58F508 [ETC]
HEATSINK ; 散热片\n
| 型号： | 58F508 |
| 厂家： | 
ETC |
| 描述： | HEATSINK
|
| 文件： | 总7页 (文件大小：358K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Extruded
Heat Sinks
EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS
621 AND 623 SERIES
Low-Profile Heat Sinks for All Metal-Case Power Semiconductors
Footprint
Dimensions
in. (mm)
Thermal Performance at Typical Load
Standard
P/N
Height
in. (mm)
Mounting
Hole Pattern
Natural
Forced
Convection
Weight
lbs. (grams)
Convection
621A
621K
623A
623K
4.750 (120.6) x 1.500 (38.1)
4.750 (120.6) x 1.500 (38.1)
4.750 (120.6) x 3.000 (76.2)
4.750 (120.6) x 3.000 (76.2)
0.461 (11.7)
0.461 (11.7)
0.461 (11.7)
0.461 (11.7)
(1) TO-3
None
(1) TO-3
None
75°C @ 15W
75°C @ 15W
52°C @ 15W
52°C @ 15W
2.0°C/W @ 250 LFM
2.0°C/W @ 250 LFM
1.5°C/W @ 250 LFM
1.5°C/W @ 250 LFM
0.1000 (45.36)
0.1000 (45.36)
0.2100 (95.26)
0.210O (95.26)
A general purpose yet efficient heat dissipator for TO-3 and virtually all other styles of metal case
power semiconductor package types, the 621 and 623 Series low-profile flat back heat sinks find
a wide variety of applications. The central channel between fins measures 1.300 in. (33.0) (min.)
in width, accommodating many types of packages. Mounting hole pattern "A" is predrilled for the
standard TO-3 package. Material: Aluminum Alloy, Black Anodized.
621 AND 623 SERIES (EXTRUSION PROFILE 1327)
MECHANICAL
DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
SEMICONDUCTOR MOUNTING HOLES
A
K
Dimensions: in. (mm)
301/302/303 SERIES
Compact Heat Sinks for Dual Stud-Mounted Semiconductor Cases
Outline
Dimensions
in. (mm)
Mounting
Hole (s)
Pattern and Number
Thermal Performance at Typical Load
Standard
P/N
Length “A”
in. (mm)
Natural
Forced
Weight
lbs. (grams)
Convection
Convection
301K
301M
301N
302M
302MM
302N
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
2.000 (50.8) x 2.000 (50.8)
0.750 (19.1)
None
70°C @ 15W
70°C @ 15W
70°C @ 15W
50°C @ 15W
50°C @ 15W
5O°C @ 15W
50°C @ 15W
37°C @ 15W
37°C @ 15W
37°C @ 15W
37°C @ 15W
2.5°C/W @ 250 LFM
2.5°C/W @ 250 LFM
2.5°C/W @ 250 LFM
1.8°C/W @ 250 LFM
1.8°C/W @ 250 LFM
1.8°C/W @ 250 LFM
1.8°C/W @ 250 LFM
1.3°C/W @ 250 LFM
1.3°C/W @ 250 LFM
1.3°C/W @ 250 LFM
1.3°C/W @ 250 LFM
0.0580 (26.31)
0.0580 (26.31)
0.0580 (26.31)
0.1330 (60.33)
0.1330 (6033)
0.1330 (60.33)
0.1330 (60.33)
0.2680 (121.56)
0.2680 (121.56)
0.2680 (121.56)
0.2680 (121.56)
0.750 (19.1) (1) 10-32UNF, 0.625 in. thread depth
0.750 (19.1) (1) 1⁄
4
-28UNF, 0.625 in. thread depth
1.500 (38.1) (1) 10-32UNF, 0.625 in. thread depth
1.500 (38.1) (2) 10-32UNF, 0.625 in. thread depth
1.500 (38.1) (1) 1⁄
4
-28UNF, 0.625 in. thread depth
-28UNF, 0.625 in. thread depth
302NN ̆ 2.000 (50.8) x 2.000 (50.8)
303M 2.000 (50.8) x 2.000 (50.8)
303MM 2.000 (50.8) x 2.000 (50.8)
303N ̆ 2.000 (50.8) x 2.000 (50.8)
303NN
1.500 (38.1) (2) 1⁄
4
3.000 (76.2) (1) 10-32UNF, 0.625 in. thread depth
3.000 (76.2) (2) 10-32UNF, 0.625 in. thread depth
3.000 (76.2) (1) 1⁄
3.000 (76.2) (2)
4
-28UNF, 0.625 in. thread depth
-28UNF, 0.625 in. thread depth
1
2.000 (50.8) x 2.000 (50.8)
⁄
4
The large fin area in minimum total volume provided by the radial design of the 301/302/303
Series offers maximum heat transfer efficiency in natural convection. All types are available
with one tapped mounting hole for rectifiers and other stud-mounting semiconductors; the
302 and 303 Series offer maximum cost savings with dual mounting locations (“MM” and
“NN” mounting hole patterns) for two stud-mount devices. Material: Aluminum Alloy, Black
Anodized.
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
MECHANICAL
DIMENSIONS
SEMICONDUCTOR MOUNTING HOLES
K
M
N
302 AND 303 SERIES
SERIES
301
302
303
Dimensions: in. (mm)
301 SERIES
641 SERIES
Maximum Performance Natural Convection Heat Sink for all Metal-Case Semiconductors
Outline
Dimensions
in. (mm)
Mounting
Hole
Pattern
Thermal Performance at Typical Load
Standard
P/N
Height
in. (mm)
Natural
Forced
Weight
lbs. (grams)
Convection
Convection
641A ̆
641K ̆
4.125 (104.8) x 3.000 (76.2)
4.125 (104.8) x 3.000 (76.2)
1.000 (25.4)
1.000 (25.4)
(1) TO-3
None
36°C @ 15W
36°C @ 15W
0.9°C/W @ 250 LFM
0.9°C/W @ 250 LFM
0.2900 (131.54)
0.2900 (131.54)
Available with a standard TO-3 mounting hole pattern predrilled for cost-effective mounting in
limited-height applications, the 641 Series provides maximum performance in natural convec-
tion with an optimized heat sink surface area. The 641K type with an open channel area of
1.300 in. (33.0) and no predrilled mounting holes can be adapted to meet mounting require-
ments for most metal case power semiconductor types. Material: Aluminum Alloy, Black
Anodized.
641 SERIES
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
MECHANICAL
DIMENSIONS
(EXTRUSION PROFILE 1371)
SEMICONDUCTOR MOUNTING HOLES
A
K
Dimensions: in. (mm)
All other products, please contact factory for price, delivery, and minimums.
̆ Normally stocked
50
Extruded
Heat Sinks
EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS
401 AND 403 SERIES
Double-Surface Heat Sinks for TO-3 Case Styles
Standard
P/N
Width
in. (mm)
Overall Dimensions
in. (mm)
Height
in. (mm)
Semiconductor
Mounting Hole Pattem Natural Convection
Thermal Performance at Typical Load
Weight
lbs. (grams)
Forced Convection
401A ̆
401F
401K ̆
403A ̆
403F ̆
403K ̆
4.750 (120.7)
4.750 (120.7)
4.750 (120.7)
4.750 (120.7)
4.750 (120.7)
4.750 (120.7)
1.500 (38.1)
1.500 (38.1)
1.500 (38.1)
3.000 (76.2)
3.000 (76.2)
3.000 (76.2)
1.250 (31.8)
1.250 (31.8)
1.250 (31.8)
1.250 (31.8)
1.250 (31.8)
1.250 (31.8)
(1) TO-3
0.270 in. (6.9)-Dia Hole
None
(1) TO-3
0.270 in. (6.9)-Dia Hole
None
80°C @ 30W
80°C @ 30W
80°C @ 30W
55°C @ 30W
55°C @ 30W
55°C @ 30W
1.5°C/W @ 250 LFM
1.5°C/W @ 250 LFM
1.5°C/W @ 250 LFM
0.9°C/W @ 250 LFM
0.9°C/W @ 250 LFM
0.9°C/W @ 250 LFM
0.1500 (68.04)
0.1500 (68.04)
0.1500 (68.04)
0.3500 (158.76)
0.3500 (158.76
0.3500 (158.76)
With fins oriented vertically in cabinet sidewall applications, 401 and 403 Series heat sinks
are recommended for critical space applications where maximum heat dissipation is required
for high-power TO-3 case styles. Forced convection performance is also exemplary with these
double surface fin types. Semiconductor mounting hole style “F” offers a single centered
0.270 in. (6.9)-diameter mounting hole (with a 0.750 in. (19.1)-diameter area free of anodize)
for mounting stud-type diodes and rectifiers. Hole pattem “V" available upon request.
Material: Aluminum Alloy, Black Anodized.
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
401 SERIES
403 SERIES
Dimensions: in. (mm)
SEMICONDUCTOR MOUNTING HOLES
V
A
K
F
401 AND 403 SERIES
(EXTRUSION
PROFILE 1024)
413/421/423 SERIES
Low-Height Double-Surface Heat Sinks for TO-3 Case Styles and Diodes
Nominal Dimensions
Standard
P/N
Width
in. (mm)
Length
in. (mm)
Height “A”
in. (mm)
Semiconductor
Thermal Performance at Typical Load
Weight
lbs. (grams)
Mounting Hole Pattern Natural Convection Forced Convection
413A
413F
413K ̆
421A
421F
421K ̆
423A
4.750 (120.7)
4.750 (120.7)
4.750 (120.7)
4.750 (120.7)
4.750 (120.7)
4.750 (120.7)
4.750 (120.7)
4.750 (120.7)
3.000 (76.2)
3.000 (76.2)
3.000 (76.2)
3.000 (76.2)
3.000 (76.2)
3.000 (76.2)
5.500 (140.2)
5.500 (140.2)
1.875 (47.6)
1.875 (47.6)
1.875 (47.6)
2.625 (66.7)
2.625 (66.7)
2.625 (66.7)
2.625 (66.7)
2.625 (66.7)
(1) TO-3
0.270 in. (6.9)-Dia Hole
None
(1) TO-3
0.270 in. (6.9)-Dia Hole
None
(1) TO-3
None
72°C @ 50W
72°C @ 50W
72°C @ 50W
58°C @ 50W
58°C @ 50W
58°C @ 50W
47°C @ 50W
47°C @ 50W
0.85°C/W @ 250 LFM
0.85°C/W @ 250 LFM
0.85°C/W @ 250 LFM
0.7°C/W @ 250 LFM
0.7°C/W @ 250 LFM
0.7°C/W @ 250 LFM
0.5°C/W @ 250 LFM
0.5°C/W @ 250 LFM
0.6300 (285.77)
0.6300 (285.77)
0.6300 (285.77)
0.6300 (285.77)
0.6300 (285.77)
0.6300 (285.77)
1.1700 (530.71)
1.1700 (530.71)
423K ̆
Space-saving double surface 413, 421, and 423 Series utilize finned surface
area on both sides of the power semiconductor mounting surface to provide
maximum heat dissipation in a compact profile. Ready to install on popular
power components in natural and forced convection applications. Apply
Wakefield Type 126 silicone-free thermal compound or Wakefield DeltaPad™
interface materials for maximum performance. Material: Aluminum Alloy, Black
Anodized.
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
423 SERIES
(EXTRUSION PROFILE 1025)
413 SERIES
(EXTRUSION
PROFILE 2276
421 SERIES
(EXTRUSION
PROFILE 1025)
SEMICONDUCTOR MOUNTING HOLES
F
K
A
V
SERIES
413
421
Dimensions: in. (mm)
All other products, please contact factory for price, delivery, and minimums.
̆ Normally stocked
51
Extruded
Heat Sinks
EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS
431 AND 433 SERIES
High-Performance Heat Sinks for 30-100W Metal Power Semiconductors
Nominal Dimensions
Standard
P/N
Width
in. (mm)
Length “A”
in. (mm)
Height
Semiconductor
Thermal Performance at Typical Load
Weight
lbs. (grams)
in. (mm) Mounting Hole Pattern Natural Convection
Forced Convection
431K
4.750 (120.7)
3.000 (76.2)
5.500 (139.7)
3.000 (76.2)
3.000 (76.2)
None
None
55°C @ 5OW
42°C @ 5OW
0.40°C/W @ 250 LFM
0.28°C/W @ 250 LFM
0.7800 (353.81)
1.4900 (675.86)
433K ̆ 4.750 (120.7)
Need maximum heat dissipation from a TO-3 rectifier heat sink in
minimum space? The Wakefield 431 and 433 Series center chan-
nel double-surface heat sinks offer the highest performance-to-weight ratio for minimum vol-
ume occupied for TO-3, diode, and stud-mount metal power semiconductors in the 30- to
100-watt operating range. Additional interface resistance reduction for maximized overall per-
formance can be achieved with proper application of Wakefield Type 126 silicone-free thermal
compound. Material: Aluminum Alloy, Black Anodized.
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
SERIES
431
433
SEMICONDUCTOR
MOUNTING HOLE
K
431 AND 433
SERIES
(EXTRUSION
PROFILE 2726)
Dimensions: in. (mm)
435 SERIES
Lightweight Quadruple Mount Heat Sink for TO-3 Case Styles
Nominal Dimensions
Length
Standard
P/N
Width
in. (mm)
Height
in. (mm)
Semiconductor
Thermal Performance at Typical Load
Weight
lbs. (grams)
in. (mm)
Mounting Hole Pattern Natural Convection Forced Convection
435AAAA 4.250(108.0)
5.500(139.7)
4.300(109.2)
(4) TO-3
37°C @ 50W
54°C @ 80W
0.38°C/W @ 250 LFM 1.1500 (521.64)
0.24°C/W @ 600 LFM
This lightweight high-performance heat sink is designed to
mount and cool efficiently one to four TO-3 style metal case
power semiconductors. The Type 435AAAA is the standard configuration available from stock,
predrilled for mounting four TO-3 style devices. Increased performance can be achieved with
the proper selection and installation of a Wakefield Type 175 DeltaPad Kapton™ interface
material for each power semiconductor or, for maximum reduction of case-to-sink interface
loss, the application of Wakefield Type 126 silicone-free thermal compound. Material:
Aluminum Alloy, Black Anodized.
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
SEMICONDUCTOR
MOUNTING HOLES
AAAA
435 SERIES
(EXTRUSION
PROFILE 4226)
441 SERIES
High-Performance Natural Convection Heat Sinks for Rectifiers and Diodes
Nominal Dimensions
Standard
P/N
Width
Length
Height
Semiconductor
Mounting Hole Pattern
Thermal Performance at Typical Load
Natural Convection Forced Convection
Weight
lbs. (grams)
in. (mm)
in. (mm)
in. (mm)
441K ̆
4.750 (120.7) 5.500 (139.7) 4.500 (114.3)
None
34°C @ SOW
47°C @ 80W
0.30°C/W @ 250 LFM
0.19°C/W @ 600 LFM
1.9700 (893.59)
Designed for vertical mounting within a power supply enclosure
or equipment cabinet without forced airflow available. This
Wakefield 441 Series heat sink will dissipate up to 100 watts efficiently in natural convection
with a maximum 55°C heat sink temperature rise above ambient. When applied in a forced
convection environment, the 441K Type will achieve thermal resistance of 0.18°C/W (sink to
ambient) at 1000 LFM. Supplied with no predrilled device mounting hole pattern. Material:
Aluminum Alloy, Black Anodized.
Dimensions: in. (mm)
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
MECHANICAL DIMENSIONS
SEMICONDUCTOR
MOUNTING HOLE
K
441 SERIES
(EXTRUSION
PROFILE 1273)
All other products, please contact factory for price, delivery, and minimums.
̆ Normally stocked
52
Extruded
Heat Sinks
EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS
465 AND 476 SERIES
High-Power Heat Sinks for Medium Hex-Type Rectifiers and Diodes
Nominal Dimensions
Standard
P/N
Width
in. (mm)
Length
in. (mm)
Height
in. (mm)
Hex Style
Type
Mounting
Thermal Performance at Typical Load
Weight
lbs. (grams)
Hole Pattern Natural Convection Forced Convection
465K
476K
476W
4.000 (101.6)
5.000 (127.0)
5.000 (127.0)
5.000 (127.0)
6.000 (152.4)
6.000 (152.4)
4.000 (101.6)
5.000 (127.0)
5.000 (127.0)
1.060 in. Hex
1.250 in. Hex
1.250 in. Hex
None
None
0.765 in.
(19.4)Dia.
Center Mount
38°C @ 5OW
25°C @ 5OW
25°C @ 5OW
0.27°C/W @500 LFM
0.19°C/W @500 LFM
0.19°C/W @500 LFM
1.9300 (875.45)
2.8200(1279.15)
2.8000(1270.08)
Wakefield Engineering has designed four standard heat sink types for ease of installation and
efficient heat dissipation for industry standard hex-type rectifiers and similar stud-mount
power devices: 465, 476, 486, and 489 Series. The 465 and 476 Series shown here are
designed for 1.060 in. Hex (465 Type) and 1.250 in. Hex (476 Type). The 476W Type is avail-
able predrilled for an 0.765 in. (19.4) dia, mounting hole, Material: Aluminum Alloy, Black
anodized.
MECHANICAL DIMENSIONS
465 SERIES (EXTRUSION
PROFILE 1244)
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
476 SERIES (EXTRUSION
PROFILE 1245)
W
K
SEMICONDUCTOR
MOUNTING HOLES
Dimensions: in. (mm)
486 AND 489 SERIES
Heat Sinks for High-Power Hex-Type Rectifiers and Diodes
Nominal Dimensions
Standard
P/N
Width
in. (mm)
Length
in. (mm)
Height
in. (mm)
Hex Style
Type
Mounting
Thermal Performance at Typical Load
Weight
lbs. (grams)
Hole Pattern Natural Convection Forced Convection
486K ̆ 6.250 (158.8)
6.000 (152.4)
6.250 (158.8)
1.750 in. Hex
None
None
24°C @ 50W
86°C @ 250W
19°C @ 50W
75°C @ 250W
0.20°C/W @250 LFM 4.2100 (1909.66)
0.13°C/W @500 LFM
0.15°C/W @250 LFM 6.1400 (2785.10)
0.10°C/W @500 LFM
489K ̆ 6.250 (158.8)
9.000 (228.6)
6.250 (158.8)
1.750 in. Hex
These two heat sink types accept industry standard 1.750 in. (44.5) hex-type devices for
mounting and efficient heat dissipation. Each type is provided with a 1.750 in. (44.5) x 2.000
in. (50.8) area on the semiconductor base mounting surface which is free of anodize.
Material: Aluminum Alloy, Black Anodized.
MECHANICAL DIMENSIONS
SEMICONDUCTOR
K
MOUNTING HOLE
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
486 AND 489 SERIES
(EXTRUSION
PROFILE 1541)
SERIES
486
489
Dimensions: in. (mm)
All other products, please contact factory for price, delivery, and minimums.
̆ Normally stocked
53
Extruded
Heat Sinks
EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS
490 SERIES
King Size Heat Sinks for High-Power Rectifiers
Nominal Dimensions
Standard
P/N
Width
in. (mm)
Length “A”
in. (mm)
Height
Semiconductor
Thermal Performance at Typical Load
Natural Convection Forced Convection
Weight
lbs. (grams)
in. (mm) Mounting Hole Pattern
490-35K
490-6K ̆
490-12K ̆ 9.250 (235.0)
9.250 (235.0)
9.250 (235.0)
3.500 (88.9)
6.000 (152.4)
12.000 (304.8)
6.750 (171.5)
6.750 (171.5)
6.750 (171.5)
None
None
None
84°C @ 20OW 0.18°C/W @ 600 LFM
60°C @ 20OW 0.13°C/W @ 600 LFM
45°C @ 20OW 0.09°C/W @ 600 LFM 10.62 (4817.23)
3.2400(1469.66)
5.4700(2481.19)
The 490 Series can be used to mount a single high-power rectifier or a grouping of smaller
power devices. The semiconductor device mounting surface is free of anodize on the entire
surface on one side only; finish overall is black anodize. Use Type 109 mounting brackets
(see accessories section) for mounting to enclosure wall and for electrical isolation. The
anodize-free mounting surface is milled for maximum contact area. The 490 Series Can also
be drilled for mounting and cooling IGBTs and other isolated power modules. Material:
Aluminum Alloy, Black Anodized.
MECHANICAL DIMENSIONS
NATURAL AND FORCED
SEMICONDUCTOR
CONVECTION CHARACTERISTICS
MOUNTING HOLE
490 SERIES
(EXTRUSION PROFILE 2131)
Dimensions: in. (mm)
PERFORMANCE, LOW PROFILE HEAT SINKS FOR POWER MODULES & IGBT’S
394, 395, 396 SERIES
Thermal Resistance at Typical Load
Overall Dimensions: in. (mm)
Device Base
Natural
Forced
Standard
P/N
Length
in. (mm)
Height
Width
in. (mm)
Mounting Area Base Mounting Convection (Øsa)(1)
Convection (Øsa)
(°C/W @ 500 LFM)
in. (mm)
(mm)
Holes
(°C/W)
394-1AB
394-2AB
395-1AB
395-2AB
396-1AB
396-2AB
3.000 (76.2)
5.500 (139.7)
3.000 (76.2)
5.500 (139.7)
3.000 (76.2)
5.500 (139.7)
1.500 (38.1)
1.500 (38.1)
2.500 (63.5)
2.500 (63.5)
1.380 (35.1)
1.380 (35.1)
5.000 (127.0)
5.000 (127.0)
5.000 (127.0)
5.000 (127.0)
5.000 (127.0)
5.000 (127.0)
101 x 76
101 x 139
50 x 76
50 x 139
50 x 76
4
6
4
6
4
6
1.85
1.51
1.10
0.90
1.85
1.51
0.90
0.60
0.50
0.32
1.07
0.64
50 x 139
Note: 1.Thermal resistance values shown are for black anodized finish at 50°C rise above ambient.
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
MECHANICAL DIMENSIONS
394 SERIES
(EXTRUSION PROFILE 7332)
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
395 SERIES
(EXTRUSION PROFILE 7330)
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
396 SERIES
(EXTRUSION PROFILE 7331)
Dimensions: in. (mm)
All other products, please contact factory for price, delivery, and minimums.
̆ Normally stocked
54
Extruded
Heat Sinks
EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS
SERIES 517, 527, 518 AND 528
Heat Sinks for “Half Brick” DC/DC Converters
Thermal Performance
Natural Convection
Power Dissipation (Watts)
Footprint
Dimensions
in. (mm)
Forced Convection
Thermal Resistance
at 300 ft/min
Standard
P/N
Height
in. (mm)
Fin
Orientation
Number
of Fins
60°C Rise Heat Sink to Ambient
517-95AB
527-45AB
527-24AB
518-95AB
528-45AB
528-24AB
2.28 (57.9) x 2.40 (61.0)
2.28 (57.9) x 2.40 (61.0)
2.28 (57.9) x 2.40 (61.0)
2.40 (61.0) x 2.28 (57.9)
2.40 (61.0) x 2.28 (57.9)
2.40 (61.0) x 2.28 (57.9)
0.95 (24.1)
0.45 (11.4)
0.24 (6.1)
0.95 (24.1)
0.45 (11.4)
0.24 (6.1)
Horizontal
Horizontal
Horizontal
Vertical
Vertical
Vertical
8
11W
7W
5W
11W
7W
5W
2.0 °C/W
3.2 °C/W
5.8 °C/W
2.0 °C/W
3.2 °C/W
5.8 °C/W
11
11
8
11
11
Material: Aluminum, Black Anodized.
Keep your "half brick" size AT&T and Computer Products power modules cool with these effi-
cient black anodized aluminum heat sinks made for natural or forced convection applications.
To include four M3 x 8mm Phillips head SEM attachment screws, add an “M” suffix to stan-
dard part number. To specify factory applied Deltalink IV thermal interface material, add an
“S4” suffix to standard part number. Deltalink IV is a non-insulating graphite based material
used as a clean, thermally efficient alternative to thermal grease.
MECHANICAL DIMENSIONS
517, 527, 518 AND 528 SERIES
PRODUCT DESIGNATION
517/527 SERIES DIMENSIONS
518/528 SERIES DIMENSIONS
Dimensions: in. (mm)
MOUNTING HARDWARE FOR EXTRUDED HEAT SINKS
100 SERIES Teflon Mounting Insulators
103 SERIES
107 SERIES
All other products, please contact factory for price, delivery, and minimums.
̆ Normally stocked
55
Extruded
Heat Sinks
HIGH FIN DENSITY HEAT SINKS FOR POWER MODULES, IGBTs, RELAYS
(5)
Height
Thermal Resistance
(Øsa) at Typical Load
Natural Forced
(“U” Series) Convection(3) Convection(4)
510, 511 AND 512 SERIES
(1)
(2)
Standard Catalog P/N(5)
Milled Base
Nonmilled Base
Milled
Base(1)
Nonmilled
Base(2)
Base Width
in. (mm)
Length
(“M Series”)
in. (mm)
in. (mm)
in. (mm)
(°C/W) (°C/W @ 100 CFM)
510-3M
510-6M
510-9M
510-12M ̆
510-14M ̆
511-3M
511-6M
511-9M
511-12M
512-3M
512-6M
512-9M
512-12M
510-3U
510-6U
510-9U
510-12U ̆
510-14U ̆
511-3U
511-6U
511-9U
511-12U
512-3U
512-6U
512-9U
512-12U
7.380 (187.452)
7.380 (187.452)
7.380 (187.452)
7.380 (187.452)
7.380 (187.452)
5.210 (132.33)
5.210 (132.33)
5.210 (132.33)
5.210 (132.33)
7.200 (182.88)
7.200 (182.88)
7.200 (182.88)
7.200 (182.88)
3.000 (76.2)
3.106 (78.9)
3.106 (78.9)
3.106 (78.9)
3.106 (78.9)
3.106 (78.9)
2.350 (59.7)
2,350 (59.7)
2.350 (59.7)
2.350 (59.7)
2.350 (59.7)
2.350 (59.7)
2.350 (59.7)
2.350 (59.7)
3.136 (79.7)
3.136 (79.7)
3.136 (79.7)
3.136 (79.7)
3.136 (79.7)
2.410 (61.2)
2.410 (61.2)
2.410 (61.2)
2.410 (61.2)
2.410 (61.2)
2.410 (61.2)
2.410 (61.2)
2.410 (61.2)
0.56
0.38
0.29
0.24
0.21
0.90
0.65
0.56
0.45
0.90
0.65
0.56
0.45
0.088
0.070
0.066
0.062
0.059
0.120
0.068
0.060
0.045
0.120
0.068
0.060
0.045
6.000 (152.4)
9.000 (228.6)
12.000 (304.8)
14.000 (355.6)
3.000 (76.2)
6.000 (152.4)
9.000 (228.6)
12.000 (304.8)
3.000 (76.2)
6.000 (152.4)
9.000 (228.6)
12.000 (304.8)
Notes:
2. Nonmilled base flatness: 0.006 in./in.
3. Natural convection heat dissipation for distributed heat
sources at 50°C rise.
4. Forced convection heat dissipation for distributed heat
sources at 100 cubic feet per minute, shrouded condition.
5. Standard models are provided without finish.
1. Precision-milled base for maximum heat transfer
performance (flatness 0.002 in./in.)
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
MECHANICAL DIMENSIONS
510 SERIES
510 Series (Extrusion Profile 5113)
511 Series (Extrusion Profile 6438-1)
512 Series (Extrusion Profile 6438-2)
511 AND 512 SERIES
Dimensions: in. (mm)
392 SERIES HIGH PERFORMANCE HEAT SINKS FOR POWER MODULES, IGBTs AND SOLID STATE RELAYS
Thermal Resistance at Typical Load
Standard P/N, Finish
Black
Anodized
Natural
Convection (Øsa)
(°CW)
Forced
Convection (Øsa)
(°CW)
Gold
Iridite
Length
in. (mm)
Weight
lbs. (grams)
392-120AB
392-180AB ̆
392-300AB ̆
392-120AG
392-180AG ̆
392-300AG ̆
4.725 (120.0)
7.087 (180.0)
11.811 (300.0)
0.50
0.43
0.33
0.16 @ 100 CFM
0.11 @ 100 CFM
0.08 @ 100 CFM
4.452 (2019.43)
6.636 (3010.09)
1O.420 (4726.51)
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
MECHANICAL DIMENSIONS
NATURAL
CONVECTION
392-120 (1 MOD)
392-180 (1 MOD)
392-300 (1 MOD)
392-300 (3 MOD)
FORCED
CONVECTION
392-120 (1 MOD)
392-120 (3 MOD)
392-180 (1 MOD)
392-180 (3 MOD)
392-300 (3 MOD)
392 SERIES
(EXTRUSION
PROFILE 5658)
Dimensions: in. (mm)
All other products, please contact factory for price, delivery, and minimums.
̆ Normally stocked
56
相关型号：
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