B69842N5257C200 [EPCOS]
Ceramic BPF, 5250MHz, CERAMIC, SMD, 3 PIN;
| 型号： | B69842N5257C200 |
| 厂家： | 
EPCOS |
| 描述： | Ceramic BPF, 5250MHz, CERAMIC, SMD, 3 PIN PC |
| 文件： | 总4页 (文件大小：170K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Microwave Ceramics and Modules
2 Pole Filter for W-LAN 5GHz / [5.15-5.35] Band
Filter
B69842N5257C200
Preliminary Data Sheet
Features
z SMD filter consisting of coupled resonators with stepped impedances
z MgTiO - CaTiO (ε = 21 / TC =0±10 ppm/K) with a coating of copper (10µm) and tin (>5µm)
3 r
3
f
z Excellent reflow solderability, no migration effect due to copper/tin metallization
Index
Page 2
z Component drawing
z Recommended footprint
Page 3
z Characteristics
z Maximum ratings
z Typical passband characteristic
Page 4
z Processing information
z Soldering requirements
z Delivery mode
ISSUE DATE
18.03.04
ISSUE
P3
PUBLISHER
SAW MWC PD
PAGE
1/4
Microwave Ceramics and Modules
2 Pole Filter for W-LAN 5GHz / [5.15-5.35] Band
Filter
B69842N5257C200
Preliminary Data Sheet
Component drawing
View from below onto the solder terminals and view from beside
Recommended footprint
I/O
I/O
G
G
G
ISSUE DATE
18.03.04
ISSUE
P3
PUBLISHER
SAW MWC PD
PAGE
2/4
Microwave Ceramics and Modules
2 Pole Filter for W-LAN 5GHz / [5.15-5.35] Band
Filter
B69842N5257C200
Preliminary Data Sheet
Characteristics
min.
-
typ.
5250
1.0
max.
-
Center frequency
Insertion loss
f
MHz
dB
c
1.2
α
IL
B 200
∆α
Passband
MHz
dB
Amplitude ripple (peak - peak)
0.8
2.0
Standing wave ratio
Impedance
SWR
Z
1.5
50
Ω
Power
P
1.0
W
Attenuation
α
at DC to 1990 MHz
at 1990 to 2170 MHz
at 2400 to 2500 MHz
at 4500 MHz
55
53
50
35
20
60
58
55
40
25
dB
dB
dB
dB
dB
at 6.5 to 10 GHz
Maximum ratings
IEC climatic category (IEC 68-1)
- 40/+ 90/56
-40 / + 85
Operating temperature
T
°C
op
Typical passband characteristic
0
-10
-20
-30
-40
-50
-60
-70
S11 [dB]
S21 [dB]
freq [GHz]
ISSUE DATE
18.03.04
ISSUE
P3
PUBLISHER
SAW MWC PD
PAGE
3/4
Microwave Ceramics and Modules
2 Pole Filter for W-LAN 5GHz / [5.15-5.35] Band
Filter
B69842N5257C200
Preliminary Data Sheet
Processing information
z Wettability acc. to IEC 68-2-58: ≥ 75% (after aging)
Soldering Requirements
Profile for eutectic
Profile for leadfree
solder paste
SnPb solder paste
Soldering type
reflow
reflow
Maximum soldering temperature
°C
(measuring point on top surface of the component) 225 (max. 10 sec.)
250 (max. 10 sec.) °C
Recommended soldering conditions (infrared):
within 10 sec.
245°C±5°C
Temp. [°C]
within 10 sec.
215°C±10°C
Temp. [°C]
30 sec.
Time [sec.]
> - 5 °C/s
20-40 sec.
Time [sec.]
2.5 °C/s
40-80 sec.
2-3 min.
Delivery mode
z Blister tape acc. to IEC 286-3, PS, grey
z Pieces/tape: 4000
EPCOS AG 2001. All Rights Reserved. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.
The information contained in this data sheet describes the type of component and shall not be considered as guaranteed characteristics.
Purchase orders are subject to the General Conditions for the Supply of Products and Services of the Electrical and Electronics Industry
recommended by the ZVEI (German Electrical and Electronic Manufacturers' Association), unless otherwise agreed.
ISSUE DATE
18.03.04
ISSUE
P3
PUBLISHER
SAW MWC PD
PAGE
4/4
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