26677A1 [ETC]
Package Migration Between Single Bit and MirrorBit? Flash Device Densities ; 包迁移之间的单位和MirrorBit ？闪存器件密度\n
| 型号： | 26677A1 |
| 厂家： | 
ETC |
| 描述： | Package Migration Between Single Bit and MirrorBit? Flash Device Densities
|
| 文件： | 总10页 (文件大小：97K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Package Migration between
Single Bit and MirrorBit™
Flash Device Densities
Application Note
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For More Information
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Publication Number 26677 Revision A Amendment +1 Issue Date November 12, 2002
Package Migration Between Single Bit and
MirrorBitTM Flash Device Densities
Application Note
48-Pin TSOP: 3.0 V x8/x16 or x16-only Devices ...............2
56-PIN TSOP: 3.0 V x8/x16 Devices .................................3
40-Pin & 40- to 48-Pin TSOP: 3.0 V x8-only Devices .......4
44-Pin SO: 3.0 V x8/x16 Devices .......................................5
64-Ball Fortified BGA: 3.0 V x8/x16 or x16-only Devices ...6
INTRODUCTION
This application note illustrates migration options be-
tween 3V single bit and 3V MirrorBitTM devices. Each
drawing shows at least one migration path. A “migra-
tion path” is a logical progression from one density to
another within a group of devices sharing a common
voltage range, architecture, bus width. All drawings
show top view of packages.
63-Ball FBGA and 48-Ball FBGA: 3.0 V x8/x16 or x16-only
Devices ..............................................................................7
48- or 63-Ball FBGA: 3.0 V x8-only Devices ......................8
Revision Summary .............................................................9
The following is a list of drawings in this document:
Publication# 26677 Rev: A Amendment/+1
Issue Date: November 12, 2002
1
48-PIN TSOP: 3.0 V X8/X16 OR X16-ONLY DEVICES
3 V
3 V
3 V
Standard
Sim R/W
MirrorBit
Am29LV641D
Am29LV641MH/L
Am29LV640MT/B
Am29LV320MT/B
Am29DL640G
Am29DL32xG
Am29LV320D
Am29LV160D
Am29LV160M
Am29DL16xD
A15
A14
A13
A12
A11
A10
A9
A8
A19
A15
A14
A13
A12
A11
A10
A9
A8
A19
A15
A14
A13
A12
A11
A10
A9
A8
A19
1
2
3
4
5
6
7
8
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
A16
BYTE#
VSS
A16
VIO
A15
A14
A13
A12
A11
A10
A9
A8
A21
A20
WE#
VSS
DQ15/A-1 DQ15
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
VCC
DQ11
DQ3
DQ10
DQ2
DQ9
DQ1
DQ8
DQ0
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
VCC
DQ11
DQ3
DQ10
DQ2
DQ9
DQ1
DQ8
DQ0
9
48-Pin
TSOP
A20
A20
NC
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
WE#
RESET#
A21
WE#
RESET#
NC
WE#
RESET#
NC
RESET#
ACC
WP#
A19
A18
A17
A7
A6
A5
A4
A3
WP#/ACC WP#/ACC
RY/BY#
A18
A17
A7
RY/BY#
A18
A17
A7
RY/BY#
A18
A17
A7
A6
A5
A4
A3
A2
A1
A6
A5
A4
A3
A2
A1
A6
A5
A4
A3
A2
A1
OE#
VSS
CE#
A0
OE#
VSS
CE#
A0
A2
A1
Am29DL16xD WP#/ACC
Am29LV160D, Am29LV160M NC
The Am29LV641 is a x16-only device.
2
Package Migration Between Single Bit and MirrorBitTM Flash Device Densities
56-PIN TSOP: 3.0 V X8/X16 DEVICES
3 V
MirrorBit
Am29LV512NH/L
Am29LV256MH/L
Am29LV128MH/L
Am29LV640MH/L
Am29LV320MH/L
NC
NC
A16
A24
NC
A16
BYTE#
VSS
1
2
3
4
5
6
7
8
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
NC
NC
A15
A14
A13
A12
A11
A10
A9
NC
NC
A23
A22
A15
A14
A13
A12
A11
A10
A9
A23
A22
NC
A22
A15
A14
A13
A12
A11
A10
A9
A15
A15
BYTE#
VSS
DQ15/A-1 DQ15/A-1
A14
A13
A12
A11
A10
A9
A8
A19
A14
A13
A12
A11
A10
A9
A8
A19
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
VCC
DQ11
DQ3
DQ10
DQ2
DQ9
DQ1
DQ8
DQ0
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
VCC
DQ11
DQ3
DQ10
DQ2
DQ9
DQ1
DQ8
DQ0
9
A8
A19
A20
A8
A19
A20
A8
A19
A20
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
56-Pin
TSOP
A20
A20
WE#
RESET#
A21
WE#
RESET#
A21
WE#
RESET#
A21
WP#/ACC
RY/BY#
WE#
RESET#
A21
WE#
RESET#
NC
WP#/ACC WP#/ACC
WP#/ACC WP#/ACC
RY/BY#
A18
A17
A7
RY/BY#
A18
A17
A7
RY/BY#
A18
A17
A7
RY/BY#
A18
A17
A7
A18
A17
A7
A6
A5
A4
A3
A2
A1
A6
A5
A4
A3
A2
A1
NC
NC
A6
A5
A4
A3
A2
A1
NC
NC
A6
A5
A4
A3
A2
A1
NC
NC
A6
A5
A4
A3
A2
A1
NC
NC
OE#
VSS
CE#
A0
NC
VIO
OE#
VSS
CE#
A0
NC
NC
NC
VIO**
** VIO may not be available for all 512 Mb MirrorBit devices. Please consult datasheet ordering information.
Package Migration Between Single Bit and MirrorBitTM Flash Device Densities
3
40-PIN & 40- TO 48-PIN TSOP: 3.0 V X8-ONLY DEVICES
3 V
3 V
MirrorBit
Standard
Am29LV033M
Am29LV033C
Am29LV116B, Am29LV116M
Am29LV017B, Am29LV017M
Am29LV008B
Am29LV081B
Am29LV004B
Am29LV002B
A17
VSS
A20
A19
A10
DQ7
DQ6
DQ5
DQ4
VCC
VIO
A21
DQ3
DQ2
DQ1
DQ0
A17
VSS
NC
NC
A10
DQ7
DQ6
DQ5
DQ4
VCC
VCC
A17
VSS
NC
A19
A10
DQ7
DQ6
DQ5
DQ4
VCC
VCC
A17
VSS
A20
A19
A10
DQ7
DQ6
DQ5
DQ4
VCC
VCC
A17
VSS
A20
A19
A10
DQ7
DQ6
DQ5
DQ4
VCC
VCC
A21
DQ3
DQ2
DQ1
DQ0
A16
A15
A14
A13
A12
A11
A9
A16
A15
A14
A13
A12
A11
A9
A16
A15
A14
A13
A12
A11
A9
1
2
3
4
5
6
7
8
40
39
38
37
36
35
34
33
A8
WE#
A8
WE#
A8
WE#
9
32
31
30
40-Pin
TSOP
RESET# RESET# RESET#
10
11
12
13
14
15
16
17
18
19
20
ACC
RY/BY#
A18
A7
NC
RY/BY#
A18
A7
NC
RY/BY#
NC
29
28
27
26
25
24
23
22
21
NC
NC
NC
DQ3
DQ2
DQ1
DQ0
OE#
VSS
DQ3
DQ2
DQ1
DQ0
OE#
VSS
DQ3
DQ2
DQ1
DQ0
OE#
VSS
A7
A6
A5
A4
A3
A2
A1
A6
A5
A4
A3
A2
A1
A6
A5
A4
A3
A2
A1
OE#
VSS
CE#
A0
OE#
VSS
CE#
A0
CE#
A0
CE#
A0
CE#
A0
Am29LV065D, Am29LV065M
Am29LV033M
Am29LV033C
NC
NC
A17
VSS
A20
A19
NC
A22
A16
A15
A14
A13
A12
A11
A9
48
47
40 46
1
2
3
4
5
6
7
8
48-Pin TSOP
A17
VSS
A20
A19
A10
DQ7
DQ6
DQ5
DQ4
VCC
VCC
A16
A15
A14
A13
A12
A11
A9
1
2
3
4
5
6
7
8
9
40-Pin TSOP
39 45
38 44
37 43
36 42
41
40
33 39
32 38
31 37
A10
DQ7
35
34
DQ6
DQ5
DQ4
VCC
VIO
9
10
11
A8
WE#
A8
WE#
RESET# RESET#
12 10
13 11
14 12
15 13
16 14
17 15
18 16
19 17
20 18
21 19
22 20
23
30
29
28
27
26
36
35
34
33
32
ACC
RY/BY#
A18
A7
ACC
RY/BY#
A18
A7
NC
NC
DQ3
DQ2
DQ1
DQ0
OE#
VSS
DQ3
DQ2
DQ1
DQ0
OE#
VSS
CE#
A0
NC
NC
A6
A5
A4
A3
A2
A1
NC
NC
A6
A5
A4
A3
A2
A1
25 31
24 30
23 29
22 28
21 27
26
CE#
A0
25
24
4
Package Migration Between Single Bit and MirrorBitTM Flash Device Densities
44-PIN SO: 3.0 V X8/X16 DEVICES
3 V
3 V
3 V
Standard Sim R/W MirrorBit
Am29LV160M
Am29LV160D
Am29LV800B, Am29DL800B
Am29DL400B
Am29LV400B
Am29LV200
RESET#
A18
A17
A7
RY/BY#
A18
A17
A7
RY/BY#
NC
NC
RY/BY#
A17
A7
NC
1
2
3
4
5
6
7
8
9
44 RESET#
WE#
A19
A8
RY/BY#
NC
A7
43 WE#
42 A8
41 A9
A17
A7
A9
A6
A6
A6
A6
A6
40 A10
39 A11
38 A12
37 A13
36 A14
35 A15
34 A16
33 BYTE#
32 VSS
A10
A11
A12
A13
A14
A15
A16
BYTE#
VSS
A5
A5
A5
A5
A5
A4
A4
A4
A4
A4
A3
A3
A3
A3
A3
A2
A2
A2
A2
A2
A1
A1
A1
A1
A1 10
A0 11
44-Pin
SO
A0
A0
A0
A0
CE#
VSS
CE#
VSS
CE#
VSS
CE#
VSS
CE# 12
VSS 13
OE#
DQ0
DQ8
DQ1
DQ9
DQ2
DQ10
DQ3
DQ11
OE#
DQ0
DQ8
DQ1
DQ9
DQ2
DQ10
DQ3
DQ11
OE#
DQ0
DQ8
DQ1
DQ9
DQ2
DQ10
DQ3
DQ11
OE#
DQ0
DQ8
DQ1
DQ9
DQ2
DQ10
DQ3
DQ11
OE# 14
DQ0 15
DQ8 16
DQ1 17
DQ9 18
DQ2 19
DQ10 20
DQ3 21
DQ11 22
31 DQ15/A-1 DQ15/A-1
30 DQ7
29 DQ14
28 DQ6
27 DQ13
26 DQ5
25 DQ12
24 DQ4
23 VCC
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
VCC
Package Migration Between Single Bit and MirrorBitTM Flash Device Densities
5
64-BALL FORTIFIED BGA: 3.0 V X8/X16 OR X16-ONLY DEVICES
64-ball Grid Array
A
B
C
D
E
F
G
H
B
C
D
E
F
G
H
8
7
6
6
5
4
3
2
1
NC
NC
NC
A13
VSS
A16
D7
A12
A8
A14
A10
A15
A11
A19
BYTE#
D14
D12
D10
D8
D15/A-1
D13
VSS
D6
A9
5
4
3
2
1
WE#
RY/BY#
A7
RST
D5
VCC
D4
ACC/WP#
A17
A18
A6
D2
D11
D3
D1
A5
D0
D9
VSS
NC
A3
A4
A2
A1
A0
CE#
OE#
NC
NC
NC
NC
NC
3 V
Standard
3 V
Sim R/W
3 V
MirrorBit
Package
Body
NC
NC
NC
NC
A21
A21
A21
A21
A21
A21
NC
NC
NC
NC
NC
NC
VI/O
VI/O
NC
VI/O
VI/O
VI/O
VI/O
NC
NC
NC
NC
NC
NC
NC
NC
NC
A24
NC
NC
NC
NC
NC
NC
NC
NC
A22
A22
A22
NC
NC
NC
NC
NC
NC
NC
NC
A23
A23
11 x 13 mm
11 x 13 mm
11 x 13 mm
11 x 13 mm
11 x 13 mm
11 x 13 mm
11 x 13 mm
11 x 13 mm
12 x 18 mm
12 x 18 mm
Am29DL163G
Am29DL323G
Am29LV160M
NC
NC
VI/O
VI/O
NC
VI/O
VI/O
VI/O
VI/O
NC
NC
NC
CE2#
NC
NC
NC
NC
NC
A20
A20
A20
A20
A20
A20
A20
A20
Am29LV320MH/L
Am29LV642D*
Am29LV640D*
Am29DL640G
Am29LV640MH/L
Am29LV128MH/L
Am29LV256MH/L
Am29LV512NH/L
Top view shown, with balls facing down.
* These are x16-only parts.
6
Package Migration Between Single Bit and MirrorBitTM Flash Device Densities
63-BALL FBGA AND 48-BALL FBGA: 3.0 V X8/X16 OR X16-ONLY DEVICES
63-ball Grid Array
A
B
C
D
E
F
G
H
F
J
K
L
M
8
7
6
48-ball Grid Array
NC*
NC*
NC*
NC*
NC
NC
NC
NC
A
B
C
D
E
G
H
6
5
4
3
2
1
VSS
A13
A12
A14
A15
A16
DQ15/A-1
A9
A8
A10
A11
DQ7
DQ5
DQ2
DQ0
A0
DQ14
DQ12
DQ10
DQ8
DQ13
VCC
DQ6
DQ4
DQ3
5
4
3
2
1
WE# RESET#
RY/BY#
DQ11
DQ9
OE#
A7
A3
A17
A4
A6
A2
A5
A1
DQ1
VSS
CE#
NC*
NC*
NC*
NC*
NC*
NC*
NC*
3 V
Sim R/W
3 V
MirrorBit
3 V
Standard
Package
Body
Ball Grid
Array
6 x 8 mm
6 x 9 mm
8 x 9 mm
8 x 6 mm
8 x 9 mm
8 x 14 mm
6 x 12 mm
8 x 9 mm
48 balls
48 balls
48 balls
48 balls
48 balls
63 balls
48 balls
48 balls
NC
NC
NC
NC
NC
NC BYTE#
NC BYTE#
Am29LV400B
Am29LV800B
Am29LV160D
Am29DL800B
NC
NC
NC
A18 NC
A18 NC
A18 NC
A19 NC BYTE#
A19 NC BYTE#
A19 NC BYTE#
A19 A20 BYTE#
A19 A20 BYTE#
A19 A20 BYTE#
Am29LV160M
Am29DL16xD
Am29DL32xG
Am29DL32xG
WP#/ACC A18 NC
WP#/ACC A18 NC
WP#/ACC A18 NC
WP#/ACC A18 NC
Am29LV320D
Am29LV640D
Am29LV320MT/B
Am29LV640MU
Am29LV640MT/B
11 x 12 mm 63 balls
11 x 12 mm 63 balls
ACC
A18 A21 A19 A20 VI/O
Am29DL640D
WP#/ACC A18 A21 A19 A20 BYTE#
Top view shown, with balls facing down. All grid arrays have 0.8 mm pitch.
* Balls are shorted together via the substrate but not connected to the die.
Package Migration Between Single Bit and MirrorBitTM Flash Device Densities
7
48- OR 63-BALL FBGA: 3.0 V X8-ONLY DEVICES
63-ball Grid Array
A
B
C
D
E
F
G
H
J
K
L
M
8
7
6
48-ball Grid Array
NC*
NC*
NC*
NC*
NC
NC
NC
NC
A
B
C
D
E
F
G
H
6
5
4
3
2
1
VSS
A14
A13
A15
A16
A17
NC
A20
A9
A8
A11
A12
NC
A20
A5
A19
DQ5
DQ2
DQ0
A0
A10
NC
DQ6
VCC
DQ7
DQ4
5
4
3
2
1
WE# RESET#
RY/BY#
NC
A6
A2
DQ3
NC
A7
A3
A18
A4
DQ1
VSS
A1
CE#
OE#
NC*
NC*
NC*
NC*
NC*
NC*
NC*
3 V
3 V
Standard
MirrorBit
Package Body Ball Grid Array
NC
NC
NC
NC
NC
Am29LV017D NC
NC
Am29LV033C ACC
ACC
NC
NC
NC
NC
A22
A22
VCC
VCC
VCC
VIO
VIO
VIO
NC
NC
A21
A21
A21
A21
8 x 9 mm
8 x 6 mm
8 x 14 mm
8 x 9 mm
11 x 12 mm
11 x 12 mm
48 balls
48 balls
63 balls
48 balls
63 balls
63 balls
Am29LV017M
Am29LV033M
Am29LV065M Am29LV065D ACC
Am29LV652M Am29LV652D ACC
CE2#
Top view shown, with balls facing down. All grid arrays have 0.8 mm pitch.
*Balls are shorted together via the substrate but not connected to the die.
8
Package Migration Between Single Bit and MirrorBitTM Flash Device Densities
REVISION SUMMARY
48- or 64-Ball FBGA: 3.0 V x8-only Devices
Revision A (September 25, 2002)
Changed chart to reflect new package size and pinout
fr Am29LV017M.
Initial release.
Revision A + 1 (November 12, 2002)
63-Ball FBGA and 48-Ball FBGA: 3.0 V x8/x16 or
x16-only Devices
Changed chart to reflect new package sizes for
Am29LV320MT/B and Am29LV160M.
Trademarks
Copyright © 2002 Advanced Micro Devices, Inc. All rights reserved.
AMD, the AMD logo, MirrorBit and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.
Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
Package Migration Between Single Bit and MirrorBitTM Flash Device Densities
9
相关型号：
267-.25%-FA2-90PPM-CARDPACK
Fixed Resistor, Wire Wound, 2W, 0.267ohm, 65V, 0.25% +/-Tol, -90,90ppm/Cel,
VISHAY
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