MAX809 [ESTEK]
3-PIN MICROPROCESSOR RESET MONITORS; 3引脚微处理器复位监视器
| 型号： | MAX809 |
| 厂家： | 
Estek Electronics Co. Ltd |
| 描述： | 3-PIN MICROPROCESSOR RESET MONITORS |
| 文件： | 总7页 (文件大小：306K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
The MAX809 and MAX810 are cost–effective system supervisor
circuits designed to monitor VCC in digital systems and provide a reset
signal to the host processor when necessary. No external components
are required.
The reset output is driven active within 20 µsec of VCC falling
through the reset voltage threshold. Reset is maintained active for a
minimum of 140msec after VCC rises above the reset threshold. The
MAX810 has an active–high RESET output while the MAX809 has
an active–low RESET output. The output of the MAX809 is
guaranteed valid down to VCC = 1V. Both devices are available in a
SOT–23 package.
The MAX809/810 are optimized to reject fast transient glitches on
the VCC line. Low supply current of 17µA (VCC = 3.3V) makes these
devices suitable for battery powered applications.
SOT–23
(TO–236)
CASE 318
PIN CONFIGURATION
(Top View)
Features
• Precision VCC Monitor for 3.0V, 3.3V, and 5.0V Supplies
• 140msec Guaranteed Minimum RESET, RESET
Output Duration
GND
1
• RESET Output Guaranteed to VCC = 1.0V (MAX809)
V
CC
3
• Low 17µA Supply Current
• VCC Transient Immunity
• Small SOT–23 Package
RESET
(RESET)**
2
• No External Components
• Wide Operating Temperature: –40°C to 85°C
SOT–23*
NOTE: *SOT–23 is equivalent to JEDEC (TO–236)
** RESET is for MAX809
Typical Applications
• Computers
** RESET is for MAX810
• Embedded Systems
• Battery Powered Equipment
• Critical µP Power Supply Monitoring
ORDERING INFORMATION
Device
Package
Shipping
TYPICAL APPLICATION DIAGRAM
MAX809xTR
SOT–23
3000 Tape/Reel
V
CC
MAX810xTR
SOT–23
3000 Tape/Reel
V
V
CC
CC
MAX809
RESET
PROCESSOR
NOTE: The ”x” denotes a suffix for V
see table below
threshold –
CC
RESET
INPUT
Suffix
Reset V Threshold (V)
CC
GND
GND
L
4.63
4.38
4.00
3.08
2.93
2.63
M
J*
T
S
R
NOTE: *J version is available for MAX809 only
1
MAX809, MAX810
ABSOLUTE MAXIMUM RATINGS*
Symbol
Parameter
to GND)
Value
Unit
V
Supply Voltage (V
6.0
CC
RESET, RESET
–0.3 to (V
CC
+ 0.3)
V
Input Current, V
CC
20
mA
Output Current, RESET, RESET
dV/dt (V
20
mA
)
100
V/µsec
mW
CC
P
D
Power Dissipation (T ≤ 70°C)
A
SOT–23 (derate 4mW/°C above +70°C)
230
T
Operating Temperature Range
–40 to +85
–65 to +150
+260
°C
°C
°C
A
T
stg
Storage Temperature Range
T
sol
Lead Temperature (Soldering, 10 Seconds)
* Maximum Ratings are those values beyond which damage to the device may occur.
2
MAX809, MAX810
ELECTRICAL CHARACTERISTICS (V
= Full Range, T = –40°C to +85°C unless otherwise noted. typical values are at T
A A
CC
= +25C, V
= 5V for L/M/J, 3.3V for T/S, 3.0V for R) (Note NO TAG)
CC
Symbol
Characteristic
Min
Typ
Max
Unit
V
Range
= 0°C to +70°C
= –40°C to +85°C
V
CC
T
1.0
1.2
—
—
5.5
5.5
A
T
A
I
Supply Current
MAX8xxL/M/J: V
MAX8xxR/S/T: V
µA
CC
< 5.5V
< 3.6V
—
—
24
17
60
50
CC
CC
V
TH
Reset Threshold (Note NO TAG)
MAX8xxL: T = 25°C
V
4.56
4.50
4.31
4.25
3.93
3.89
3.04
3.00
2.89
2.85
2.59
2.55
4.63
—
4.38
—
4.00
—
3.08
—
2.93
—
2.63
—
4.70
4.75
4.45
4.50
4.06
4.10
3.11
3.15
2.96
3.00
2.66
2.70
A
T
= –40°C to +85°C
A
MAX8xxM: T = 25°C
A
T
= –40°C to +85°C
A
MAX809J: T = 25°C
A
T
= –40°C to +85°C
A
MAX8xxT: T = 25°C
A
T
= –40°C to +85°C
A
MAX8xxS: T = 25°C
A
T
= –40°C to +85°C
A
MAX8xxR: T = 25°C
A
T
= –40°C to +85°C
A
Reset Threshold Temperature Coefficient
to Reset Delay V = V to (V – 100mV)
TH
—
—
30
20
—
—
ppm/°C
µsec
msec
V
V
CC
CC
Reset Active Timeout Period
RESET Output Voltage Low (MAX809)
TH
140
240
560
V
OL
MAX809R/S/T: V
MAX809L/M/J: V
= V
= V
= 50µA
min, I
min, I
= 1.2mA
= 3.2mA
—
—
—
—
—
—
0.3
0.4
0.3
CC
CC
TH
TH
SINK
SINK
V
CC
> 1.0V, I
SINK
V
OH
V
OL
V
OH
RESET Output Voltage High (MAX809)
V
V
V
MAX809R/S/T: V
MAX809L/M/J: V
> V
> V
max, I
max, I
= 500µA
= 800µA
0.8 V
—
—
—
—
CC
CC
TH
TH
SOURCE
SOURCE
CC
– 1.5
V
CC
RESET Output Voltage Low (MAX810)
MAX810R/S/T: V
MAX810L/M/J: V
= V
= V
max, I
max, I
= 1.2mA
= 3.2mA
—
—
—
—
0.3
0.4
CC
CC
TH
TH
SINK
SINK
RESET Output Voltage High (MAX810)
1.8 < V < V min, I = 150µA
0.8 V
CC
—
—
CC
TH
SOURCE
1. Production testing done at T = 25°C, over temperature limits guaranteed by design.
A
PIN DESCRIPTION
Pin No.
Symbol
GND
Description
1
2
Ground
RESET (MAX809)
RESET output remains low while V
is below the reset voltage threshold, and for 240msec (typ.)
CC
after V
rises above reset threshold
CC
2
3
RESET (MAX810)
RESET output remains high while V is below the reset voltage threshold, and for 240msec (typ.)
CC
after V
rises above reset threshold
CC
V
CC
Supply Voltage (typ.)
3
MAX809, MAX810
APPLICATIONS INFORMATION
V
Transient Rejection
hold the output low (Figure 2). This resistor value, though
CC
not critical, should be chosen such that it does not
appreciably load RESET under normal operation (100k
will be suitable for most applications). Similarly, a pull–up
resistor to VCC is required for the MAX810 to ensure a valid
high RESET for VCC below 1.0V.
The MAX809/810 provides accurate VCC monitoring and
reset timing during power–up, power–down, and
brownout/sag conditions, and rejects negative–going
transients (glitches) on the power supply line. Figure 1
shows the maximum transient duration vs. maximum
negative excursion (overdrive) for glitch rejection. Any
combination of duration and overdrive which lies under the
curve will not generate a reset signal. Combinations above
the curve are detected as a brownout or power–down.
Transient immunity can be improved by adding a capacitor
in close proximity to the VCC pin of the MAX809/810.
V
CC
V
CC
MAX809
RESET
V
CC
R1
100 k
GND
V
TH
Overdrive
Figure 2. Ensuring RESET Valid to V
= 0 V
CC
Duration
Processors With Bidirectional I/O Pins
400
T
A
= +25° C
Some µP’s (such as Motorola 68HC11) have
bi–directional reset pins. Depending on the current drive
capability of the processor pin, an indeterminate logic level
may result if there is a logic conflict. This can be avoided
by adding a 4.7k resistor in series with the output of the
MAX809/810 (Figure 3). If there are other components in
the system which require a reset signal, they should be
buffered so as not to load the reset line. If the other
componentsare required to follow the reset I/O of the µP, the
buffer should be connected as shown with the solid line.
320
240
160
90
0
MAX8xxL/M/J
MAX8xxR/S/T
10
1
100
1000
RESET COMPARATOR OVERDRIVE,
(V – V (mV)
BUFFER
BUFFERED RESET
TO OTHER SYSTEM
COMPONENTS
TH
CC
V
CC
Figure 1. Maximum Transient Duration vs. Overdrive
for Glitch Rejection at 25° C
V
CC
P
V
CC
RESET Signal Integrity During Power–Down
MAX809
47 k
The MAX809 RESET output is valid to VCC = 1.0V.
Belowthis voltage the output becomes an ”open circuit” and
does not sink current. This means CMOS logic inputs to the
µP will be floating at an undetermined voltage. Most digital
systems are completely shutdown well above this voltage.
However, in situations where RESET must be maintained
valid to VCC = 0V, a pull–down resistor must be connected
from RESET to ground to discharge stray capacitances and
RESET
RESET
GND
GND
Figure 3. Interfacing to Bidirectional Reset I/O
4
MAX809, MAX810
TYPICAL CHARACTERISTICS
35
30
25
20
15
10
5
30
V
V
= 5 V
= 3 V
CC
V
V
= 5 V
= 3 V
25
20
15
10
CC
CC
CC
V
CC
= 1 V
5
0
V
CC
= 1 V
0
–40
–20
0
20
40
60
85
–40
–20
0
20
40
60
85
TEMPERATURE (C°)
TEMPERATURE (C°)
Figure 4. Supply Current vs Temperature
(No Load, MAX8xxR/S/T)
Figure 5. Supply Current vs Temperature
(No Load, MAX8xxL/M/J/)
140
120
100
80
100
80
V
OD
= VTH – V
CC
OD
V
OD
= VTH – V
CC
V
= 10 mV
V
OD
= 10 mV
60
40
V
OD
= 10 mV
V
OD
= 20 mV
60
40
20
V
= 100 mV
V
OD
= 100 mV
OD
20
0
V
= 200 mV
V
= 200 mV
OD
20
TEMPERATURE (C°)
OD
0
–40
–40
–20
0
20
40
60
85
–20
0
40
60
85
TEMPERATURE (C°)
Figure 7. Power–Down Reset Delay vs
Figure 6. Power–Down Reset Delay vs
Temperature and Overdrive (MAX8xxL/M/J)
Temperature and Overdrive (MAX8xxR/S/T)
250
245
1.003
1.002
MAX8xxL/M/J
MAX8xxR/S/T
1.001
1.000
240
235
0.999
0.998
0.997
230
225
–40
–20
0
20
40
60
85
–40
–20
0
20
40
60
85
TEMPERATURE (C°)
TEMPERATURE (C°)
Figure 8. Power–Up Reset Timeout vs
Temperature
Figure 9. Normalized Reset Threshold vs
Temperature
5
MAX809, MAX810
Component Taping Orientation for 3L SOT–23 (JEDEC–236) Devices
USER DIRECTION OF FEED
TAPING FORM
DEVICE
MARKING
PIN 1
Standard Reel Component Orientation
(Mark Right Side Up)
Tape & Reel Specifications Table
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
SOT–23
8 mm
4 mm
3000
7 inches
MARKING DIAGRAM
SOT–23
x
x
Y
W
YW = Date Code
MARKING
ON Semiconductor Part #
Reset Threshold or Address
Marking
MAX809L
MAX809M
MAX809T
MAX809S
MAX809R
MAX809J
4.63
4.38
3.08
2.93
2.63
4.00
4.63
4.38
3.08
2.93
2.63
J1YW
J2YW
J3YW
J4YW
J5YW
J6YW
K1YW
K2YW
K3YW
K4YW
K5YW
MAX810L
MAX810M
MAX810T
MAX810S
MAX810R
YW = Date code
6
MAX809, MAX810
PACKAGE DIMENSIONS
SOT–23
PLASTIC PACKAGE (TO–236)
CASE 318–08
ISSUE AF
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
A
L
3
INCHES
DIM MIN MAX
MILLIMETERS
S
C
B
MIN
2.80
1.20
0.89
0.37
1.78
MAX
3.04
1.40
1.11
0.50
2.04
0.100
0.177
0.69
1.02
2.64
0.60
1
2
A
B
C
D
G
H
J
0.1102 0.1197
0.0472 0.0551
0.0350 0.0440
0.0150 0.0200
0.0701 0.0807
V
G
0.0005 0.0040 0.013
0.0034 0.0070 0.085
K
L
S
0.0140 0.0285
0.0350 0.0401
0.0830 0.1039
0.0177 0.0236
0.35
0.89
2.10
0.45
H
J
D
V
K
7
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