60068-1)

Standard

X7R

ꢁC/C

M15

55/125/56

EIA

%

Dielectric

Class 2

Rated voltage¹⁾

Test voltage

Capacitance range

Dissipation factor (limit value)

V_R

V_test

C_R

16; 25; 50

2.5 · V_R/5 s

100 nF … 2.2 ꢀF

<50 · 10^–3for ?25 V

<25 · 10^–3for 50 V

>10⁴

>500

–55 … +125

yes

VDC

tan ꢂ

Insulation resistance²⁾at +25 LC

Time constant²⁾at +25 LC

Operating temperature range

Ageing³⁾

R_ins

ꢄ

Mꢃ

s

LC

T_op

1) Note: No operation on AC line.

2) For C >10 nF the time constant ꢀ = C · R is given.

R

ins

3) Refer to chapter “General technical information”, “Ageing”.

Please read Cautions and warnings and

Important notes at the end of this document.

3

10/06

Multilayer ceramic capacitors

HighCV; X7R

High

CV

Capacitance tolerances

Code letter

Tolerance

K

(standard)

M10%

Dimensional drawing

b

k

KKE0329-N

Dimensions (mm)

Case size (inch) 0603

(mm) 1608

0805

2012

1206

3216

l

1.6 M0.15 2.00 M0.20 3.2 M0.20

0.8 M0.10 1.25 M0.15 1.6 M0.15

0.8 M0.10 1.35 max. 1.80 max.

b

s

k

0.1 –0.4

0.13 –0.75 0.25 –0.75

Tolerances to CECC 32101-801

Please read Cautions and warnings and

Important notes at the end of this document.

4

10/06

Multilayer ceramic capacitors

HighCV; X7R

High

CV

Recommended solder pad

D

KKE0308-1

Recommended dimensions (mm) for reflow soldering

Case size

(inch/mm)

Type

A

C

D

0603/1608

0805/2012

1206/3216

single chip

0.6 … 0.7

0.8 … 0.9

1.8 … 2.20

2.2 … 2.60

3.8 … 4.32

0.6 … 0.8

0.8 … 1.1

1.0 … 1.4

Recommended dimensions (mm) for wave soldering

Case size

(inch/mm)

Type

A

C

D

0603/1608

0805/2012

1206/3216

single chip

0.8 … 0.9

0.9 … 1.0

1.0 … 1.1

2.2 … 2.8

2.8 … 3.2

4.2 … 4.8

0.6 … 0.8

0.8 … 1.1

1.0 … 1.4

Termination

Ceramic body

Termination

(nickel barrier)

Inner electrode

Ni

Substrate electrode

Intermediate electrode

External electrode

Cu

Ni

Sn

KKE0342-F

Please read Cautions and warnings and

Important notes at the end of this document.

5

10/06

Multilayer ceramic capacitors

HighCV; X7R

High

CV

Product range for HighCV chip capacitors, X7R

1)

Size

inch

0603

0805

1206

mm

1608

2012

3216

Type

B37931

B37941

B37872

V (VDC)

R

16

25

50

16

25

50

16

25

50

C

R

100 nF

220 nF

330 nF

470 nF

1.0 ꢀF

2.2 ꢀF

1) l P b (inch) / l P b (mm)

Please read Cautions and warnings and

Important notes at the end of this document.

6

10/06

Multilayer ceramic capacitors

HighCV; X7R; 0603 to 1206

High

CV

Ordering codes and packing for HighCV, X7R, 16, 25 and 50 VDC,

nickel barrier terminations

Chip thickness

Cardboard tape, Cardboard tape,

b 180-mm reel

b 360-mm reel

^

** 60

** 70

1)

C

Ordering code

mm

pcs/reel

16000

R

Case size 0603, 16 VDC

220. nF

B37931K9224K0**

0.8 M0.1

4000

Case size 0603, 25 VDC

220. nF

B37931K0224K0**

4000

Case size 0603, 50 VDC

100. nF

B37931K5104K0**

4000

Case size 0805, 16 VDC

220. nF

330. nF

470. nF

1.0 ꢀF

B37941K9224K0**

0.8 M0.1

1.2 M0.1

4000

16000

B37941K9334K0**

B37941K9474K0**

B37941K9105K0**

2)

3)

3000

12000

Case size 0805, 25 VDC

220. nF

330. nF

470. nF

1.0 ꢀF

B37941K0224K0**

0.8 M0.1

1.2 M0.1

4000

16000

B37941K0334K0**

B37941K0474K0**

B37941K0105K0**

2)

3)

3000

12000

Case size 0805, 50 VDC

220. nF

330. nF

470. nF

1.0 ꢀF

B37941K5224K0**

0.8 M0.1

1.2 M0.1

4000

3000

16000

12000

2)

3)

B37941K5334K0**

B37941K5474K0**

B37941K5105K0**

2)

3)

2)

3)

Case size 1206, 16 VDC

2)

3)

1.0 ꢀF

2.2 ꢀF

B37872K9105K0**

B37872K9225K0**

1.2 M0.1

3000

12000

2)

3)

Case size 1206, 25 VDC

2)

3)

1.0 ꢀF

2.2 ꢀF

B37872K0105K0**

B37872K0225K0**

1.2 M0.1

3000

12000

2)

3)

Case size 1206, 50 VDC

2)

3)

1.0 ꢀF

B37872K5105K0**

1.2 M0.1

3000

12000

1) Other capacitance values on request.

2) Blister tape, 180-mm reel, ordering code ** 62

3) Blister tape, 330-mm reel, ordering code ** 72

^

Please read Cautions and warnings and

Important notes at the end of this document.

7

10/06

Multilayer ceramic capacitors

HighCV; X7R

High

CV

1)

Typical characteristics for HighCV X7R

Capacitance change ꢁC/C versus

25

0

temperature T

superimposed DC voltage V

KKE0395-6

KKE0396-E

15

20

%

∆C

C₂₅

∆C

C₀

5

0

^_5

^_10

^_20

^_10

^_15

^_20

^_25

^_30

^_35

^_40

^_45

^_50

1 µF/50 V/size 1206

^_30

^_40

^_50

^_60

^_70

^_80

^_90

^_100

1 µF/25 V/size 0805

_

^_60 40 20

0

20 40 60 80 100 C 140

0

5

10 15 20 25 30 35 40 V 50

V

˚

T

Capacitance change ꢁC/C versus

Dissipation factor tan ꢂ versus

1

time t

temperature T

^_1

KKE0494-4

KKE0397-M

10

%

∆C

C₁

tan δ

5

0

^_5

^_2

10

^_10

^_15

^_20

^_3

10

^_60 40 20

0

20 40 60 80 100 C 140

_

10⁰

10¹

10²

10³

10⁴h 10⁵

t

˚

T

1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance.

Please read Cautions and warnings and

Important notes at the end of this document.

8

10/06

Multilayer ceramic capacitors

HighCV; X7R

High

CV

1)

Typical characteristics for HighCV X7R

Insulation resistance R versus

temperature T

Impedance |Z| and ESR versus

frequency f

ins

KKE0398-V

KKE0495-C

10⁴

10 ⁴

Ω

M

Ω

220 nF/25 V/size 0603

R_ins

Z , ESR

10²

10 ³

10 ²

10 ¹

10¹

10⁰

1 µF/50 V/size 1206

1 µF/25 V/size 0805

2.2 µF/25 V/size 1206

^_1

10

^_2

^_3

Z

ESR

10

^_4

^_3

^_2

^_1

10 10 10 10 10⁰10¹10²MHz 10⁴

f

20

40

60

80

100

C 130

T

˚

Impedance |Z| and ESR versus

frequency f

Impedance |Z| and ESR versus

frequency f

KKE0399-4

KKE0400-B

10⁴

Ω

1 µF/25 V/size 0805

2.2 µF/25 V/size 1206

Z , ESR

10²

10¹

10⁰

^_1

10

^_2

^_3

^_2

^_3

Z

10

ESR

^_4

^_3

^_2

^_1

^_4

^_3

^_2

^_1

10 10 10 10 10⁰10¹10²MHz 10⁴

f

10 10 10 10 10⁰10¹10²MHz 10⁴

f

1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance.

Please read Cautions and warnings and

Important notes at the end of this document.

9

10/06

Multilayer ceramic capacitors

Cautions and warnings

Notes on the selection of ceramic capacitors

In the selection of ceramic capacitors, the following criteria must be considered:

1. Depending on the application, ceramic capacitors used to meet high quality requirements should

at least satisfy the specifications to AEC-Q200. They must meet quality requirements going

beyond this level in terms of ruggedness (e.g. mechanical, thermal or electrical) in the case of

critical circuit configurations and applications (e.g. in safety-relevant applications such as ABS

and airbag equipment or durable industrial goods).

2. At the connection to the battery or power supply (e.g. clamp 15 or 30 in the automobile) and at

positions with stranding potential, to reduce the probability of short circuits following a fracture,

two ceramic capacitors must be connected in series and/or a ceramic capacitor with integrated

series circuit should be used. The MLSC from EPCOS contains such a series circuit in a single

component.

3. Ceramic capacitors with the temperature characteristics Z5U and Y5V do not satisfy the require-

ments to AEC-Q200 and are mechanically and electrically less rugged than C0G or X7R/X8R

ceramic capacitors. In applications that must satisfy high quality requirements, therefore, these

capacitors should not be used as discrete components (see the chapter “Effects on mechanical,

thermal and electrical stress”, point 1.4).

4. For ESD protection, preference should be given to the use of multilayer varistors (MLV) (see the

chapter “Effects on mechanical, thermal and electrical stress”, point 1.4).

5. An application-specific derating or continuous operating voltage must be considered in order to

cushion (unexpected) additional stresses (see the chapter “Reliability”).

The following should be considered in circuit board design

1. If technically feasible in the application, preference should be given to components having an

optimal geometrical design.

2. At least FR4 circuit board material should be used.

3. Geometrically optimal circuit boards should be used, ideally those that cannot be deformed.

4. Ceramic capacitors must always be placed a sufficient minimum distance from the edge of the

circuit board. High bending forces may be exerted there when the panels are separated and dur-

ing further processing of the board (such as when incorporating it into a housing).

5. Ceramic capacitors should always be placed parallel to the possible bending axis of the circuit

board.

6. No screw connections should be used to fix the board or to connect several boards. Compo-

nents should not be placed near screw holes. If screw connections are unavoidable, they must

be cushioned (for instance by rubber pads).

10 10/06

Multilayer ceramic capacitors

Cautions and warnings

The following should be considered in the placement process

1. Ensure correct positioning of the ceramic capacitor on the solder pad.

2. Caution when using casting, injection-molded and molding compounds and cleaning agents,

as these may damage the capacitor.

3. Support the circuit board and reduce the placement forces.

4. A board should not be straightened (manually) if it has been distorted by soldering.

5. Separate panels with a peripheral saw, or better with a milling head (no dicing or breaking).

6. Caution in the subsequent placement of heavy or leaded components (e.g. transformers or

snap-in components): danger of bending and fracture.

7. When testing, transporting, packing or incorporating the board, avoid any deformation of the

board not to damage the components.

8. Avoid the use of excessive force when plugging a connector into a device soldered onto the

board.

9. Ceramic capacitors must be soldered only by the mode (reflow or wave soldering) permissible

for them (see the chapter “Soldering directions”).

10. When soldering the most gentle solder profile feasible should be selected (heating time, peak

temperature, cooling time) in order to avoid thermal stresses and damage.

11. Ensure the correct solder meniscus height and solder quantity.

12. Ensure correct dosing of the cement quantity.

13. Ceramic capacitors with an AgPd external termination are not suited for the lead-free solder

process: they were developed only for conductive adhesion technology.

This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.

11 10/06

Multilayer ceramic capacitors

Important notes

The following applies to all products named in this publication:

1. Some parts of this publication contain statements about the suitability of our products for

certain areas of application. These statements are based on our knowledge of typical

requirements that are often placed on our products in the areas of application concerned. We

nevertheless expressly point out that such statements cannot be regarded as binding

statements about the suitability of our products for a particular customer application. As

a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them

than the customers themselves. For these reasons, it is always ultimately incumbent on the

customer to check and decide whether an EPCOS product with the properties described in the

product specification is suitable for use in a particular customer application.

2. We also point out that in individual cases, a malfunction of passive electronic components

or failure before the end of their usual service life cannot be completely ruled out in the

current state of the art, even if they are operated as specified. In customer applications

requiring a very high level of operational safety and especially in customer applications in which

the malfunction or failure of a passive electronic component could endanger human life or health

(e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of

suitable design of the customer application or other action taken by the customer (e.g.

installation of protective circuitry or redundancy) that no injury or damage is sustained by third

parties in the event of malfunction or failure of a passive electronic component.

3. The warnings, cautions and product-specific notes must be observed.

4. In order to satisfy certain technical requirements, some of the products described in this

publication may contain substances subject to restrictions in certain jurisdictions (e.g.

because they are classed as “hazardous”). Useful information on this will be found in our

Material Data Sheets on the Internet (www.epcos.com/material). Should you have any more

detailed questions, please contact our sales offices.

5. We constantly strive to improve our products. Consequently, the products described in this

publication may change from time to time. The same is true of the corresponding product

specifications. Please check therefore to what extent product descriptions and specifications

contained in this publication are still applicable before or when you place an order.

We also reserve the right to discontinue production and delivery of products.

Consequently, we cannot guarantee that all products named in this publication will always be

available.

6. Unless otherwise agreed in individual contracts, all orders are subject to the current version

of the “General Terms of Delivery for Products and Services in the Electrical Industry”

published by the German Electrical and Electronics Industry Association (ZVEI).

7. The trade names EPCOS, EPCOS-JONES, Baoke, CeraDiode, CSSP, MLSC, PhaseCap,

PhaseMod, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMID, SIOV, SIP5D, SIP5K, UltraCap,

WindCap are trademarks registered or pending in Europe and in other countries. Further

information will be found on the Internet at www.epcos.com/trademarks.

12 10/06


型号：	B37941K5224K070
厂家：	EPCOS
描述：	CAPACITOR, CERAMIC, MULTILAYER, 50V, X7R, 0.22uF, SURFACE MOUNT, 0805, CHIP
文件：	总13页 (文件大小：114K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

B37941K5224K070 [EPCOS]

相关型号：

B37941K5272K001

B37941K5272K060

B37941K5272K070

B37941K5273K001

B37941K5273K060

B37941K5273K070

B37941K5332J062

B37941K5332K001

B37941K5332K060

B37941K5332K070

B37941K5333K001

B37941K5333K060