12061A221J-MR [ETC]
CAP. 220PF MINIREEL 500PCS ; CAP 。 220PF MINIREEL 500PCS\n
| 型号： | 12061A221J-MR |
| 厂家： | 
ETC |
| 描述： | CAP. 220PF MINIREEL 500PCS
|
| 文件： | 总12页 (文件大小：341K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
C0G (NP0) Dielectric
General Specifications
C0G (NP0) is the most popular formulation of the “tempera-
ture-compensating,” EIA Class I ceramic materials. Modern
C0G (NP0) formulations contain neodymium, samarium and
other rare earth oxides.
C0G (NP0) ceramics offer one of the most stable capacitor
dielectrics available. Capacitance change with temperature
is 0 ±±0ppmꢀ/C which is less than ±0.±ꢁ ∆ C from -55/C
to +125/C. Capacitance drift or hysteresis for C0G (NP0)
ceramics is negligible at less than ±0.05ꢁ versus up to
±2ꢁ for films. ꢂypical capacitance change with life is less
than ±0.1ꢁ for C0G (NP0), one-fifth that shown by most
other dielectrics. C0G (NP0) formulations show no aging
characteristics.
ꢂhe C0G (NP0) formulation usually has a “Q” in excess
of 1000 and shows little capacitance or “Q” changes with
frequency. ꢂheir dielectric absorption is typically less than
0.6ꢁ which is similar to mica and most films.
PART NUMBER (see page 3 for complete part number explanation)
0805
5
A
101
J
A
T
2
A
Size
(L" x W")
Voltage
25ꢃ = ±
50ꢃ = 5
100ꢃ = 1
200ꢃ = 2
Dielectric
C0G (NP0) = A
Capacitance Capacitance
Failure
Rate
A = Not
Applicable
Terminations
ꢂ = Plated Ni
and Solder
Packaging
2 = 7" Reel
4 = 1±" Reel
Special
Code
A = Std.
Product
Code
Tolerance
Preferred
K = ±10ꢁ
J = ± 5ꢁ
PERFORMANCE CHARACTERISTICS
Capacitance Range
0.5 pF to .1 µF (1.0 ±0.2 ꢃrms, 1ꢄkH, for ≤100 pF use 1 MkH)
Capacitance Tolerances
Preferred ±5ꢁ, ±10ꢁ
others available: ±.25 pF, ±.5 pF, ±1ꢁ (≥25pF), ±2ꢁ(≥1±pF), ±20ꢁ
For values ≤ 10 pF preferred tolerance is ±.5 pF, also available ±.25 pF.
Operating Temperature Range
Temperature Characteristic
Voltage Ratings
-55/C to +125/C
0 ± ±0 ppmꢀ/C (EIA C0G)
25, 50, 100 & 200 ꢃDC (+125/C)
Dissipation Factor and “Q”
For values >±0 pF: 0.1ꢁ max. (+25/C and +125/C)
For values ≤±0 pF: “Q” = 400 + 20 x C (C in pF)
Insulation Resistance (+25/C, RꢃDC)
Insulation Resistance (+125/C, RꢃDC)
Dielectric Strength
100,000 megohms min. or 1000 MΩ - µF min., whichever is less
10,000 megohms min. or 100 MΩ - µF min., whichever is less
250ꢁ of rated voltage for 5 seconds at 50 mamp max. current
1 ± 0.2 ꢃrms
Test Voltage
Test Frequency
For values ≤100 pF: 1 MkH
For values >100 pF: 1 KkH
4
C0G (NP0) Dielectric
Typical Characteristic Curves**
Variation of Impedance with Cap Value
Impedance vs. Frequency
0805 - C0G (NP0)
Temperature Coefficient
10 pF vs. 100 pF vs. 1000 pF
Typical Capacitance Change
Envelope: 0 ± 30 ppm/°C
100,000
10,000
1,000
100
+0.5
0
-0.5
10 pF
10.0
-55 -35
+125
-15 +5 +25 +45 +65 +85 +105
1.0
0.1
100 pF
1000 pF
Temperature °C
1
100
1000
10
⌬ Capacitance vs. Frequency
Frequency, MHz
Variation of Impedance with Chip Size
Impedance vs. Frequency
1000 pF - C0G (NP0)
+2
+1
10
0
-1
-2
1206
0805
1812
1210
1.0
0.1
1KHz
10 KHz
100 KHz
1 MHz
10 MHz
Frequency
100
1000
10
Frequency, MHz
Insulation Resistance vs Temperature
10,000
1,000
100
Variation of Impedance with Ceramic Formulation
Impedance vs. Frequency
1000 pF - C0G (NP0) vs X7R
0805
10.00
X7R
NPO
1.00
0.10
0.01
0
+20
+40
+60
+80 +100
+25
Temperature °C
100
1000
10
Frequency, MHz
SUMMARY OF CAPACITANCE RANGES VS. CHIP SIZE
Style
0402*
0504
25V
0.5pF - 220pF
0.5pF - 330pF
0.5pF - 1nF
0.5pF - 4.7nF
0.5pF - 10nF
560pF - 10nF
—
50V
100V
200V
0.5pF - 120pF
0.5pF - 150pF
0.5pF - 1nF
0.5pF - 2.2nF
0.5pF - 4.7nF
560pF - 10nF
10pF - 1.5nF
1nF - 4.7nF
1nF - 10nF
—
—
0.5pF - 68pF
0.5pF - 330pF
0.5pF - 1nF
0.5pF - 2.2nF
560pF - 3.9nF
10pF - 820pF
1nF - 3.9nF
1nF - 4.7nF
1nF - 12nF
—
0603*
0805*
1206*
1210*
1505
—
0.5pF - 470pF
0.5pF - 1nF
560pF - 1.5nF
10pF - 560pF
1nF - 2.2nF
1nF - 3.3nF
1nF - 6.8nF
3.3nF - 27nF
1nF - 39nF
1808
→
1812*
1825*
2220
1nF - 15nF
→
1nF - 22nF
→
4.7nF - 47nF
1nF - 100nF
4.7nF - 39nF
1nF - 39nF
2225
→
* Standard Sizes
** For additional information on performance changes with operating conditions consult AVX’s software SpiCap.
5
C0G (NP0) Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE
0402*
0504*
0603*
0805
1206
1505
Standard Reel
All Paper
1.00 .10
(.040 .004)
.50 .10
(.020 .004)
All Embossed
1.27 .25
(.050 .010)
1.02 .25
(.040 .010)
All Paper
1.60 .15
(.063 .006)
.81 .15
(.032 .006)
Paper/Embossed
2.01 .20
(.079 .008)
1.25 .20
(.049 .008)
Paper/Embossed
3.20 .20
(.126 .008)
1.60 .20
(.063 .008)
All Embossed
3.81 .25
(.150 .010)
1.27 .25
(.050 .010)
Packaging
MM
(L) Length
(W) Width
(in.)
MM
(in.)
MM
(in.)
MM
(in.)
.60
1.02
.90
1.30
1.50
1.27
(T) Max. Thickness
(t) Terminal
WVDC
(.024)
(.040)
(.035)
(.051)
(.059)
(.050)
.25 .15
(.010 .006)
.38 .13
(.015 .005)
.35 .15
(.014 .006)
.50 .25
(.020 .010)
.50 .25
(.020 .010)
.50 .25
(.020 .010)
25
50
25
50
100
25
50
100
25
50
100
200
25
50
100
200
50
100
200
Cap
(pF)
0.5
W
1.0
1.2
1.5
L
᭢
T
᭢
1.8
2.2
2.7
t
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
10000
= Paper Tape
= Embossed Tape
*Reflow soldering only.
NOTES: For higher voltage chips, see pages 20 and 21.
6
C0G (NP0) Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE
1210
1808*
1812*
1825*
2220*
2225*
Standard Reel Packaging
Paper/Embossed
All Embossed
All Embossed
All Embossed
All Embossed
All Embossed
MM
(in.)
3.20 .20
(.126 .008)
4.57 .25
(.180 .010)
4.50 .30
(.177 .012)
4.50 .30
(.177 .012)
5.7 .40
(.225 .016)
5.72 .25
(.225 .010)
(L) Length
MM
(in.)
2.50 .20
(.098 .008)
2.03 .25
(.080 .010)
3.20 .20
(.126 .008)
6.40 .40
(.252 .016)
5.0 .40
(.197 .016)
6.35 .25
(.250 .010)
(W) Width
MM
(in.)
1.70
(.067)
1.52
(.060)
1.70
(.067)
1.70
(.067)
2.30
(.090)
1.70
(.067)
(T) Max. Thickness
(t) Terminal
MM
(in.)
.50 .25
(.020 .010)
.64 .39
(.025 .015)
.61 .36
(.024 .014)
.61 .36
(.024 .014)
.64 .39
(.025 .015)
.64 .39
(.025 .015)
WVDC
25
50
100
200
50
100
200
25
50
100
200
50
100
200
50
100
200
50
100
200
Cap
(pF)
560
680
820
W
L
᭢
1000
1200
1500
T
᭢
1800
2200
2700
t
3300
3900
4700
5600
6800
8200
Cap.
(µF)
.010
.012
.015
.018
.022
.027
.033
.039
.047
.068
.082
.1
= Paper Tape
*Reflow soldering only.
= Embossed Tape
NOTES: For higher voltage chips, see pages 20 and 21.
7
How to Order
Part Number Explanation
EXAMPLE: 08055A101JAT2A
0805
5
A
101
J
A
T
2
A
Size
(L" x W")
0402
0504
0603
0805
1005
0907
1206
1210
1505
1805
1808
1812
1825
2225
3640
Dielectric
C0G (NP0) = A
X7R = C
Capacitance
Tolerance
C = .25 pFꢀ
D = .50 pFꢀ
F = 1ꢁ (≥ 25 pF)
G = 2ꢁ (≥ 13 pF)
J = 5ꢁ
K = 10ꢁ
M = 20ꢁ
Z = +80ꢁ, -20ꢁ
P = +100ꢁ, -0ꢁ
Terminations
Special**
Code
Standard:
T = Ni and Tin
Plated
A = Standard
Product
X5R = D
Z5U = E
Y5V = G
Non-Standard
P = Embossed
unmarked
M = Embossed
marked
E = Standard
packaging
Others:
7 = Plated Ni
Gold Plated
1 = Pd/Ag
marked
Low Profile
Chips Only
Max. Thickness
T = .66mm (.026")
S = .56mm (.022")
R = .46mm (.018")
Voltage
10V = Z
Capacitance
Code
Failure
Rate
A = Not
Applicable
16V = Y
(2 significant
digits + no. of
zeros)
25V = 3
50V = 5
100V = 1
200V = 2
250V = V
500V = 7
600V = C
1000V = A
1500V = S
2000V = G
2500V = W
3000V = H
4000V = J
5000V = K
Examples:
Packaging**
10 pF = 100
100 pF = 101
1,000 pF = 102
Recommended:
2 =7" Reel
4 =13" Reel
22,000 pF = 223
220,000 pF = 224
1 µF = 105
Others:
7 = Bulk Cassette
9 = Bulk
For values below 10 pF,
use “R” in place of
decimal point, e.g., 9.1
pfd = 9R1.
ꢀC&D tolerances for Յ10 pF values.
ꢀꢀ Standard Tape and Reel material depends upon chip size and thickness.
See individual part tables for tape material type for each capacitance value.
Note: Unmarked product is standard. Marked product is available on special request, please contact AVX.
Standard packaging is shown in the individual tables.
Non-standard packaging is available on special request, please contact AVX.
3
Surface Mounting Guide
MLC Chip Capacitors
Component Pad Design
Component pads should be designed to achieve good sol-
der filets and minimize component movement during reflow
soldering. Pad designs are given below for the most com-
mon sizes of multilayer ceramic capacitors for both wave
and reflow soldering. The basis of these designs is:
• Pad width equal to component width. It is permissible to
decrease this to as low as 85% of component width but it
is not advisable to go below this.
• Pad overlap 0.5mm beneath component.
• Pad extension 0.5mm beyond components for reflow and
1.0mm for wave soldering.
REFLOW SOLDERING
Case Size
0402
D1
D2
D3
D4
D5
D2
1.70 (0.07)
2.30 (0.09)
3.00 (0.12)
4.00 (0.16)
4.00 (0.16)
5.60 (0.22)
5.60 (0.22)
5.60 (0.22)
6.60 (0.26)
6.60 (0.26)
0.60 (0.02)
0.80 (0.03)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04))
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
0.50 (0.02)
0.70 (0.03)
1.00 (0.04)
2.00 (0.09)
2.00 (0.09)
3.60 (0.14)
3.60 (0.14)
3.60 (0.14)
4.60 (0.18)
4.60 (0.18)
0.60 (0.02)
0.80 (0.03)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
0.50 (0.02)
0.75 (0.03)
1.25 (0.05)
1.60 (0.06)
2.50 (0.10)
2.00 (0.08)
3.00 (0.12)
6.35 (0.25)
5.00 (0.20)
6.35 (0.25)
0603
0805
1206
1210
1808
1812
1825
2220
D1
D3
D4
D5
2225
Dimensions in millimeters (inches)
41
Surface Mounting Guide
MLC Chip Capacitors
WAVE SOLDERING
D2
Case Size
0603
D1
D2
D3
D4
D5
3.10 (0.12)
4.00 (0.15)
5.00 (0.19)
5.00 (0.19)
1.20 (0.05)
1.50 (0.06)
1.50 (0.06)
1.50 (0.06)
0.70 (0.03)
1.00 (0.04)
2.00 (0.09)
2.00 (0.09)
1.20 (0.05)
1.50 (0.06)
1.50 (0.06)
1.50 (0.06)
0.75 (0.03)
1.25 (0.05)
1.60 (0.06)
2.50 (0.10)
D1
D3
D4
0805
1206
1210
D5
Dimensions in millimeters (inches)
Component Spacing
Preheat & Soldering
For wave soldering components, must be spaced sufficiently
far apart to avoid bridging or shadowing (inability of solder
to penetrate properly into small spaces). This is less impor-
tant for reflow soldering but sufficient space must be
allowed to enable rework should it be required.
The rate of preheat should not exceed 4°C/second to
prevent thermal shock. A better maximum figure is about
2°C/second.
For capacitors size 1206 and below, with a maximum
thickness of 1.25mm, it is generally permissible to allow a
temperature differential from preheat to soldering of 150°C.
In all other cases this differential should not exceed 100°C.
For further specific application or process advice, please
consult AVX.
≥1.5mm (0.06)
≥1mm (0.04)
Cleaning
Care should be taken to ensure that the capacitors are
thoroughly cleaned of flux residues especially the space
beneath the capacitor. Such residues may otherwise
become conductive and effectively offer a low resistance
bypass to the capacitor.
≥1mm (0.04)
Ultrasonic cleaning is permissible, the recommended
conditions being 8 Watts/litre at 20-45 kHz, with a process
cycle of 2 minutes vapor rinse, 2 minutes immersion in the
ultrasonic solvent bath and finally 2 minutes vapor rinse.
42
Surface Mounting Guide
MLC Chip Capacitors
General
APPLICATION NOTES
Surface mounting chip multilayer ceramic capacitors
are designed for soldering to printed circuit boards or other
substrates. The construction of the components is such that
they will withstand the time/temperature profiles used in both
wave and reflow soldering methods.
Storage
Good solderability is maintained for at least twelve months,
provided the components are stored in their “as received”
packaging at less than 40°C and 70% RH.
Solderability
Handling
Terminations to be well soldered after immersion in a 60/40
tin/lead solder bath at 235 5°C for 2 1 seconds.
Chip multilayer ceramic capacitors should be handled with
care to avoid damage or contamination from perspiration
and skin oils. The use of tweezers or vacuum pick ups
is strongly recommended for individual components. Bulk
handling should ensure that abrasion and mechanical shock
are minimized. Taped and reeled components provides the
ideal medium for direct presentation to the placement
machine. Any mechanical shock should be minimized during
handling chip multilayer ceramic capacitors.
Leaching
Terminations will resist leaching for at least the immersion
times and conditions shown below.
Solder
Tin/Lead/Silver Temp. °C
60/40/0 260 5
Solder
Immersion Time
Seconds
Termination Type
Nickel Barrier
30 1
Preheat
It is important to avoid the possibility of thermal shock during
soldering and carefully controlled preheat is therefore
required. The rate of preheat should not exceed 4°C/second
and a target figure 2°C/second is recommended. Although
an 80°C to 120°C temperature differential is preferred,
recent developments allow a temperature differential
between the component surface and the soldering temper-
ature of 150°C (Maximum) for capacitors of 1210 size and
below with a maximum thickness of 1.25mm. The user is
cautioned that the risk of thermal shock increases as chip
size or temperature differential increases.
Recommended Soldering Profiles
Reflow
300
Natural
Cooling
Preheat
250
200
220°C
150
100
50
to
250°C
Soldering
Mildly activated rosin fluxes are preferred. The minimum
amount of solder to give a good joint should be used.
Excessive solder can lead to damage from the stresses
caused by the difference in coefficients of expansion
between solder, chip and substrate. AVX terminations are
suitable for all wave and reflow soldering systems. If hand
soldering cannot be avoided, the preferred technique is the
utilization of hot air soldering tools.
0
1min
(Minimize soldering time)
10 sec. max
1min
Wave
Cooling
Natural cooling in air is preferred, as this minimizes stresses
within the soldered joint. When forced air cooling is used,
cooling rate should not exceed 4°C/second. Quenching
is not recommended but if used, maximum temperature
differentials should be observed according to the preheat
conditions above.
300
Preheat
Natural
Cooling
250
200
150
100
50
T
230°C
to
Cleaning
250°C
Flux residues may be hygroscopic or acidic and must be
removed. AVX MLC capacitors are acceptable for use with
all of the solvents described in the specifications MIL-STD-
202 and EIA-RS-198. Alcohol based solvents are acceptable
and properly controlled water cleaning systems are also
acceptable. Many other solvents have been proven successful,
and most solvents that are acceptable to other components
on circuit assemblies are equally acceptable for use with
ceramic capacitors.
0
1 to 2 min
3 sec. max
(Preheat chips before soldering)
T/maximum 150°C
43
Packaging of Chip Components
Automatic Insertion Packaging
TAPE & REEL QUANTITIES
All tape and reel specifications are in compliance with RS481.
8mm
12mm
Paper or Embossed Carrier
Embossed Only
0805, 1005, 1206,
1210
0504, 0907
1505, 1805,
1808
1812, 1825
2220, 2225
Paper Only
0402, 0603
2,000 or 4,000(1)
10,000
Qty. per Reel/7" Reel
3,000
1,000
4,000
Qty. per Reel/13" Reel
10,000
(1) Dependent on chip thickness. Low profile chips shown on page 27 are 5,000 per reel for 7" reel. 0402 size chips are 10,000 per 7" reels and are
not available on 13" reels. For 3640 size chip contact factory for quantity per reel.
REEL DIMENSIONS
Tape
A
Max.
B*
Min.
D*
Min.
N
Min.
W2
Max.
C
W1
W3
Size(1)
7.9 Min.
(.311)
8.4+–10..00
14.4
8mm
+.060
(.331
)
(.567)
10.9 Max.
(.429)
–0.0
330
(12.992)
1.5
(.059)
13.0 0.20
(.512 .008)
20.2
(.795)
50
(1.969)
11.9 Min.
(.469)
15.4 Max.
(.607)
12.4+–20..00
18.4
(.724)
12mm
+.076
(.488
)
–0.0
Metric dimensions will govern.
English measurements rounded and for reference only.
(1) For tape sizes 16mm and 24mm (used with chip size 3640) consult EIA RS-481 latest revision.
32
Embossed Carrier Configuration
8 & 12mm Tape Only
8 & 12mm Embossed Tape
Metric Dimensions Will Govern
CONSTANT DIMENSIONS
Tape Size
D0
E
P0
P2
T Max.
T1
G1
G2
8mm
and
12mm
8.4+-00..010
1.75 0.10
4.0 0.10
2.0 0.05
0.600
(.024)
0.10
(.004)
Max.
0.75
0.75
+.004
(.059
-0.0
)
(.069 .004) (.157 .004) (.079 .002)
(.030)
(.030)
Min.
Min.
See Note 3
See Note 4
VARIABLE DIMENSIONS
Tape Size
B1
D1
F
P1
R
T2
W
A0 B0 K0
Max.
Min.
Min.
See Note 6 See Note 5
See Note 2
8.0+-00..13
4.55
1.0
3.5 0.05
4.0 0.10
25
2.5 Max
(.098)
8mm
See Note 1
See Note 1
See Note 1
See Note 1
(.315+-..000142
)
(.179)
(.039)
(.138 .002) (.157 .004)
(.984)
8.2
(.323)
1.5
(.059)
5.5 0.05
(.217 .002) (.157 .004)
4.0 0.10
30
(1.181)
6.5 Max.
(.256)
12.0 .30
(.472 .012)
12mm
8.0+-00..13
8mm
1/2 Pitch
4.55
(.179)
1.0
(.039)
3.5 0.05
(.138 .002) 0.79 .004
2.0 0.10
25
(.984)
2.5 Max.
(.098)
(.315+-..000142
)
12mm
Double
Pitch
8.2
(.323)
1.5
(.059)
5.5 0.05
(.217 .002) (.315 .004)
8.0 0.10
30
(1.181)
6.5 Max.
(.256)
12.0 .30
(.472 .012)
NOTES:
1. A0, B0, and K0 are determined by the max. dimensions to the ends of the terminals extending from the component body and/or the body dimensions of the component. The
clearance between the end of the terminals or body of the component to the sides and depth of the cavity (A0, B0, and K0) must be within 0.05 mm (.002) min. and 0.50 mm
(.020) max. The clearance allowed must also prevent rotation of the component within the cavity of not more than 20 degrees (see sketches C & D).
2. Tape with components shall pass around radius “R” without damage. The minimum trailer length (Note 2 Fig. 3) may require additional length to provide R min. for 12 mm
embossed tape for reels with hub diameters approaching N min. (Table 4).
3. G1 dimension is the flat area from the edge of the sprocket hole to either the outward deformation of the carrier tape between the embossed cavities or to the edge of the
cavity whichever is less.
4. G2 dimension is the flat area from the edge of the carrier tape opposite the sprocket holes to either the outward deformation of the carrier tape between the embossed cavity
or to the edge of the cavity whichever is less.
5. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment.
Dimensions of embossment location and hole location shall be applied independent of each other.
6. B1 dimension is a reference dimension for tape feeder clearance only.
33
Paper Carrier Configuration
8 & 12mm Tape Only
8 & 12mm Paper Tape
Metric Dimensions Will Govern
CONSTANT DIMENSIONS
Tape Size
D0
E
P0
P2
T1
G1
G2
R MIN.
+0.1
8mm
and
12mm
1.5 -0.0
1.75 0.10
4.0 0.10
2.0 0.05
0.10
(.004)
Max.
0.75
(.030)
Min.
0.75
(.030)
Min.
25 (.984)
See Note 2
+.004
-.000
(.059
)
(.069 .004) (.157 .004) (.079 .002)
VARIABLE DIMENSIONS
Tape Size
P1
F
W
A0 B0
See Note 1
T
8.0+-00..13
8mm
4.0 0.10
(.157 .004)
3.5 0.05
(.138 .002)
See Note 3
(.315+-..000142
)
4.0 .010
(.157 .004)
5.5 0.05
(.217 .002)
12.0 0.3
(.472 .012)
12mm
8.0+-00..13
8mm
1/2 Pitch
2.0 0.10
(.079 .004)
3.5 0.05
(.138 .002)
(.315+-..000142
)
12mm
Double
Pitch
8.0 0.10
(.315 .004)
5.5 0.05
(.217 .002)
12.0 0.3
(.472 .012)
NOTES:
1. A0, B0, and T are determined by the max. dimensions to the ends of the terminals extending from the component body and/or the body dimensions of the component. The
clearance between the ends of the terminals or body of the component to the sides and depth of the cavity (A0, B0, and T) must be within 0.05 mm (.002) min. and 0.50 mm
(.020) max. The clearance allowed must also prevent rotation of the component within the cavity of not more than 20 degrees (see sketches A & B).
2. Tape with components shall pass around radius “R” without damage.
3. 1.1 mm (.043) Base Tape and 1.6 mm (.063) Max. for Non-Paper Base Compositions.
Bar Code Labeling Standard
AVX bar code labeling is available and follows latest version of EIA-556-A.
34
Bulk Case Packaging
BENEFITS
BULK FEEDER
• Easier handling
• Smaller packaging volume
(1/20 of T/R packaging)
• Easier inventory control
• Flexibility
Case
Cassette
• Recyclable
Gate
Shooter
CASE DIMENSIONS
Shutter
Slider
12mm
36mm
Mounter
Head
Expanded Drawing
110mm
Chips
Attachment Base
CASE QUANTITIES
Part Size
0402
0603
0805
Qty.
(pcs / cassette)
10,000 (T=0.6mm)
5,000 (T¯≥0.6mm)
80,000
15,000
35
相关型号：
12061A221JAT1A
Ceramic Capacitor, Multilayer, Ceramic, 100V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.00022uF, Surface Mount, 1206, CHIP
KYOCERA AVX
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