B72650M0140K093_技术文档

Ceramic transient voltage suppressors

SMD disk varistors standard series

Series/Type:

Date:

August 2008

information contained therein without EPCOS' prior express consent is prohibited.

SMD disk varistors (CU varistors)

Standard series

EPCOS type designation system for SMD disk varistor standard series

CU

4032

K

275

G2

Construction:

CU ꢀ Encapsulated chip

Case sizes:

3225 ꢀ 32 x 25

4032 ꢀ 40 x 32

Varistor voltage tolerance:

K ꢀ ±10%

Maximum RMS operating voltage (V_RMS):

275 ꢀ 275 V

Taping mode:

G2 ꢀ Taped, 330-mm reel

Please read Cautions and warnings and

Important notes at the end of this document.

Page 2 of 33

SMD disk varistors (CU varistors)

Standard series

Features

Electrical equivalents to leaded types SIOV-S05/S07

Operating voltage up to 300 V_RMS

SMD plastic package

RoHS-compatible

Suitable for lead-free soldering

UL approved

CSA approved (types with voltages higher than 130 V_RMS

)

PSpice models available

Applications

Overvoltage protection and transient suppression in control electronics, detectors and

sensors, touch screens, plug-in cards, remote controls

Design

Cylindrical varistor element, encapsulated.

Encapsulation: thermoplastic, flame-retardant to UL 94 V-0.

Termination: tinned copper alloy, suitable for lead-free wave and reflow soldering, and

compatible with tin/lead solder.

V/I characteristics and derating curves

V/I and derating curves are attached to the data sheet. The curves are sorted by V_RMSand

then by case size, which is included in the type designation.

General technical data

Maximum RMS operating voltage

Maximum DC operating voltage

Maximum surge current

Maximum energy absorption

Maximum power dissipation

Maximum clamping voltage

Operating temperature

V_RMS,max

V_DC,max

I_surge,max

W_max

P_diss,max

V_clamp,max

T_op

11 ... 300

14 ... 385

100 ... 1200

300 ... 23000

10 ... 250

36 ... 775

ꢁ40/+85

V

A

mJ

mW

V

°C

(8/20 µs)

(2 ms)

(8/20 µs)

Storage temperature

T_stg

ꢁ40/+125

Temperature derating

Climatic category: ꢁ40/+85 °C

Please read Cautions and warnings and

Important notes at the end of this document.

Page 3 of 33

SMD disk varistors (CU varistors)

Standard series

Electrical specifications and ordering codes

Maximum ratings (T_op,max= 85 °C)

V_RMS,maxV_DC,maxI_surge,max

(8/20 µs) (2 ms)

mJ

W_maxP_diss,max

Type

Ordering code

V

A

mW

CU3225K11G2

CU4032K11G2

CU3225K14G2

CU4032K14G2

CU3225K17G2

CU4032K17G2

CU3225K20G2

CU4032K20G2

CU3225K25G2

CU4032K25G2

CU3225K30G2

CU4032K30G2

CU3225K35G2

CU4032K35G2

CU3225K40G2

CU4032K40G2

CU3225K50G2

CU4032K50G2

CU3225K60G2

CU4032K60G2

CU3225K75G2

CU4032K75G2

CU3225K95G2

CU4032K95G2

CU3225K115G2

CU4032K115G2

CU3225K130G2

CU4032K130G2

CU3225K140G2

CU4032K140G2

CU3225K150G2

CU4032K150G2

CU3225K175G2

CU4032K175G2

B72650M0110K072

B72660M0110K072

B72650M0140K072

B72660M0140K072

B72650M0170K072

B72660M0170K072

B72650M0200K072

B72660M0200K072

B72650M0250K072

B72660M0250K072

B72650M0300K072

B72660M0300K072

B72650M0350K072

B72660M0350K072

B72650M0400K072

B72660M0400K072

B72650M0500K072

B72660M0500K072

B72650M0600K072

B72660M0600K072

B72650M0750K072

B72660M0750K072

B72650M0950K072

B72660M0950K072

B72650M0111K072

B72660M0111K072

B72650M0131K072

B72660M0131K072

B72650M0141K072

B72660M0141K072

B72650M0151K072

B72660M0151K072

B72650M0171K072

B72660M0171K072

11

14

17

20

25

30

35

40

50

60

75

95

115

130

140

150

175

14

18

22

26

31

38

45

56

65

85

100

125

150

170

180

200

225

100

250

100

250

100

250

100

250

100

250

100

250

100

250

100

250

400

1200

400

1200

400

1200

400

1200

400

1200

400

1200

400

1200

400

1200

400

1200

300 10

800 20

400 10

900 20

500 10

1100 20

600 10

1300 20

700 10

1600 20

900 10

2000 20

1100 10

2500 20

1300 10

3000 20

1800 100

4200 250

2200 100

4800 250

2500 100

5900 250

3400 100

7600 250

3600 100

8400 250

4200 100

9500 250

4500 100

10000 250

4900 100

11000 250

5600 100

13000 250

Please read Cautions and warnings and

Important notes at the end of this document.

Page 4 of 33

SMD disk varistors (CU varistors)

Standard series

Characteristics (T_A= 25 °C)

V_V

(1 mA)

V

∆V_V

V_clamp,max

V

I_clamp

(8/20 µs)

A

C_typ

(1 kHz, 1 V)

pF

Type

%

CU3225K11G2

CU4032K11G2

CU3225K14G2

CU4032K14G2

CU3225K17G2

CU4032K17G2

CU3225K20G2

CU4032K20G2

CU3225K25G2

CU4032K25G2

CU3225K30G2

CU4032K30G2

CU3225K35G2

CU4032K35G2

CU3225K40G2

CU4032K40G2

CU3225K50G2

CU4032K50G2

CU3225K60G2

CU4032K60G2

CU3225K75G2

CU4032K75G2

CU3225K95G2

CU4032K95G2

CU3225K115G2

CU4032K115G2

CU3225K130G2

CU4032K130G2

CU3225K140G2

CU4032K140G2

CU3225K150G2

CU4032K150G2

CU3225K175G2

CU4032K175G2

18

22

27

33

39

47

56

68

82

±10

36

43

53

65

77

1

2.5

1

2.5

1

2.5

1

2.5

1

2.5

1

2.5

1

2.5

1

2.5

5

10

5

10

5

10

5

10

5

10

5

10

5

10

5

10

5

1750

2750

1450

2300

1200

1900

980

1600

850

1400

720

1200

620

1050

520

900

300

530

250

480

210

430

135

260

110

220

100

200

95

77

93

110

135

165

200

250

300

340

360

395

455

82

100

120

150

180

205

220

240

270

180

90

170

75

10

150

Please read Cautions and warnings and

Important notes at the end of this document.

Page 5 of 33

SMD disk varistors (CU varistors)

Standard series

Electrical specifications and ordering codes

Maximum ratings (T_op,max= 85 °C)

V_RMS,maxV_DC,maxI_surge,max

(8/20 µs) (2 ms)

mJ

W_maxP_diss,max

Type

Ordering code

V

A

mW

CU3225K230G2

CU4032K230G2

CU3225K250G2

CU4032K250G2

CU3225K275G2

CU4032K275G2

CU3225K300G2

CU4032K300G2

B72650M0231K072

B72660M0231K072

B72650M0251K072

B72660M0251K072

B72650M0271K072

B72660M0271K072

B72650M0301K072

B72660M0301K072

230

300

400

1200

400

1200

400

1200

400

1200

7200 100

17000 250

8200 100

19000 250

8600 100

21000 250

9600 100

23000 250

230

250

275

300

320

350

385

Characteristics (T_A= 25 °C)

V_V

∆V_V

V_clamp,max

I_clamp

C_typ

Type

(1 mA)

V

(8/20 µs)

A

(1 kHz, 1 V)

pF

%

V

CU3225K230G2

CU4032K230G2

CU3225K250G2

CU4032K250G2

CU3225K275G2

CU4032K275G2

CU3225K300G2

CU4032K300G2

360

390

430

470

±10

595

650

710

775

5

10

5

10

5

10

5

10

60

115

55

105

50

95

45

90

Please read Cautions and warnings and

Important notes at the end of this document.

Page 6 of 33

SMD disk varistors (CU varistors)

Standard series

Dimensional drawing

Dimensions in mm

Chip size V_RMS,max

EIA in mm

l

w

h

3225

4032

11 ... 175 8.0 ±0.3 6.3 ±0.3 3.2 ±0.3

230 ... 300 8.0 ±0.3 6.3 ±0.3 4.5 ±0.3

11 ... 175 10.2 ±0.3 8.0 ±0.3 3.2 ±0.3

230 ... 300 10.2 ±0.3 8.0 ±0.3 4.5 ±0.3

Recommended solder pad layout

Dimensions in mm

Chip size

A

B

C

EIA in mm

3225

4032

3.50

2.80

4.50

6.50

Please read Cautions and warnings and

Important notes at the end of this document.

Page 7 of 33

SMD disk varistors (CU varistors)

Standard series

Delivery mode

EIA case size Taping

Reel size Packing unit Type

Ordering code

mm

pcs.

3225

4032

Blister

330

1000

CU3225K115G2

CU3225K11G2

CU3225K130G2

CU3225K140G2

CU3225K14G2

CU3225K150G2

CU3225K175G2

CU3225K20G2

CU3225K230G2

CU3225K250G2

CU3225K25G2

CU3225K275G2

CU3225K300G2

CU3225K30G2

CU3225K35G2

CU3225K40G2

CU3225K50G2

CU3225K60G2

CU3225K75G2

CU3225K95G2

CU4032K11G2

CU3225K17G2

CU4032K115G2

CU4032K130G2

CU4032K140G2

CU4032K14G2

CU4032K150G2

CU4032K175G2

CU4032K17G2

CU4032K20G2

CU4032K230G2

CU4032K250G2

CU4032K25G2

CU4032K275G2

CU4032K300G2

CU4032K30G2

CU4032K35G2

CU4032K40G2

CU4032K50G2

CU4032K60G2

CU4032K75G2

CU4032K95G2

B72650M0111K072

B72650M0110K072

B72650M0131K072

B72650M0141K072

B72650M0140K072

B72650M0151K072

B72650M0171K072

B72650M0200K072

B72650M0231K072

B72650M0251K072

B72650M0250K072

B72650M0271K072

B72650M0301K072

B72650M0300K072

B72650M0350K072

B72650M0400K072

B72650M0500K072

B72650M0600K072

B72650M0750K072

B72650M0950K072

B72660M0110K072

B72650M0170K072

B72660M0111K072

B72660M0131K072

B72660M0141K072

B72660M0140K072

B72660M0151K072

B72660M0171K072

B72660M0170K072

B72660M0200K072

B72660M0231K072

B72660M0251K072

B72660M0250K072

B72660M0271K072

B72660M0301K072

B72660M0300K072

B72660M0350K072

B72660M0400K072

B72660M0500K072

B72660M0600K072

B72660M0750K072

B72660M0950K072

Please read Cautions and warnings and

Important notes at the end of this document.

Page 8 of 33

SMD disk varistors (CU varistors)

Standard series

V/I characteristics

CU3225 ...

Please read Cautions and warnings and

Important notes at the end of this document.

Page 9 of 33

SMD disk varistors (CU varistors)

Standard series

V/I characteristics

CU4032 ...

Please read Cautions and warnings and

Important notes at the end of this document.

Page 10 of 33

SMD disk varistors (CU varistors)

Standard series

Derating curves

Maximum surge current I_surge,max= f (t_r, pulse train)

For explanation of the derating curves refer to "General technical information", chapter 2.7.2

CU3225K11G2 ... K40G2

CU4032K11G2 ... K40G2

Please read Cautions and warnings and

Important notes at the end of this document.

Page 11 of 33

SMD disk varistors (CU varistors)

Standard series

Derating curves

Maximum surge current I_surge,max= f (t_r, pulse train)

For explanation of the derating curves refer to "General technical information", chapter 2.7.2

CU3225K50G2 ... K300G2

CU4032K50G2 ... K300G2

Please read Cautions and warnings and

Important notes at the end of this document.

Page 12 of 33

SMD disk varistors (CU varistors)

Standard series

Taping and packing

1

Taping and packing for SMD components

Blister tape (the taping to IEC 60286-3)

1.1

Dimensions in mm

8-mm tape

12-mm tape

16-mm tape

Case size (inch/mm)

Case size

(inch/mm)

Case size

(inch/mm)

Tolerance

0508/

1220

0612/

1632

1012/

2532

0603/

1608

0506/

1216

0805/

2012

1206/

3216

1210/

3225

1812/

4532

2220/

5750

3225 4032

A₀

B₀

K₀

T

0.9 ±0.10

1.75 ±0.10

1.0

1.50

1.80

0.80

1.60

2.40

1.90

3.50

1.80

2.80

3.50

4.80

5.10

6.00

7.00 8.60 ±0.20

8.70 10.60 ±0.20

2.60

5.00

0.30

5.50

1.50

4.00

2.00

12.00

16.00

1.75

7.50

0.75

max.

0.30

3.50

1.50

4.00

2.00

8.00

12.00

1.75

5.50

0.75

max.

T₂

D₀

D₁

P₀

P₂

P₁

W

E

1.3

1.20

2.50

max.

1.50

1.00

4.00

2.00

4.00

8.00

1.75

3.50

0.75

+0.10/ꢁ0

min.

±0.10¹⁾

±0.05

±0.10

±0.30

±0.10

±0.05

min.

F

G

1) ≤±0.2 mm over 10 sprocket holes.

Please read Cautions and warnings and

Important notes at the end of this document.

Page 13 of 33

SMD disk varistors (CU varistors)

Standard series

Part orientation in tape pocket for blister tape

For discrete chip, case sizes 0603, 0805,

1206, 1210, 1812 and 2220

For array, case sizes 0612

For arrays 0506 and 1012

For filter array, case size 0508

Additional taping information

Reel material

Polystyrol (PS)

Tape material

Polystyrol (PS) or Polycarbonat (PC) or PVC

Tape break force

Top cover tape strength

Top cover tape peel force

min. 10 N

0.2 to 0.6 N for 8-mm tape and 0.2 to 0.8 N for

12-mm tape at a peel speed of 300 mm/min

Tape peel angle

Cavity play

Angle between top cover tape and the direction of feed

during peel off: 165° to 180°

Each part rests in the cavity so that the angle between

the part and cavity center line is no more than 20°

Please read Cautions and warnings and

Important notes at the end of this document.

Page 14 of 33

SMD disk varistors (CU varistors)

Standard series

1.2

Cardboard tape (taping to IEC 60286-3)

Dimensions in mm

8-mm tape

Case size

(inch/mm)

Case size (inch/mm)

Tolerance

0201/0603 0402/1005 0405/1012 0603/1608 1003/2508 0508/1220

A₀

B₀

T

0.38 ±0.05

0.68 ±0.05

0.35 ±0.02

0.4 min.

0.60

1.15

0.60

0.70

1.05

1.60

0.75

0.90

0.95

1.80

0.95

1.10

1.00

2.85

1.00

1.10

1.60

2.40

0.95

1.12

1.50

±0.20

max.

T₂

D₀

P₀

P₂

P₁

W

E

max.

1.50 ±0.1

1.50

4.00

2.00

+0.10/ꢁ0

±0.10²⁾

±0.05

±0.10

±0.30

±0.10

±0.05

min.

2.00 ±0.05

2.00

4.00

0.75

4.00

8.00

1.75

3.50

F

G

1.35

2) ≤0.2 mm over 10 sprocket holes.

Please read Cautions and warnings and

Important notes at the end of this document.

Page 15 of 33

SMD disk varistors (CU varistors)

Standard series

Part orientation in tape pocket for cardboard tape

For discrete chip case sizes 0201, 0402, 0603

and 1003

For array case size 0405

For array case size 0508

For filter array, case size 0405

Additional taping information

Reel material

Polystyrol (PS)

Tape material

Cardboard

min. 10 N

Tape break force

Top cover tape strength

Top cover tape peel force

Tape peel angle

0.1 to 0.65 N at a peel speed of 300 mm/min

Angle between top cover tape and the direction of feed

during peel off: 165° to 180°

Cavity play

Each part rests in the cavity so that the angle between

the part and cavity center line is no more than 20°

Please read Cautions and warnings and

Important notes at the end of this document.

Page 16 of 33

SMD disk varistors (CU varistors)

Standard series

1.3

Reel packing

Dimensions in mm

8-mm tape

180-mm reel 330-mm reel

12-mm tape

16-mm tape

330-mm reel

330 ꢁ2.0

180-mm reel

330-mm reel

330 ꢁ2.0

A

180 ꢁ3/+0

8.4 +1.5/ꢁ0

14.4 max.

330 ꢁ2.0

8.4 +1.5/ꢁ0

14.4 max.

180 ꢁ3/+0

12.4 +1.5/ꢁ0

18.4 max.

W₁

W₂

12.4 +1.5/ꢁ0

18.4 max.

16.4 +1.5/ꢁ0

22.4 max.

Leader, trailer

Please read Cautions and warnings and

Page 17 of 33

Important notes at the end of this document.

SMD disk varistors (CU varistors)

Standard series

Soldering directions

1

Terminations

1.1

Nickel barrier termination

The nickel barrier layer of the silver/nickel/tin termination prevents leaching of the silver base met-

allization layer. This allows great flexibility in the selection of soldering parameters. The tin pre-

vents the nickel layer from oxidizing and thus ensures better wetting by the solder. The nickel bar-

rier termination is suitable for all commonly-used soldering methods.

Multilayer CTVS: Structure of nickel barrier termination

1.2

Silver-palladium termination

Silver-palladium terminations are used for the large case sizes 1812 and 2220 and for chips in-

tended for conductive adhesion. This metallization improves the resistance of large chips to ther-

mal shock.

In case of conductive adhesion, the silver-palladium metallization reduces susceptibility to corro-

sion. Silver-palladium termination can be used for smaller case sizes (only chip) for hybrid appli-

cations as well. The silver-palladium termination is not approved for lead-free soldering.

Multilayer varistor: Structure of silver-palladium termination

Please read Cautions and warnings and

Important notes at the end of this document.

Page 18 of 33

SMD disk varistors (CU varistors)

Standard series

2

Recommended soldering temperature profiles

Reflow soldering temperature profile

2.1

Recommended temperature characteristic for reflow soldering following

JEDEC J-STD-020D

Profile feature

Sn-Pb eutectic assembly Pb-free assembly

Preheat and soak

- Temperature min

- Temperature max

- Time

Average ramp-up rate

Liquidous temperature

Time at liquidous

Peak package body temperature T_p

Time (t_P)³⁾within 5 °C of specified

classification temperature (T_c)

T_smin

T_smax

100 °C

150 °C

200 °C

t_sminto t_smax60 ... 120 s

T_smaxto T_p3 °C/ s max.

60 ... 180 s

3 °C/ s max.

217 °C

60 ... 150 s

245 °C ... 260 °C²⁾

T_L

t_L

183 °C

60 ... 150 s

220 °C ... 235 °C²⁾

1)

20 s³⁾

30 s³⁾

Average ramp-down rate

T_pto T_smax6 °C/ s max.

6 °C/ s max.

Time 25 °C to peak temperature

maximum 6 min

maximum 8 min

1) Tolerance for peak profile temperature (T_P) is defined as a supplier minimum and a user maximum.

2) Depending on package thickness. For details please refer to JEDEC J-STD-020D.

3) Tolerance for time at peak profile temperature (t_P) is defined as a supplier minimum and a user maximum.

Note: All temperatures refer to topside of the package, measured on the package body surface.

Number of reflow cycles: 3

Please read Cautions and warnings and

Important notes at the end of this document.

Page 19 of 33

SMD disk varistors (CU varistors)

Standard series

2.2

Wave soldering temperature profile

Temperature characteristics at component terminal with dual-wave soldering

2.3

Lead-free soldering processes

EPCOS multilayer CTVS with AgNiSn termination are designed for the requirements of lead-free

soldering processes only.

Soldering temperature profiles to JEDEC J-STD-020D, IEC 60068-2-58 and ZVEI recommenda-

tions.

Please read Cautions and warnings and

Important notes at the end of this document.

Page 20 of 33

SMD disk varistors (CU varistors)

Standard series

3

Recommended soldering methods - type-specific releases by EPCOS

Overview

3.1

Reflow soldering

SnPb

Wave soldering

SnPb

Type

Case size

Lead-free

Approved

No

Lead-free

No

CT... / CD...

CN...

0201/ 0402

Approved

No

0603 ... 2220 Approved

0405 ... 1012 Approved

Approved

No

Approved

No

Arrays

Approved

No

ESD/EMI filters 0405, 0508

Approved

No

CU

3225, 4032

-

Approved

SHCV

3.2

Nickel barrier terminated multilayer CTVS

All EPCOS MLVs with nickel barrier termination are suitable and fully qualiyfied for lead-free sol-

dering. The nickel barrier layer is 100% matte tin-plated.

3.3

Silver-palladium terminated MLVs

AgPd-terminated MLVs are mainly designed for conductive adhesion technology on hybrid materi-

al. Additionally MLVs with AgPd termination are suitable for reflow and wave soldering with SnPb

solder.

Note:

Lead-free soldering is not approved for MLVs with AgPd termination.

3.4

Tinned copper alloy

All EPCOS CU types with tinned termination are approved for lead-free and SnPb soldering.

3.5

Tinned iron wire

All EPCOS SHCV types with tinned termination are approved for lead-free and SnPb soldering.

4

Solder joint profiles / solder quantity

Nickel barrier termination

4.1

If the meniscus height is too low, that means the solder quantity is too low, the solder joint may

break, i.e. the component becomes detached from the joint. This problem is sometimes interpret-

ed as leaching of the external terminations.

Please read Cautions and warnings and

Important notes at the end of this document.

Page 21 of 33

SMD disk varistors (CU varistors)

Standard series

If the solder meniscus is too high, i.e. the solder quantity is too large, the vise effect may occur.

As the solder cools down, the solder contracts in the direction of the component. If there is too

much solder on the component, it has no leeway to evade the stress and may break, as in a vise.

The figures below show good and poor solder joints for dual-wave and infrared soldering.

4.1.1 Solder joint profiles for nickel barrier termination - dual-wave soldering

Good and poor solder joints caused by amount of solder in dual-wave soldering.

4.1.2 Solder joint profiles for nickel barrier termination / silver-palladium termination

- reflow soldering

Good and poor solder joints caused by amount of solder in reflow soldering.

Please read Cautions and warnings and

Important notes at the end of this document.

Page 22 of 33

SMD disk varistors (CU varistors)

Standard series

5

Conductive adhesion

Attaching surface-mounted devices (SMDs) with electrically conductive adhesives is a commer-

cially attractive method of component connection to supplement or even replace conventional sol-

dering methods.

Electrically conductive adhesives consist of a non-conductive plastic (epoxy resin, polyimide or

silicon) in which electrically conductive metal particles (gold, silver, palladium, nickel, etc) are em-

bedded. Electrical conduction is effected by contact between the metal particles.

Adhesion is particularly suitable for meeting the demands of hybrid technology. The adhesives

can be deposited ready for production requirements by screen printing, stamping or by dis-

pensers. As shown in the following table, conductive adhesion involves two work operations fewer

than soldering.

Reflow soldering

Screen-print solder paste

Mount SMD

Wave soldering

Apply glue dot

Mount SMD

Cure glue

Conductive adhesion

Screen-print conductive adhesive

Mount SMD

Predry solder paste

Reflow soldering

Wash

Cure adhesive

Wave soldering

Wash

Inspect

A further advantage of adhesion is that the components are subjected to virtually no temperature

shock at all. The curing temperatures of the adhesives are between 120 °C and 180 °C, typical

curing times are between 30 minutes and one hour.

The bending strength of glued chips is, in comparison with that of soldered chips, higher by a fac-

tor of at least 2, as is to be expected due to the elasticity of the glued joints.

The lower conductivity of conductive adhesive may lead to higher contact resistance and thus re-

sult in electrical data different to those of soldered components. Users must pay special attention

to this in RF applications.

Please read Cautions and warnings and

Important notes at the end of this document.

Page 23 of 33

SMD disk varistors (CU varistors)

Standard series

6

Solderability tests

Test

Standard

Test conditions

Sn-Pb soldering

Test conditions

Pb-free soldering

Criteria/ test results

Covering of 95% of

Wettability

IEC

Immersion in

60068-2-58 60/40 SnPb solder Sn96.5Ag3.0Cu0.5 end termination,

using non-activated solder using non- or checked by visual

flux at 215 ± 3 °C

for 3 ± 0.3 s

low activated flux

at 245 ± 5 °C

for 3 ± 0.3 s

inspection

Leaching

IEC

Immersion in

No leaching of

resistance

60068-2-58 60/40 SnPb

solder using

Sn96.5Ag3.0Cu0.5 contacts

solder using non- or

mildly activated flux low activated flux

without preheating without preheating

at 260 ± 5 °C

for 10 ±1 s

at 255 ± 5 °C

for 10 ±1 s

Thermal shock

(solder shock)

Dip soldering at

300 °C/5 s

Dip soldering at

300 °C/5 s

No deterioration of

electrical parameters.

Capacitance change:

≤ ±15%

Tests of resistance IEC

Immersion in

Change of varistor

to soldering heat

for SMDs

60068-2-58 60/40 SnPb for 10 s Sn96.5Ag3.0Cu0.5 voltage:

at 260 °C

for 10 s at 260 °C

≤ ±5%

Tests of resistance IEC

Immersion

of leads in

Sn96.5Ag3.0Cu0.5 Change of

for 10 s at 260 °C capacitance X7R:

≤ ꢁ5/+10%

Change of varistor

voltage: ≤ ±5%

to soldering heat

for radial leaded

components

(SHCV)

60068-2-20 of leads in

60/40 SnPb

for 10 s at 260 °C

Please read Cautions and warnings and

Important notes at the end of this document.

Page 24 of 33

SMD disk varistors (CU varistors)

Standard series

Note:

Leaching of the termination

Effective area at the termination might be lost if the soldering temperature and/or immersion time

are not kept within the recommended conditions. Leaching of the outer electrode should not ex-

ceed 25% of the chip end area (full length of the edge A-B-C-D) and 25% of the length A-B,

shown below as mounted on substrate.

As a single chip

As mounted on substrate

7

Notes for proper soldering

Preheating and cooling

7.1

According to JEDEC J-STD-020D. Please refer to chapter 2.

7.2

Repair / rework

Manual soldering with a soldering iron must be avoided, hot-air methods are recommended for

rework purposes.

7.3

Cleaning

All environmentally compatible agents are suitable for cleaning. Select the appropriate cleaning

solution according to the type of flux used. The temperature difference between the components

and cleaning liquid must not be greater than 100 °C. Ultrasonic cleaning should be carried out

with the utmost caution. Too high ultrasonic power can impair the adhesive strength of the metal-

lized surfaces.

7.4

Solder paste printing (reflow soldering)

An excessive application of solder paste results in too high a solder fillet, thus making the chip

more susceptible to mechanical and thermal stress. Too little solder paste reduces the adhesive

strength on the outer electrodes and thus weakens the bonding to the PCB. The solder should be

applied smoothly to the end surface.

Please read Cautions and warnings and

Important notes at the end of this document.

Page 25 of 33

SMD disk varistors (CU varistors)

Standard series

7.5

Adhesive application

Thin or insufficient adhesive causes chips to loosen or become disconnected during curing.

Low viscosity of the adhesive causes chips to slip after mounting. It is advised to consult the

manufacturer of the adhesive on proper usage and amounts of adhesive to use.

7.6

Selection of flux

Used flux should have less than or equal to 0.1 wt % of halogenated content, since flux residue

after soldering could lead to corrosion of the termination and/or increased leakage current on the

surface of the component. Strong acidic flux must not be used. The amount of flux applied should

be carefully controlled, since an excess may generate flux gas, which in turn is detrimental to sol-

derability.

7.7

Storage of CTVSs

Solderability is guaranteed for one year from date of delivery for multilayer varistors, CeraDiodes

and ESD/EMI filters (half a year for chips with AgPd terminations) and two years for SHCV and

CU components, provided that components are stored in their original packages.

Storage temperature:

Relative humidity:

ꢁ25 °C to +45 °C

≤75% annual average, ≤95% on 30 days a year

The solderability of the external electrodes may deteriorate if SMDs and leaded components are

stored where they are exposed to high humidity, dust or harmful gas (hydrogen chloride, sulfurous

acid gas or hydrogen sulfide).

Do not store SMDs and leaded components where they are exposed to heat or direct sunlight.

Otherwise the packing material may be deformed or SMDs/ leaded components may stick togeth-

er, causing problems during mounting.

After opening the factory seals, such as polyvinyl-sealed packages, it is recommended to use the

SMDs or leaded components as soon as possible.

7.8

Placement of components on circuit board

Especially in the case of dual-wave soldering, it is of advantage to place the components on the

board before soldering in that way that their two terminals do not enter the solder bath at different

times.

Ideally, both terminals should be wetted simultaneously.

7.9

Soldering cautions

An excessively long soldering time or high soldering temperature results in leaching of the outer

electrodes, causing poor adhesion and a change of electrical properties of the varistor due to

the loss of contact between electrodes and termination.

Wave soldering must not be applied for MLVs designated for reflow soldering only.

Keep the recommended down-cooling rate.

Please read Cautions and warnings and

Important notes at the end of this document.

Page 26 of 33

SMD disk varistors (CU varistors)

Standard series

7.10

Standards

CECC 00802

IEC 60068-2-58

IEC 60068-2-20

JEDEC J-STD-020D

Please read Cautions and warnings and

Important notes at the end of this document.

Page 27 of 33

SMD disk varistors (CU varistors)

Standard series

Symbols and terms

Symbol

C_line,typ

C_max

C_min

Term

Typical capacitance per line

Maximum capacitance

Minimum capacitance

C_nom

∆C_nom

C_typ

Nominal capacitance

Tolerance of nominal capacitance

Typical capacitance

f_cut-off,min

I

I_clamp

I_leak

I_leak,typ

I_PP

Minimum cut-off frequency

Current

Clamping current

Leakage current

Typical leakage current

Peak pulse current

I_surge,max

LCT

L_typ

Maximum surge current (also termed peak current)

Lower category temperature

Typical inductance

P_diss,max

P_PP

Maximum power dissipation

Peak pulse power

R_ins

Insulation resistance

R_min

Minimum resistance

R_S

Resistance per line

T_A

Ambient temperature

T_op

Operating temperature

Storage temperature

T_stg

t_r

Duration of equivalent rectangular wave

Response time

t_resp

UCT

V

Upper category temperature

Voltage

V_BR,min

V_clamp,max

V_DC,max

V_ESD,air

V_ESD,contact

V_jump

Minimum breakdown voltage

Maximum clamping voltage

Maximum DC operating voltage (also termed working voltage)

Air discharge ESD capability

Contact discharge ESD capability

Maximum jump start voltage

Please read Cautions and warnings and

Important notes at the end of this document.

Page 28 of 33

SMD disk varistors (CU varistors)

Standard series

V_RMS,max

V_V

Maximum AC operating voltage, root-mean-square value

Varistor voltage (also termed breakdown voltage)

Minimum varistor voltage

V_V,min

V_V,max

∆V_V

Maximum varistor voltage

Tolerance of varistor voltage

W_LD

Maximum load dump

W_max

Maximum energy absorption (also termed transient energy)

α_typ

Typical insertion loss

Lead spacing

ꢂ*ꢃ

Maximum possible application conditions

All dimensions are given in mm.

The commas used in numerical values denote decimal points.

Please read Cautions and warnings and

Important notes at the end of this document.

Page 29 of 33

SMD disk varistors (CU varistors)

Standard series

Cautions and warnings

General

Some parts of this publication contain statements about the suitability of our ceramic transient

voltage suppressor (CTVS) components (multilayer varistors (MLVs), CeraDiodes, ESD/EMI fil-

ters, SMD disk varistors (CU types), leaded transient voltage/ RFI suppressors (SHCV types)) for

certain areas of application, including recommendations about incorporation/design-in of these

products into customer applications. The statements are based on our knowledge of typical re-

quirements often made of our CTVS devices in the particular areas. We nevertheless expressly

point out that such statements cannot be regarded as binding statements about the suitability of

our CTVS components for a particular customer application. As a rule, EPCOS is either unfamiliar

with individual customer applications or less familiar with them than the customers themselves.

For these reasons, it is always incumbent on the customer to check and decide whether the

CTVS devices with the properties described in the product specification are suitable for use in a

particular customer application.

Do not use EPCOS CTVS components for purposes not identified in our specifications,

application notes and data books.

Ensure the suitability of a CTVS in particular by testing it for reliability during design-in. Always

evaluate a CTVS component under worst-case conditions.

Pay special attention to the reliability of CTVS devices intended for use in safety-critical

applications (e.g. medical equipment, automotive, spacecraft, nuclear power plant).

Design notes

Always connect a CTVS in parallel with the electronic circuit to be protected.

Consider maximum rated power dissipation if a CTVS has insufficient time to cool down

between a number of pulses occurring within a specified isolated time period. Ensure that

electrical characteristics do not degrade.

Consider derating at higher operating temperatures. Choose the highest voltage class

compatible with derating at higher temperatures.

Surge currents beyond specified values will puncture a CTVS. In extreme cases a CTVS will

burst.

If steep surge current edges are to be expected, make sure your design is as low-inductance

as possible.

In some cases the malfunctioning of passive electronic components or failure before the end of

their service life cannot be completely ruled out in the current state of the art, even if they are

operated as specified. In applications requiring a very high level of operational safety and

especially when the malfunction or failure of a passive electronic component could endanger

human life or health (e.g. in accident prevention, life-saving systems, or automotive battery line

applications such as clamp 30), ensure by suitable design of the application or other measures

(e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by

third parties in the event of such a malfunction or failure. Only use CTVS components from the

automotive series in safety-relevant applications.

Specified values only apply to CTVS components that have not been subject to prior electrical,

mechanical or thermal damage. The use of CTVS devices in line-to-ground applications is

Please read Cautions and warnings and

Important notes at the end of this document.

Page 30 of 33

SMD disk varistors (CU varistors)

Standard series

therefore not advisable, and it is only allowed together with safety countermeasures like

thermal fuses.

Storage

Only store CTVS in their original packaging. Do not open the package before storage.

Storage conditions in original packaging: temperature ꢁ25 to +45°C, relative humidity ≤75%

annual average, maximum 95%, dew precipitation is inadmissible.

Do not store CTVS devices where they are exposed to heat or direct sunlight. Otherwise the

packaging material may be deformed or CTVS may stick together, causing problems during

mounting.

Avoid contamination of the CTVS surface during storage, handling and processing.

Avoid storing CTVS devices in harmful environments where they are exposed to corrosive

gases for example (SO_x, Cl).

Use CTVS as soon as possible after opening factory seals such as polyvinyl-sealed packages.

Solder CTVS components after shipment from EPCOS within the time specified:

ꢁ

CTVS with Ni barrier termination, 12 months

CTVS with AgPd termination, 6 months

SHCV and CU series, 24 months

Handling

Do not drop CTVS components and allow them to be chipped.

Do not touch CTVS with your bare hands - gloves are recommended.

Avoid contamination of the CTVS surface during handling.

Mounting

When CTVS devices are encapsulated with sealing material or overmolded with plastic

material, electrical characteristics might be degraded and the life time reduced.

Make sure an electrode is not scratched before, during or after the mounting process.

Make sure contacts and housings used for assembly with CTVS components are clean before

mounting.

The surface temperature of an operating CTVS can be higher. Ensure that adjacent

components are placed at a sufficient distance from a CTVS to allow proper cooling.

Avoid contamination of the CTVS surface during processing.

Multilayer varistors (MLVs) with AgPd termination are not approved for lead-free soldering.

Soldering

Complete removal of flux is recommended to avoid surface contamination that can result in an

instable and/or high leakage current.

Use resin-type or non-activated flux.

Bear in mind that insufficient preheating may cause ceramic cracks.

Rapid cooling by dipping in solvent is not recommended, otherwise a component may crack.

Please read Cautions and warnings and

Important notes at the end of this document.

Page 31 of 33

SMD disk varistors (CU varistors)

Standard series

Conductive adhesive gluing

Only multilayer varistors (MLVs) with an AgPd termination are approved for conductive

adhesive gluing.

Operation

Use CTVS only within the specified operating temperature range.

Use CTVS only within specified voltage and current ranges.

Environmental conditions must not harm a CTVS. Only use them in normal atmospheric

conditions. Reducing the atmosphere (e.g. hydrogen or nitrogen atmosphere) is prohibited.

Prevent a CTVS from contacting liquids and solvents. Make sure that no water enters a CTVS

(e.g. through plug terminals).

Avoid dewing and condensation.

EPCOS CTVS components are mainly designed for encased applications. Under all

circumstances avoid exposure to:

ꢁ

direct sunlight

rain or condensation

steam, saline spray

corrosive gases

atmosphere with reduced oxygen content

EPCOS CTVS devices are not suitable for switching applications or voltage stabilization where

static power dissipation is required.

Multilayer varistors (MLVs) are designed for ESD protection and transient suppression.

CeraDiodes are designed for ESD protection only, ESD/EMI filters are designed for ESD and

EMI protection only.

This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.

Please read Cautions and warnings and

Important notes at the end of this document.

Page 32 of 33

Important notes

The following applies to all products named in this publication:

1. Some parts of this publication contain statements about the suitability of our products for

certain areas of application. These statements are based on our knowledge of typical re-

quirements that are often placed on our products in the areas of application concerned. We

nevertheless expressly point out that such statements cannot be regarded as binding

statements about the suitability of our products for a particular customer application.

As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar

with them than the customers themselves. For these reasons, it is always ultimately incum-

bent on the customer to check and decide whether an EPCOS product with the properties de-

scribed in the product specification is suitable for use in a particular customer application.

2. We also point out that in individual cases, a malfunction of electronic components or

failure before the end of their usual service life cannot be completely ruled out in the

current state of the art, even if they are operated as specified. In customer applications

requiring a very high level of operational safety and especially in customer applications in

which the malfunction or failure of an electronic component could endanger human life or

health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by

means of suitable design of the customer application or other action taken by the customer

(e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by

third parties in the event of malfunction or failure of an electronic component.

3. The warnings, cautions and product-specific notes must be observed.

4. In order to satisfy certain technical requirements, some of the products described in this

publication may contain substances subject to restrictions in certain jurisdictions (e.g.

because they are classed as hazardous). Useful information on this will be found in our Ma-

terial Data Sheets on the Internet (www.epcos.com/material). Should you have any more de-

tailed questions, please contact our sales offices.

5. We constantly strive to improve our products. Consequently, the products described in this

publication may change from time to time. The same is true of the corresponding product

specifications. Please check therefore to what extent product descriptions and specifications

contained in this publication are still applicable before or when you place an order. We also

reserve the right to discontinue production and delivery of products. Consequently, we

cannot guarantee that all products named in this publication will always be available. The

aforementioned does not apply in the case of individual agreements deviating from the fore-

going for customer-specific products.

6. Unless otherwise agreed in individual contracts, all orders are subject to the current ver-

sion of the "General Terms of Delivery for Products and Services in the Electrical In-

dustry" published by the German Electrical and Electronics Industry Association

(ZVEI).

7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CSSP, CTVS, DSSP, MiniBlue, MKK,

MLSC, MotorCap, PCC, PhaseCap, PhaseMod, SIFERRIT, SIFI, SIKOREL, SilverCap,

SIMDAD, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse, WindCap are trademarks

registered or pending in Europe and in other countries. Further information will be found on

the Internet at www.epcos.com/trademarks.

Page 33 of 33


型号：	B72650M0140K093
厂家：	EPCOS
描述：	RESISTOR, VOLTAGE DEPENDENT, 18V, 0.4J, SURFACE MOUNT, CHIP, 2110, ROHS COMPLIANT
文件：	总33页 (文件大小：840K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

B72650M0140K093 [EPCOS]

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