B37941R0101M043 [EPCOS]
Multilayer ceramic capacitors; 多层陶瓷电容器
| 型号： | B37941R0101M043 |
| 厂家： | 
EPCOS |
| 描述： | Multilayer ceramic capacitors |
| 文件： | 总15页 (文件大小：713K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Multilayer ceramic capacitors
Array, X7R
Series/Type:
Array
Date:
February 2009
The following products presented in this data sheet are being withdrawn.
Substitute Products: See www.epcos.com/withdrawal_mlcc
Ordering Code
Substitute Product
Date of
Withdrawal
Deadline Last
Orders
Last Shipments
B37831R9102M021
B37831R9102M023
B37831R9103M021
2009-06-26
2009-06-26
2009-06-26
2010-06-30
2010-06-30
2010-06-30
2010-12-31
2010-12-31
2010-12-31
© EPCOS AG 2009. Reproduction, publication and dissemination of this publication, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.
Ordering Code
Substitute Product
Date of
Withdrawal
Deadline Last
Orders
Last Shipments
B37831R9103M023
B37831R9223M021
B37831R9223M023
B37831R9333M021
B37831R9333M023
B37941R0102M041
B37941R0102M043
B37941R0222M041
B37941R0222M043
B37941R0472M041
B37941R0472M043
B37941R0103M041
B37941R0103M043
B37941R5102M041
B37941R5102M043
B37872R5472M043
B37872R5103M041
B37872R5103M043
B37872R5223M041
B37872R5223M043
B37872R5102M041
B37872R5102M043
B37872R5222M041
B37872R5222M043
B37872R5472M041
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2009-06-26
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-06-30
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
2010-12-31
For further information please contact your nearest EPCOS sales office, which will also support
you in selecting a suitable substitute. The addresses of our worldwide sales network are
presented at www.epcos.com/sales.
Multilayer ceramic capacitors
X7R
Array
X7R
Ordering code system
B37831
R
0
101
K
0
2
1
Type and size
Chip size
Temperature characteristic
(inch/mm)
0405/1012
0508/1220
0612/1632
X7R
B37831
B37941
B37872
Internal coding
"R" indicates array capacitor
Rated voltage
9 (Code) ꢀ 16 VDC
0 (Code) ꢀ 25 VDC
5 (Code) ꢀ 50 VDC
Capacitance, coded (example)
100 ꢀ 10 ꢁ 100 pF = 10 pF
101 ꢀ 10 ꢁ 101 pF = 100 pF
220 ꢀ 22 ꢁ 100 pF = 22 pF
Capacitance tolerance
K
ꢀ ±10%
M
ꢀ ±20% (standard for X7R)
Internal coding: 0
or decimal place for cap. value <10 pF
2 ꢀ 2-fold array
4 ꢀ 4-fold array
Packaging
1 ꢀ cardboard tape, 180-mm reel
3 ꢀ cardboard tape, 330-mm reel
Please read Cautions and warnings and
Important notes at the end of this document.
Page 2 of 14
Multilayer ceramic capacitors
X7R
Features
Reduction of mounting time and mounting costs
Space saving on the PCB
Based on AEC-Q200 Rev-C
Applications
Suitable for electronic circuits with parallel line layout
Decoupling
Coupling
Blocking
Interference suppression
Termination
Nickel barrier terminations (Ni) for lead-free soldering
Options
Alternative capacitance values and tolerances available on request
Delivery mode
Cardboard and blister tape, 180-mm and 330-mm reel available
Electrical data
Temperature characteristic
X7R
Max. relative capacitance change within ꢂ55 ... +125 °C ∆C/C
±15
%
Climatic category
Standard
(IEC 60068-1)
55/125/56
EIA
Dielectric
Class 2
Rated voltage1)
Test voltage
Capacitance range
Dissipation factor
VR
Vtest
CR
tan δ
tan δ
Rins
Rins
τ
16, 25, 50
2.5 ꢁ VR/5 s
1 nF ... 33 nF
< 25 ꢁ 10-3
< 35 ꢁ 10-3 for 16 V
> 105
VDC
VDC
(limit value)
(limit value)
(at +25 °C)
(at +125 °C)
(at +25 °C)
(at +125 °C)
Insulation resistance2)
Insulation resistance2)
Time constant2)
MΩ
MΩ
s
> 104
> 1000
Time constant2)
τ
> 100
s
Operating temperature range
Ageing3)
Top
ꢂ55 ... +125
yes
°C
1) Note: No operation on AC line.
2) For CR >10 nF the time constant τ = C ꢁ Rins is given.
3) Refer to chapter "General technical information", "Ageing".
Please read Cautions and warnings and
Important notes at the end of this document.
Page 3 of 14
Multilayer ceramic capacitors
X7R
Capacitance tolerances
Code letter
Tolerance
K
M (standard)
±10%
±20%
Dimensional drawing
2-fold array (case size 0405)
4-fold array (case sizes 0508 and 0612)
Dimensions (mm)
2-fold array
4-fold array
Case size
(inch)
(mm)
0405
1012
0508
1220
0612
1632
l
1.37 ±0.15
1.00 +0/ꢂ0.15
0.70 max.
0.36 ±0.10
0.64
2.00 ±0.20
3.20 ±0.20
w
th
k
1.25 ±0.15
1.60 ±0.20
0.85 ±0.10
0.85 ±0.10
0.30 ±0.10
0.40 ±0.15
e
u
0.50 ±0.10
0.80 ±0.15
0.20 ±0.10
0.20 +0.30/ꢂ0.10
0.20 +0.30/ꢂ0.10
Tolerances to CECC 32101-801
Please read Cautions and warnings and
Important notes at the end of this document.
Page 4 of 14
Multilayer ceramic capacitors
X7R
Recommended solder pad
2-fold array (case size 0405)
4-fold array (case sizes 0508 and 0612)
Recommended dimensions (mm) for reflow soldering
Case size
(inch/mm)
0405/1012
Type
A
B
C
D
P
2-fold array
0.50 ... 0.45 ... 1.45 ... 0.30 ... 0.64
0.55 0.50 1.60 0.35 ±0.10
0.50 ... 0.60 ... 1.60 ... 0.25 ... 0.50
0.70 0.70 2.10 0.35 ±0.005
0.70 ... 0.80 ... 2.20 ... 0.30 ... 0.80
0508/1220
0612/1632
4-fold array
4-fold array
0.90
1.00
2.80
0.40
±0.005
Termination
Please read Cautions and warnings and
Important notes at the end of this document.
Page 5 of 14
Multilayer ceramic capacitors
X7R
Product range for array capacitors, X7R
2-fold arrays
Size
4-fold arrays
inch (l x w)
0405
0508
0612
mm (l x w)
1012
1220
1632
Type
B37831R
16
B37941R
B37872R
50
CR \ VR (VDC)
1.0 nF
2.2 nF
4.7 nF
10 nF
25
50
22 nF
33 nF
Please read Cautions and warnings and
Important notes at the end of this document.
Page 6 of 14
Multilayer ceramic capacitors
X7R
Ordering codes and packing for X7R, 16 VDC, nickel barrier terminations
Chip thickness
Cardboard tape,
180-mm reel
Cardboard tape,
330-mm reel
* ꢀ 1
* ꢀ 3
CR
Ordering code
mm
pcs./reel
pcs./reel
Case size 0405, 16 VDC, 2-fold arrays
1.0 nF B37831R9102M02* 0.6 ±0.1
5000
5000
5000
5000
20000
20000
20000
20000
10 nF
22 nF
33 nF
B37831R9103M02* 0.6 ±0.1
B37831R9223M02* 0.6 ±0.1
B37831R9333M02* 0.6 ±0.1
Ordering codes and packing for X7R, 25 VDC, nickel barrier terminations
Chip thickness
Cardboard tape,
180-mm reel
Cardboard tape,
330-mm reel
* ꢀ 1
* ꢀ 3
CR
Ordering code
mm
pcs./reel
pcs./reel
Case size 0508, 25 VDC, 4-fold arrays
1.0 nF B37941R0102M04* 0.85 ±0.1
2.2 nF B37941R0222M04* 0.85 ±0.1
4.7 nF B37941R0472M04* 0.85 ±0.1
4000
4000
4000
4000
16000
16000
16000
16000
10 nF
B37941R0103M04* 0.85 ±0.1
Ordering codes and packing for X7R, 50 VDC, nickel barrier terminations
Chip thickness
Cardboard tape,
180-mm reel
Cardboard tape,
330-mm reel
* ꢀ 1
* ꢀ 3
CR
Ordering code
mm
pcs./reel
pcs./reel
Case size 0508, 50 VDC, 4-fold arrays
1.0 nF B37941R5102M04* 0.85 ±0.1
Case size 0612, 50 VDC, 4-fold arrays
1.0 nF B37872R5102M04* 0.85 ±0.1
2.2 nF B37872R5222M04* 0.85 ±0.1
4.7 nF B37872R5472M04* 0.85 ±0.1
4000
16000
4000
4000
4000
4000
4000
16000
16000
16000
16000
16000
10 nF
22 nF
B37872R5103M04* 0.85 ±0.1
B37872R5223M04* 0.85 ±0.1
Please read Cautions and warnings and
Important notes at the end of this document.
Page 7 of 14
Multilayer ceramic capacitors
X7R
Typical characteristics1)
Capacitance change ∆C/C25 versus
Capacitance change ∆C/C0 versus
temperature T
superimposed DC voltage V
Impedance |Z| versus frequency f
Dissipation factor tan δ versus temperature T
1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 8 of 14
Multilayer ceramic capacitors
X7R
Typical characteristics1)
Insulation resistance Rins versus
temperature T
Capacitance change ∆C/C1 versus time t
1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 9 of 14
Multilayer ceramic capacitors
X7R
Cautions and warnings
How to select ceramic capacitors
Remember the following when selecting ceramic capacitors:
1. Ceramic capacitors that must fulfill high quality requirements must be qualified based on
AEC-Q200 Rev-C.
2. When ceramic capacitors are used at the connection to a battery or power supply (e.g. clamp
15 or 30 in an automobile) or for safety-relevant applications, two single ceramic capacitors
should be connected in series. Alternatively a ceramic capacitor with integrated series circuits
should be used in order to reduce the possibility of a short circuit caused by a fracture. The
MLSC from EPCOS contains such a series circuit in a single component.
3. The use of multilayer varistors (MLVs) is recommended for ESD protection (see chapter
“Effects on mechanical, thermal and electrical stress”, section 1.4).
4. Additional stress factors such as continuous operating voltage or application-specific derating
must be taken into account in the selection of components (refer to chapter “Reliability”).
Recommendations for the circuit board design
1. Components with an optimized geometrical design are preferable where permitted by the
application.
2. Use at least FR4 circuit board material.
3. Geometrically optimized circuit boards are preferable, especially those that cannot be
deformed.
4. Ceramic capacitors should be placed with a sufficient minimum distance from the edge of a
circuit board. High bending forces may be exerted there when boards are separated and
during further processing of a board (e.g. when incorporating it in a housing).
5. Ceramic capacitors should always be placed parallel to the possible bending axis of a circuit
board.
6. Screw connections should not be used to fix a board or connect several boards. Components
should not be placed near screw holes. If screw connections are unavoidable, they should be
cushioned, for instance using rubber pads.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 10 of 14
Multilayer ceramic capacitors
X7R
Recommendations for processing
1. Ensure correct positioning of a ceramic capacitor on the solder pad.
2. Be careful when using casting, injection-molded and molding compounds and cleaning
agents. They can damage a capacitor.
3. Support a circuit board and reduce placement forces.
4. Do not straighten a board (manually) if it is distorted by soldering.
5. Separate boards with a peripheral saw, or preferably with a milling head (no dicing or
breaking).
6. Be careful when subsequently placing heavy or leaded components (e.g. transformers or
snap-in components) because of the danger of bending and fracture.
7. When testing, transporting, packing or inserting a board, avoid any deformation of it so that
components are not damaged.
8. Avoid excessive force when plugging a connector into a device soldered onto a board.
9. Only mount ceramic capacitors using the soldering process (reflow or wave) that is
permissible for them (see chapter “Soldering directions”).
10. When soldering, select the softest solder profile possible (heating time, peak temperature,
cooling time) to avoid thermal stress and damage.
11. Ensure the correct solder meniscus height and solder quantity.
12. Ensure correct dosing of the cement.
13. Ceramic capacitors with external silver-palladium terminations are intended for conductive
adhesion - they are not suited for lead-free soldering processes.
This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 11 of 14
Multilayer ceramic capacitors
X7R
Symbols and terms
Symbol
A
English
Area
German
Fläche
C
Capacitance
Kapazität
C0
C1
CR
C20
C25
∆C
Initial (original) capacitance
Capacitance value after one hour's use Kapazitätswert nach einer Stunde
Rated capacitance
Capacitance at 20 °C
Capacitance at 25 °C
Capacitance change
Anfangskapazität
Nennkapazität
Kapazität bei 20 °C
Kapazität bei 25 °C
Kapazitätsänderung
D
Bending displacement
Durchbiegung
Ea
Activation energy
Aktivierungsenergie
ESR
Equivalent series resistance
Ersatzserienwiderstand
F
Force
Kraft
f
Frequency
Frequenz
fmeas
fres
Measuring frequency
Self-resonant frequency
Messfrequenz
Eigenresonanzfrequenz
Itest
k
Test current
Prüfstrom
Ageing constant
Inductance
Alterungskonstante
Induktivität
L
N
Quantity (integer values)
Power dissipation or loss
Anzahl (ganzzahliger Wert)
Verlustleistung
Ploss
Qel
Q
Electrical charge
Quality
Elektrische Ladung
Güte
Rins
RP
RS
Insulation resistance
Parallel resistance
Series resistance (circuit resistance)
Isolationswiderstand
Parallelwiderstand
Serienwiderstand
SV
Rate of rise of a voltage pulse
Flankensteilheit eines Spannungsimpulses
T
Temperature
Temperatur
Tmeas
Top
Tref
Ttest
t
Measuring temperature
Operating temperature
Reference temperature
Test temperature
Time
Messtemperatur
Betriebstemperatur
Bezugstemperatur
Prüftemperatur
Zeit
tr
Rise time of a voltage pulse
Test duration
Dissipation factor
Anstiegszeit eines Spannungsimpulses
Prüfdauer
Verlustfaktor
ttest
tan δ
Please read Cautions and warnings and
Important notes at the end of this document.
Page 12 of 14
Multilayer ceramic capacitors
X7R
Symbol
English
German
V
Voltage
Spannung
V0
Initial (original) voltage (basic voltage
level)
Measuring voltage
Rated voltage
Anfangsspannung
(Spannungsgrundpegel)
Messspannung
Vmeas
VR
Nennspannung
VS
VRMS
Amplitude of a voltage pulse
Measuring (root-mean-square or
effective) AC voltage
Test voltage
Hub des Spannungsimpulses
Effektivspannung
Vtest
|Z|
Prüfspannung
Magnitude of impedance (AC
resistance)
Betrag der Impedanz
(Wechselstromwiderstand)
α
Temperature coefficient
Temperaturkoeffizient
ε0
εr
Absolute dielectric constant
Relative dielectric constant
Absolute Dielektrizitätskonstante
Relative Dielektrizitätskonstante
λ
τ
Failure rate
Ausfallrate
Time constant
Zeitkonstante
Abbreviations / Notes
Symbol
English
German
Lead spacing (in mm)
Surface-mounted devices
Rastermaß (in mm)
Oberflächenmontierbares Bauelement
*
To be replaced by a number in ordering Platzhalter für Zahl im Bestellnummern-
codes, type designations etc.
code oder für die Typenbezeichnung.
Platzhalter für einen Buchstaben.
Alle Maße sind in mm angegeben.
+
To be replaced by a letter.
All dimensions are given in mm.
The commas used in numerical values Verwendete Kommas in Zahlenwerten
denote decimal points. bezeichnen Dezimalpunkte.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 13 of 14
Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical re-
quirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application.
As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar
with them than the customers themselves. For these reasons, it is always ultimately incum-
bent on the customer to check and decide whether an EPCOS product with the properties de-
scribed in the product specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or
failure before the end of their usual service life cannot be completely ruled out in the
current state of the art, even if they are operated as specified. In customer applications
requiring a very high level of operational safety and especially in customer applications in
which the malfunction or failure of an electronic component could endanger human life or
health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by
means of suitable design of the customer application or other action taken by the customer
(e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by
third parties in the event of malfunction or failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as hazardous). Useful information on this will be found in our Ma-
terial Data Sheets on the Internet (www.epcos.com/material). Should you have any more de-
tailed questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order. We also
reserve the right to discontinue production and delivery of products. Consequently, we
cannot guarantee that all products named in this publication will always be available. The
aforementioned does not apply in the case of individual agreements deviating from the fore-
going for customer-specific products.
6. Unless otherwise agreed in individual contracts, all orders are subject to the current ver-
sion of the "General Terms of Delivery for Products and Services in the Electrical In-
dustry" published by the German Electrical and Electronics Industry Association
(ZVEI).
7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CSMP, CSSP, CTVS, DSSP,
MiniBlue, MKK, MLSC, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, SIFERRIT,
SIFI, SIKOREL, SilverCap, SIMDAD, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse,
WindCap are trademarks registered or pending in Europe and in other countries. Further
information will be found on the Internet at www.epcos.com/trademarks.
Page 14 of 14
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