PMF5118VSF [ERICSSON]
DC-DC Regulated Power Supply Module, 1 Output, 12.5W, Hybrid, ROHS COMPLIANT, SMD-10;
| 型号： | PMF5118VSF |
| 厂家： | 
ERICSSON |
| 描述： | DC-DC Regulated Power Supply Module, 1 Output, 12.5W, Hybrid, ROHS COMPLIANT, SMD-10 |
| 文件： | 总16页 (文件大小：774K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CApril 2007
Key Features
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10A output current
4.5-5. 5V input voltage range
DDR/QDR compatible output voltage
V
TT tracks VREF in range of 0.55V to 1.8V
Industry standard POLA™ compatible
22.1 x 12.57 x 8.51 mm (0.87 x 0.5 x 0.335 in.)
More than 4.0 million hours MTBF
General Characteristics
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Operating temperature: -40ºC to 85ºC
Input under voltage protection
Start up into a pre-biased output safe
Output short-circuit protection
On/Off inhibit control (VTT standby)
Highly automated manufacturing ensures quality
ISO 9001/14001 certified supplier
Safety Approvals
Design for Environment
Meets requirements in high-
temperature lead-free soldering
processes.
Contents
General Information
Safety Specification
Absolute Maximum Ratings
............................................................. 2
............................................................. 3
............................................................. 4
Product Program
0.55-1.8 V/10 A
1.25 V/10 A Electrical Specification
Ordering No.
PMF 5118VxF ........................................
............................................................. 5
EMC Specification
............................................................. 8
............................................................. 8
........................................................... 10
........................................................... 10
........................................................... 11
........................................................... 13
........................................................... 15
........................................................... 16
Operating Information
Thermal Consideration
Connections
Mechanical Information
Soldering Information
Delivery Information
Product Qualification Specification
2
Technical Specification
EN/LZT 146 332 R1C April 2007
PMF 5000F series
POL regulator, Input 4.5-5.5 V, Output 10 A/18 W
© Ericsson Power Modules AB
Compatibility with RoHS requirements)
General Information
The products are compatible with the relevant clauses and
requirements of the RoHS directive 2002/95/EC and have a
maximum concentration value of 0.1% by weight in
homogeneous materials for lead, mercury, hexavalent
chromium, PBB and PBDE and of 0.01% by weight in
homogeneous materials for cadmium.
Ordering Information
See Contents for individual product ordering numbers.
Option
Through hole pin
SMD pin
Suffix
P
S
PMF5118VPF
PMF5118VSF
SMD pin, leadfree reflow
temperature capable pin
R
PMF5118VSRF
Reliability
The Mean Time Between Failure (MTBF) is calculated at full
output power and an operating ambient temperature (TA) of
+40°C. Different methods could be used to calculate the
predicted MTBF and failure rate which may give different
results. Ericsson Power Modules currently uses Telcordia
SR332.
Exemptions in the RoHS directive utilized in Ericsson
Power Modules products include:
-
Lead in high melting temperature type solder (used to
solder the die in semiconductor packages)
Lead in glass of electronics components and in
electronic ceramic parts (e.g. fill material in chip
resistors)
-
Predicted MTBF for the series is:
-
4.05 million hours according to Telcordia SR332, issue
1, Black box technique.
-
Lead as an alloying element in copper alloy containing
up to 4% lead by weight (used in connection pins
made of Brass)
Telcordia SR332 is a commonly used standard method
intended for reliability calculations in IT&T equipment. The
parts count procedure used in this method was originally
modelled on the methods from
MIL-HDBK-217F, Reliability Predictions of Electronic
Equipment.
It assumes that no reliability data is available on the actual
units and devices for which the predictions are to be made,
i.e. all predictions are based on generic reliability
parameters.
The exemption for lead in solder for servers, storage and
storage array systems, network infrastructure equipment
for switching, signaling, transmission as well as network
management for telecommunication is only utilized in
surface mount products intended for end-users’ leaded
SnPb Eutectic soldering processes.
Quality Statement
The products are designed and manufactured in an
industrial environment where quality systems and methods
like ISO 9000, 6σ (sigma), and SPC are intensively in use to
boost the continuous improvements strategy. Infant
mortality or early failures in the products are screened out
and they are subjected to an ATE-based final test.
Conservative design rules, design reviews and product
qualifications, plus the high competence of an engaged
work force, contribute to the high quality of our products.
Warranty
Warranty period and conditions are defined in Ericsson
Power Modules General Terms and Conditions of Sale.
Limitation of Liability
Ericsson power Modules does not make any other
warranties, expressed or implied including any warranty of
merchantability or fitness for a particular purpose
(including, but not limited to, use in life support
applications, where malfunctions of product can cause
injury to a person’s health or life).
3
CApril 2007
Safety Specification
Isolated DC/DC converters
It is recommended that a slow blow fuse with a rating
twice the maximum input current per selected product be
used at the input of each DC/DC converter. If an input filter
is used in the circuit the fuse should be placed in front of
the input filter.
General information
Ericsson Power Modules DC/DC converters and DC/DC
regulators are designed in accordance with safety
standards IEC/EN/UL60950, Safety of Information
Technology Equipment.
In the rare event of a component problem in the input filter
or in the DC/DC converter that imposes a short circuit on
the input source, this fuse will provide the following
functions:
IEC/EN/UL60950 contains requirements to prevent injury
or damage due to the following hazards:
•
•
•
•
•
•
Electrical shock
Energy hazards
Fire
Mechanical and heat hazards
Radiation hazards
Chemical hazards
•
•
Isolate the faulty DC/DC converter from the input
power source so as not to affect the operation of
other parts of the system.
Protect the distribution wiring from excessive
current and power loss thus preventing
hazardous overheating.
On-board DC-DC converters are defined as component
power supplies. As components they cannot fully comply
with the provisions of any Safety requirements without
“Conditions of Acceptability”. It is the responsibility of the
installer to ensure that the final product housing these
components complies with the requirements of all
applicable Safety standards and Directives for the final
product.
The galvanic isolation is verified in an electric strength test.
The test voltage (Viso) between input and output is
1500 Vdc or 2250 Vdc for 60 seconds (refer to product
specification).
Leakage current is less than 1 μA at nominal input voltage.
24 V DC systems
The input voltage to the DC/DC converter is SELV (Safety
Extra Low Voltage) and the output remains SELV under
normal and abnormal operating conditions.
Component power supplies for general use should comply
with the requirements in IEC60950, EN60950 and
UL60950 “Safety of information technology equipment”.
48 and 60 V DC systems
There are other more product related standards, e.g.
IEEE802.3af “Ethernet LAN/MAN Data terminal equipment
power”, and ETS300132-2 “Power supply interface at the
input to telecommunications equipment; part 2: DC”, but
all of these standards are based on IEC/EN/UL60950 with
regards to safety.
If the input voltage to Ericsson Power Modules DC/DC
converter is 75 Vdc or less, then the output remains SELV
(Safety Extra Low Voltage) under normal and abnormal
operating conditions.
Single fault testing in the input power supply circuit should
be performed with the DC/DC converter connected to
demonstrate that the input voltage does not exceed
75 Vdc.
Ericsson Power Modules DC/DC converters and DC/DC
regulators are UL60950 recognized and certified in
accordance with EN60950.
If the input power source circuit is a DC power system, the
source may be treated as a TNV2 circuit and testing has
demonstrated compliance with SELV limits and isolation
requirements equivalent to Basic Insulation in accordance
with IEC/EN/UL60950.
The flammability rating for all construction parts of the
products meets requirements for V-0 class material
according to IEC 60695-11-10.
The products should be installed in the end-use
equipment, in accordance with the requirements of the
ultimate application. Normally the output of the DC/DC
converter is considered as SELV (Safety Extra Low
Voltage) and the input source must be isolated by
minimum Double or Reinforced Insulation from the primary
circuit (AC mains) in accordance with IEC/EN/UL60950.
Non-isolated DC/DC regulators
The input voltage to the DC/DC regulator is SELV (Safety
Extra Low Voltage) and the output remains SELV under
normal and abnormal operating conditions.
4
CApril 2007
Absolute Maximum Ratings
Characteristics
min
–40
typ
max
85
Unit
°C
°C
V
Tref
TS
VI
Operating Temperature (see Thermal Consideration section)
Storage temperature
Input voltage
–40
125
5.5
4.5
5
Positive logic option
Negative logic option
Vin-0.5
N/A
Open
N/A
N/A
V
Inhibit On/Off pin voltage
(see Operating Information section)
Vinh
Vadj
V
Adjust pin voltage (see Operating Information section)
N/A
V
Stress in excess of Absolute Maximum Ratings may cause permanent damage. Absolute Maximum Ratings, sometimes referred to as no destruction limits, are
normally tested with one parameter at a time exceeding the limits of Output data or Electrical Characteristics. If exposed to stress above these limits, function and
performance may degrade in an unspecified manner.
Fundamental Circuit Diagram
3
2
1
2
VIN
VTT
1
VSEN
3
2
1
GND
Auto Track
VREF
PWM Controller
Error Amplifier
Ref
INH
RC Block
GND
GND
GND
5
CApril 2007
1.25 V/10 A Electrical Specification
PMF 5118VxF
Tref = -40 to +85ºC, VI = 4.5 to 5.5 V, VREF = 1.25V, unless otherwise specified under conditions.
Typical values given at: Tref = +25°C, VI= 5 V, max IO, unless otherwise specified under conditions.
Additional Cin=330uF and Cout=470uF. See Operating Information section for selection of capacitor types.
Connect the sense pin, where available, to the output pin.
Characteristics
Conditions
min
4.5
typ
max
Unit
V
VI
Input voltage range
5.5
VIoff
VIon
CI
Turn-off input voltage
Turn-on input voltage
Internal input capacitance
Output power
Decreasing input voltage
Increasing input voltage
3.4
3.7
4.3
75
V
4.45
12.5
V
µF
W
PO
0
50 % of max IO
max IO
89.8
84.1
2.4
η
Efficiency
%
Pd
Pli
PRC
IS
Power Dissipation
Input idling power
Input standby power
Static Input current
Switching frequency
max IO
W
mW
mW
A
IO= 0, VI = 5 V
160
25
VI = 5 V (turned off with INHIBIT)
VI = 5 V, max IO
0-100% of max IO
3.0
fs
250
300
350
kHz
Output voltage initial setting and
accuracy
VOi
Tref = +25°C, VI = 5 V, max IO
1.240
1.240
1.250
1.260
1.260
V
Output voltage tolerance band
Idling voltage
10-100% of max IO
IO = 0
1.250
1.251
±10
V
V
VO
Line regulation
Max IO
mV
mV
Load regulation
VI = 5 V, 0-100% of max IO
±10
Load transient
voltage deviation
VI = 5 V, Load step from -1.5A to
+1.5A, di/dt = 15 A/µs,
see Note 1
Vtr
ttr
tr
25
30
40
mV
µs
Load transient recovery time
Ramp-up time
(from 10−90 % of VOi)
3.0
ms
max IO
Start-up time
(from VI connection to 90% of VOi)
ts
tf
4.8
ms
Max Io
170
475
4.8
60
µs
µs
ms
µs
ms
A
Vin shutdown fall time.
(From VI off to 10% of VO)
Io = 1A
Max Io
INHIBIT start-up time
tInh
Max Io
INHIBIT shutdown fall time
(From INHIBIT off to 10% of VO)
Io = 0.1 A
4.0
IO
Output current
0
10
Ilim
Current limit threshold
Tref < max Tref,
20
20
A
See ripple & noise section,
max IO, VOi
VOac
Output ripple & noise
mVp-p
Note1: Output filter according to Ripple & Noise section
6
CApril 2007
1.25 V/10 A Typical Characteristics
Efficiency
PMF 5118VxF
Power Dissipation
[%]
95
[W]
2.40
90
1.80
1.20
0.60
0.00
4.5 V
5V
4.5 V
5 V
5.5 V
85
80
75
5.5 V
70
0
2
4
6
8
10 [A]
0
2
4
6
8
10 [A]
Dissipated power vs. load current and input voltage at
ref = +25°C
Efficiency vs. load current and input voltage at Tref = +25°C
T
Output Current Deratings
Output Characteristics
[A]
14
[V]
1.30
12
10
8
2.0 m/s
1.0 m/s
0.5 m/s
1.25
1.20
1.15
1.10
4.5 V
5 V
6
5.5 V
4
Nat.
Conv.
2
0
0
20
40
60
80
[°C]
0
2
4
6
8
10 [A]
Available load current vs. ambient air temperature and airflow at
VI = 5 V, VOUT = 1.5 V. See Thermal Consideration section.
Output voltage vs. load current at Tref = +25°C
7
CApril 2007
1.25 V/10 A Typical Characteristics
PMF 5118VxF
Start-up
Shut-down
Start-up enabled by connecting VI at:
Tref = +25°C, IO = 10 A resistive load,
VI = 5 V.
Top trace: output voltage (0.5 V/div).
Bottom trace: input voltage (2 V/div).
Time scale: 20 ms/div.
Shut-down enabled by disconnecting VI at:
Tref = +25°C, IO = 10 A resistive load,
VI = 5 V.
Top trace: output voltage (0.5 V/div). Bottom
trace: input voltage (2 V/div).
Time scale: 20 ms/div.
Output Ripple & Noise
Output Load Transient Response
Output voltage ripple (20mV/div) at:
Tref = +25°C, IO = 10 A resistive load,
VI = 5 V. Time scale: 2 µs/div
See the filter in the Output ripple and noise
section (EMC Specification).
Output voltage response to load current step- Top trace: Vout-Vtrk (50mV/div).
change (-1.5A-1.5A) at:
Bottom trace: load current (2 A/div).
Time scale: 0.05 ms/div.
Tref =+25°C, VI = 5 V.
8
CApril 2007
EMC Specification
Output ripple and noise
Output ripple and noise measured according to figure below.
See Design Note 022 for detailed information.
Conducted EMI measured according to test set-up.
The fundamental switching frequency is 300 kHz for
PMF 5118VxF @ VI = 5.0 V, max IO.
Conducted EMI Input terminal value (typ)
TBD
Output ripple and noise test setup
EMI without filter
Operating information
Extended information for POLA products is found in
Application Note AN206.
Input Voltage
The input voltage range 4.5 to 5.5 Vdc makes the product
easy to use in intermediate bus applications when powered
by a regulated bus converter.
TBD
Turn-off Input Voltage
The DC/DC regulators monitor the input voltage and will turn
on and turn off at predetermined levels.
The minimum hysteresis between turn on and turn off input
voltage is 0.6V.
Remote Control {Inhibit}
Test set-up
The products are fitted with a
remote control (Inhibit) function
referenced to the primary negative
input connection (- In), positive
logic. The INHIBIT function allows
the regulator to be turned on/off by
an external device like a
Layout recommendation
The radiated EMI performance of the DC/DC regulator will
depend on the PCB layout and ground layer design.
It is also important to consider the stand-off of the DC/DC
regulator.
If a ground layer is used, it should be connected to the output
of the DC/DC regulator and the equipment ground or chassis.
semiconductor or mechanical
switch.
The regulator will turn on when the input voltage is applied
with the INH pin open. Turn off is achieved by connecting the
INH pin to the - In. To ensure safe turn off the voltage
difference between INH pin and the - In pin shall be less than
0.6V. The regulator will restart automatically when this
connection is opened.
A ground layer will increase the stray capacitance in the PCB
and improve the high frequency EMC performance.
9
CApril 2007
External Capacitors
Remote Sense
Input capacitors:
The DC/DC regulators have remote sense that can be used to
compensate for voltage drops between the output and the
point of load. The sense traces should be located close to the
PCB ground layer to reduce noise susceptibility. The remote
sense circuitry will compensate for up to 0.3v voltage drop
between output pins and the point of load.
The recommended input capacitors are determined by the
330 µF minimum capacitance and 500 mArms minimum
ripple current rating.
Output capacitors (required):
A 470 µF low-ESR electrolytic output capacitance Is required
to meet specification as defined in the electrical specification.
If the remote sense is not needed, Vsen can be left open.
Output capacitors (optional):
Over Current Protection (OCP)
The recommended output capacitance of 200 µF ceramic
capacitor will allow the module to meet its transient response
specification as defined in the electrical specification.
The regulators include current limiting circuitry for protection
at continuous overload.
The output voltage will decrease towards zero for output
currents in excess of current limit threshold. The regulator will
resume normal operation after removal of the overload. The
load distribution should be designed for the maximum output
short circuit current specified. The current limit operation is a
“hick up” mode.
When using one or more non-ceramic capacitors, the
calculated equivalent ESR should be no lower than 4 mΩ
(Use 7 mΩ as the minimum when using max-ESR values to
calculate).
Input And Output Impedance
The impedance of both the input source and the load will
interact with the impedance of the DC/DC regulator. It is
important that the input source has low characteristic
impedance. The regulators are designed for stable operation
without external capacitors connected to the input or output.
The performance in some applications can be enhanced by
addition of external capacitance as described under External
Decoupling Capacitors. If the input voltage source contains
significant inductance, the addition of a 100 µF capacitor
across the input of the regulator will ensure stable operation.
The capacitor is not required when powering the DC/DC
regulator from an input source with an inductance below
10 µH.
Generation of the BusTermination Voltage
The voltage at VREF is the reference voltage for the system bus
receiver comparators. It is normally set to precisely half the
bus driver supply voltage (VDDQ/2), using a resistor divider.
The Thevenin impedance of the network driving the VREF pin
should not exceed 500 ohm
The module senses VREF to regulate the output voltage VTT, the
required bus termination supply voltage. VTT is active about
20 ms after a valid VREF input source is applied to the module.
Once active VTT will track the voltage applied at VREF
.
External Decoupling Capacitors
When powering loads with significant dynamic current
requirements, the voltage regulation at the point of load can
be improved by addition of decoupling capacitors at the load.
The most effective technique is to locate low ESR ceramic
and electrolytic capacitors as close to the load as possible,
using several parallel capacitors to lower the effective ESR.
The ceramic capacitors will handle high-frequency dynamic
load changes while the electrolytic capacitors are used to
handle low frequency dynamic load changes. Ceramic
capacitors will also reduce any high frequency noise at the
load.
It is equally important to use low resistance and low
inductance PCB layouts and cabling.
External decoupling capacitors will become part of the
control loop of the DC/DC regulator and may affect the
stability margins. As a “rule of thumb”, 100 µF/A of output
current can be added without any additional analysis. The
ESR of the capacitors is a very important parameter. Power
Modules guarantee stable operation with a verified ESR value
of >10 mΩ across the output connections.
For further information please contact your local Ericsson
Power Modules representative.
10
CApril 2007
Thermal Consideration continued
Thermal Consideration
Definition of reference temperature (Tref
)
General
The reference temperature is used to monitor the temperature
limits of the product. Temperatures above maximum Tref are
not allowed and may cause degradation or permanent
damage to the product. Tref is also used to define the
temperature range for normal operating conditions.
The regulators are designed to operate in different thermal
environments and sufficient cooling must be provided to
ensure reliable operation.
Cooling is achieved mainly by conduction, from the pins to
the host board, and convection, which is dependant on the
airflow across the regulator. Increased airflow enhances the
cooling of the regulator.
Tref is defined by the design and used to guarantee safety
margins, proper operation and high reliability of the module.
Ambient Temperature Calculation
The Output Current Derating graph found in the Output
section for each model provides the available output current
vs. ambient air temperature and air velocity at Vin = 5 V.
TBD
The DC/DC regulator is tested on a 254 x 254 mm,
35 µm (1 oz), 8-layer test board mounted vertically in a wind
tunnel with a cross-section of 305 x 305 mm.
Connections
Proper cooling of the DC/DC regulator can be verified by
measuring the temperature at positions P1, P2 and P3. The
temperature at these positions should not exceed the max
values provided in the table below.
v F
Note that the max value is the absolute maximum rating
(non destruction) and that the electrical Output data is
guaranteed up to Tref +85°C.
See Design Note 019 for further information.
TOP VIEW
Position
P1
Device
PCB
Designation
Tref
max value
110º C
P2
P3
MOSFET
120º C
120º C
Pin
1
Designation
GND
Function
Common ground connection for the Vin
and VTT power connections.
INDUCTOR
2
3
VIN
The positive input voltage power node to
the module.
Inhibit
Applying a low-level ground signal to this
input disables the module’s output.
4
5
No Connect
VoSENSE
The Vo sense allows the regulation circuit
to compensate for voltage drop between
the module and load. For optimal voltage
accuracy Vo Sense should be connected
to VTT.
6
VTT
Regulated power output with respect to
the GND node and required bus
termination supply voltage.
7
8
GND
VREF
Common ground connection for the Vin
and VTT power connections.
Reference voltage for the system bus
receiver comparators.
9
No Connect
No Connect
10
11
CApril 2007
Mechanical Information (Surface mount version)
12
CApril 2007
Mechanical Information (Through hole mount version)
13
CApril 2007
Maximum regulator temperature requirements
Soldering Information - Surface mounting
The surface mount version of the product is intended for
convection or vapor phase reflow Pb-free processes. To
achieve a good and reliable soldering result, make sure to
follow the recommendations from the solder paste supplier,
to use state-of-the-art reflow equipment and reflow profiling
techniques as well as the following guidelines.
To avoid damage or performance degradation of the product,
the reflow profile should be optimized to avoid excessive
heating. The maximum product temperature shall be
monitored by attaching a thermocoupler to the top of the
main transformer.
A sufficiently extended preheat time is recommended to
ensure an even temperature across the host PCB, for both
small and large devices. To reduce the risk of excessive
heating is also recommended to reduce the time in the reflow
zone as much as possible.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside of the DC/DC regulator. The
cleaning residues may affect long time reliability and isolation
voltage.
SnPb solder processes
Minimum pin temperature recommendations
For conventional SnPb solder processes, the product is
qualified for MSL 1 according to IPC/JEDEC standard
J-STD-020C.
Pin number 9 is chosen as reference location for the minimum
pin temperature recommendations since this will be the
coolest solder joint during the reflow process.
During reflow, TP must not exceed +225 °C at any time.
PIN 9 for measurement of
minimum solder joint
temperature, TPIN
Lead-free (Pb-free) solder processes
For Pb-free solder processes, the product is qualified for
MSL 3 according to IPC/JEDEC standard J-STD-020C.
Main transformer for
measurement of Max
product temperature, TP
During reflow, TP must not exceed +260 °C at any time.
Temperature
Ramp-up
TP
Ramp-down
(cooling)
TL
SnPb solder processes
For Pb solder processes, a pin temperature (TPIN) in excess of
the solder melting temperature, (TL, +183 °C for Sn63/Pb37)
for more than 30 seconds, and a peak temperature of
+210 °C is recommended to ensure a reliable solder joint.
Reflow
Preheat
Time 25 °C to peak
25 °C
Time
Lead-free (Pb-free) solder processes
For Pb-free solder processes, a pin temperature (TPIN) in
Profile features
Sn/Pb eutectic
assembly
Pb-free assembly
excess of the solder melting temperature (TL, +217 to +221 °C
for Sn/Ag/Cu solder alloys) for more than 30 seconds, and a
peak temperature of +235 °C on all solder joints is
recommended to ensure a reliable solder joint.
Average ramp-up rate
3 °C/s max
+183 °C
3 °C/s max
+221 °C
Solder melting
temperature (typical)
TL
Peak product temperature TP
Average ramp-down rate
+225 °C
+260 °C
6 °C/s max
6 °C/s max
Time 25 °C to peak
temperature
6 minutes max
8 minutes max
14
CApril 2007
Soldering Information — Through Hole Mounting
The through hole mount version of the product is intended for
through hole mounting in a PCB. When wave soldering is
used, the temperature on the pins is specified to maximum
260 °C for maximum 10 seconds.
Maximum preheat rate of 4 °C/s and temperature of max
150 °C is suggested. When hand soldering, care should be
taken to avoid direct contact between the hot soldering iron
tip and the pins for more than a few seconds in order to
prevent overheating.
A no-clean (NC) flux is recommended to avoid entrapment of
cleaning fluids in cavities inside of the DC/DC power module.
The residues may affect long time reliability and isolation
voltage.
15
CApril 2007
Delivery package information
Carrier tape specifications
The products are delivered in antistatic trays (JEDEC
Polystyrene
Material
standard) or in antistatic carrier tape (EIA standard).
< 10E5 ohms/square
The tape can not be baked.
44 mm [1.732 inch]
24 mm [0.945 inch]
9.57 mm [0.377 inch]
380 mm [15 inch]
Surface resistance
Bake ability
Tape width
Tray specifications
PET
Material
Pocket pitch
Pocket depth
Reel diameter
Reel capacity
Box capacity
Weight
10E3 to 10E5 ohms/square
The trays can not be baked.
36 products /tray
180 products/box)
240 g/full tray
Surface resistance
Bake ability
Tray capacity
Box capacity
Weight
250 products /reel
250 products (1 reels/box)
1.4 kg/full reel
Tape feed directions
Round holes
Elongated holes
Dry pack information
The products are delivered in trays or tape & reel. These inner
shipment containers are dry packed in standard moisture
barrier bags according to IPC/JEDEC standard J-STD-033A
(Handling, packing, shipping and use of moisture/reflow
sensitivity surface mount devices).
Using products in high temperature Pb-free soldering
processes requires dry pack storage and handling. In case
the products have been stored in an uncontrolled
environment and no longer can be considered dry, the
modules must be baked according to the referred IPC/JEDEC
standard.
16
CApril 2007
Product Qualification Specification
Characteristics
Visual inspection
JESD22-B101
Temperature cycling
JESD22-A104-B
Dwell time
30 min
Transfer time
Temperature range
Number of cycles
0-1 min
-40 °C to +125 °C
300 cycles
High temperature storage life
Cold (in operation)
JESD22-A103-B
IEC 68-2-1, test Ad
JESD22-B105-C
Temperature
Duration
125 °C
1000 h
Temperature TA
Duration
-45 °C
72 h
Lead integrity
Test condition A
Weight
Duration
1000 g
30 s
Solder ability(only apply to
through hole version)
IEC 68-2-54
Solder immersion depth
Duration of immersion (FC time)
TA (time for onset of wetting)
Time to FB
1 mm
15 s
<4 s
8 s
Wetting Strength FB
Stability FC /FB
>100 mN/m
>0.8
Steady State Temperature
Humidity Bias Life Test
JESD22-A101-B
JESD22-B104-B
Temperature
Humidity
Duration
+85 °C
85 % RH
1000 hours
Maximum
Input Voltage
Mechanical shock
Peak acceleration
Duration
200 g
1.5 ms
Number of shocks
5 in each of two directions of three axes
Vibration, variable freq
Random vibration
JESD22-B103-B
JESD22-B103-B
Frequency range
Acceleration amplitude
10-1000 Hz
10 g or displacement amplitude 1.0 mm
Frequency
Acceleration density
2-500 Hz
0.008-0.2 g2/Hz
Operational life test
Temperature
Load
ON
85 °C
Maximum
9 min
OFF
3 min
Test duration
1000 h
Moisture reflow sensitivity
classification test
J-STD-020C
SnPb eutectic MSL 1
Pb free MSL 3
225 °C
260 °C
Resistance to cleaning agents
IEC 68-2-45 Xa
Method 2
Water
Glycol ether
Isopropyl alcohol
+55 ±5 °C
+35 ±5 °C
+35 ±5 °C
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