B82477G4473M003 [EPCOS]
1 ELEMENT, 47uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD, CHIP, 5050, ROHS COMPLIANT;
| 型号： | B82477G4473M003 |
| 厂家： | 
EPCOS |
| 描述： | 1 ELEMENT, 47uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD, CHIP, 5050, ROHS COMPLIANT |
| 文件： | 总7页 (文件大小：636K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SMT Power Inductors
Size 12.8 x 12.8 x 8.0 (mm)
Series/Type:
B82477G
Ordering code:
B82477G4473M003
Date:
June 2012
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Identification/Classification 1
(header 1 + top left bar):
SMT Power Inductors
Identification/Classification 2
Size 12.8 x 12.8 x 8.0 (mm)
(header 2 + bottom left header bar):
Ordering code: (top right header bar)
Series/Type: (bottom right header bar)
B82477G4473M003
B82477G
Preliminary data (optional):
(if necessary)
Department:
Date:
June 2012
EPCOS AG 2012. Reproduction, publication and dissemination of this publication, enclosures hereto and the information
contained therein without EPCOS' prior express consent is prohibited.
SMT Power Inductors
B82477G4473M003
B82477G
Size 12.8 x 12.8 x 8.0 (mm)
Rated inductance 47 µH
Construction
■ Ferrite core
■ Magnetically shielded
■ Winding: enamel copper wire
■ Winding: soldered to terminals
Features
■ High mechanical stability
■ Temperature range up to +125 °C
■ Increased current handling capability
compared to standard device
B82477G4473M000 (Isat +30%)
■ Low DC resistance
■ Suitable for lead-free reflow soldering
■ RoHS-compatible
Applications
■ Filtering of supply voltages
■ Coupling, decoupling
■ DC/DC converters
Terminals
■ Base material CuSn6P
■ Layer composition Ni, Sn (lead-free)
■ Electro-plated
Marking
■ Marking on component:
Manufacturer, L value (µH, coded),
manufacturing date (YWWD)
■ Minimum data on reel:
Manufacturer, ordering code, L value,
quantity, date of packing
Delivery mode and packing unit
■ 24-mm blister tape, wound on 330-mm reel
■ Packing unit: 400 pcs./reel
June 2012
Please read Cautions and warnings and
Page 2 of 7
Important notes at the end of this document.
SMT Power Inductors
B82477G4473M003
B82477G
Size 12.8 x 12.8 x 8.0 (mm)
Dimensional Drawing and layout recommendation
1)
1)
7
8.5±0.2
1.5±0.2
13.2
IND0493-B
Marking
12.8 max.
1) Soldering area
Dimensions in mm
IND0492-V-E
Taping and packing
Blister tape and reel
4±0.1
1.5+0.1
2±0.1
Component
21±0.5
2.5±0.5
13±0.2
1.0
1.5 min.
8.7 max.
20±0.1
30.4 max.
330±1
Direction of unreeling
IND0348-6
IND0342-S-E
Dimensions in mm
June 2012
Please read Cautions and warnings and
Page 3 of 7
Important notes at the end of this document.
SMT Power Inductors
B82477G4473M003
B82477G
Size 12.8 x 12.8 x 8.0 (mm)
Technical data and measuring conditions
Measured with LCR meter Agilent 4284A at frequency fL,
0.1 V, +20 °C
Rated inductance LR
Rated temperature TR
Rated current IR
+85 °C
Max. permissible DC with temperature increase of ≤40 K
at rated temperature
Saturation current ISat
DC resistance Rtyp
Permissible DC with inductance decrease ∆L/L0 of approx. 10%
Measured at +20 °C
Dip and look method Sn95.5Ag3.8Cu0.7: +(245 5) °C, (3 0.3) s
Wetting of soldering area 90% (based on IEC 60068-2-58)
Solderability (lead-free)
Resistance to soldering heat
Climatic category
+260 °C, 10 s
55/125/56 (to IEC 60068-1)
Mounted: –55 °C … +125 °C
Packaged: –25 °C … +40 °C, ≤75% RH
Storage conditions
Weight
Approx. 4 g
Characteristics and ordering codes
LR
Tolerance
fL
IR
A
Isat
A
Rtyp
Rmax
Ordering code
MHz
H
47
20% = M
0.1
3.00
5.00
0.051 0.055 B82477G4473M003
June 2012
Please read Cautions and warnings and
Important notes at the end of this document.
Page 4 of 7
SMT Power Inductors
B82477G4473M003
B82477G
Size 12.8 x 12.8 x 8.0 (mm)
Inductance derating versus DC superposition
Current derating IOP/IR
versus ambient temperature TA
(rated temperature TR = +85°C)
IND0508-Z
1.2
Iop
IR
1.0
0.8
0.6
0.4
0.2
0
0
20 40 60 80 100 120 C 150
˚
TA
June 2012
Please read Cautions and warnings and
Page 5 of 7
Important notes at the end of this document.
SMT Power Inductors
B82477G4473M003
B82477G
Size 12.8 x 12.8 x 8.0 (mm)
Cautions and warnings
■ Please note the recommendations in our Inductors data book (latest edition) and in the data
sheets.
– Particular attention should be paid to the derating curves given there.
– The soldering conditions should also be observed. Temperatures quoted in relation to wave
soldering refer to the pin, not the housing.
■ If the components are to be washed varnished it is necessary to check whether the washing
varnish agent that is used has a negative effect on the wire insulation, any plastics that are used,
or on glued joints. In particular, it is possible for washing varnish agent residues to have a
negative effect in the long-term on wire insulation
Washing processes may damage the product due to the possible static or cyclic mechanical
loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,
which might lead to reduced reliability or lifetime.
■ The following points must be observed if the components are potted in customer applications:
– Many potting materials shrink as they harden. They therefore exert a pressure on the plastic
housing or core. This pressure can have a deleterious effect on electrical properties, and in
extreme cases can damage the core or plastic housing mechanically.
– It is necessary to check whether the potting material used attacks or destroys the wire
insulation, plastics or glue.
– The effect of the potting material can change the high-frequency behaviour of the components.
■ Ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to
breakage of the core.
■ Even for customer-specific products, conclusive validation of the component in the circuit can
only be carried out by the customer.
June 2012
Please read Cautions and warnings and
Page 6 of 7
Important notes at the end of this document.
Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical
requirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application. As a
rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them
than the customers themselves. For these reasons, it is always ultimately incumbent on the
customer to check and decide whether an EPCOS product with the properties described in the
product specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or failure
before the end of their usual service life cannot be completely ruled out in the current state
of the art, even if they are operated as specified. In customer applications requiring a very high
level of operational safety and especially in customer applications in which the malfunction or
failure of an electronic component could endanger human life or health (e.g. in accident
prevention or life-saving systems), it must therefore be ensured by means of suitable design of the
customer application or other action taken by the customer (e.g. installation of protective circuitry
or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or
failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as hazardous). Useful information on this will be found in our Material
Data Sheets on the Internet (www.epcos.com/material). Should you have any more detailed
questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order.
We also reserve the right to discontinue production and delivery of products. Consequently,
we cannot guarantee that all products named in this publication will always be available.
The aforementioned does not apply in the case of individual agreements deviating from the
foregoing for customer-specific products.
6. Unless otherwise agreed in individual contracts, all orders are subject to the current version of
the “General Terms of Delivery for Products and Services in the Electrical Industry”
published by the German Electrical and Electronics Industry Association (ZVEI).
7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CeraLink, CSMP, CSSP, CTVS, DeltaCap,
DigiSiMic, DSSP, FilterCap, FormFit, MiniBlue, MiniCell, MKD, MKK, MLSC, MotorCap, PCC,
PhaseCap, PhaseCube, PhaseMod, PhiCap, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD,
SiMic, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse, WindCap are trademarks
registered or pending in Europe and in other countries. Further information will be found on the
Internet at www.epcos.com/trademarks.
Page 7 of 7
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