2SK2982-Z

更新时间:2024-09-18 02:45:29
品牌:ETC
描述:TRANSISTOR | MOSFET | N-CHANNEL | 30V V(BR)DSS | 30A I(D) | TO-252AA

2SK2982-Z 概述

TRANSISTOR | MOSFET | N-CHANNEL | 30V V(BR)DSS | 30A I(D) | TO-252AA 晶体管| MOSFET | N沟道| 30V V( BR ) DSS | 30A I( D) | TO- 252AA

2SK2982-Z 数据手册

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DATA SHEET  
MOS FIELD EFFECT TRANSISTOR  
2SK2982  
SWITCHING  
N-CHANNEL POWER MOS FET  
INDUSTRIAL USE  
DESCRIPTION  
The 2SK2982 is N-channel MOS Field Effect Transistor designed for high current switching applications.  
FEATURES  
Low on-resistance  
RDS(on)1 = 12.5 mMAX. (VGS = 10 V, ID = 15 A)  
RDS(on)2 = 16.5 mMAX. (VGS = 4.5 V, ID = 15 A)  
RDS(on)3 = 19.0 mMAX. (VGS = 4.0 V, ID = 15 A)  
Low Ciss : Ciss = 2290 pF TYP.  
Built-in gate protection diode  
ORDERING INFORMATION  
PART NUMBER  
(TO-251)  
PACKAGE  
TO-251  
2SK2982  
2SK2982-Z  
TO-252  
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)  
Drain to Source Voltage (VGS = 0 V)  
Gate to Source Voltage (VDS = 0 V)  
Drain Current (DC)  
VDSS  
VGSS  
ID(DC)  
ID(pulse)  
PT  
30  
V
V
(TO-252)  
20  
30  
120  
A
Drain Current (Pulse) Note  
A
Total Power Dissipation (TA = 25°C)  
Total Power Dissipation (TC = 25°C)  
Channel Temperature  
1.0  
W
W
°C  
°C  
PT  
30  
Tch  
150  
Storage Temperature  
Tstg  
–55 to + 150  
Note PW 10 µs, Duty cycle 1%  
The information in this document is subject to change without notice. Before using this document, please  
confirm that this is the latest version.  
Not all devices/types available in every country. Please check with local NEC representative for  
availability and additional information.  
Document No.  
Date Published May 2001 NS CP(K)  
Printed in Japan  
D12354EJ3V0DS00 (3rd edition)  
1998  
©
The mark # shows major revised points.  
2SK2982  
ELECTRICAL CHARACTERISTICS (TA = 25°C)  
CHARACTERISTICS  
SYMBOL  
RDS(on)1  
RDS(on)2  
RDS(on)3  
VGS(off)  
| yfs |  
IDSS  
TEST CONDITIONS  
VGS = 10 V, ID = 15 A  
MIN. TYP. MAX. UNIT  
Drain to Source On-state Resistance  
9.8  
13.2  
15.0  
1.5  
12.5  
16.5  
19.0  
2.0  
m  
mΩ  
mΩ  
V
VGS = 4.5 V, ID = 15 A  
VGS = 4.0 V, ID = 15 A  
VDS = 10 V, ID = 1 mA  
VDS = 10 V, ID = 15 A  
VDS = 30 V, VGS = 0 V  
VGS = 20 V, VDS = 0 V  
VDS = 10 V  
Gate to Source Cut-off Voltage  
Forward Transfer Admittance  
Drain Leakage Current  
Gate to Source Leakage Current  
Input Capacitance  
1.0  
13  
27  
S
10  
10  
µA  
µA  
pF  
pF  
pF  
ns  
ns  
ns  
ns  
IGSS  
Ciss  
2290  
940  
440  
40  
Output Capacitance  
Coss  
VGS = 0 V  
Reverse Transfer Capacitance  
Turn-on Delay Time  
Crss  
f = 1 MHz  
Td(on)  
tr  
td(off)  
Tf  
ID = 15 A  
Rise Time  
VGS(on) = 10 V  
427  
174  
226  
53  
Turn-off Delay Time  
VDD = 15 V  
Fall Time  
RG = 10 Ω  
Total Gate Charge  
QG  
ID = 30 A  
nC  
nC  
nC  
V
Gate to Source Charge  
Gate to Drain Charge  
Body Diode forward Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
QGS  
VDD = 24 V  
6.3  
16  
QGD  
VGS = 10 V  
VF(S-D)  
Trr  
IF = 30 A, VGS = 0 V  
IF= 30A, VGS = 0 V  
di/dt = 100A/µs  
0.8  
49  
ns  
nC  
Qrr  
50  
TEST CIRCUIT 1 SWITCHING TIME  
TEST CIRCUIT 2 GATE CHARGE  
D.U.T.  
D.U.T.  
IG  
= 2 mA  
RL  
V
GS  
R
L
90%  
V
GS  
VGS(on)  
10%  
Wave Form  
0
RG  
PG.  
VDD  
50  
PG.  
VDD  
90%  
ID  
90%  
10%  
ID  
V
0
GS  
10%  
I
D
0
Wave Form  
tr  
td(on)  
td(off)  
t
f
τ
ton  
toff  
τ = 1µs  
Duty Cycle 1%  
2
Data Sheet D12354EJ3V0DS  
2SK2982  
TYPICAL CHARACTERISTICS (TA = 25°C)  
TOTAL POWER DISSIPATION vs.  
CASE TEMPERATURE  
DERATING FACTOR OF FORWARD BIAS  
SAFE OPERATING AREA  
70  
60  
50  
40  
30  
100  
80  
60  
40  
20  
0
20  
10  
0
0
20  
40  
60  
80 100 120 140 160  
0
20 40  
60  
80 100 120 140 160  
T
C
- Case Temperature - ˚C  
TC - Case Temperature - ˚C  
#
FORWARD BIAS SAFE OPERATING AREA  
DRAIN CURRENT vs.  
DRAIN TO SOURCE VOLTAGE  
1000  
100  
Pulsed  
200  
I
D(pulse)  
160  
120  
80  
PW = 500  
1 ms  
Limited  
=10 V)  
µ
s
RDS(on)  
(at V  
GS  
I
D(DC)  
10 ms  
Power Dissipation imited  
100 ms  
4.5 V  
4.0 V  
V
GS =10 V  
10  
1
40  
0
T
C
= 25˚C  
Single Pulse  
DC  
0.1  
1
10  
100  
0
1.0  
DS - Drain to Source Voltage - V  
2.0  
0.5  
1.5  
V
VDS -  
Drain to Source Voltage - V  
FORWARD TRANSFER CHARACTERISTICS  
1000  
100  
Pulsed  
T
ch = 25˚C  
25˚C  
125˚C  
10  
1
0
VDS = 10 V  
0
2
6
8
4
V
GS - Gate to Source Voltage - V  
3
Data Sheet D12354EJ3V0DS  
2SK2982  
TRANSIENT THERMAL RESISTANCE vs. PULSE WIDTH  
1000  
100  
10  
Rth(ch-A) = 125 ˚C/W  
Rth(ch-C) = 4.17 ˚C/W  
1
0.1  
0.01  
Single Pulse  
T
C
= 25˚C  
0.001  
µ
100  
µ
10  
1 m  
10 m  
100 m  
1
10  
100  
1000  
PW - Pulse Width - s  
DRAIN TO SOURCE ON-STATE RESISTANCE vs.  
GATE TO SOURCE VOLTAGE  
FORWARD TRANSFER ADMITTANCE vs.  
DRAIN CURRENT  
30  
1000  
100  
10  
V
DS = 10 V  
Pulsed  
Pulsed  
T
ch = 25˚C  
25˚C  
20  
75˚C  
125˚C  
ID = 15 A  
10  
0
1
1
0
5
10  
15  
10  
100  
1000  
V
GS - Gate to Source Voltage - V  
I
D- Drain Current - A  
GATE TO SOURCE CUT-OFF VOLTAGE vs.  
CHANNEL TEMPERATURE  
DRAIN TO SOURCE ON-STATE  
RESISTANCE vs. DRAIN CURRENT  
30  
20  
Pulsed  
V
DS = 10 V  
= 1 mA  
2.0  
1.5  
I
D
V
GS = 4.0 V  
10 V  
4.5 V  
1.0  
0.5  
10  
0
0
50  
0
50  
100  
150  
0.2  
1
10  
100  
T
ch - Channel Temperature - ˚C  
ID - Drain Current - A  
4
Data Sheet D12354EJ3V0DS  
2SK2982  
DRAIN TO SOURCE ON-STATE RESISTANCE vs.  
CHANNEL TEMPERATURE  
SOURCE TO DRAIN DIODE FORWARD VOLTAGE  
100  
10  
1
20  
4.5 V  
10 V  
VGS = 4.0 V  
V
GS = 0 V  
15  
10  
5
0.1  
Pulsed  
1.5  
I
D
= 15 A  
150  
0.02  
0
0
1.0  
100  
0.5  
0
50  
50  
V
SD  
- Source to Drain Voltage - V  
T
ch - Channel Temperature - ˚C  
SWITCHING CHARACTERISTICS  
CAPACITANCE vs. DRAIN TO  
SOURCE VOLTAGE  
1000  
100  
10000  
1000  
t
r
V
GS = 0 V  
t
f
f = 1 MHz  
t
d(off)  
Ciss  
t
d(on)  
Coss  
Crss  
10  
1
100  
10  
V
DD = 15 V  
V
GS = 10 V  
R
G
= 10  
10  
0.1  
1
100  
0.1  
1
10  
100  
I
D
- Drain Current - A  
VDS - Drain to Source Voltage - V  
REVERSE RECOVERY TIME vs.  
DRAIN CURRENT  
DYNAMIC INPUT/OUTPUT CHARACTERISTICS  
1000  
100  
40  
30  
20  
10  
di/dt = 100 A/µs  
GS = 0 V  
I = 30 A  
D
V
14  
12  
10  
8
V
GS  
V
DD = 24 V  
15 V  
6 V  
6
10  
1
4
2
0
V
DS  
0
0
20  
Q
40  
60  
80  
0.1  
1
10  
100  
I
F
- Drain Current - A  
G
- Gate Charge - nC  
5
Data Sheet D12354EJ3V0DS  
2SK2982  
PACKAGE DRAWINGS (Unit: mm)  
TO-251(MP-3)  
TO-252(MP-3Z)  
6.5±0.2  
2.3±0.2  
2.3±0.2  
6.5±0.2  
5.0±0.2  
5.0±0.2  
4
0.5±0.1  
0.5±0.1  
4
1
2
3
1
2
3
1.1±0.2  
0.9  
0.8  
1.1±0.2  
MAX. MAX.  
2.3 2.3  
0.8  
+0.2  
0.5-0.1  
+0.2  
0.5-0.1  
1. Gate  
2.3 2.3  
2. Drain  
3. Source  
4. Fin (Drain)  
1.Gate  
2.Drain  
3.Source  
4.Fin (Drain)  
EQUIVALENT CIRCUIT  
Drain  
Body  
Diode  
Gate  
Gate  
Protection  
Diode  
Source  
Remark The diode connected between the gate and source of the transistor serves as a protector against ESD.  
When this device actually used, an additional protection circuit is externally required if a voltage exceeding  
the rated voltage may be applied to this device.  
6
Data Sheet D12354EJ3V0DS  
2SK2982  
[MEMO]  
7
Data Sheet D12354EJ3V0DS  
2SK2982  
The information in this document is current as of May, 2001. The information is subject to change  
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data  
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products  
and/or types are available in every country. Please check with an NEC sales representative for  
availability and additional information.  
No part of this document may be copied or reproduced in any form or by any means without prior  
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.  
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of  
third parties by or arising from the use of NEC semiconductor products listed in this document or any other  
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any  
patents, copyrights or other intellectual property rights of NEC or others.  
Descriptions of circuits, software and other related information in this document are provided for illustrative  
purposes in semiconductor product operation and application examples. The incorporation of these  
circuits, software and information in the design of customer's equipment shall be done under the full  
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third  
parties arising from the use of these circuits, software and information.  
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers  
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize  
risks of damage to property or injury (including death) to persons arising from defects in NEC  
semiconductor products, customers must incorporate sufficient safety measures in their design, such as  
redundancy, fire-containment, and anti-failure features.  
NEC semiconductor products are classified into the following three quality grades:  
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products  
developed based on a customer-designated "quality assurance program" for a specific application. The  
recommended applications of a semiconductor product depend on its quality grade, as indicated below.  
Customers must check the quality grade of each semiconductor product before using it in a particular  
application.  
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio  
and visual equipment, home electronic appliances, machine tools, personal electronic equipment  
and industrial robots  
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster  
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed  
for life support)  
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life  
support systems and medical equipment for life support, etc.  
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's  
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not  
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness  
to support a given application.  
(Note)  
(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.  
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for  
NEC (as defined above).  
M8E 00. 4  

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