174-9-310P [ETC]
THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS;
| 型号： | 174-9-310P |
| 厂家： | 
ETC |
| 描述： | THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS |
| 文件： | 总5页 (文件大小：262K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
WTS001_p50-68 6/14/07 10:46 AM Page 64
Accessory
Products
THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS
The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with
120 SERIES
a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of
only 0.05°C/W for a 0.001 in. film with an area of one square inch. There is no measurable increase in case tem-
perature of a mounted semiconductor on a heat sink after the 6-month stabilization period (Time versus Thermal
Resistivity graph below).
TYPICAL VALUES FOR THERMAL RESISTANCE,
120 SERIES - THERMAL JOINT COMPOUND
CASE TO SINK (Ø ) WHEN THERMAL JOINT
cs
Characteristic
Volume Resistivity
Description
5 X 1014 ohm-cm
225 volts/mil
COMPOUNDS ARE USED
Typical
Mounting Torque Thermal
in inch • pounds Resistance
Dielectric Strength
Case Style Characteristics
T0-3
TO-66
(N•M)
8 (0.9)
9 (0.9)
(°C/W)
0.09
0.14
Specific Gravity
Thermal Conductivity @ 36°C
2.1 min.
0.735 W/(m)(K)
5.1(Btu) (in.)/(hr)(ft2)(°F)
TO-220
8 (0.9)
15 (1.7)
0.50
0.16
Thermal Resistivity (P)
Bleed, % after 24 hrs @ 200°C
Evaporation, % after 24 hrs @ 200°C
Color
56 (°C)(in.)/watt
0.5
0.19 (4.8) stud x 0.44 (11.2) hex
0.25 (6.4) stud x 0.69 (17.5) hex
0.38 (9.7) stud x 1.06 (26.9) hex
30 (3.39)
75 (8.47)
0.10
0.07
0.5
opaque white
5 years
0.50 (12.7) stud x 1.06 (26.9) hex
0.75 (19.1) stud x 1.25 (31.8) hex
125 (14.12)
600 (67.79)
0.07
0.052
Shelf life
Operating Temperature Range (°C)
-40/+200
120 SERIES - ORDER GUIDE
Series -
P/N
Container Size
120-SA
120-2
120-5
120-8
120-80
120-320
4 gram plastic pak
2 oz (0.06 kg) jar
5 oz (0.14 kg) tube
8 oz (0.23 kg) jar
5 lb (2.27 kg) can
20 lb (9.08 kg) can
HIGH PERFORMANCE THERMAL COMPOUND
122 Series Thermal Joint Compound is a stable, silicone based, thixotropic paste developed to provide premium
performance at an affordable price. It is formulated to significantly reduce contact thermal resistance where
power densities are concentrated in devices such as flip chip, reduced die size, and ‘overclock’ microprocessors.
When applied as a thin film between a Wakefield heat sink and device it possesses superior thermal conductivity
compared to traditional ‘grease’. It is compatible with automated or manual dispensing methods and is fully RoHS
compliant.
122 SERIES
122 SERIES - ORDER GUIDE
122 SERIES THERMAL JOINT COMPOUND
Series -
Container Size
Typical Characteristics
Description
P/N
122-10CC
122-2
10cc syringe
2 oz (0.06 kg) jar
30cc syringe
Appearance
Smooth Gray paste
Thermal Conductivity
2.5 W / m °K,
17.3 (Btu) (in.)/(hr) (ft2) (0F)
122-30CC
Thermal Resistance
Bleed
0.02 °C in 2 / W
0.015 wt%, 24 hrs at 200°C
0.150 wt%, 24 hrs at 200°C
1.4 x 1010 ohm-cm
225 volts/mil
Evaporation
Volume Resistivity
Dielectric Strength
Specific Gravity
Operating Range
Shelf Life
2.23 (gm/cc) at 25°C
-40°C to 205°C
5 years
64
WTS001_p50-68 6/14/07 10:46 AM Page 65
Accessory
Products
THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS
The 126 Series is a nontoxic, synthetic, ester-based (nonsilicone) Thermal Joint Compound with metal oxide
126 SERIES
fillers designed to enhance thermal performance characteristics of plastic and metal package devices exceeding
that of silicone-based compounds. Solved are problems associated with contamination of wave solder baths and
migration of silicone-based products. Shelf life: 5 years.
126 SERIES THERMAL JOINT COMPOUND
Characteristics Description
126 SERIES - ORDER GUIDE
Series -
P/N
Container Size
Appearance
Smooth, white homogeneous paste
65% min
.69 W / m 0K, 4.8 (Btu)(in.)/(hr) (ft2) (°F)
0.043°C/W TO-3 at 0.0008 thick film
0.09% max
0.6 max
2.3 x 1012 ohms-cm
200 volts/mil
126-2
126-4
126-4S
126-5LB
2 oz (0.6 kg) jar
4 oz (0.11 kg) tube
4 oz (0.11 kg) syringe
5 lb (2.27 kg) can
Solids Content, wt %
Thermal Conductivity at 36°C
Interface Thermal Resistance
Bleed, 24 hrs at 200°C, wt%
Evaporation, 24 hrs at 200°C, wt%
Volume Resistivity
Dielectric Strength
Specific Gravity @ 60°F
Penetration
2.93 (gm/cc)
280 to 320
Operating Range
-40°C to 200°C
DeltaBond™ 152 adhesive is ideal for general cementing; thermally bonding semiconductors and components to
chassis or heat sinks, while electrically isolating one from the other; fabricating heat sinks or thermal links; and
for all permanent bonding of assemblies which require high thermally conductive interfaces. It produces a rigid,
high strength bond to most materials when cured. DeltaBond™ 152 is available in bi-packs, kits, and quarts.
DeltaBond™ 152
Order one bottle of hardener A-4 or B-4 per one quart of DeltaBond™ 152 separately. Shelf life: 152KA year,
3
all others years.
3
DELTABOND™152
DELTABOND™152
Characteristics
Hardener Type
Mixing Proportions and Working Properties
Typical Properties Fully Cured
Thermal conductivity -
W/(m) (°K)
(Btu) (in.)/(hr) (ft2) (°F)
Thermal resistivity - (°C) (in.)watt
A4
B4
Characteristics
Parts of hardener per 100 parts
of resin by weight
A4
B4
7.5
3.5
0.836
5.8
47
2,900
2,200
0.908
6.3
42
2,300
2,000
*Working Time - at 77°F
†Initial cure time 77°F
150°F
45 min
8 hrs
30 min
6 hrs
Bond shear strength
1 in. overlap - psi
etched aluminum to
etched aluminum
77°F
45 min
20 min
30 min
15 minn
125°F
250°F
212°F
400
130
800
225
‡Post-cure time at a temp in °F
‡Alternate room temp. aging
time at 77°F
4 hrs @200°F
4 days
4 hrs @ 200°F
4 days
Heat distortion point - °F
Minimum dielectric strength,
v/mil, 0.125 in. sample
400
65
100
400
150
190
Working consistency (77°F)
Working viscosity (77°F) cps
viscous liquid
25,000
paste
—
Max operation
temp - °C
Continuous
Intermittent
DELTABOND™152
Ordering Guide - Resin and Hardener
Resin
Container
Model
Number
Hardener
Part Number
Part No.
152-1A
152-1B
152-KA
152-Q
Bi-Pack (1 oz)
Bi-Pack (1 oz)
Kit (7 oz Resin, 0.5 oz Hardener)
1 quart (4 lbs)
Included in PIN 152-1 A (“A-4”) Type
Included in P/N 152-1 B (“B-4”) Type
lncluded in P/N 152-KA
All hardener
part numbers
A-4, B-4
DeltaBond™ 152
A-4 (0.316 lb), B-4 (0.14 lb), (order 1 only)
NOTES:
*
Since the hardener/resin reaction is exothermic, it is important that batch size be matched to hardener speed. Working times given are for approximate batch sizes: A—200 gms,
B—200 gms. Larger batch sizes will greatly reduce working time.
** For optimum electrical properties, dry parts for 15 minutes at 150°F (65°C) or 30 minutes at 75°F (24°C) to slowly evaporate the thinner and then final cure for 4 hours at 275°F
(135°C).
†
After initial cure, material may be handled, removed from fixture, etc., but has not yet achieved full properties and should be room temperature aged or post-cured as shown to
achieve full physical and electrical properties.
‡
After initial cure, material may be brought to full physical and electrical properties during post-cure or may be room temperature aged for charted length of time to achieve same
full properties.
The information contained herein is based on data believed to be reliable but we do not assume responsibility for accuracy. All such information is used at the customer's own risk,
conditions of use being beyond our control.
65
WTS001_p50-68 6/14/07 10:46 AM Page 66
Accessory
Products
THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS
DeltaCast™ 153 is a pourable casting resin having thermal expansion characteristics similar to aluminum and
DeltaBond™ 153
copper allowing assemblies to operate over a very wide temperature range. Ideal for encapsulating components
and assemblies, this series' major advantages and uses include potted systems (virtually indestructible), protecting
components and systems from moisture and contaminants, securing proprietary circuitry, mechanical support of
devices, removal of heat from hot components and the assembly equalizing temperatures, and high voltage isola-
tion. DeltaCast™ 153 is available in quarts and gallons. Order one bottle of hardener A4 or B4 per one quart of
DeltaCast™ 153 separately. Shelf life: years.
3
DELTACAST™153
DELTACAST™153
Characteristics
Typical Properties Fully Cured
Thermal conductivity -
W/(m) (°K)
(Btu) (in.)/(hr) (ft2) (°F)
Thermal resistivity - (°C) (in.)watt
Hardener Type
Mixing Proportions and Working Properties
A4
B4
Characteristics
A4
B4
3.5
Parts of hardener per 100 parts
of resin by weight
7.5
0.836
5.8
0.908
6.3
*Working Time - at 77°F
† Initial cure time 77°F
150°F
45 min
8 hrs
30 min
6 hrs
47
42
Bond shear strength
1 in. overlap - psi
etched aluminum to
etched aluminum
77°F
2,500
—
1,900
—
45 min
20 min
30 min
15 minn
125°F
250°F
212°F
—
—
‡Post-cure time at a temp in °F
‡Alternate room temp. aging
time at 77°F
4 hrs @200°F
4 days
4 hrs @ 200°F
4 days
Heat distortion point - °F
Minimum dielectric strength,
v/mil, 0.125 in. sample
130
225
400
400
Working consistency (77°F)
Working viscosity (77°F) cps
heavy liquid
10,000
viscous liquid
30,000
Max operation
temp - °C
Continuous
Intermittent
65
100
150
190
DELTACAST™153
Ordering Guide - Resin and Hardener
Resin
Container
Model
Number
Hardener
Part Number
All hardener
part
Part No.
numbers
A-4, B-4
DeltaCast™ 153
153-Q
1 quart (4 lbs)
A-4 (0.316 lb), B-4 (0.14 lb), (order 1 only)
DeltaBond™ 154 is a medium viscosity, aluminum-filled resin with the best thermal conductivity of this series. It
is, however, neither a good electrical insulator nor conductor. Its principal application is that of a good thermal
mechanical adhesive for applications such as bonding fins to base plates or structural mounting blocks or brackets
DeltaBond™ 154
to heat sinks. Order one bottle of hardener A4 or B4 per one quart of DeltaBond™ 154 separately. Shelf life:
3
years.
DELTABOND™154
DELTABOND™154
Characteristics
Hardener Type
Mixing Proportions and Working Properties
Typical Properties Fully Cured
Thermal conductivity -
W/(m) (°K)
(Btu) (in.)/(hr) (ft2) (°F)
Thermal resistivity - (°C) (in.)watt
A4
B4
Characteristics
Parts of hardener per 100 parts
of resin by weight
A4
B4
11.0
4.5
1.053
7.3
37
1.154
8.0
34
*Working Time - at 77°F
45 min
8 hrs
30 min
6 hrs
† Initial cure time
77°F
Bond shear strength
1 in. overlap - psi
etched aluminum to
etched aluminum
Heat distortion point - °F
Minimum dielectric strength,
v/mil, 0.125 in. sample
77°F
3,000
2,400
150°F
250°F
45 min
20 min
30 min
15 min
125°F
2,300
2,100
212°F
500
130
800
225
‡Post-cure time at a temp in °F
‡Alternate room temp. aging
time at 77°F
4 hrs @200°F
4 days
4 hrs @ 200°F
4 days
NA*
65
100
NA*
150
190
Working consistency (77°F)
Working viscosity (77°F) cps
viscous liquid
25,000
paste
—
Max operation
temp - °C
Continuous
Intermittent
DELTABOND™154
Ordering Guide - Resin and Hardener
Resin
Container
Model
Number
Hardener
Part Number
All hardener
part
Part No.
numbers
A-4, B-4
DeltaBond™ 154
154-Q
1 quart (2.5 lbs)
A-4 (0.316 lb), B-4 (0.14 lb), (order 1 only)
66
WTS001_p50-68 6/14/07 10:46 AM Page 67
Accessory
Products
THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS
DeItaBond™ 155 is an epoxy adhesive formulated for use within the semiconductor industry. An easy to mix spread
thixotropic paste, it offers high heat transfer, low shrinkage, and a coefficient of thermal expansion comparable to that of
copper and aluminum. This adhesive is principally used to form thermally conductive joints in fabricated heat sinks and
between heat sinks and power devices. When used to bond semiconductors to heat sinks, it also serves as an electrical
insulator. Its strong bond to a wide variety of substrates resists severe temperature cycling. DeItaBond™ 155 is only
DeltaBond™ 155
available in kit size. Simply squeeze out equal lengths and mix to uniform color. Shelf life: year.
3
DELTABOND™155
Mixing Proportions and Working Properties
Parts of hardener per 100 parts of resin
DELTABOND™155
Characteristics
Typical Properties Fully Cured
Thermal conductivity -
W/(m) (°K)
(Btu) (in.)/(hr) (ft2) (°F)
Thermal resistivity - (°C) (in.)watt
Hardener Type
DeltaBond™155
by volume 100
90 min
*Working Time - at 77°F
†Initial cure time 77°F
0.836
5.8
47
2,600
—
8 hrs
45 min
20 min
150°F
250°F
‡Post-cure time at a temp in °F
‡Alternate room temp. aging time at 77°F
Working consistency (77°F)
4 hrs @ 200°F
4 days
Bond shear strength
1 in. overlap - psi
etched aluminum to
etched aluminum
77°F
125°F
paste
212°F
—
130
Working viscosity (77°F) cps
paste
Heat distortion point - °F
Minimum dielectric strength,
v/mil, 0.125 in. sample
DELTABOND™155
400
65
100
Ordering Guide - Resin and Hardener
Resin
Max operation
temp - °C
Continuous
Intermittent
Model
Number
Hardener
Part Number
Part No.
Container
DeltaBond™ 155 155
Kit (3 oz resin, 3 oz hardener) Included in P/N 155
DeltaBond™ 156 Thermally Conductive Adhesive is a modified acrylic adhesive designed for permanent mounting on
components where heat must be effectively transmitted. Recommended for electromechanical assemblies to bond com-
ponents and dissipate heat, it replaces mechanical fasteners and compressible pads, silicone grease, and epoxies; elimi-
nates air entrapment, and other variables related to epoxy mixing. This soft paste requires no mixing and flows easily to
allow thin bond lines. Primer activated, cure begins upon assembly. DeltaBond™ Activator fixtures at room temperature
in less than 5 minutes. Full strength is developed in 4 to 12 hours and fillets become dry to the touch in 24 hours. It is
not recommended to use this durable adhesive without the use of DeltaBond™ Activator. DeltaBond™ 156 is available in
kit size; order 156-K (25 ml Syringe and Activator Kit). Shelf life: 1 year.
DeltaBond™ 156
DELTABOND™156
DELTABOND™156
Typical Electrical Properties
Results
Characteristics
Description
Typical Properties Fully Cured
Test
Test
ASTM
D149
D150
Results
ASTM
Dielectric Strength
Dielectric Constant, 77°F (25°C)
100 Hz
220 volts/mil
Temperature Range
-65 to 300°F
(-54 to 149°C)
300°F to (177°C)
Intermittent
14.92
14.26
12.34
1000 Hz
1MM Hz
Tensile Strength, at break
Modulus
2360 psi
233,000 psi
7.75%
2.5% TLM
0.05% CVCM
D638
D638
D638
E595
Dissipaton Factor, 77°F (25°C)
100 Hz
D150
Elongation, at break
Outgassing
0.05
0.03
1000 Hz
Coefficient of Thermal Expansion
Tensile Shear
Thermal Conductivity, K
(absolute at 86°F (30°C)
7.1 x 10-4 (cm/cm°C)
2500psi
1MM Hz
0.06
D1002
Volume Resistivity
Surface Resistivity
5.2x1011 (ohms-cm)
8.6 x 1013 (ohms)
D257
D257
3.47 Btu x in./hr ft2 °F
(0.50 W/m °C)
Note: DeltaBond™ Thermally Conductive Adhesive-High Strength
contains a metallic filler which, in certain applications, may have an
effect on electrical properties. Therefore, test each particular appli-
cation to ensure that electrical properties are as required.
Note: The absolute thermal conductivity test was developed specifically
for measuring thermal properties of thin film adhesive bonds.
DELTABOND™156
Ordering Guide - Resin and Hardener
Resin
Container
Model
Number
Hardener
Part Number
Part No.
Resin Kit Hardener Syringe - 0.85 fl oz - 25 ml - 2 oz
net/0.44 oz fl contents bottle -12ml
Included in kit hardener with brush applicator -
4.2 oz total wt/kt
DeltaBond™ 156
156-K
*
†
‡
Since the hardener/resin reaction is exothermic, it is important that batch size be matched to hardener speed. Working times given are for approximate batch sizes: A—200 gms,
B—200 gms. Larger batch sizes will greatly reduce working time.
After initial cure, material may be handled, removed from fixture, etc., but has not yet achieved full properties and should be room temperature aged or post-cured as shown to
achieve full physical and electrical properties.
After initial cure, material may be brought to full physical and electrical properties during post-cure or may be room temperature aged for charted length of time to achieve same
full properties.
The information contained herein is based on data believed to be reliable but we do not assume responsibility for accuracy. All such information is used at the customer's own risk,
conditions of use being beyond our control.
67
WTS001_p50-68 6/14/07 10:46 AM Page 68
Accessory
Products
THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS
DeltaPads™ Thermally Conductive Insulators
173/174 SERIES
TO-3, TO-66, TO-220,DO-4, DO-5 SHEET
Greaseless Thermally Conductive Kapton® Reinforced Insulators
175 SERIES
DeltaPads™
173-7 Series
0.007 in.
Gray
DeltaPads™
173-9 Series
0.009 in.
Gray
DeltaPads™
174-9 Series
0.009 in.
Tan
Kapton®
175-6 Series
0.006 in.
Gray
Test Method
Characteristics
Material Thickness
Micrometer
Visual
The 173, 174, and 175
Series are highly
Color
Tear Strength, lb/in. Typical100
Volume Resistivity, megohm-cm, Minimum Normal
Breakdown Voltage, Minimum
Dielectric Constant at 60 Hz and 100 V Maximum
Continuous Use Temperature, °C
Thermal Conductivity, cal/cm sec. °C, Minimum
Thermal Resistance (TO-3), 1 in.2 °C/W
Recommended Mounting Pressure, lb/in.2
100
1.0 x 109
4,000
2.70
-60/+200
3 x 10-3
0.33
100
1.0 x 109
5,000
2.40
-60/+200
3 x 10-3
0.50
100
1.0 x 1013
5,000
2.50
-60/+200
1 x 10-2
0.25
ASTM 0624
1 x 1013
6,000
5.5 @ 1,000 Hz
-60/+200
1.2 x 10-3
0.40
efficient thermally con-
ductive insulators de-
signed for semi -
ASTM D257
ASTM 0149
ASTM D 150
conductor interface
to heat sinks. Their
properties eliminate
messy concerns asso-
ciated with thermal
greases.
–
–
–
350/550
350/550
350/550
350/550
Formula*
T (torque [in.-lb] x N (number of fasteners)
0.2 x D (Thread Dia) x A (contact surface area square inches)
*P (pressure in psi) =
173-7
173-9
174-9
175-6
Series
Series
Series
Series
No
Adhesive
Adhesive
Backing
No
Adhesive
No
Adhesive
Greaseless
–
–
173-9-210P
–
175-6-210P
175-6-220P
175-6-230P
175-6-240P
175-6-250P
175-6-280P
175-6-310P
175-6-320P
175-6-330P
175-6-410P
175-6-610P
–
173-7-220P
–
–
–
173-7-230P
–
173-9-230P
–
173-7-240P
173-7-240A
173-9-240P
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
174-9-310P
–
–
–
–
–
–
–
–
–
–
–
–
173-7-1212P
173-9-1212P
174-9-1212P
MECHANICAL DIMENSIONS
D04/05
TO-220
TO-66
TO-3
TO-5
SHEET
TO-66 (RECTANGLE)
DUAL TO-220
Dimensions: in. (mm)
68
相关型号：
174.25%FA1A90PPM-TANDR
Fixed Resistor, Wire Wound, 1W, 0.174ohm, 44V, 0.25% +/-Tol, -90,90ppm/Cel,
VISHAY
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