概述
数据手册B57431V2104J062 概述
SMD NTC Thermistor with Ni-Barrier Termination SMD NTC热敏电阻与镍屏障终止
B57431V2104J062 数据手册
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PDF下载SMD NTC Thermistor
SMD NTC Thermistor with Ni-Barrier Termination
B57431V2104J062
Data sheet
Applications
-
Temperature measurement and compensation for mobile phone applications (e.g. battery pack,
TCXO, LCD display), automotive and data systems
Features
-
-
-
-
-
-
-
Multilayer SMD NTC with inner electrodes
Standard EIA chip size 0805
Ni - Barrier termination (Ag/Ni/Sn)
High accuracy: ±5% in resistance, ±3% in B-value
Excellent long term ageing stability in high temperature and high humidity environment
Superior resistance stability during soldering, therefore almost no change (<1%) during soldering
The component is compliant with ROHS (DIRECTIVE 2002/95/EC OF THE EUROPEAN
PARLIAMENT AND THE COUNCIL of 27 January 2003 on the restriction of the use of certain
hazardous substances in electrical and electronic equipment)
Part Dimensions
W
T
Type
L
W
T
k
0805
2.0±0.20 1.25±0.15 1.30 max. 0.50±0.25
Dimensions in mm
L
k
Dimensions in [mm]
Termination Ag/Ni/Sn
Electrical Specifications
Zero-Power
Part Number
Resistance
(at 25°C)
B25/100
B25/85
B25/50
B57431V2472J062
4500 K ± 3%
(4470 K)
(4390 K)
100kΩ ± 5%
Climatic Category (IEC 60068-1)
Lower category temperature
Higher category temperature
Power rating at 25°C
55/125/56
-55°C
125°C
P25
Gth
Tth
210mW 1)
Dissipation factor (on PCB)
Thermal cooling time constant (on PCB)
Heat capacity
approx. 3.5 mW/K 1)
approx. 10.0 s 1)
approx. 35 mJ/K 1)
approx. 13 mg
Cth
Weight of component
1) Depends on mounting situation
ISSUE DATE
08.12.2005
ISSUE
a
PUBLISHER
KB S PE
PAGE
1/7
SMD NTC Thermistor
SMD NTC Thermistor with Ni-Barrier Termination
B57431V2104J062
Data sheet
Resistance - Temperature Characteristic
NTC Resistance Temperature Curve
R/T-Curve
R at 25°C
B(25/100)
Rn at 25°C
8503 / A01
100000 [Ohm]
4500[K] ± 3 [%]
100000 [Ohm] ± 5 [%]
T
R_Nom
R_Min
R_Max
∆R/R25
∆T
[°C]
[Ω]
[Ω]
[Ω]
[±%]
[±°C]
-55
-50
-45
-40
-35
-30
-25
-20
-15
-10
-5
13251642
9052292
6263714
4386660
3107081
2224393
1608658
1174593
865527
643370
482234
364348
277391
212741
164311
127767
100000
78759
62406
49737
39863
32123
26022
21186
17334
14249
11767
9760
10382025
7217556
5077217
3611387
2595726
1884237
1380657
1020735
761093
572134
433452
330849
254352
196894
153431
120328
95000
74194
58338
46147
36716
29376
23631
19109
15530
12683
10407
8579
16121259
10887029
7450210
5161932
3618436
2564548
1836659
1328451
969962
714606
531015
397847
300430
228587
175190
135206
105000
83325
66475
53328
43011
34871
28413
23264
19137
15814
13126
10941
9157
21,7
20,3
18,9
17,7
16,5
15,3
14,2
13,1
12,1
11,1
10,1
9,2
2,8
2,7
2,6
2,5
2,4
2,3
2,2
2,1
2,0
1,9
1,8
1,7
1,5
1,4
1,3
1,2
1,0
1,2
1,4
1,6
1,8
2,0
2,2
2,4
2,6
2,8
3,1
3,3
3,5
3,7
4,0
4,2
4,4
4,7
4,9
5,2
5,4
0
5
8,3
10
7,4
15
6,6
20
5,8
25
5,0
30
5,8
35
6,5
40
7,2
45
7,9
50
8,6
55
9,2
60
9,8
65
10,4
11,0
11,6
12,1
12,6
13,2
13,7
14,2
14,6
15,1
15,5
16,0
16,4
70
75
80
85
8130
7103
90
6800
5906
7695
95
5711
4931
6491
100
105
110
115
120
125
4815
4134
5496
4075
3479
4671
3461
2938
3983
2950
2491
3409
2523
2120
2927
2165
1810
2521
ISSUE DATE
08.12.2005
ISSUE
a
PUBLISHER
KB S PE
PAGE
2/7
SMD NTC Thermistor
SMD NTC Thermistor with Ni-Barrier Termination
B57431V2104J062
Data sheet
Reliability
Tests of SMD NTC thermistors are made according to IEC 60068. The parts are mounted on
standardized PCB in accordance with IEC 60539-1.
Test
Standard
Test conditions
∆R25 / R25
Remarks
(typical)
IEC 60068-2-2
(=JIS C 0021)
Storage at upper category
temperature
Storage in
dry heat
< 2%
< 2%
T: 125°C
t: 1000h
Storage in IEC 60068-2-3
damp heat, (=JIS C 0022)
steady state
Temperature of air: 40°C
relative humidity of air: 93%
Duration: 56days
No visible damage
Rapid
IEC 60068-2-14 Lower test temperature: -55°C
temperature (=JIS C 0025) Upper test temperature: 125°C
< 2%
< 2%
cycling
Number of cycles: 100
Endurance
at Pmax
-
Pmax=210mW
Duration: 1000h
IEC 60068-2-58
Solderability: 215°C/3s
235°C/2s
95% of termination
wetted
Solderability (=JIS C 0054)
Resistance to soldering heat:
260°C/10s
Resistance
reflow soldering profile
wave soldering profile
drift after
soldering
-
< 1%
ISSUE DATE
08.12.2005
ISSUE
a
PUBLISHER
KB S PE
PAGE
3/7
SMD NTC Thermistor
SMD NTC Thermistor with Ni-Barrier Termination
B57431V2104J062
Data sheet
Mounting Instructions
1. Termination
Ni-barrier termination (Ag/Ni/Sn)
Inner electrode
Base layer - silver
Diffusion barrier - nickel
Outer layer - tin
2. Recommended geometry of solder pads
Size
A
B
C
D
[mm]
1.3
[mm]
1.2
[mm]
1.0
[mm]
3.4
0805
B
C
B
A
A
D
3. Requirements for Solderability
- Wettability test in accordance with IEC 60068-2-58 (= JIS C 0054) :
Preconditioning: Immersion into flux F-SW 32.
Evaluation criteria: Wetting of soldering areas ≥ 95%.
Pb-containing solder: Sn(60)Pb(40)
Bath temperature (°C): 215 ± 3
Dwell time (s): 3 ± 0.3
Pb-free solder: Sn(95.1-96.0)Ag(3.0-4.0)Cu(0.5-0.9)
Bath temperature (°C): 245 ± 5
Dwell time (s): 3 ± 0.3
- Soldering heat resistance test in accordance with IEC 60068-2-58 (= JIS C 0054) :
Preconditioning: Immersion into flux F-SW 32.
Evaluation criteria: Leaching of side edges ≤ 1/3.
Solder: Sn(60)Pb(40), Sn(95.1-96.0)Ag(3.0-4.0)Cu(0.5-0.9)
Bath temperature (°C): 260 ± 5
Dwell time (s): 10 ± 1
ISSUE DATE
08.12.2005
ISSUE
a
PUBLISHER
KB S PE
PAGE
4/7
SMD NTC Thermistor
SMD NTC Thermistor with Ni-Barrier Termination
B57431V2104J062
Data sheet
4. Recommended soldering profiles
Reflow soldering profile: (according to CECC 00802)
Temperature characteristics at component terminals during reflow soldering
(two cycles are permitted).
Wave soldering profile:
Temperature characteristics at component terminals during wave soldering can be recommended
once in general.
5. Storage conditions
Solderability is guaranteed for 12 months from date of delivery for types with Ni-barrier termination,
provided that the components are stored in the original packages.
Storage temperature: -25 ... +45°C
Relative humidity: < 75% annual average, < 95% on max. 30 days in a year, dew precipitation and
wetness are inadmissible.
ISSUE DATE
08.12.2005
ISSUE
a
PUBLISHER
KB S PE
PAGE
5/7
SMD NTC Thermistor
SMD NTC Thermistor with Ni-Barrier Termination
B57431V2104J062
Data sheet
Taping and Packing
Taping:
Tape and reel packing comply with specifications of IEC 60286-3
Blister tape
A
D
P
0
Section A-A
P
2
0
E
F
W
B
0
G
D
A
1
K
0
0
A
P
T
1
2
Direction of unreeling
Dimensions and tolerances:
Definition
Symbol Dimension (mm)
Tol. (mm)
Size 0805
1.6 x 2.4
1.4
Compartment width x Compartments length A0 x B0
± 0.2
max.
max.
Compartment height
Overall thickness
K0
T2
T
2.5
0.3
max.
Sprocket hole diameter
Compartment hole diameter
Sprocket hole pitch
Distance centre hole to centre compartment
Pitch of the component compartments
Tape width
Distance edge to centre of hole
Distance centre hole to centre compartment
Distance edge to centre compartment
1) ≤ 0.2 mm over 10 sprocket holes.
D0
D1
P0
P2
P1
W
E
1.5
1.0
4.0
2.0
4.0
8.0
1.75
3.5
0.75
+0.1/-0
min.
± 0.11)
± 0.05
± 0.1
± 0.3
± 0.1
± 0.05
min.
F
G
Part orientation in tape pocket
equivalent terminations
because of unipolar component
ISSUE DATE
08.12.2005
ISSUE
a
PUBLISHER
KB S PE
PAGE
6/7
SMD NTC Thermistor
SMD NTC Thermistor with Ni-Barrier Termination
B57431V2104J062
Data sheet
Reel Packing:
Reel material:
PS.
Tape material:
Tape break force:
Blister
min. 10N
Top cover tape peel force: 0.1 - 0.65N at a peel speed of 300 mm/min, angle between top cover
tape and the direction of feed during peel off: 165 -180°.
Top cover tape strength: min. 10N
Length of tape:
Leader section: additional top cover tape, length min 400 mm, before component section (including
carrier tape with empty cavities, length min. 150 mm or min. 20 pcs. of empty cavities).
Trailer section: length min. 40 mm.
Empty part cavities at leader and trailer section on tape are sealed with top cover tape.
Cavity play:
Each part rests in the cavity so that the angle between the part centreline and the cavity centreline is
no more than 20°.
Weight of loaded reel:
Packing units:
max. 1500 g
3000pcs.
Package 8 mm tape
Definition
Reel diameter
Reel width (inside)
Reel width (outside)
Symbol
A
W1
Dim. (mm) Tol. (mm)
180
8.4
-3/+0
+1.5/-0
max.
W2
14.4
EPCOS AG 2005. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the information
contained therein without EPCOS' prior express consent is prohibited.
Purchase orders are subject to the General Conditions for the Supply of Products and Services of the Electrical and
Electronics Industry recommended by the ZVEI (German Electrical and Electronic Manufacturers' Association), unless
otherwise agreed.
ISSUE DATE
08.12.2005
ISSUE
a
PUBLISHER
KB S PE
PAGE
7/7
B57431V2104J062 相关器件
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